DATA SHEET
www.onsemi.com
TinyLogic UHS Dual
Unbuffered Inverter
MARKING
DIAGRAMS
Pin 1
Description
The NC7WZU04 is a dual unbuffered inverter from onsemi’s Ultra
High Speed Series of TinyLogic in the space saving SC−88 6−lead
package. The special purpose unbuffered circuit design is intended for
crystal oscillator or analog applications. The internal circuit consists
of only one−stage, the output, to allow for this part to be used in these
oscillator or analog applications. The device is fabricated with
advanced CMOS technology to achieve ultra high speed with high
output drive while maintaining low static power dissipation over a
very broad VCC operating range. The device is specified to operate
over the 1.65 V to 5.5 V VCC range. The inputs are high impedance
when VCC is 0 V. Inputs tolerate voltages up to 5.5 V independent of
VCC operating voltage.
Features
•
•
•
•
•
•
•
•
B5KK
XYZ
SIP6 1.45x1.0
CASE 127EB
NC7WZU04
Space−Saving SC−88 6−Lead Package
Ultra−Small MicroPak™ Leadless Packages
Unbuffered for Crystal Oscillator and Analog Applications
Balanced Output Drive: ±32 mA at 4.5 V VCC
Balanced Output Drive: ±8 mA at 4.5 V VCC
(NC7WZU04P6X−L22347)
Broad VCC Operating Range: 1.65 V to 5.5 V
Low Quiescent Power: ICC < 1 mA at 5 V VCC, TA = 25°C
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
6
SC−88
CASE 419B−02
ZU4M G
G
1
B5, ZU4
KK
XY
Z
M
G
= Specific Device Code
= 2−Digit Lot Run Traceability Code
= 2−Digit Date Code Format
= Assembly Plant Code
= Data Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 7 of this data sheet.
IEEE / IEC
A1
A2
1
1
Y1
Y2
Figure 1. Logic Symbol
© Semiconductor Components Industries, LLC, 2006
April, 2022 − Rev. 4
1
Publication Order Number:
NC7WZU04/D
NC7WZU04
Pin Configurations
A1 1
6
Y1
GND 2
5
VCC
A2 3
4
Y2
A1 1
GND 2
A2 3
Figure 2. SC−88 (Top View)
(Top View)
6 Y1
5 VCC
4 Y2
Figure 3. MicroPak (Top Through View)
AAA
Pin One
AAA represents Product Code Top Mark − see ordering code
NOTE:
Orientation of Top Mark determines Pin One location.
Reading the top product code mark left to right, Pin
One is the lower left pin (see diagram).
Figure 4. SC−88 Pin 1 Orientation
PIN DEFINITIONS
FUNCTION TABLE (Y = A)
Pin Name
Description
Input
Output
A1, A2
Data Inputs
A
Y
Y1, Y2
Outputs
L
H
H
L
H = HIGH Logic Level
L = LOW Logic Level
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2
NC7WZU04
ABSOLUTE MAXIMUM RATINGS
Symbol
Min
Max
Unit
VCC
Supply Voltage
−0.5
6.5
V
VIN
DC Input Voltage
−0.5
6.5
V
DC Output Voltage
−0.5
VCC + 0.5
V
VOUT
Parameter
IIK
DC Input Diode Current
VIN < 0 V
−
−50
mA
IOK
DC Output Diode Current
VOUT < 0 V
−
−50
mA
VOUT > VCC
−
+50
mA
IOUT
DC Output Current
−
±50
mA
DC VCC / GND Current
−
±50
mA
−65
+150
°C
ICC or IGND
TSTG
Storage Temperature
TJ
Junction Temperature Under Bias
−
150
°C
TL
Junction Lead Temperature (Soldering, 10 Seconds)
−
260
°C
PD
Power Dissipation in Still Air
SC−88
−
332
mW
MicroPak−6
−
812
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VIN
VOUT
Min
Max
Unit
Supply Voltage Operating
Parameter
1.65
5.5
V
Supply Voltage Data Retention
1.5
5.5
Input Voltage
0
5.5
V
Output Voltage
0
VCC
V
−40
+85
°C
°C/W
TA
Operating Temperature
qJA
Thermal Resistance
Conditions
SC−88
−
377
MicroPak−6
−
154
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
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3
NC7WZU04
DC ELECTRICAL CHARACTERISTICS
