NC7SZ175
TinyLogic UHS D-Type
Flip-Flop with
Asynchronous Clear
Description
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The NC7SZ175 is a single positive edge−triggered D−type CMOS
Flip−Flop with Asynchronous Clear from ON Semiconductor’s Ultra
High Speed Series of TinyLogic in the space saving SC70 6−lead
package. The device is fabricated with advanced CMOS technology to
achieve ultra high speed with high output drive while maintaining low
static power dissipation over a very broad VCC operating range. The
device is specified to operate over the 1.65 V to 5.5 V VCC range. The
inputs and output are high impedance when VCC is 0 V. Inputs tolerate
voltages up to 5.5 V independent of VCC operating voltage. This
single flip−flop will store the state of the D input that meets the setup
and hold time requirements on the LOW−to−HIGH Clock (CP)
transition. A LOW input to Clear sets the Q output to LOW level. The
Clear input is independent of clock.
MARKING
DIAGRAMS
SIP6 1.45x1.0
CASE 127EB
Pin 1
SC−88
(SC−70 6 Lead)
1.25x2
CASE 419AD−01
Features
•
•
•
•
•
•
•
•
•
•
Space Saving SC70 6−Lead Package
Ultra Small MicroPak™ Leadless Package
Ultra High Speed: tPD 2.6 ns Typ into 50 pF at 5 V VCC
High Output Drive: ±24 mA at 3 V VCC
Broad VCC Operating Range: 1.65 V to 5.5 V
Matches the Performance of LCX when Operated at 3.3 V VCC
Power Down High Impedance Inputs / Output
Overvoltage Tolerant Inputs Facilitate 5 V to 3 V Translation
Proprietary Noise / EMI Reduction Circuitry Implemented
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
C4KK
XYZ
C4, Z75
KK
XY
Z
T
Z75T
= Specific Device Code
= 2−Digit Lot Run Traceability Code
= 2−Digit Date Code Format
= Assembly Plant Code
= Year Coding Scheme
= Plant Code Identifier
= Die Run Code
= Eight−Week Datacoding Scheme
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
IEEC / IEC
C
CP
D
Q
Figure 1. Logic Symbol
© Semiconductor Components Industries, LLC, 2004
June, 2019 − Rev. 3
1
Publication Order Number:
NC7SZ175/D
NC7SZ175
Connection Diagrams
CP
1
GND
2
CP
D
C
5
VCC
CP 1
C
D
6
GND 2
Q
3
4
Q
5 VCC
D 3
Figure 2. SC70 (Top View)
(Top View)
6 C
4 Q
Figure 4. MicroPak (Top Through View)
AAA
Pin One
AAA represents Product Code Top Mark − see ordering code.
NOTE:
Orientation of Top Mark determines Pin One location.
Read the Top Product Code Mark left to right, Pin One
is the lower left pin (see diagram).
Figure 3. Pin 1 Orientation
PIN DESCRIPTIONS
Pin Name
D
FUNCTION TABLE
Description
Inputs
Data Input
D
C
Q
Clock Pulse Input
L
H
L
C
Clear Input
H
H
H
Q
Flip−Flop Output
X
H
Qn
X
L
L
CP
CP
Output
X
H = HIGH Logic Level
L = LOW Logic Level
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2
Qn = No Change in Data
X = Immaterial
NC7SZ175
ABSOLUTE MAXIMUM RATINGS
Symbol
Min
Max
Unit
VCC
Supply Voltage
−0.5
+6.5
V
VIN
