DATA SHEET
www.onsemi.com
TinyLogic UHS Dual 2-Input
Exclusive-OR Gate
MARKING
DIAGRAMS
UQFN8
1.6X1.6, 0.5P
CASE 523AY
NC7WZ86
N7KK
XYZ
Description
The NC7WZ86 is a dual 2−Input Exclusive−OR Gate from
onsemi’s Ultra High Speed Series of TinyLogic. The device is
fabricated with advanced CMOS technology to achieve ultra high
speed with high output drive while maintaining low static power
dissipation over a very broad VCC operating range. The device is
specified to operate over the 1.65 V to 5.5 V VCC range. The inputs
and output are high impedance when VCC is 0 V. Inputs tolerate
voltages up to 5.5 V independent of VCC operating voltage.
Features
•
•
•
•
•
•
•
•
•
•
Space Saving US8 Surface Mount Package
MicroPak™ Pb−Free Leadless Package
Ultra High Speed: tPD 2.9 ns Typ. into 50 pF at 5 V VCC
High Output Drive: ±24 mA at 3 V VCC
Broad VCC Operating Range: 1.65 V to 5.5 V
Matches the Performance of LCX when Operated at 3.3 V VCC
Power Down High Impedance Inputs / Output
Overvoltage Tolerant Inputs Facilitate 5 V to 3 V Translation
Patented Noise / EMI Reduction Circuitry Implemented
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
US8
CASE 846AN
N7, WZ86
KK
XY
Z
A
L
YW
WZ86
ALYW
= Specific Device Code
= 2−Digit Lot Run Traceability Code
= 2−Digit Date Code Format
= Assembly Plant Code
= Assembly Site
= Wafer Lot Number
= Assembly Start Week
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
IEEE/IEC
A1
B1
=1
A2
B2
=1
Y1
Y2
Figure 1. Logic Symbol
© Semiconductor Components Industries, LLC, 2005
June, 2022 − Rev. 3
1
Publication Order Number:
NC7WZ86/D
NC7WZ86
Connection Diagrams
A1
1
8
VCC
B1
2
7
Y1
Y2
3
6
B2
GND
4
5
A2
A1
7
B1
6
Y2
5
VCC 8
1
Y1
2
B2
3
A2
Figure 4. Pad Assignments for MicroPak
(Top Thru View)
Figure 2. Connection Diagram
(Top View)
(Top View)
4 GND
AAA
Pin One
AAA represents Product Code Top Mark − see ordering code
NOTE:
Orientation of Top Mark determines Pin One location.
Read the top product code mark left to right, Pin One
is the lower left pin (see diagram).
Figure 3. Pin One Orientation Diagram
PIN DESCRIPTIONS
FUNCTION TABLE (Y = A ⊕ B)
Pin Names
An, Bn
Yn
Description
Output
Inputs
Input
A
B
Y
Output
L
L
L
L
H
H
H
L
H
H
H
L
H = HIGH Logic Level
L = LOW Logic Level
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2
NC7WZ86
ABSOLUTE MAXIMUM RATINGS
Symbol
Min
Max
Unit
VCC
Supply Voltage
−0.5
6.5
V
VIN
DC Input Voltage
−0.5
6.5
V
DC Output Voltage
−0.5
6.5
V
VOUT
Parameter
IIK
DC Input Diode Current
VIN < 0 V
−
−50
mA
IOK
DC Output Diode Current
VOUT < 0 V
−
−50
mA
IOUT
DC Output Current
−
±50
mA
DC VCC / GND Current
−
±100
mA
−65
+150
°C
ICC / IGND
TSTG
Storage Temperature
TJ
Junction Temperature under Bias
−
150
°C
TL
Junction Lead Temperature (Soldering, 10 Seconds)
−
260
°C
PD
Power Dissipation in Still Air
−
−
500
539
mW
US8
MicroPak−8
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VIN
VOUT
Parameter
Min
Max
Unit
Supply Voltage Operating
1.65
5.5
V
Supply Voltage Data Retention
1.5
5.5
0
5.5
Input Voltage
Output Voltage
TA
Operating Temperature
tr, tf
Input Rise and Fall Time
qJA
Thermal Resistance
V
0
VCC
V
−40
+85
°C
VCC = 1.8 V ±0.15 V, 2.5 V ±0.2 V
0
20
ns/V
VCC = 3.3 V ±0.3 V
0
10
VCC = 5.0 V ±0.5 V
0
5
−
−
250
232
US8
MicroPak−8
°C/W
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
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3
NC7WZ86
DC ELECTICAL CHARACTERISTICS
TA = +25°C
Symbol
VIH
VIL
VOH
VOL
IIN
Parameter
Conditions
VCC (V)
Min
TA = −40 to +85°C
Typ
Max
Min
Max
Unit
−
−
0.65 VCC
−
