NC7SZ04L6X

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This literature is subject to all applicable copyright laws and is not for resale in any manner. NC7SZ04 TinyLogic® UHS Inverter Features Description  Ultra-High Speed: tPD 2.4ns (Typical) into 50pF at 5V VCC    High Output Drive: ±24mA at 3V VCC   Power Down High Impedance Inputs/Outputs The NC7SZ04 is a single inverter from Fairchild’s UltraHigh Speed (UHS) series of TinyLogic®. The device is fabricated with advanced CMOS technology to achieve ultra-high speed with high output drive while maintaining low static power dissipation over a broad VCC operating range. The device is specified to operate over the 1.65V to 5.5V VCC operating range. The inputs and output are high-impedance when VCC is 0V. Inputs tolerate voltages up to 6V, independent of VCC operating voltage. Over-Voltage Tolerance Inputs Facilitate 5V to 3V Translation Related Resources    Proprietary Noise/EMI Reduction Circuitry Broad VCC Operating Range: 1.65V to 5.5V Matches Performance of LCX when Operated at 3.3V VCC Ultra-Small MicroPak™ Packages  MS-503 — Family Characteristics TinyLogic® HS/HST and UHS Series Space-Saving SOT23 and SC70 Packages Ordering Information Part Number Top Mark NC7SZ04M5X 7Z04 5-Lead SOT23, JEDEC MO-178 1.6mm 3000 Units on Tape & Reel NC7SZ04P5X Z04 5-Lead SC70, EIAJ SC-88a, 1.25mm Wide 3000 Units on Tape & Reel NC7SZ04L6X CC 6-Lead MicroPak™, 1.00mm Wide 5000 Units on Tape & Reel NC7SZ04FHX CC 6-Lead, MicroPak2™, 1x1mm Body, .35mm Pitch 5000 Units on Tape & Reel © 1996 Fairchild Semiconductor Corporation NC7SZ04 • Rev. 1.0.5 Package Packing Method www.fairchildsemi.com NC7SZ04 — TinyLogic® UHS Inverter February 2011 NC7SZ04 — TinyLogic® UHS Inverter Connection Diagrams IEEC/IEC Figure 1. Logic Symbol Pin Configurations Figure 2. SC70 and SOT23 (Top View) Figure 3. MicroPak™ (Top Through View) Pin Definitions Pin # SC70 / SOT23 Pin # MicroPak™ Name Description 1 1,5 NC 2 2 A 3 3 GND Ground 4 4 Y Output 5 6 VCC No Connect Input Supply Voltage Function Table Y= /A Inputs Output A Y L H H L H = HIGH Logic Level L = LOW Logic Level © 1996 Fairchild Semiconductor Corporation NC7SZ04 • Rev. 1.0.5 www.fairchildsemi.com 2 Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VCC Supply Voltage -0.5 6.0 V VIN DC Input Voltage -0.5 6.0 V 6.0 V VOUT DC Output Voltage -0.5 VIN < -0.5V -50 VIN > 6.0V +20 IIK DC Input Diode Current IOK DC Output Diode Current IOUT DC Output Current ±50 mA DC VCC or Ground Current ±50 mA ICC or IGND TSTG VOUT < -0.5V -50 VOUT > 6V, VCC=GND +20 +150 °C Junction Temperature Under Bias +150 °C TL Junction Lead Temperature (Soldering, 10 Seconds) +260 °C Power Dissipation at +85°C -65 mA TJ PD Storage Temperature Range mA SOT-23 200 SC70-5 150 MicroPak™-6 130 MicroPak2™-6 ESD NC7SZ04 — TinyLogic® UHS Inverter Absolute Maximum Ratings mW 120 Human Body Model, JEDEC:JESD22-A114 4000 Charge Device Model, JEDEC:JESD22-C101 2000 V Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol VCC VIN VOUT TA tr, tf JA Parameter Conditions Min. Max. Supply Voltage Operating 1.65 5.50 Supply Voltage Data Retention 1.5 5.5 Input Voltage 0 5.5 V Output Voltage 0 VCC V °C Operating Temperature