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TinyLogic ULP-A Buffer
with Three-State Output
NC7SV125
The NC7SV125 is a single non−inverting 3−state buffer in tiny
footprint packages. The device is designed to operate for VCC = 0.9 V
to 3.6 V.
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Features
•
•
•
•
•
•
•
MARKING
DIAGRAMS
Designed for 0.9 V to 3.6 V VCC Operation
1.0 ns tPD at 3.3 V (Typ)
Inputs/Outputs Over−Voltage Tolerant up to 3.6 V
IOFF Supports Partial Power Down Protection
Source/Sink 24 mA at 3.3 V
Available in SC−88A and MicroPak™ Packages
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
OE
5
1
VCC
A 2
OE 1
4
Y
GND
CCKK
XYZ
Pin 1
CC
KK
XY
Z
= Specific Device Code
= 2−Digit Lot Run Traceability Code
= 2−Digit Date Code
= Assembly Plant Code
6 VCC
A 2
GND 3
SIP6 1.45X1.0
MicroPak
CASE 127EB
SC−88A
CASE 419A−02
5 NC
3
XXXMG
G
4 Y
SC−88A
XXX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
MicroPak
Figure 1. Pinout Diagrams (Top Views)
ORDERING INFORMATION
OE
EN
See detailed ordering, marking and shipping information on
page 7 of this data sheet.
Y
A
Figure 2. Logic Symbol
PIN ASSIGNMENT
FUNCTION TABLE
Pin
SC88A
MicroPak
Input
Output
1
OE
OE
OE
A
Y
2
A
A
L
L
L
3
GND
GND
L
H
H
4
Y
Y
H
X
Z
5
VCC
N.C.
6
−
VCC
X = Don’t Care
Z = High Impedance State
N.C. = No Connect
© Semiconductor Components Industries, LLC, 2004
February, 2021 − Rev. 2
1
Publication Order Number:
NC7SV125/D
NC7SV125
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
−0.5 to +4.3
V
VIN
DC Input Voltage
−0.5 to +4.3
V
−0.5 to VCC + 0.5
−0.5 to +4.3
−0.5 to +4.3
V
VIN < GND
−50
mA
VOUT < GND
−50
mA
VOUT
Characteristics
DC Output Voltage
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IOUT
DC Output Source/Sink Current
±50
mA
DC Supply Current per Supply Pin or Ground Pin
±50
mA
ICC or IGND
−65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
+150
°C
qJA
Thermal Resistance (Note 2)
SC−88A
MicroPak
377
154
°C/W
PD
Power Dissipation in Still Air
SC−88A
MicroPak
332
812
mW
Level 1
−
TSTG
Storage Temperature Range
MSL
Moisture Sensitivity
FR
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
−
ESD Withstand Voltage (Note 3)
Human Body Model
Charged Device Model
2000
1000
V
±100
mA
VESD
ILatchup
Latchup Performance (Note 4)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Applicable to devices with outputs that may be tri−stated.
2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow per JESD51−7.
3. HBM tested to EIA / JESD22−A114−A. CDM tested to JESD22−C101−A. JEDEC recommends that ESD qualification to EIA/JESD22−A115A
(Machine Model) be discontinued.
4. Tested to EIA/JESD78 Class II.
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2
NC7SV125
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
Positive DC Supply Voltage
VIN
DC Input Voltage
VOUT
TA
tr , tf
DC Output Voltage
Min
Max
Unit
0.9
3.6
V
0
3.6
V
0
0
0
VCC
3.6
3.6
−40
+85
°C
0
10
ns/V
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
Operating Temperature Range
VCC = 3.3 V ± 0.3 V
Input Transition Rise and Fall Time
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
TA = 255C
Symbol
VIH
VIL
VOH
Parameter
Condition
High−Level Input
Voltage
Low−Level Input
Voltage
High−Level Output
Voltage
VCC (V)
TA = −405C to +855C
Min
Typ
Max
Min
Max
Unit
V
0.9
−
0.5
−
−
−
1.1 to 1.3
0.65 x VCC
−
−
0.65 x VCC
−
1.4 to 1.6
0.65 x VCC
−
−
0.65 x VCC
−
1.65 to 1.95 0.65 x VCC
−
−
0.65 x VCC
−
2.3 to