NC7SZ374P6X

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This literature is subject to all applicable copyright laws and is not for resale in any manner. Revised October 2004 NC7SZ374 TinyLogic UHS D-Type Flip-Flop with 3-STATE Output General Description Features The NC7SZ374 is a single positive edge-triggered D-type CMOS Flip-Flop with 3-STATE output from Fairchild’s Ultra High Speed Series of TinyLogic in the space saving SC70 6-lead package. The device is fabricated with advanced CMOS technology to achieve ultra high speed with high output drive while maintaining low static power dissipation over a very broad VCC operating range. The device is specified to operate over the 1.65V to 5.5V VCC range. The inputs and output are high impedance when VCC is 0V. Inputs tolerate voltages up to 7V independent of VCC operating voltage. This single flip-flop will store the state of the D input that meets the setup and hold time requirements on the LOW-to-HIGH Clock (CP) transition. The output tolerates voltages above VCC in the 3-STATE condition. ■ Space saving SC70 6-lead package ■ Ultra small MicroPak leadless package ■ Ultra High Speed; tPD 2.6 ns Typ into 50 pF at 5V VCC ■ High Output Drive; ±24 mA at 3V VCC ■ Broad VCC Operating Range; 1.65V to 5.5V ■ Matches the performance of LCX when operated at 3.3V VCC ■ Power down high impedance inputs/output ■ Overvoltage tolerant inputs facilitate 5V - 3V translation ■ Patented noise/EMI reduction circuitry implemented Ordering Code: Order Package Product Code Number Number Top Mark NC7SZ374P6X MAA06A Z74 6-Lead SC70, EIAJ SC88, 1.25mm Wide 3k Units on Tape and Reel NC7SZ374L6X MAC06A C9 6-Lead MicroPak, 1.0mm Wide 5k Units on Tape and Reel Package Description Supplied As TinyLogic is a registered trademark of Fairchild Semiconductor Corporation. MicroPak is a trademark of Fairchild Semiconductor Corporation. © 2004 Fairchild Semiconductor Corporation DS500156 www.fairchildsemi.com NC7SZ374 TinyLogic UHS D-Type Flip-Flop with 3-STATE Output May 1998 NC7SZ374 Logic Symbol Connection Diagrams IEEE/IEC Pin Assignments for SC70 Pin Descriptions Pin Names Description D Data Input CP Clock Pulse Input OE Output Enable Input Q Flip-Flop Output (Top View) Pin One Orientation Diagram Function Table Inputs    CP D X H = HIGH Logic Level L = LOW Logic Level AAA represents Product Code Top Mark - see ordering code Output OE Note: Orientation of Top Mark determines Pin One location. Read the top product code mark left to right, Pin One is the lower left pin (see diagram). Q L L L H L H X L Qn X H Z Pad Assignment for MicroPak Z = High Impedance X = Immaterial Qn = No change in data (Top Thru View) www.fairchildsemi.com 2 Supply Voltage (VCC) −0.5V to +7.0V DC Input Voltage (VIN) −0.5V to +7.0V DC Output Voltage (VOUT) −0.5V to +7.0V Recommended Operating Conditions (Note 2) Power Supply DC Input Diode Current (IIK) VIN < 0V −50 mA Operating (VCC ) 1.65V to 5.5V Data Retention 1.5V to 5.5V Input Voltage (VIN) DC Output Diode Current (IOK) 0V to 5.5V Output Voltage (VOUT) VOUT < 0V DC Output (IOUT) Source/Sink Current −50 mA Active State 0V to VCC ± 50 mA 3-STATE 0V to 5.5V ± 50 mA DC VCC/GND Current (ICC/IGND) Input Rise and Fall Time (tr, tf) −65°C to +150°C Storage Temperature Range (TSTG) 150°C Junction Temperature under Bias (TJ) VCC = 1.8V, 2.5V ± 0.2V 0 to 20 ns/V VCC = 3.3V ± 0.3V 0 to 10 ns/V VCC = 5.5V ± 0.5V Junction Lead Temperature (TL) 260°C (Soldering, 10 seconds) Power Dissipation (PD) @ +85°C 0 to 5 ns/V −40°C to +85°C Operating Temperature (TA) Thermal Resistance (θJA) 180 mW 350° C/W Note 1: Absolute Maximum Ratings: are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the absolute maximum ratings. The “Recommended Operating Conditions” table will define the conditions for actual device operation. Note 2: Unused inputs must be held HIGH or LOW. They may not float. DC Electrical Characteristics Symbol VIH Parameter HIGH Level Control Input Voltage VIL LOW Level Control Input Voltage VOH HIGH Level Control Output Voltage VOL VCC TA = +25°C (V) Min TA = −40°C to +85°C Typ Max 1.65 to 1.95 0.75 VCC 2.3 to 5.5 2.3 to 5.5 0.25 VCC 0.3 VCC 1.65 0.3 VCC 1.8 1.7 1.8 1.7 2.3 2.2 2.3 2.2 3.0 2.9 3.0 2.9 4.5 4.4 4.5 4.4 1.65 1.24 1.52 1.29 2.3 1.9 2.15 1.9 3.0 2.4 2.8 2.4 IOH = −16 mA 3.0 2.3 2.68 2.3 IOH = −24 mA 4.5 3.8 4.2 V 0.1 Output Voltage 1.8 0.0 0.1 0.1 2.3 0.0 0.1 0.1 3.0 0.0 0.1 0.1 IOFF Power Off Leakage Current ICC Quiescent Supply Current IOH = −4 mA IOH = −32 mA 3.8 0.1 3-STATE Output Leakage VIN = VIH IOH = −8 mA 0.0 IOZ V IOH = −100 µA 1.65 Input Leakage Current Conditions 1.55 LOW Level Control IIN Units V 0.7 VCC 0.25 VCC 1.55 Max 0.75 VCC 0.75 VCC 1.65 to 1.95 1.65 Min IOL = 100 µA 4.5 0.0 0.1 0.1 1.65 0.08 0.24 0.24 2.3 0.10 0.3 0.3 IOL = 8 mA 3.0 0.15 0.4 0.4 IOL = 16 mA 3.0 0.22 0.55 0.55 IOL = 24 mA 4.5 0.22 0.55 0.55 0 to 5.5 ±0.1 ±1.0 µA 0 ≤ VIN ≤ 5.5V 1.65 to 5.5 ±0.5 ±5.0 µA VIN = VIL or VIH 0.0 1.0 10 µA VIN or VOUT = 5.5V 1.65 to 5.5 1.0 10.0 µA VIN = 5.5V, GND V VIN = VIH IOL = 4 mA IOL = 32 mA 0 ≤ VOUT ≤ 5.5V 3 www.fairchildsemi.com NC7SZ374 Absolute Maximum Ratings(Note 1) NC7SZ374 AC Electrical Characteristics Symbol fMAX VCC (V) Parameter TA = +25°C Min Typ TA = −40°C to +85°C Max Min Maximum Clock 1.65 100 Frequency 1.8 100 2.5 ± 0.2 125 3.3 ± 0.3 150 5.0 ± 0.5 tPLH Propagation Delay tPHL CP to Q tPLZ tH RD = 500Ω, S1 = Open Figure Number Figures 1, 3 175 1.50 2.5 16.5 1.8 2.5 6.5 10.0 2.5 11.0 2.5 ± 0.2 2.0 3.8 6.5 2.0 7.0 3.3 ± 0.3 1.5 2.8 4.5 1.4 5.0 5.0 ± 0.5 1.0 2.2 3.5 1.0 3.8 3.3 ± 0.3 2.0 3.4 5.5 1.6 6.2 CL = 50 pF 5.0 ± 0.5 1.5 2.6 4.0 1.4 4.7 RD = 500 Ω, S1 = Open 1.65 2.0 9.0 13.5 2.0 14.3 1.8 2.0 6.0 9.0 2.0 9.5 2.5 ± 0.2 2.0 3.7 6.0 1.8 6.6 3.3 ± 0.3 1.5 2.8 5.0 1.4 5.3 S1 = GND for tPZH 5.0 ± 0.5 1.0 2.2 3.7 1.0 3.9 S1 = VI for tPZL 1.65 2.0 7.7 12.0 2.0 13.0 CL = 15 pF ns RD = 1 MΩ CL = 50 pF, VI = 2x VCC ns RU, RD = 500 Ω CL = 50 pF, VI = 2x VCC 1.8 2.0 5.1 8.0 2.0 8.5 2.0 3.5 6.0 1.8 6.3 3.3 ± 0.3 1.5 2.8 4.5 1.4 4.7 S1 = GND for tPHZ 