NC7SZ04
TinyLogic UHS Inverter
Description
The NC7SZ04 is a single inverter from ON Semiconductor’s
Ultra−High Speed (UHS) series of TinyLogic. The device is fabricated
with advanced CMOS technology to achieve ultra−high speed with
high output drive while maintaining low static power dissipation over
a broad VCC operating range. The device is specified to operate over
the 1.65 V to 5.5 V VCC operating range. The inputs and output are
high−impedance when VCC is 0 V. Inputs tolerate voltages up to 5.5 V,
independent of VCC operating voltage.
Features
•
•
•
•
•
•
•
•
•
•
Ultra−High Speed: tPD 2.4 ns (Typical) into 50 pF at 5 V VCC
High Output Drive: ±24 mA at 3 V VCC
Broad VCC Operating Range: 1.65 V to 5.5 V
Matches Performance of LCX when Operated at 3.3 V VCC
Power Down High−Impedance Inputs / Outputs
Over−Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation
Proprietary Noise / EMI Reduction Circuitry
Ultra−Small MicroPak™ Packages
Space−Saving SC−74A and SC70 Packages
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
IEEC / IEC
A
1
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MARKING
DIAGRAMS
CCKK
XYZ
SIP6 1.45x1.0
CASE 127EB
Pin 1
UDFN6
1.0X1.0, 0.35P
CASE 517DP
CCKK
XYZ
Pin 1
SC−74A
CASE 318BQ
7Z04 MG
G
SC−88A
(SC−70 5 Lead),
1.25x2
CASE 419AC−01
Y
Z04T
Figure 1. Logic Symbol
CC, 7Z04, Z04 = Specific Device Code
KK
= 2−Digit Lot Run Traceability Code
XY
= 2−Digit Date Code Format
Z
= Assembly Plant Code
M
= Data Code
T
= Die Run Code
= Year Coding Scheme
= Plant Code Identifier
= Eight−Week Datacoding Scheme
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 1996
July, 2019 − Rev. 3
1
Publication Order Number:
NC7SZ04/D
NC7SZ04
Pin Configurations
NC 1
5
NC 1
VCC
A 2
A 2
GND 3
4
Y
GND 3
Figure 2. SC70 and SC−74A (Top View)
6 VCC
5 NC
4 Y
Figure 3. MicroPak (Top Through View)
PIN DEFINITIONS
FUNCTION TABLE (Y = /A)
Pin # SC70 /
SC74 A
Pin # MicroPak
Name
1
1, 5
NC
2
2
A
3
3
GND
Ground
4
4
Y
Output
5
6
VCC
Description
No Connect
Input
Input
Output
A
Y
L
H
H
L
H = HIGH Logic Level
L = LOW Logic Level
Supply Voltage
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2
NC7SZ04
ABSOLUTE MAXIMUM RATINGS
Symbol
Min
Max
Unit
VCC
Supply Voltage
−0.5
6.0
V
VIN
DC Input Voltage
−0.5
6.0
V
DC Output Voltage
−0.5
6.0
V
VIN < −0.5 V
−
−50
mA
VIN > 6.0 V
−
+20
VOUT < −0.5 V
−
−50
VOUT > 6 V, VCC = GND
−
+20
DC Output Current
−
±50
mA
DC VCC or Ground Current
−
±50
mA
−65
+150
°C
−
+150
°C
VOUT
IIK
IOK
IOUT
ICC or IGND
TSTG
Parameter
DC Input Diode Current
DC Output Diode Current
Storage Temperature Range
mA
TJ
Junction Temperature Under Bias
TL
Junction Lead Temperature (Soldering, 10 Seconds)
−
+260
°C
PD
Power Dissipation in Still Air
SC−74A
−
225
mW
SC70−5
−
190
MicroPak−6
−
327
MicroPak2™−6
−
327
Human Body Model, JEDEC: JESD22−A114
−
4000