V
HIGH Level Input
Voltage
1.65 to 1.95 0.65 VCC
2.3 to 5.5
0.7 VCC
−
−
0.7 VCC
−
LOW Level Input
Voltage
1.65 to 1.95
−
−
0.35 VCC
−
0.35 VCC
2.3 to 5.5
−
−
0.3 VCC
−
0.3 VCC
1.65
1.55
1.65
−
1.55
−
2.3
2.2
2.3
−
2.2
−
3.0
2.9
3.0
−
2.9
−
4.5
4.4
4.5
−
4.4
−
IOH = −4 mA
1.65
1.29
1.52
−
1.29
−
IOH = −8 mA
2.3
1.9
2.15
−
1.9
−
IOH = −16 mA
3.0
2.4
2.80
−
2.4
−
IOH = −24 mA
3.0
2.3
2.68
−
2.3
−
IOH = −32 mA
4.5
3.8
4.20
−
3.8
−
IOL = 100 mA
1.65
−
0.0
0.1
−
0.1
2.3
−
0.0
0.1
−
0.1
3.0
−
0.0
0.1
−
0.1
4.5
−
0.0
0.1
−
0.1
IOL = 4 mA
1.65
−
0.08
0.24
−
0.24
IOL = 8 mA
2.3
−
0.10
0.3
−
0.3
IOL = 16 mA
3.0
−
0.15
0.4
−
0.4
IOL = 24 mA
3.0
−
0.22
0.55
−
0.55
IOL = 32 mA
4.5
−
0.22
0.55
−
0.55
1.65 to 5.5
−
−
±0.1
−
±1
mA
0.0
−
−
1
−
10
mA
1.65 to 5.5
−
−
1
−
10
mA
HIGH Level Output
Voltage
LOW Level Output
Voltage
VIN = VIH, VIL
VIN = VIH or
VIL
IOH = −100 mA
Input Leakage
Current
VIN = 5.5 V, GND
IOFF
Power Off Leakage
Current
VIN or VOUT = 5.5 V
ICC
Quiescent Supply
Current
VIN = 5.5 V, GND
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4
V
V
V
NC7WZ86
AC ELECTRICAL CHARACTERISTICS
TA = +25°C
Symbol
Parameter
Conditions
tPLH, tPHL Propagation Delay
(Figure 5, 7)
CL = 15 pF,
RL = 1 MW
CL = 50 pF,
RL = 500 W
CIN
Input Capacitance
CPD
Power Dissipation Capacitance
(Figure 6)
(Note 2)
TA = −40 to +85°C
VCC (V)
Min
Typ
Max
Min
Max
Unit
1.8 ±0.15
−
6.7
12.5
−
13.0
ns
2.5 ±0.2
−
4.1
7.0
−
7.5
3.3 ±0.3
−
3.0
4.8
−
5.2
5.0 ±0.5
−
2.2
3.5
−
3.8
3.3 ±0.3
−
3.8
5.4
−
5.9
5.0 ±0.5
−
2.9
4.2
−
4.6
0
−
2.5
−
−
−
pF
3.3
−
15
−
−
−
pF
5.0
−
19
−
−
−
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle. (see Figure 6) CPD is related to ICCD dynamic operating current by the expression:
ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
AC Loading and Waveforms
VCC
OUTPUT
INPUT
CL
RL
CL includes load and stray capacitance
Input PRR = 1.0 MHz; tW = 500 ns
Figure 5. AC Test Circuit
VCC
A
INPUT
Input = AC Waveform;tr = tf = 1.8 ns;
PRR = 10 MHz; Duty Cycle = 50%
Figure 6. ICCD Test Circuit
Figure 7. AC Waveforms
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5
NC7WZ86
ORDERING INFORMATION
Top Mark
Package
Shipping†
NC7WZ86K8X
WZ86
8−Lead US8, JEDEC MO−187, Variation CA
3.1 mm Wide
3000 / Tape & Reel
NC7WZ86L8X
N7
8−Lead MicroPak, 1.6 mm Wide
(Pb−Free)
5000 / Tape & Reel
NC7WZ86L8X−L22185
N7
8−Lead MicroPak, 1.6 mm Wide
(Pb−Free)
5000 / Tape & Reel
Order Number
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
3. Pb−Free package per JEDEC J−STD−020B.
MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UQFN8 1.6X1.6, 0.5P
CASE 523AY
ISSUE O
0.05
C
A
1.60
DATE 31 AUG 2016
0.40
(6X)
1.60
B
0.45
(2X)
2X
1.60
TOP VIEW
PIN#1 IDENT
0.05
1.61
C
0.50
RECOMMENDED
LAND PATTERN
0.50±0.05
0.05
C
0.05
C
0.25
(8X)
NOTES:
SEATING
PLANE
0.025±0.025
A. PACKAGE CONFORMS TO JEDEC MO−255
VARIATION UAAD.
C
B. DIMENSIONS ARE IN MILLIMETERS.
SIDE VIEW
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 2009.
1.60±0.05
(0.10)
D. LAND PATTERN RECOMMENDATION IS
EXISTING INDUSTRY LAND PATTERN.
(0.20)3X
DETAIL A
1
2
3
(0.20)
(0.09)
4
8
1.60±0.05
0.30±0.05
0.30±0.05 (7X)
7
6
5
0.50
1.00±0.05
(0.15)
0.20±0.05 (8X)
BOTTOM VIEW
DOCUMENT NUMBER:
DESCRIPTION:
98AON13591G
UQFN8 1.6X1.6, 0.5P
0.30±0.05
0.10
C
0.05
C
A
B
DETAIL A
SCALE : 2X
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
US8
CASE 846AN
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13778G
US8
DATE 31 DEC 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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