DATA SHEET
www.onsemi.com
TinyLogic UHS Unbuffered
Inverter
MARKING
DIAGRAMS
C5KK
XYZ
SIP6
CASE 127EB
NC7SZU04
Pin 1
Description
The NC7SZU04 is a single unbuffered inverter from onsemi’s
Ultra−High Speed series of TinyLogic. The special purpose
unbuffered circuit design is primarily intended for crystal oscillator or
analog applications. The device is fabricated with advanced CMOS
technology to achieve ultra−high speed with high output drive while
maintaining low static power dissipation over a broad VCC operating
range. The device is specified to operate over the 1.65 V to 5.5 V VCC
range.
C5KK
XYZ
UDFN6
CASE 517DP
Pin 1
SOT−23−5
CASE 527AH
7ZU4M
SC−88A
CASE 419A−02
ZU4MG
G
Features
• Unbuffered for Crystal Oscillator and Analog Applications
• Balanced Output Drive: ±32 mA at 4.5 V VCC
• Balanced Output Drive: ±16 mA at 4.5 V VCC
•
•
•
•
•
•
(NC7SZU04P5X−L22057)
Broad VCC Operating Range: 1.65 V to 5.5 V
Matches Performance of LCX Operated at 3.3 V VCC
Low Quiescent Power: ICC < 2 mA, VCC = 5.5 V, TA = 25°C
Ultra−Small MicroPak™ Packages
Space−Saving SOT−23−5 and SC−88A Packages
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
1
June, 2022 − Rev. 6
(Note: Microdot may be in either location)
Y
ORDERING INFORMATION
Figure 1. Logic Symbol
© Semiconductor Components Industries, LLC, 1996
= Specific Device Code
= 2−Digit Lot Run Traceability Code
= 2−Digit Date Code Format
= Assembly Plant Code
= Date Code*
= Pb−Free Package
*Date Code orientation and/or position may
vary depending upon manufacturing location.
IEEE / IEC
A
C5, 7ZU4, ZU4
KK
XY
Z
M
G
See detailed ordering, marking and shipping information in the
package dimensions section on page 7 of this data sheet.
1
Publication Order Number:
NC7SZU04/D
NC7SZU04
Pin Configurations
NC 1
5
NC 1
VCC
A 2
A 2
GND 3
4
Y
GND 3
Figure 2. SC88A and SOT−23−5 (Top
View)
6 VCC
5 NC
4 Y
Figure 3. MicroPak (Top Through View)
PIN DEFINITIONS
FUNCTION TABLE
Pin # SC−88A /
SOT−23−5
Pin # MicroPak
Name
1
1, 5
NC
2
2
A
3
3
GND
Ground
4
4
Y
Output
5
6
VCC
Description
No Connect
Input
Inputs
Output
A
Y
L
H
H
L
H = HIGH Logic Level
L = LOW Logic Level
Supply Voltage
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2
NC7SZU04
ABSOLUTE MAXIMUM RATINGS
Symbol
Min
Max
Unit
VCC
Supply Voltage
−0.5
6.5
V
VIN
DC Input Voltage
−0.5
6.5
V
DC Output Voltage
−0.5
VCC + 0.5
V
VOUT
Parameter
IIK
DC Input Diode Current
VIN < 0 V
−
−50
mA
IOK
DC Output Diode Current
VOUT < 0 V
−
−50
mA
VOUT > VCC
−
+50
IOUT
DC Output Current
−
±50
mA
DC VCC or Ground Current
−
±50
mA
−65
+150
°C
ICC or IGND
TSTG
Storage Temperature Range
TJ
Junction Temperature Under Bias
−
+150
°C
TL
Junction Lead Temperature (Soldering, 10 Seconds)
−
+260
°C
PD
Power Dissipation in Still Air
SOT−23−5
−
390
mW
SC−88A
−
332
MicroPak−6
−
812
MicroPak2™−6
−
812
Human Body Model, JEDEC: JESD22−A114
−
4000
Charge Device Model, JEDEC: JESD22−C101
−
2000
ESD
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VIN
VOUT
Parameter
Conditions
Min
Max
Unit
Supply Voltage Operating
1.65
5.5
V
Supply Voltage Data Retention
1.50
5.5
Input Voltage
0
5.5
V
Output Voltage
0
VCC
V
−40
+85
°C
SOT−23−5
−
320
°C/W
SC−88A
−
377
MicroPak−6
−
154
MicroPak2−6
−
154
TA
Operating Temperature
qJA
Thermal Resistance
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