TA = +25°C
Symbol
VIH
VIL
TA = −40 to +85°C
VCC (V)
Min
Typ
Max
Min
Max
Unit
HIGH Level Input
Voltage
1.8 to 2.7
0.85 VCC
−
−
0.85 VCC
−
V
3.0 to 5.5
0.8 VCC
−
−
0.8 VCC
−
LOW Level Input
Voltage
1.8 to 2.7
−
−
0.15 VCC
−
0.15 VCC
3.0 to 5.5
−
−
0.2 VCC
−
0.2 VCC
Parameter
Conditions
V
VOH
High−Level Output
Voltage
VIN = GND
IOH = −100 mA
IOH = −4 mA
IOH = −8 mA
IOH = −12 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
VCC − 0.1
1.29
1.9
2.2
2.4
2.3
3.8
VCC
1.4
2.1
2.4
2.7
2.5
4.0
−
−
−
−
−
−
−
VCC − 0.1
1.29
1.9
2.2
2.4
2.3
3.8
−
−
−
−
−
−
−
VOL
Low−Level Output
Voltage
VIN = VCC
IOL = 100 mA
IOL = 4 mA
IOL = 8 mA
IOL = 12 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
−
−
−
−
−
−
−
−
0.08
0.2
0.22
0.28
0.38
0.42
0.1
0.24
0.3
0.4
0.4
0.55
0.55
−
−
−
−
−
−
−
0.1
0.24
0.3
0.4
0.4
0.55
0.55
IIN
Input Leakage
Current
VIN = 5.5 V, GND
1.65 to 5.5
−
−
±0.1
−
±1.0
mA
ICC
Quiescent Supply
Current
VIN = 5.5 V, GND
1.65 to 5.5
−
−
1.0
−
10
mA
ICCPEAK
Peak Supply
Current in Analog
Operation
VOUT = Open
VIN = Adjust for Peak ICC
Current
1.8
−
0.2
−
−
−
mA
2.5
−
2
−
−
−
3.3
−
5
−
−
−
5.0
−
15
−
−
−
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4
V
V
NC7WZU04
DC ELECTRICAL CHARACTERISTICS (NC7WZU04P6X−L22347)
TA = +25°C
Symbol
VIH
VIL
VOH
Parameter
VCC (V)
Typ
Max
Min
Max
Unit
V
HIGH Level Input
Voltage
1.8 to 2.7
0.85 VCC
−
−
0.85 VCC
−
3.0 to 5.5
0.8 VCC
−
−
0.8 VCC
−
LOW Level Input
Voltage
1.8 to 2.7
−
−
0.15 VCC
−
0.15 VCC
3.0 to 5.5
−
−
0.2 VCC
−
0.2 VCC
HIGH Level Output
Voltage
1.65
LOW Level Output
Voltage
VIN = VIL
1.55
1.65
−
1.55
−
1.8
1.6
1.79
−
1.6
−
2.3
2.1
2.29
−
2.1
−
3.0
2.7
2.99
−
2.7
−
4.5
4.0
4.48
−
4.0
−
IOH = −2 mA
1.29
1.52
−
1.29
−
2.3
IOH = −2 mA
1.9
2.19
−
1.9
−
3.0
IOH = −4 mA
2.4
2.82
−
2.4
−
3.0
IOH = −6 mA
2.3
2.73
−
2.3
−
4.5
IOH = −8 mA
3.8
4.24
−
3.8
−
IOL = 100 mA
−
0.01
0.2
−
0.2
1.8
−
0.01
0.2
−
0.2
2.3
−
0.01
0.2
−
0.2
3.0
−
0.01
0.3
−
0.3
4.5
−
0.01
0.5
−
0.5
IOL = 2 mA
−
0.10
0.24
−
0.24
2.3
IOL = 2 mA
−
0.12
0.3
−
0.3
3.0
IOL = 4 mA
−
0.19
0.4
−
0.4
3.0
IOL = 6 mA
−
0.29
0.55
−
0.55
IOL = 8 mA
1.65
VOL
Conditions
TA = −40 to +85°C
Min
1.65
1.65
4.5
VIN = GND
VIN = VIH
VIN = VCC
IOH = −100 mA
V
V
V
V
V
−
0.29
0.55
−
0.55
IIN
Input Leakage
Current
1.65 to 5.5
VIN = 5.5 V, GND
−
−
±0.1
−
±1.0
mA
ICC
Quiescent Supply
Current
1.65 to 5.5
VIN = 5.5 V, GND
−
−
1.0
−
10
mA
ICCPEAK
Peak Supply
Current in Analog
Operation
1.8
VOUT = Open
VIN = Adjust for Peak ICC
Current
−
0.2
−
−
−
mA
−
2
−
−
−
2.5
3.3
−
5
−
−
−
5.0
−
15
−
−
−
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5
NC7WZU04
AC ELECTRICAL CHARACTERISTICS
TA = +25°C
Symbol
tPLH, tPHL
Parameter
VCC (V)
Typ
Max
Min
Max
Unit
−
5.5
9.8
−
11.0
ns
−
4.6
8.1
−
8.9
2.5 ±0.2
−
3.3
5.7
−
6.3
3.3 ±0.3
−
2.7
4.1
−
4.5
5.0 ±0.5
−
2.2
3.3
−
3.6
−
4.0
6.4
−
7.0
−
3.4
5.6
−
6.2
−
3
−
−
−
pF
−
3.5
−
−
−
pF
−
5.5
−
−
−
CL = 15 pF,
RL = 1 MW
1.65
1.8
CL = 50 pF,
RL = 500 W
3.3 ±0.3
5.0 ±0.5
CIN
Input Capacitance
CPD
Power Dissipation Capacitance
(Figure 7)
TA = −40 to +85°C
Min
Propagation Delay
(Figure 5, 6)
Conditions
0
(Note 2)
3.3
5.0
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression:
ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
AC Loading and Waveforms
tr = 3 ns
VCC
90%
Input
VCC
10%
OUTPUT
CL *
90%
50%
GND
INPUT
tf = 3 ns
50%
10%
tW
tPLH
tPHL
RL
VOH
Output
*CL includes load and stray capacitance.
