DATA SHEET
www.onsemi.com
TinyLogic UHS 2-Input
Non-Inverting Multiplexer
MARKING
DIAGRAMS
NC7SZ157
Pin 1
Description
The NC7SZ157 is a single, high performance, 2−to−1 CMOS
non−inverting multiplexer from onsemi’s Ultra−High Speed series of
TinyLogic. The device is fabricated with advanced CMOS technology
to achieve ultra high speed with high output drive while maintaining
low static power dissipation over a broad VCC operating range. The
device is specified to operate over the 1.65 V to 5.5 V VCC operating
range. The inputs and outputs are high impedance when VCC is 0 V.
Inputs tolerate voltages up to 5.5 V independent of VCC operating
range.
UDFN6
1.0X1.0, 0.35P
CASE 517DP
B9KK
XYZ
Pin 1
6
SC−88
CASE 419B−02
ZF7M G
G
1
Features
•
•
•
•
•
•
•
•
B9KK
XYZ
SIP6 1.45x1.0
CASE 127EB
Broad VCC Operating Range: 1.65 V to 5.5 V
Ultra High−Speed
Power Down High−Impedance Inputs / Outputs
Over−Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation
Proprietary Noise / EMI Reduction Circuitry
Ultra−Small MicroPak™ Packages
Space−Saving SC−88 Package
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
I1
1
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
S
0
= Specific Device Code
= 2−Digit Lot Run Traceability Code
= 2−Digit Date Code Format
= Assembly Plant Code
= Date Code*
= Pb−Free Package
ORDERING INFORMATION
IEEC / IEC
I0
B9, ZF7
KK
XY
Z
M
G
MUX
Z
Figure 1. Logic Symbol
© Semiconductor Components Industries, LLC, 2000
June, 2022 − Rev. 6
1
Publication Order Number:
NC7SZ157/D
NC7SZ157
Pin Configurations
I1 1
I1 1
6
S
5
VCC
4
Z
1
GND 2
0
I0 3
GND 2
5 VCC
I0 3
Figure 2. SC−88 (Top View)
(Top View)
6 S
4 Z
Figure 3. MicroPak (Top Through View)
AAA
Pin One
NOTES:
1. AAA represents product code top mark (see Ordering Information).
2. Orientation of top mark determines pin one location.
3. Reading the top mark left to right, pin one is the lower left pin.
Figure 4. Pin 1 Orientation
PIN DEFINITIONS
FUNCTION TABLE
Pin # SC−88
Pin # MicroPak
Name
1
1
I1
2
2
GND
3
3
4
Description
Inputs
Output
Data Input
S
I1
I0
Z = (I0) · (S) + (I1) · (S)
Ground
L
X
L
L
I0
Data Input
L
X
H
H
4
Z
Output
H
L
X
L
5
5
VCC
Supply Voltage
H
H
X
H
6
6
S
Control Input
H = HIGH Logic Level
L = LOW Logic Level
X = Don’t Care
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2
NC7SZ157
ABSOLUTE MAXIMUM RATINGS
Symbol
Min
Max
Unit
VCC
Supply Voltage
−0.5
6.5
V
VIN
DC Input Voltage
−0.5
6.5
V
DC Output Voltage
−0.5
6.5
V
VOUT
Parameter
IIK
DC Input Diode Current
VIN < 0 V
−
−50
mA
IOK
DC Output Diode Current
VOUT < 0 V
−
−50
mA
IOUT
DC Output Current
−
±50
mA
DC VCC or Ground Current
−
±50
mA
−65
+150
°C
ICC or IGND
TSTG
Storage Temperature Range
TJ
Junction Temperature Under Bias
−
+150
°C
TL
Junction Lead Temperature (Soldering, 10 Seconds)
−
+260
°C
PD
Power Dissipation in Still Air
SC−88
−
332
mW
MicroPak−6
−
812
MicroPak2™−6
−
812
Human Body Model, JEDEC: JESD22−A114
−
4000
Charge Device Model, JEDEC: JESD22−C101
−
2000
ESD
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VIN