Charge Device Model, JEDEC: JESD22−C101
−
2000
ESD
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VIN
VOUT
Parameter
Min
Max
Unit
Supply Voltage Operating
1.65
5.50
V
Supply Voltage Data Retention
1.5
5.5
Input Voltage
0
5.5
V
Output Voltage
0
VCC
V
−40
+85
°C
VCC at 1.8 V, 2.5 V ±0.2 V
0
20
ns/V
VCC at 3.3 V ±0.3 V
0
10
VCC at 5.0 V ±0.5 V
0
5
SC−74A
−
555
SC70−5
−
659
MicroPak−6
−
382
MicroPak2−6
−
382
TA
Operating Temperature
tr, tf
Input Rise and Fall Times
qJA
Thermal Resistance
Conditions
°C/W
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
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3
NC7SZ04
DC ELECTICAL CHARACTERISTICS
TA = 25°C
Symbol
VIH
VIL
VOH
Parameter
HIGH Level Input Voltage
LOW Level Input Voltage
HIGH Level Output Voltage
Typ
Max
Min
Max
Unit
1.65 to 1.95
0.65 VCC
−
−
0.65 VCC
−
V
2.30 to 5.50
0.70 VCC
−
−
0.70 VCC
−
1.65 to 1.95
−
−
0.35 VCC
−
0.35 VCC
2.30 to 5.50
−
−
0.30 VCC
−
0.30 VCC
1.55
1.65
−
−
−
1.70
1.80
−
1.70
−
2.30
2.20
2.30
−
2.20
−
3.00
2.90
3.00
−
2.90
−
4.50
4.40
4.50
−
4.40
−
VCC (V)
1.65
1.80
VOL
LOW Level Output Voltage
IOFF
Power Off Leakage Current
ICC
Quiescent Supply Current
VIN = VIL,
IOH = −100 mA
IOH = −4 mA
1.29
1.52
−
1.29
−
2.30
IOH = −8 mA
1.90
2.15
−
1.90
−
3.00
IOH = −16 mA
2.40
2.80
−
2.40
−
3.00
IOH = −24 mA
2.30
2.68
−
2.30
−
4.50
IOH = −32 mA
3.80
4.20
−
3.80
−
1.65
VIN = VIH,
IOL = 100 mA
−
0.00
0.10
−
0.10
−
0.00
0.10
−
0.10
2.30
−
0.00
0.10
−
0.10
3.00
−
0.00
0.10
−
0.10
4.50
−
0.00
0.10
−
0.10
1.65
IOL = 4 mA
−
0.80
0.24
−
0.24
2.30
IOL = 8 mA
−
0.10
0.30
−
0.30
3.00
IOL = 16 mA
−
0.15
0.40
−
0.40
3.00
IOL = 24 mA
−
0.22
0.55
−
0.55
4.50
Input Leakage Current
Conditions
1.65
1.80
IIN
TA = −40 to 85°C
Min
1.65 to 5.5
0
1.65 to 5.50
V
V
V
IOL = 32 mA
−
0.22
0.55
−
0.55
0 ≤ VIN ≤ 5.5 V
−
−
±1
−
±10
mA
VIN or VOUT = 5.5 V
−
−
1
−
10
mA
VIN = 5.5 V, GND
−
−
2.0
−
20
mA
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4
NC7SZ04
AC ELECTRICAL CHARACTERISTICS
TA = +25°C
Symbol
tPLH, tPHL
Parameter
VCC (V)
Propagation Delay
(Figure 4, 5)
Conditions
TA = −40 to +85°C
Min
Typ
Max
Min
Max
Unit
−
5.3
11.4
−
12.0
ns
−
4.4
9.5
−
10.0
2.50 ±0.20
−
2.9
6.5
−
7.0
3.30 ±0.30
−
2.1
4.5
−
4.7
5.00 ±0.50
−
1.8
3.9
−
4.1
−
2.9
5.0
−
5.2
−
2.4
4.3
−
4.5
CL = 15 pF,
RL = 1 MW
1.65
1.80
3.30 ±0.30
5.00 ±0.50
CL = 50 pF,
RL = 500 W
CIN
Input Capacitance
0.00
−
4
−
−
−
pF
CPD
Power Dissipation Capacitance
(Note 2) (Figure 6)
3.30
−
20
−
−
−
pF
5.00
−
26
−
−
−
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression:
ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
tf = 3 ns
tr = 3 ns
90%
50%
INPUT
10%
VCC
INPUT
RL
OUTPUT
VCC
50%
10%
tW
tPHL
OUTPUT
CL
90%
tPLH
50%
GND
VOH
50%
VOL
Figure 4. AC Test Circuit
Figure 5. AC Waveforms
VCC
A
INPUT
NOTE:
3. Input = AC Waveform; tr = tf = 1.8 ns;
PRR = 10 MHz; Duty Cycle = 50%.