Input Rise and Fall Times Thermal Resistance -40 +85 VCC at 1.8V, 2.5V ±0.2V 0 20 VCC at 3.3V ± 0.3V 0 10 VCC at 5.0V ± 0.5V 0 5 SOT-23 300 SC70-5 425 MicroPak™-6 500 MicroPak2™-6 560 Unit V ns/V °C/W Note: 1. Unused inputs must be held HIGH or LOW. They may not float. © 1996 Fairchild Semiconductor Corporation NC7SZ04 • Rev. 1.0.5 www.fairchildsemi.com 3 Symbol Parameter VIH HIGH Level Input Voltage VIL LOW Level Input Voltage VCC IIN Typ. Max. Min. 1.65 to 1.95 0.75VCC 0.75VCC 0.70VCC 0.70VCC V 0.25VCC 0.25VCC 2.30 to 5.50 0.30VCC 0.30VCC 1.65 1.55 1.65 1.80 1.70 1.80 1.70 2.20 2.30 2.20 3.00 2.90 3.00 2.90 4.50 4.40 4.50 HIGH Level Output Voltage 4.40 LOW Level Output Voltage Input Leakage Current 1.65 IOH=-4mA 1.29 1.52 1.29 2.30 IOH=-8mA 1.90 2.15 1.90 3.00 IOH=-16mA 2.40 2.80 2.40 3.00 IOH=-24mA 2.30 2.68 2.30 4.50 IOH=-32mA 3.80 4.20 3.80 1.65 0.00 0.10 0.10 0.00 0.10 0.10 VIN=VIH, IOL=100µA V V 1.80 0.00 0.10 0.10 3.00 0.00 0.10 0.10 4.50 0.00 0.10 0.10 V 1.65 IOL=4mA 0.80 0.24 0.24 2.30 IOL=8mA 0.10 0.30 0.30 3.00 IOL=16mA 0.15 0.40 0.40 3.00 IOL=24mA 0.22 0.55 0.55 4.50 IOL=32mA 0.22 0.55 0.55 0 VIN 5.5V ±1 ±10 µA VIN or VOUT=5.5V 1 10 µA 2.0 20 µA 0 to 5.5 IOFF Power Off Leakage Current 0 ICC Quiescent Supply Current 1.65 to 5.50 © 1996 Fairchild Semiconductor Corporation NC7SZ04 • Rev. 1.0.5 VIN=VIL, IOH=-100µA Units Max. 1.65 to 1.95 2.30 VOL Min. TA=-40 to 85°C 2.30 to 5.50 2.30 VOH TA=25°C Conditions VIN=5.5V, GND NC7SZ04 — TinyLogic® UHS Inverter DC Electrical Characteristics www.fairchildsemi.com 4 Symbol Parameter VCC Propagation Delay CPD Typ. Max. Min. 2.0 5.3 11.4 2.0 12.0 2.0 4.4 9.5 2.0 10.0 CL=15pF, RL=1M 0.8 2.9 6.5 0.8 7.0 3.30 ± 0.30 0.5 2.1 4.5 0.5 4.7 5.00 ± 0.50 0.5 1.8 3.9 0.5 4.1 3.30 ± 0.30 1.5 2.9 5.0 1.5 5.2 0.8 2.4 4.3 0.8 4.5 CL=50pF, RL=500 Input Capacitance 0.00 4 Power Dissipation (2) Capacitance 3.30 20 5.00 26 Units Figure ns Figure 4 Figure 5 Max. 1.65 5.00 ± 0.50 CIN Min. TA=-40 to 85°C 1.80 2.50 ± 0.20 tPLH, tPHL TA=25°C Conditions pF pF Figure 6 Note: 2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at no output lading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression: ICCD=(CPD)(VCC)(fIN)+(ICCstatic). Figure 4. AC Test Circuit NC7SZ04 — TinyLogic® UHS Inverter AC Electrical Characteristics Figure 5. AC Waveforms Note: 3. Input=AC Waveform; tr=tf=1.8ns; PRR=10MHz; Duty Cycle=50%. Figure 6. ICCD Test Circuit © 1996 Fairchild Semiconductor Corporation NC7SZ04 • Rev. 1.0.5 www.fairchildsemi.com 5 NC7SZ04 — TinyLogic® UHS Inverter Physical Dimensions 3.00 2.80 5 SYMM CL 0.95 0.95 A 4 B 3.00 2.60 1.70 1.50 1 2 2.60 3 (0.30) 1.00 0.50 0.30 0.95 0.20 1.90 C A B 0.70 TOP VIEW LAND PATTERN RECOMMENDATION SEE DETAIL A 1.30 0.90 1.45 MAX 0.15 0.05 0.22 0.08 C 0.10 C NOTES: UNLESS OTHEWISE SPECIFIED GAGE PLANE A) THIS PACKAGE CONFORMS TO JEDEC MO-178, ISSUE B, VARIATION AA, B) ALL DIMENSIONS ARE IN MILLIMETERS. C) MA05Brev5 0.25 8° 0° 0.55 0.35 SEATING PLANE 0.60 REF Figure 7. 