DC Input Voltage
−0.5
+6.5
V
DC Output Voltage
−0.5
+6.5
V
VOUT
Parameter
IIK
DC Input Diode Current
VIN < 0 V
−
−50
mA
IOK
DC Output Diode Current
VOUT < 0 V
−
−50
mA
IOUT
DC Output Source / Sink Current
−
±50
mA
DC VCC / GND Current
−
±50
mA
−65
+150
°C
ICC / IGND
TSTG
Storage Temperature Range
TJ
Junction Temperature under Bias
−
150
°C
TL
Junction Lead Temperature (Soldering, 10 Seconds)
−
260
°C
PD
Power Dissipation @ +85°C
SC70
−
190
mW
MicroPak
−
327
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VIN
VOUT
tr, tf
Min
Max
Unit
Supply Voltage Operating
Parameter
1.65
5.5
V
Supply Voltage Data Retention
1.5
5.5
Input Voltage
0
5.5
V
Output Voltage
0
VCC
V
VCC = 1.8 V, 2.5 V ±0.2 V
0
20
ns/V
VCC = 3.3 V ±0.3 V
0
10
Input Rise and Fall Time
Conditions
VCC = 5.5 V ±0.5 V
TA
Operating Temperature
qJA
Thermal Resistance
0
5
−40
+85
°C
SC70−5
−
659
°C/W
MicroPak
−
382
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
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3
NC7SZ175
DC ELECTICAL CHARACTERISTICS
TA = +25°C
Symbol
VIH
VIL
VOH
VOL
Parameter
VCC (V)
Typ
Max
Min
Max
Unit
V
HIGH Level Input
Control Voltage
1.65 to 1.95
0.65 VCC
−
−
0.65 VCC
−
2.3 to 5.5
0.7 VCC
−
−
0.7 VCC
−
LOW Level Input
Control Voltage
1.65 to 1.95
−
−
0.35 VCC
−
0.35 VCC
2.3 to 5.5
−
−
0.3 VCC
−
0.3 VCC
1.55
1.65
−
1.55
−
1.7
1.8
−
1.7
−
2.3
2.2
2.3
−
2.2
−
3.0
2.9
3.0
−
2.9
−
4.5
4.4
4.5
−
4.4
−
HIGH Level Control
Output Voltage
LOW Level Control
Output Voltage
1.65
1.8
Input Leakage
Current
IOFF
Power Off Leakage
Current
ICC
Quiescent Supply
Current
VIN = VIH
or VIL
IOH = −100 mA
1.65
IOH = −4 mA
1.24
1.52
−
1.29
−
2.3
IOH = −8 mA
1.9
2.15
−
1.9
−
3.0
IOH = −16 mA
2.4
2.8
−
2.4
−
3.0
IOH = −24 mA
2.3
2.68
−
2.3
−
4.5
IOH = −32 mA
3.8
4.2
−
3.8
−
IOL = 100 mA
−
0.0
0.1
−
0.1
−
0.0
0.1
−
0.1
2.3
−
0.0
0.1
−
0.1
3.0
−
0.0
0.1
−
0.1
4.5
−
0.0
0.1
−
0.1
1.65
1.8
VIN = VIL
or VIH
1.65
IOL = 4 mA
−
0.08
0.24
−
0.24
2.3
IOL = 8 mA
−
0.10
0.3
−
0.3
3.0
IOL = 16 mA
−
0.15
0.4
−
0.4
3.0
IOL = 24 mA
−
0.22
0.55
−
0.55
IOL = 32 mA
4.5
IIN
Conditions
TA = −40 to +85°C
Min
1.65 to 5.5
0.0
1.65 to 5.5
V
V
V
−
0.22
0.55
−
0.55
0 ≤ VIN ≤ 5.5 V
−
−
±0.1
−
±1.0
mA
VIN or VOUT = 5.5 V
−
−
1.0
−
10
mA
VIN = 5.5 V, GND
−
−
1.0
−
10.0
mA
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4
NC7SZ175
AC ELECTRICAL CHARACTERISTICS
TA = +25°C
Symbol
fMAX
tPLH, tPHL
Parameter
Maximum Clock Frequency
(Figures 5, 8)
Propagation Delay CP to Q
(Figures 5, 7)
Conditions
Min
Typ
Max
Min
Max
Unit
1.65
CL = 50 pF,
RL = 500 W
−
−
−
100
−
MHz
−
−
−
100
−
2.5 ±0.2
−
−
−
125
−
3.3 ±0.3
−
−
−
150
−
5.0 ±0.5
−
−
−
175
−
−
9.8
15.0
−
16.5
−
6.5
10.0
−
11.0
2.5 ±0.2
−
3.8
6.5
−
7.0
3.3 ±0.3
−
2.8
4.5
−
5.0
1.8
CL = 15 pF,
RL = 1 MW
1.65
1.8
5.0 ±0.5
−
2.2
3.5
−
3.8
CL = 50 pF,
RL = 500 W
−
3.4
5.5
−
6.2
−
2.6
4.0
−