Figure 6. ICCD Test Circuit
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5
NC7SZ04
DEVICE ORDERING INFORMATION
Top Mark
Packages
Shipping†
NC7SZ04M5X
7Z04
5−Lead SC−74A, 1.6mm
3000 / Tape & Reel
NC7SZ04P5X
Z04
5−Lead SC70, EIAJ SC−88a, 1.25 mm Wide
3000 / Tape & Reel
NC7SZ04L6X
CC
6−Lead MicroPak, 1.00 mm Wide
5000 / Tape & Reel
NC7SZ04FHX
CC
6−Lead, MicroPak2, 1 x 1 mm Body, .35 mm Pitch
5000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other
countries.
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6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13590G
SIP6 1.45X1.0
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
5
1
SCALE 2:1
DATE 18 JAN 2018
5X
b
0.20 C A B
E1
5
M
4
1
2
E
3
B
0.05
A1
e
D
A
L
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
DIM
A
A1
b
c
D
E
E1
e
L
M
TOP VIEW
A
SIDE VIEW
DETAIL A
C
c
SEATING
PLANE
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
MILLIMETERS
MIN
MAX
0.90
1.10
0.01
0.10
0.25
0.50
0.10
0.26
2.85
3.15
2.50
3.00
1.35
1.65
0.95 BSC
0.20
0.60
0_
10 _
GENERIC
MARKING DIAGRAM*
0.95
PITCH
XXX MG
G
XXX
M
G
2.40
= Specific Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
5X
1.00
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON66279G
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
SC−74A
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON66279G
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ BY I. HYLAND.
27 JUN 2017
A
CORRECTED MARKING DIAGRAM FROM 6 TO 5−LEAD. REQ BY I. HYLAND.
20 SEP 2017
B
CORRECTED SOLDERING FOOTPRINT PITCH FROM 3.40MM TO 2.40MM. REQ.
BY I. HYLAND.
18 JAN 2018
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2018
January, 2018 − Rev. B
Case Outline Number:
318BQ
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70 5 Lead), 1.25x2
CASE 419AC−01
ISSUE A
D
e
e
E1 E
DATE 29 JUN 2010
SYMBOL
MIN
A
0.80
MAX
1.10
A1
0.00
0.10
A2
0.80
1.00
b
0.15
0.30
0.18
c
0.10
D
1.80
2.00
2.20
E
1.80
2.10
2.40
E1
1.15
1.25
1.35
0.65 BSC
e
L
TOP VIEW
NOM
0.26
0.36
L1
0.42 REF
L2
0.15 BSC
0.46
θ
0º
8º
θ1
4º
10º
q1
A2 A
q
b
q1
L
L1
A1
SIDE VIEW
c
L2
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-203.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34260E
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
SC−88A (SC−70 5 LEAD), 1.25X2
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6 1.0X1.0, 0.35P
CASE 517DP
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13593G
UDFN6 1.0X1.0, 0.35P
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
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1
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