VOUT
Parameter
Min
Max
Unit
Supply Voltage Operating
1.65
5.5
V
Supply Voltage Data Retention
1.50
5.5
0
5.5
Input Voltage
Output Voltage
TA
Operating Temperature
tr, tf
Input Rise and Fall Times
qJA
Conditions
Thermal Resistance
V
0
VCC
V
−40
+85
°C
VCC at 1.8 V ±0.15 V, 2.5 V ±0.2 V
0
20
ns/V
VCC at 3.3 V ±0.3 V
0
10
VCC at 5.0 V ±0.5 V
0
5
SC−88
−
377
MicroPak−6
−
154
MicroPak2−6
−
154
°C/W
°C/W
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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3
NC7SZ157
DC ELECTRICAL CHARACTERISTICS
TA = +25°C
Symbol
VIH
VIL
VOH
VOL
Parameter
VCC (V)
Conditions
Typ
Max
Min
Max
Unit
V
HIGH Level
Input Voltage
1.65 to 1.95
0.65 VCC
−
−
0.65 VCC
−
2.30 to 5.50
0.70 VCC
−
−
0.70 VCC
−
LOW Level
Input Voltage
1.65 to 1.95
−
−
0.35 VCC
−
0.35 VCC
2.30 to 5.50
−
−
0.30 VCC
−
0.30 VCC
1.55
1.65
−
1.55
−
2.20
2.30
−
2.20
−
3.00
2.90
3.00
−
2.90
−
4.50
4.40
4.50
−
4.40
−
HIGH Level
Output Voltage
LOW Level
Output Voltage
1.65
2.30
VIN = VIH
or VIL
IOH = −100 mA
1.65
IOH = −4 mA
1.29
1.52
−
1.29
−
2.30
IOH = −8 mA
1.90
2.15
−
1.90
−
3.00
IOH = −16 mA
2.40
2.80
−
2.40
−
3.00
IOH = −24 mA
2.30
3.68
−
2.30
−
4.50
IOH = −32 mA
3.90
4.20
−
3.80
−
IOL = 100 mA
−
0
0.10
−
0.10
−
0
0.10
−
0.10
−
0
0.10
−
0.10
1.65
2.30
VIN = VIH
or VIL
3.00
4.50
IIN
TA = −40 to +85°C
Min
Input Leakage
Current
IOFF
Power Off
Leakage Current
ICC
Quiescent
Supply Current
V
V
V
−
0
0.10
−
0.10
1.65
IOL = 4 mA
−
0.08
0.24
−
0.24
2.30
IOL = 8 mA
−
0.10
0.30
−
0.30
3.00
IOL = 16 mA
−
0.15
0.40
−
0.40
3.00
IOL = 24 mA
−
0.22
0.55
−
0.55
4.50
IOL = 32 mA
−
0.22
0.55
−
0.55
VIN = 5.5 V, GND
−
−
±0.1
−
±1
mA
VIN or
VOUT = 5.5 V
−
−
1.0
−
10
mA
VIN = 5.5 V, GND
−
−
1.0
−
10
mA
1.65 to 5.5
0
1.65 to 5.50
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4
NC7SZ157
AC ELECTRICAL CHARACTERISTICS
TA = +25°C
Symbol
tPLH, tPHL
Parameter
VCC (V)
Propagation Delay S to Z
(Figure 5, 6)
Conditions
Typ
Max
Min
Max
Unit
−
6.0
11.5
−
12.0
ns
−
3.5
6.1
−
6.5
3.30 ±0.30
−
2.6
4.1
−
4.5
5.00 ±0.50
−
1.9
3.2
−
3.5
−
5.9
10.0
−
10.5
−
3.5
5.8
−
6.1
3.30 ±0.30
−
2.6
3.9
−
4.2
5.00 ±0.50
−
1.9
3.1
−
3.3
CL = 50 pF,
RL = 500 W,
−
3.2
4.8
−
5.2
−
2.4
3.8
−
4.1
CL = 50 pF,
RL = 500 W,
−
3.2
4.6
−
5.0
−
2.4
3.7
−
4.0
1.80 ±0.15
2.50 ±0.20
Propagation Delay In to Z
(Figure 5, 6)
TA = −40 to +85°C
Min
1.80 ±0.15
5.00 ±0.50
Propagation Delay S to Z
(Figure 5, 6)
3.30 ±0.30
Propagation Delay In to Z
(Figure 5, 6)
3.30 ±0.30
5.00 ±0.50
5.00 ±0.50
CL = 15 pF,
RL = 1 MW,
CL = 15 pF,
RL = 1MW,
CIN
Input Capacitance
0.00
−
2
−
−
−
pF
CPD
Power Dissipation Capacitance
(Note 4) (Figure 7)
3.30
−
14
−
−
−
pF
5.00
−
17
−
−
−
4. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression:
ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
tr = 3 ns
VCC
tf = 3 ns
90%
DUT
INPUT
CL
50%
INPUT
OUTPUT
10%
RL
90%
50%
GND
tPLH
VOH
50%
50%
Out of Phase
OUTPUT
Figure 5. AC Test Circuit
10%
tW
tPHL
NOTE:
5. CL includes load and stray capacitance;
inputs PRR = 1.0 MHz, tW = 500 ns.
