NC7WV07P6X

DATA SHEET www.onsemi.com TinyLogic ULP-A Dual Buffer (Open-Drain Output) MARKING DIAGRAMS NC7WV07 The NC7WV07 is a dual buffer with open−drain output in tiny footprint packages. The device is designed to operate for VCC = 0.9 V to 3.6 V. Features • • • • • • • Designed for 0.9 V to 3.6 V VCC Operation 1.6 ns tPD at 3.3 V (Typ) Inputs/Outputs Over−Voltage Tolerant up to 3.6 V IOFF Supports Partial Power Down Protection Source/Sink 24 mA at 3.3 V Available in SC−88 and MicroPak™ Packages These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant A1 1 6 Y1 GND 2 5 VCC A2 3 4 Y2 A1 1 GND 6 Y1 CCKK XYZ SIP6 1.45X1.0 MicroPak CASE 127EB Pin 1 CC KK XY Z = Specific Device Code = 2−Digit Lot Run Traceability Code = 2−Digit Date Code = Assembly Plant Code 6 XXXM G G SC−88 CASE 419B−02 1 1 XXX = Specific Devic Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. 5 VCC 2 A2 3 4 Y2 MicroPak SC−88 ORDERING INFORMATION See detailed ordering, marking and shipping information on page 6 of this data sheet. Figure 1. Pinout Diagrams (Top Views) A1 1 Y1 A2 1 Y2 Figure 2. Logic Symbol PIN ASSIGNMENT Pin FUNCTION TABLE Function A Input Y Output 1 A1 L L 2 GND H Z 3 A2 4 Y2 5 VCC 6 Y1 © Semiconductor Components Industries, LLC, 2006 September, 2021 − Rev. 2 Z = High Impedance 1 Publication Order Number: NC7WV07/D NC7WV07 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage −0.5 to +4.3 V VIN DC Input Voltage −0.5 to +4.3 V −0.5 to VCC + 0.5 −0.5 to +4.3 −0.5 to +4.3 V VIN < GND −50 mA VOUT < GND −50 mA VOUT Characteristics DC Output Voltage Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) IIK DC Input Diode Current IOK DC Output Diode Current IOUT DC Output Source/Sink Current ±50 mA DC Supply Current per Supply Pin or Ground Pin ±50 mA ICC or IGND TSTG −65 to +150 °C TL Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias +150 °C qJA Thermal Resistance (Note 2) SC−88 MicroPak 377 154 °C/W PD Power Dissipation in Still Air SC−88 MicroPak 332 812 mW Level 1 − MSL Moisture Sensitivity FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in − ESD Withstand Voltage (Note 3) Human Body Model Charged Device Model 4000 2000 V ±100 mA VESD ILatchup Latchup Performance (Note 4) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Applicable to devices with outputs that may be tri−stated. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow per JESD51−7. 3. HBM tested to EIA / JESD22−A114−A. CDM tested to JESD22−C101−A. JEDEC recommends that ESD qualification to EIA/JESD22−A115A (Machine Model) be discontinued. 4. Tested to EIA/JESD78 Class II. www.onsemi.com 2 NC7WV07 RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Positive DC Supply Voltage VIN DC Input Voltage VOUT TA tr , tf DC Output Voltage Min Max Unit 0.9 3.6 V 0 3.6 V 0 0 0 VCC 3.6 3.6 −40 +85 °C 0 10 ns/V Active−Mode (High or Low State) Tri−State Mode (Note 5) Power−Down Mode (VCC = 0 V) Operating Temperature Range Input Transition Rise and Fall Time VCC = 3.3 V ± 0.3 V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 5. Applicable to devices with outputs that may be tri−stated. DC ELECTRICAL CHARACTERISTICS TA = 255C Symbol VIH VIL VOL Parameter VCC (V) Min Typ Max Min Max Unit 0.9 − 0.5 − − − V 1.1 to 1.3 0.65 x VCC − − 0.65 x VCC − 1.4 to 1.6 0.65 x VCC − − 0.65 x VCC − 1.65 to 1.95 0.65 x VCC − − 0.65 x VCC − 2.3 to