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3
NC7SZU04
DC ELECTRICAL CHARACTERISTICS
TA = +25°C
VCC (V)
Typ
Max
Min
Max
Unit
V
Symbol
Parameter
VIH
HIGH Level Input
Voltage
1.8 to 2.7
0.85 VCC
−
−
0.85 VCC
−
3.0 to 5.5
0.80 VCC
−
−
0.80 VCC
−
LOW Level Input
Voltage
1.8 to 2.7
−
−
0.15 VCC
−
0.15 VCC
3.0 to 5.5
−
−
0.20 VCC
−
0.20 VCC
VIL
Conditions
TA = −40 to +85°C
Min
VOH
High−Level Output VIN = GND
Voltage
IOH = −100 mA
IOH = −4 mA
IOH = −8 mA
IOH = −12 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
VCC − 0.1
1.29
1.9
2.2
2.4
2.3
3.8
VCC
1.4
2.1
2.4
2.7
2.5
4.0
−
−
−
−
−
−
−
VCC − 0.1
1.29
1.9
2.2
2.4
2.3
3.8
−
−
−
−
−
−
−
VOL
Low−Level Output VIN = VCC
Voltage
IOL = 100 mA
IOL = 4 mA
IOL = 8 mA
IOL = 12 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
−
−
−
−
−
−
−
−
0.08
0.2
0.22
0.28
0.38
0.42
0.1
0.24
0.3
0.4
0.4
0.55
0.55
−
−
−
−
−
−
−
0.1
0.24
0.3
0.4
0.4
0.55
0.55
V
V
V
IIN
Input Leakage
Current
VIN = 5.5 V, GND
1.65 to 5.5
−
−
±1
−
±10
mA
ICC
Quiescent Supply
Current
VIN = 5.5 V, GND
1.65 to 5.5
−
−
2
−
20
mA
ICCPEAK
Peak Supply
Current in Analog
Operation
VOUT = Open, VIN = Adjust
for Peak ICC Current
1.8
−
2
−
−
−
mA
2.5
−
4
−
−
−
3.3
−
10
−
−
−
5.0
−
30
−
−
−
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4
NC7SZU04
DC ELECTRICAL CHARACTERISTICS (NC7SZU04P5X−L22057, NC7SZU04L6X−L22175,
NC7SZU04FHX−L22175)
TA = +25°C
Min
Typ
Max
Min
Max
Unit
1.8 to 2.7
0.85 VCC
−
−
0.85 VCC
−
V
3.0 to 5.5
0.80 VCC
−
−
0.80 VCC
−
1.8 to 2.7
−
−
0.15 VCC
−
0.15 VCC
3.0 to 5.5
−
−
0.20 VCC
−
0.20 VCC
1.55
1.65
−
1.55
−
1.80
1.60
1.80
−
1.60
−
2.30
2.10
2.30
−
2.10
−
3.00
2.70
3.00
−
2.70
−
Symbol
Parameter
VCC (V)
VIH
HIGH Level Input
Voltage
VIL
LOW Level Input
Voltage
VOH
HIGH Level
Output Voltage
1.65
Conditions
VIN = VIL, IOH = −100 mA
4.50
4.00
4.40
−
4.00
−
IOH = −4 mA
1.29
1.52
−
1.29
−
2.30
IOH = −4 mA
1.90
2.14
−
1.90
−
3.00
IOH = −8 mA
2.40
2.75
−
2.40
−
3.00
IOH = −12 mA
2.30
2.61
−
2.30
−
4.50
IOH = −16 mA
3.80
4.13
−
3.80
−
1.65
VOL
LOW Level
Output Voltage
TA = −40 to +85°C
1.65
VIN = GND
−
0.00
0.10
−
0.10
1.80
−
0.00
0.20
−
0.20
2.30
−
0.00
0.20
−
0.20
3.00
−
0.00
0.30
−
0.30
4.50
−
0.00
0.50
−
0.50
IOL = 4 mA
−
0.80
0.24
−
0.24
2.30
IOL = 4 mA
−
0.10
0.30
−
0.30
3.00
IOL = 8 mA
−
0.17
0.40
−
0.40
3.00
IOL = 12 mA
−
0.25
0.55
−
0.55
4.50
IOL = 16 mA
−
0.226
0.55
−
0.55
1.65
VIN = VIH, IOL = 100 mA
VIN = VCC
V
V
V
IIN
Input Leakage
Current
1.65 to 5.5
VIN = 5.5 V, GND
−
−
±1
−
±10
mA
ICC
Quiescent Supply
Current
1.65 to 5.50
VIN = 5.5 V, GND
−
−
2
−
20
mA
ICCPEAK
Peak Supply
Current in Analog
Operation
1.8
VOUT = Open, VIN = Adjust
for Peak ICC Current
−
2
−
−
−
mA
−
4
−
−
−
3.3
−
10
−
−
−
5.0
−
30
−
−
−
2.5
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5
NC7SZU04
AC ELECTRICAL CHARACTERISTICS
TA = +25°C
Symbol
tPLH, tPHL
Parameter
TA = −40 to +85°C
Min
Typ
Max
Min
Max
Unit
−
−
11.7
−
12.1
ns
−
−
8.5
−
9.0
2.50 ±0.20
−
−
6.2
−
6.5
3.30 ±0.30
−
−
4.5
−
4.8
5.00 ±0.50
−
−
3.9
−
4.1
−
−
6.0
−
6.5
−
−
5.0
−
5.5
VCC (V)
Propagation Delay
(Figure 4, 5)
Conditions
CL = 15 pF,
RL = 1 MW
1.65
1.80
3.30 ±0.30
5.00 ±0.50
CL = 50 pF,
RL = 500 W
CIN
Input Capacitance
0.00
−
4.5
−
−
−
pF
CPD
Power Dissipation Capacitance
(Note 2) (Figure 6)
3.30
−
6.3
−
−
−
pF
5.00
−
9.5
−
−
−