Input PRR = 1.0 MHz, tW = 500 ns.
50%
50%
VOL
Figure 5. AC Test Circuit
Figure 6. AC Waveforms
VCC
A
INPUT
Application Note: When operating the NC7WZU04’s unbuffered
output stage in its linear range, as in oscillator applications, care
must be taken to observe maximum power rating for the device
and package. The high drive nature of the design of the output
stage will result in substantial simultaneous conduction currents
when the stage is in the linear region. See the ICCPEAK
specification on page 4.
Input = AC Waveform; tr = tf = 1.8 ns.
PRR = 10 MHz; Duty Cycle = 50%.
Figure 7. ICCD Test Circuit
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6
NC7WZU04
DEVICE ORDERING INFORMATION
Top Mark
Packages
Shipping†
NC7WZU04P6X
ZU4
SC−88
3000 / Tape & Reel
NC7WZU04P6X−L22347
ZU4
SC−88
3000 / Tape & Reel
B5
MicroPak
5000 / Tape & Reel
Device
NC7WZU04L6X
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
www.onsemi.com
7
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DOCUMENT NUMBER:
DESCRIPTION:
98AON13590G
SIP6 1.45X1.0
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88 (SC−70 6 Lead), 1.25x2
CASE 419AD
ISSUE A
DATE 07 JUL 2010
1
D
e
e
E1 E
SYMBOL
MIN
A
0.80
MAX
1.10
A1
0.00
0.10
A2
0.80
1.00
b
0.15
0.30
0.18
c
0.10
D
1.80
2.00
2.20
E
1.80
2.10
2.40
E1
1.15
1.25
1.35
0.65 BSC
e
L
0.26
L1
0.36
0.46
0.42 REF
0.15 BSC
L2
TOP VIEW
NOM
θ
0º
8º
θ1
4º
10º
q1
A2 A
q
b
q1
L
L1
A1
SIDE VIEW
c
L2
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-203.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34266E
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
SC−88 (SC−70 6 LEAD), 1.25X2
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
1
SCALE 2:1
DATE 11 DEC 2012
2X
aaa H D
D
H
A
D
6
5
GAGE
PLANE
4
1
2
L
L2
E1
E
DETAIL A
3
aaa C
2X
bbb H D
2X 3 TIPS
e
B
6X
b
ddd
TOP VIEW
C A-B D
M
A2
DETAIL A
A
6X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY AND DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OF THE FOOT.
ccc C
A1
SIDE VIEW
C
SEATING
PLANE
END VIEW
c
RECOMMENDED
SOLDERING FOOTPRINT*
6X
DIM
A
A1
A2
b
C
D
E
E1
e
L
L2
aaa
bbb
ccc
ddd
MILLIMETERS
MIN
NOM MAX
−−−
−−−
1.10
0.00
−−−
0.10
0.70
0.90
1.00
0.15
0.20
0.25
0.08
0.15
0.22
1.80
2.00
2.20
2.00
2.10
2.20
1.15
1.25
1.35
0.65 BSC
0.26
0.36
0.46
0.15 BSC
0.15
0.30
0.10
0.10
GENERIC
MARKING DIAGRAM*
6
XXXMG
G
6X
0.30
INCHES
NOM MAX
−−− 0.043
−−− 0.004
0.035 0.039
0.008 0.010
0.006 0.009
0.078 0.086
0.082 0.086
0.049 0.053
0.026 BSC
0.010 0.014 0.018
0.006 BSC
0.006
0.012
0.004
0.004
MIN
−−−
0.000
0.027
0.006
0.003
0.070
0.078
0.045
0.66
1
2.50
0.65
PITCH
XXX = Specific Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
*Date Code orientation and/or position may
vary depending upon manufacturing location.