5-Lead SOT23, JEDEC MO-178 1.6mm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specification Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/packaging/SOT23-5L_tr.pdf. Package Designator M5X © 1996 Fairchild Semiconductor Corporation NC7SZ04 • Rev. 1.0.5 Tape Section Cavity Number Leader (Start End) 125 (Typical) Cavity Status Cover Type Status Empty Sealed Carrier 3000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed www.fairchildsemi.com 6 NC7SZ04 — TinyLogic® UHS Inverter Physical Dimensions Figure 8. 5-Lead, SC70, EIAJ SC-88a, 1.25mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specification Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/products/analog/pdf/sc70-5_tr.pdf. Package Designator P5X © 1996 Fairchild Semiconductor Corporation NC7SZ04 • Rev. 1.0.5 Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed Carrier 3000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed www.fairchildsemi.com 7 NC7SZ04 — TinyLogic® UHS Inverter Physical Dimensions 2X 0.05 C 1.45 B 2X (1) 0.05 C (0.254) (0.49) 5X 1.00 (0.75) PIN 1 IDENTIFIER 5 (0.52) 1X A TOP VIEW 0.55MAX (0.30) 6X PIN 1 0.05 C 0.05 0.00 RECOMMENED LAND PATTERN 0.05 C C 0.25 0.15 6X 1.0 DETAIL A 0.10 0.05 0.45 0.35 0.10 0.00 6X C B A C 0.40 0.30 0.35 5X 0.25 0.40 5X 0.30 0.5 (0.05) 6X DETAIL A PIN 1 TERMINAL 0.075 X 45 CHAMFER (0.13) 4X BOTTOM VIEW Notes: 1. CONFORMS TO JEDEC STANDARD M0-252 VARIATION UAAD 2. DIMENSIONS ARE IN MILLIMETERS 3. DRAWING CONFORMS TO ASME Y14.5M-1994 4. FILENAME AND REVISION: MAC06AREV4 5. PIN ONE IDENTIFIER IS 2X LENGTH OF ANY OTHER LINE IN THE MARK CODE LAYOUT. Figure 9. 6-Lead, MicroPak™, 1.0mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specification Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf. Package Designator L6X © 1996 Fairchild Semiconductor Corporation NC7SZ04 • Rev. 1.0.5 Tape Section Cavity Number Cavity Status Cover Type Status Leader (Start End) 125 (Typical) Empty Sealed Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed www.fairchildsemi.com 8 NC7SZ04 — TinyLogic® UHS Inverter Physical Dimensions 0.89 0.35 0.05 C 1.00 2X B A 5X 0.40 PIN 1 MIN 250uM 0.66 1.00 1X 0.45 6X 0.19 0.05 C TOP VIEW RECOMMENDED LAND PATTERN FOR SPACE CONSTRAINED PCB 2X 0.90 0.05 C 0.35 0.55MAX C 5X 0.52 SIDE VIEW 0.73 (0.08) 4X 1 DETAIL A 2 1X 0.57 0.09 0.19 6X 3 0.20 6X ALTERNATIVE LAND PATTERN FOR UNIVERSAL APPLICATION (0.05) 6X 5X 0.35 0.25 6 5 4 0.35 0.60 (0.08) 4X 0.10 .05 C C B A 0.40 0.30 BOTTOM VIEW NOTES: A. COMPLIES TO JEDEC MO-252 STANDARD B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994 D. LANDPATTERN RECOMMENDATION IS BASED ON FSC DESIGN. E. DRAWING FILENAME AND REVISION: MGF06AREV3 Figure 10. 0.075X45° CHAMFER DETAIL A PIN 1 LEAD SCALE: 2X 6-Lead, MicroPak2™, 1x1mm Body, .35mm Pitch Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specification Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/packaging/MicroPAK2_6L_tr.pdf. Package Designator FHX © 1996 Fairchild Semiconductor Corporation NC7SZ04 • Rev. 1.0.5 Tape Section Cavity Number Leader (Start End) 125 (Typical) Cavity Status Cover Type Status Empty Sealed Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed www.fairchildsemi.com 9 NC7SZ04 — TinyLogic® UHS Inverter © 1996 Fairchild Semiconductor Corporation NC7SZ04 • Rev. 1.0.5 www.fairchildsemi.com 10 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. 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