5.0 ± 0.5 1.0 2.3 3.7 1.0 3.9 S1 = VI for tPLZ 2.5 ± 0.2 2.5 CP to D 3.3 ± 0.3 2.0 5.0 ± 0.5 1.5 Hold Time, 2.5 ± 0.2 1.5 CP to D 3.3 ± 0.3 1.5 5.0 ± 0.5 1.5 2.5 ± 0.2 3.0 3.3 ± 0.3 2.8 5.0 ± 0.5 2.5 Figures 1, 3 S1 = Open 2.5 ± 0.2 Setup Time, Pulse Width, CP tW CL = 50 pF 9.7 Output Disable Time tS MHz Conditions 2.5 tPZH tPHZ Units 1.65 Output Enable Time tPZL Max ns RU, RD = 500 Ω CL = 50 pF ns RD = 500 Ω, S1 = Open CL = 50 pF ns D = 500 Ω, S1 = Open Figures 1, 3 Figures 1, 4 Figures 1, 4 Figures 1, 5 Figures 1, 5 CL = 50 pF ns RD = 500 Ω, S1 = Open Figures 1, 5 Capacitance (Note 3) Symbol Parameter Typ Max Units Conditions 3 pF VCC = Open, VIN 0V or VCC Output Capacitance 4 pF VCC = 3.3V, VIN = 0V or VCC Power Dissipation Capacitance (Note 4) 10 CIN Input Capacitance COUT CPD 12 pF VCC = 3.3V VCC = 5.0V Note 3: TA = +25C, f = 1MHz. Note 4: C PD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD ) at no output loading and operating at 50% duty cycle. (See Figure 2) CPD is related to ICCD dynamic operating current by the expression: ICCD = (CPD) (VCC) (fIN) + (ICCstatic). www.fairchildsemi.com 4 NC7SZ374 AC Loading and Waveforms CL includes load and stray capacitance CP Input = AC Waveform; tr = tf = 1.8 ns; Input PRR = 1.0 MHz; tw = 500 ns CP Input PRR = 10 MHz; Duty Cycle = 50% D Input PRR = 5MHz; Duty Cycle = 50% FIGURE 1. AC Test Circuit FIGURE 2. ICCD Test Circuit FIGURE 3. AC Waveforms FIGURE 4. AC Waveforms FIGURE 5. AC Waveforms 5 www.fairchildsemi.com NC7SZ374 Tape and Reel Specification TAPE FORMAT for SC70 Package Designator P6X Tape Number Cavity Section Cavities Status Cover Tape Status Leader (Start End) 125 (typ) Empty Sealed Carrier 3000 Filled Sealed Trailer (Hub End) 75 (typ) Empty Sealed TAPE DIMENSIONS inches (millimeters) Package SC70-6 Tape Size 8 mm www.fairchildsemi.com DIM A DIM B 0.093 0.096 (2.35) (2.45) DIM F DIM Ko 0.138 ± 0.004 0.053 ± 0.004 (3.5 ± 0.10) 6 (1.35 ± 0.10) DIM P1 DIM W 0.157 0.315 ± 0.004 (4) (8 ± 0.1) TAPE FORMAT for MicroPak Package Designator (Continued) Tape Number Cavity Section Cavities Status Status Leader (Start End) 125 (typ) Empty Sealed L6X Cover Tape Carrier 5000 Filled Sealed Trailer (Hub End) 75 (typ) Empty Sealed N W1 W2 W3 REEL DIMENSIONS inches (millimeters) Tape Size 8 mm A B C D 7.0 0.059 0.512 0.795 2.165 0.331 + 0.059/−0.000 0.567 W1 + 0.078/−0.039 (177.8) (1.50) (13.00) (20.20) (55.00) (8.40 + 1.50/−0.00) (14.40) (W1 + 2.00/−1.00) 7 www.fairchildsemi.com NC7SZ374 Tape and Reel Specification NC7SZ374 Physical Dimensions inches (millimeters) unless otherwise noted 6-Lead SC70, EIAJ SC88, 1.25mm Wide Package Number MAA06A www.fairchildsemi.com 8 NC7SZ374 TinyLogic UHS D-Type Flip-Flop with 3-STATE Output Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 6-Lead MicroPak, 1.0mm Wide Package Number MAC06A Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. www.fairchildsemi.com 9 www.fairchildsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. 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