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
STYLES ON PAGE 2
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42985B
SC−88/SC70−6/SOT−363
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
DATE 11 DEC 2012
STYLE 1:
PIN 1. EMITTER 2
2. BASE 2
3. COLLECTOR 1
4. EMITTER 1
5. BASE 1
6. COLLECTOR 2
STYLE 2:
CANCELLED
STYLE 3:
CANCELLED
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. COLLECTOR
4. EMITTER
5. BASE
6. ANODE
STYLE 5:
PIN 1. ANODE
2. ANODE
3. COLLECTOR
4. EMITTER
5. BASE
6. CATHODE
STYLE 6:
PIN 1. ANODE 2
2. N/C
3. CATHODE 1
4. ANODE 1
5. N/C
6. CATHODE 2
STYLE 7:
PIN 1. SOURCE 2
2. DRAIN 2
3. GATE 1
4. SOURCE 1
5. DRAIN 1
6. GATE 2
STYLE 8:
CANCELLED
STYLE 9:
PIN 1. EMITTER 2
2. EMITTER 1
3. COLLECTOR 1
4. BASE 1
5. BASE 2
6. COLLECTOR 2
STYLE 10:
PIN 1. SOURCE 2
2. SOURCE 1
3. GATE 1
4. DRAIN 1
5. DRAIN 2
6. GATE 2
STYLE 11:
PIN 1. CATHODE 2
2. CATHODE 2
3. ANODE 1
4. CATHODE 1
5. CATHODE 1
6. ANODE 2
STYLE 12:
PIN 1. ANODE 2
2. ANODE 2
3. CATHODE 1
4. ANODE 1
5. ANODE 1
6. CATHODE 2
STYLE 13:
PIN 1. ANODE
2. N/C
3. COLLECTOR
4. EMITTER
5. BASE
6. CATHODE
STYLE 14:
PIN 1. VREF
2. GND
3. GND
4. IOUT
5. VEN
6. VCC
STYLE 15:
PIN 1. ANODE 1
2. ANODE 2
3. ANODE 3
4. CATHODE 3
5. CATHODE 2
6. CATHODE 1
STYLE 16:
PIN 1. BASE 1
2. EMITTER 2
3. COLLECTOR 2
4. BASE 2
5. EMITTER 1
6. COLLECTOR 1
STYLE 17:
PIN 1. BASE 1
2. EMITTER 1
3. COLLECTOR 2
4. BASE 2
5. EMITTER 2
6. COLLECTOR 1
STYLE 18:
PIN 1. VIN1
2. VCC
3. VOUT2
4. VIN2
5. GND
6. VOUT1
STYLE 19:
PIN 1. I OUT
2. GND
3. GND
4. V CC
5. V EN
6. V REF
STYLE 20:
PIN 1. COLLECTOR
2. COLLECTOR
3. BASE
4. EMITTER
5. COLLECTOR
6. COLLECTOR
STYLE 21:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. N/C
6. CATHODE 1
STYLE 22:
PIN 1. D1 (i)
2. GND
3. D2 (i)
4. D2 (c)
5. VBUS
6. D1 (c)
STYLE 23:
PIN 1. Vn
2. CH1
3. Vp
4. N/C
5. CH2
6. N/C
STYLE 24:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
STYLE 25:
PIN 1. BASE 1
2. CATHODE
3. COLLECTOR 2
4. BASE 2
5. EMITTER
6. COLLECTOR 1
STYLE 26:
PIN 1. SOURCE 1
2. GATE 1
3. DRAIN 2
4. SOURCE 2
5. GATE 2
6. DRAIN 1
STYLE 27:
PIN 1. BASE 2
2. BASE 1
3. COLLECTOR 1
4. EMITTER 1
5. EMITTER 2
6. COLLECTOR 2
STYLE 28:
PIN 1. DRAIN
2. DRAIN
3. GATE
4. SOURCE
5. DRAIN
6. DRAIN
STYLE 29:
PIN 1. ANODE
2. ANODE
3. COLLECTOR
4. EMITTER
5. BASE/ANODE
6. CATHODE
STYLE 30:
PIN 1. SOURCE 1
2. DRAIN 2
3. DRAIN 2
4. SOURCE 2
5. GATE 1
6. DRAIN 1
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42985B
SC−88/SC70−6/SOT−363
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
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