VCC
VOL
VCC
tPLH
A
In Phase
OUTPUT
tPHL
50%
VOH
50%
VOL
INPUT
DUT
INPUT
Figure 6. AC Waveforms
NOTE:
6. Input = AC Waveform; PRR = Variable; Duty Cycle = 50%.
Figure 7. ICCD Test Circuit
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5
NC7SZ157
DEVICE ORDERING INFORMATION
Top Mark
Packages
Shipping†
NC7SZ157P6X
ZF7
6−Lead SC70, EIAJ SC−88, 1.25 mm Wide
3000 / Tape & Reel
NC7SZ157P6X−L22347
ZF7
6−Lead SC70, EIAJ SC−88, 1.25 mm Wide
3000 / Tape & Reel
NC7SZ157L6X
B9
6−Lead MicroPak, 1.00 mm Wide
5000 / Tape & Reel
NC7SZ157L6X−L22175
B9
6−Lead MicroPak, 1.00 mm Wide
5000 / Tape & Reel
NC7SZ157FHX
B9
6−Lead, MicroPak2, 1x1 mm Body, .35 mm Pitch
5000 / Tape & Reel
NC7SZ157FHX−L22175
B9
6−Lead, MicroPak2, 1x1 mm Body, .35 mm Pitch
5000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United
States and/or other countries.
www.onsemi.com
6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13590G
SIP6 1.45X1.0
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
1
SCALE 2:1
DATE 11 DEC 2012
2X
aaa H D
D
H
A
D
6
5
GAGE
PLANE
4
1
2
L
L2
E1
E
DETAIL A
3
aaa C
2X
bbb H D
2X 3 TIPS
e
B
6X
b
ddd
TOP VIEW
C A-B D
M
A2
DETAIL A
A
6X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY AND DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OF THE FOOT.
ccc C
A1
SIDE VIEW
C
SEATING
PLANE
END VIEW
c
RECOMMENDED
SOLDERING FOOTPRINT*
6X
DIM
A
A1
A2
b
C
D
E
E1
e
L
L2
aaa
bbb
ccc
ddd
MILLIMETERS
MIN
NOM MAX
−−−
−−−
1.10
0.00
−−−
0.10
0.70
0.90
1.00
0.15
0.20
0.25
0.08
0.15
0.22
1.80
2.00
2.20
2.00
2.10
2.20
1.15
1.25
1.35
0.65 BSC
0.26
0.36
0.46
0.15 BSC
0.15
0.30
0.10
0.10
GENERIC
MARKING DIAGRAM*
6
XXXMG
G
6X
0.30
INCHES
NOM MAX
−−− 0.043
−−− 0.004
0.035 0.039
0.008 0.010
0.006 0.009
0.078 0.086
0.082 0.086
0.049 0.053
0.026 BSC
0.010 0.014 0.018
0.006 BSC
0.006
0.012
0.004
0.004
MIN
−−−
0.000
0.027
0.006
0.003
0.070
0.078
0.045
0.66
1
2.50
0.65
PITCH
XXX = Specific Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
*Date Code orientation and/or position may
vary depending upon manufacturing location.