4.7
CL = 15 pF,
RL = 1 MW
−
9.8
13.5
−
15.0
−
6.5
9.0
−
10.0
2.5 ±0.2
−
3.8
6.0
−
6.4
3.3 ±0.3
−
2.8
4.3
−
4.6
5.0 ±0.5
−
2.2
3.2
−
3.5
CL = 50 pF,
RL = 500 W
−
3.4
5.3
−
5.8
−
2.7
4.0
−
4.5
CL = 50 pF,
RL = 500 W
−
−
−
2.5
−
−
−
−
2.0
−
−
−
1.5
−
CL = 50 pF,
RL = 500 W
−
−
−
1.5
−
−
−
−
1.5
−
−
−
−
1.5
−
−
−
−
3.0
−
−
−
−
2.8
−
3.3 ±0.3
5.0 ±0.5
tPHL
Propagation Delay C to Q
(Figures 5, 7)
1.65
1.8
3.3 ±0.3
5.0 ±0.5
tS
Setup Time, CP to D
(Figures 5, 8)
2.5 ±0.2
3.3 ±0.3
5.0 ±0.5
tH
Hold Time, CP to D
(Figures 5, 8)
2.5 ±0.2
3.3 ±0.3
5.0 ±0.5
tW
Pulse Width, CP
(Figures 5, 8)
2.5 ±0.2
3.3 ±0.3
CL = 50 pF,
RL = 500 W
5.0 ±0.5
Pulse Width, C
(Figures 5, 8)
2.5 ±0.2
3.3 ±0.3
5.0 ±0.5
trec
Recovery Time, C to CP
(Figures 5, 8)
TA = −40 to +85°C
VCC (V)
2.5 ±0.2
3.3 ±0.3
−
−
−
2.5
−
Clock HIGH
or LOW
CL = 50 pF,
RL = 500 W
−
−
−
3.0
−
−
−
−
2.8
−
−
−
−
2.5
−
CL = 50 pF,
RL = 500 W
−
−
−
1.0
−
−
−
−
1.0
−
−
−
−
1.0
−
5.0 ±0.5
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5
ns
ns
ns
ns
ns
ns
ns
NC7SZ175
CAPACITANCE (TA = +25°C, f = 1 MHz)
Symbol
Parameter
CIN
Condition
Typ
Max
Units
Input Capacitance
VCC = Open, VIN = 0 V or VCC
3
−
pF
COUT
Output Capacitance
VCC = 3.3 V, VIN = 0 V or VCC
4
−
pF
CPD
Power Dissipation Capacitance
(Note 2)
VCC = 3.3 V
VCC = 5.0 V
10
12
−
−
pF
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle. (See Figure 6)
CPD is related to ICCD dynamic operating current by the expression: ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
AC Loading and Waveforms
VCC
A
VCC
CP
CP Input
Q
D
C
C Input
OUTPUT
CL
D Input
RL
Q Output
CP Input = AC Waveform; tr = tf = 1.8 ns;
CP Input PRR = 10 MHz; Duty Cycle = 50%
D Input PRR = 5 MHz; Duty Cycle = 50%.
CL includes load and stray capacitance
Input PRR = 1.0 MHz, tW = 500 ns.
Figure 5. AC Test Circuit
Figure 6. ICCD Test Circuit
Figure 7. AC Waveforms
Figure 8. AC Waveforms
DEVICE ORDERING INFORMATION
Top Mark
Packages
Shipping†
NC7SZ175P6X
Z75
6−Lead SC70, EIAJ SC88, 1.25 mm Wide
3000 / Tape & Reel
NC7SZ175L6X
C4
6−Lead MicroPak, 1.00 mm Wide
5000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13590G
SIP6 1.45X1.0
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88 (SC−70 6 Lead), 1.25x2
CASE 419AD−01
ISSUE A
SYMBOL
D
e
e
E1 E
DATE 07 JUL 2010
MIN
MAX
A
0.80
1.10
A1
0.00
0.10
A2
0.80
1.00
b
0.15
0.30
c
0.10
0.18
D
1.80
2.00
2.20
E
1.80
2.10
2.40
E1
1.15
1.25
1.35
0.65 BSC
e
L
TOP VIEW
NOM
0.26
0.36
L1
0.42 REF
L2
0.15 BSC
0.46
θ
0º
8º
θ1
4º
10º
q1
A2 A
q
b
q1
L
L1
A1
SIDE VIEW
c
L2
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-203.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34266E
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
SC−88 (SC−70 6 LEAD), 1.25X2
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
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