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression:
ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
tf = 3 ns
tr = 3 ns
90%
VCC
50%
INPUT
INPUT
10%
OUTPUT
CL
90%
RL
50%
OUTPUT
10%
tW
tPLH
NOTE:
3. CL includes load and stray capacitance.
4. Input PRR = 1.0 MHz; tW = 500 ns
VCC
tPHL
50%
GND
VOH
50%
VOL
Figure 4. AC Test Circuit
Figure 5. AC Waveforms
VCC
A
INPUT
NOTE:
5. When operating the NC7SZU04’s unbuffered output stage in its linear range, as in oscillator applications, care must be taken to observe
maximum power rating for the device and package. The high drive nature of the design of the output stage results in substantial simultaneous
conduction currents when the stage is in the linear region. See the ICCPEAK specification in the DC Electrical Characteristics table.
6. Input = AC Waveform; tr = tf = 1.8 ns; PRR = Variable; Duty Cycle = 50%.
Figure 6. ICCD Test Circuit
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6
NC7SZU04
ORDERING INFORMATION
Top Mark
Packages
Shipping†
NC7SZU04M5X
7ZU4
SOT−23−5
3000 / Tape & Reel
NC7SZU04M5X−L22090
7ZU4
SOT−23−5
3000 / Tape & Reel
NC7SZU04P5X
ZU4
SC−88A
3000 / Tape & Reel
NC7SZU04P5X−L22057
ZU4
SC−88A
3000 / Tape & Reel
NC7SZU04L6X
C5
SIP6, MicroPak
5000 / Tape & Reel
NC7SZU04L6X−L22175
C5
SIP6, MicroPak
5000 / Tape & Reel
NC7SZU04FHX
C5
UDFN6, MicroPak2
5000 / Tape & Reel
NC7SZU04FHX−L22175
C5
UDFN6, MicroPak2
5000 / Tape & Reel
Part Number
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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7
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13590G
SIP6 1.45X1.0
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
SCALE 2:1
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DATE 17 JAN 2013
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
B
M
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
J
GENERIC MARKING
DIAGRAM*
C
K
H
XXXMG
G
SOLDER FOOTPRINT
0.50
0.0197
XXX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
mm Ǔ
ǒinches
STYLE 1:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 2:
PIN 1. ANODE
2. EMITTER
3. BASE
4. COLLECTOR
5. CATHODE
STYLE 3:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
STYLE 4:
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
5. GATE 2
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
STYLE 7:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 8:
PIN 1. CATHODE
2. COLLECTOR
3. N/C
4. BASE
5. EMITTER
STYLE 9:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42984B
STYLE 5:
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
4. CATHODE 3
5. CATHODE 4
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
SC−88A (SC−70−5/SOT−353)
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6 1.0X1.0, 0.35P
CASE 517DP
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13593G
UDFN6 1.0X1.0, 0.35P
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−23, 5 Lead
CASE 527AH
ISSUE A
DATE 09 JUN 2021
q
q
q
q
q
q1
q2
GENERIC
MARKING DIAGRAM*
XXXM
XXX = Specific Device Code
M = Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34320E
SOT−23, 5 LEAD
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
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vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
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