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
STYLES ON PAGE 2
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42985B
SC−88/SC70−6/SOT−363
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
DATE 11 DEC 2012
STYLE 1:
PIN 1. EMITTER 2
2. BASE 2
3. COLLECTOR 1
4. EMITTER 1
5. BASE 1
6. COLLECTOR 2
STYLE 2:
CANCELLED
STYLE 3:
CANCELLED
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. COLLECTOR
4. EMITTER
5. BASE
6. ANODE
STYLE 5:
PIN 1. ANODE
2. ANODE
3. COLLECTOR
4. EMITTER
5. BASE
6. CATHODE
STYLE 6:
PIN 1. ANODE 2
2. N/C
3. CATHODE 1
4. ANODE 1
5. N/C
6. CATHODE 2
STYLE 7:
PIN 1. SOURCE 2
2. DRAIN 2
3. GATE 1
4. SOURCE 1
5. DRAIN 1
6. GATE 2
STYLE 8:
CANCELLED
STYLE 9:
PIN 1. EMITTER 2
2. EMITTER 1
3. COLLECTOR 1
4. BASE 1
5. BASE 2
6. COLLECTOR 2
STYLE 10:
PIN 1. SOURCE 2
2. SOURCE 1
3. GATE 1
4. DRAIN 1
5. DRAIN 2
6. GATE 2
STYLE 11:
PIN 1. CATHODE 2
2. CATHODE 2
3. ANODE 1
4. CATHODE 1
5. CATHODE 1
6. ANODE 2
STYLE 12:
PIN 1. ANODE 2
2. ANODE 2
3. CATHODE 1
4. ANODE 1
5. ANODE 1
6. CATHODE 2
STYLE 13:
PIN 1. ANODE
2. N/C
3. COLLECTOR
4. EMITTER
5. BASE
6. CATHODE
STYLE 14:
PIN 1. VREF
2. GND
3. GND
4. IOUT
5. VEN
6. VCC
STYLE 15:
PIN 1. ANODE 1
2. ANODE 2
3. ANODE 3
4. CATHODE 3
5. CATHODE 2
6. CATHODE 1
STYLE 16:
PIN 1. BASE 1
2. EMITTER 2
3. COLLECTOR 2
4. BASE 2
5. EMITTER 1
6. COLLECTOR 1
STYLE 17:
PIN 1. BASE 1
2. EMITTER 1
3. COLLECTOR 2
4. BASE 2
5. EMITTER 2
6. COLLECTOR 1
STYLE 18:
PIN 1. VIN1
2. VCC
3. VOUT2
4. VIN2
5. GND
6. VOUT1
STYLE 19:
PIN 1. I OUT
2. GND
3. GND
4. V CC
5. V EN
6. V REF
STYLE 20:
PIN 1. COLLECTOR
2. COLLECTOR
3. BASE
4. EMITTER
5. COLLECTOR
6. COLLECTOR
STYLE 21:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. N/C
6. CATHODE 1
STYLE 22:
PIN 1. D1 (i)
2. GND
3. D2 (i)
4. D2 (c)
5. VBUS
6. D1 (c)
STYLE 23:
PIN 1. Vn
2. CH1
3. Vp
4. N/C
5. CH2
6. N/C
STYLE 24:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
STYLE 25:
PIN 1. BASE 1
2. CATHODE
3. COLLECTOR 2
4. BASE 2
5. EMITTER
6. COLLECTOR 1
STYLE 26:
PIN 1. SOURCE 1
2. GATE 1
3. DRAIN 2
4. SOURCE 2
5. GATE 2
6. DRAIN 1
STYLE 27:
PIN 1. BASE 2
2. BASE 1
3. COLLECTOR 1
4. EMITTER 1
5. EMITTER 2
6. COLLECTOR 2
STYLE 28:
PIN 1. DRAIN
2. DRAIN
3. GATE
4. SOURCE
5. DRAIN
6. DRAIN
STYLE 29:
PIN 1. ANODE
2. ANODE
3. COLLECTOR
4. EMITTER
5. BASE/ANODE
6. CATHODE
STYLE 30:
PIN 1. SOURCE 1
2. DRAIN 2
3. DRAIN 2
4. SOURCE 2
5. GATE 1
6. DRAIN 1
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42985B
SC−88/SC70−6/SOT−363
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6 1.0X1.0, 0.35P
CASE 517DP
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13593G
UDFN6 1.0X1.0, 0.35P
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
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