NCL30085FLYGEVB

NCL30085FLYGEVB, NCL30088FLYGEVB 10 W High Power Factor Isolated LED Driver Evaluation Board User'sManual www.onsemi.com EVAL BOARD USER’S MANUAL Overview This manual covers the specification, theory of operation, testing and construction of the NCL30085/88FLYGEVB evaluation board. The NCL30085/88 board demonstrates a 10 W high PF isolated flyback LED driver in a typical A19 outline. The 2 evaluation boards are nearly identical in construction except for the controller and Vcc bulk capacitor. The NCL30088 controller is a non−dimming version while the NCL30085 supports 3 levels of step dimming. Table 1. SPECIFICATIONS Key Features As illustrated, the key features of this evaluation board include: • Wide Mains • Low THD across Line and Load • High Power Factor across Wide Line and Load • Integrated Auto Recovery Fault Protection (can be latched by Choice A Version) ♦ Programmable Over Temperature Thermal Foldback (NTC mounted on PCB) ♦ Cycle by Cycle Current Limiting ♦ Open LED and Shorted Output Protection Parameter Value Input voltage (Class 2 Input, no ground) 90 − 265 V ac Line Frequency 50 Hz / 60 Hz Power Factor (100% Load) THD (100% Load) Comment 0.9 Min 20% Max Class 2 Output Mains Isolated Output Voltage Range Output Current Efficiency Start Up Time EMI (conducted) 14 − 28 V dc 350 mA dc ±2% 85% Typical < 500 msec Typical Class B FCC/CISPR Figure 1. Evaluation Board Picture (Top View) © Semiconductor Components Industries, LLC, 2014 December, 2014 − Rev. 0 1 Publication Order Number: EVBUM2287/D NCL30088FLYGEVB THEORY OF OPERATION Power Stage Auxiliary Winding The power stage for the evaluation boards is an isolated flyback. The controller has a built in control algorithm that is specific to the flyback transfer function. Specifically: The auxiliary winding has 3 functions: 1. CrM timing 2. Vcc Power 3. Output voltage sense Vout + Duty (1*Duty) Vin CrM Timing In the off time, the voltage on the transformer/inductor forward biases Dout and D9. When the current in the magnetic has reached zero, the voltage collapses to zero. This voltage collapse triggers a comparator on the ZCD pin to start a new switching cycle. The ZCD pin also counts rings on the auxiliary winding for higher order valley operation. A failure of the ZCD pin to reach a certain threshold also indicates a shorted output condition fault. This is applicable to flyback, buck boost, and SEPIC converters. The control is very similar to the control of the NCL30080−83 with the addition of a power factor correction control loop. The controller has a built in hardware algorithm that relates the output current to a reference on the primary side. Iout + Vref Nps 2 Rsense Nps + Npri Nsec Vcc Power The forward biases D9 to provide power for the controller. This arrangement is called a “bootstrap”. Initially the Cvcc, is charged through R4 and R5. When the voltage on Cvcc reaches the startup threshold, the controller starts switching and providing power to the output circuit and the Cvcc. Cvcc discharges as the controller draws current. As the output voltage rises, the auxiliary winding starts to provide all the power to the controller. Ideally, this happens before Cvcc discharges to the undervoltage threshold where the controller stops operating to allow Cvcc to recharge once again. The size of the output capacitor will have a large effect on the rise of the output voltage. Since the LED driver is a current source, the rise of output voltage is directly dependent on the size of the output capacitor. There are tradeoffs in the selection of Cout and Cvcc. A low output ripple will require a large Cout value. This requires that Cvcc be large enough to support Vcc power to the controller while Cout is charging up. A large value of Cvcc requires that R4 and R5 be lower in value to allow a fast enough startup time. Smaller values of R4 and R5 have higher static power dissipation which lowers efficiency of the driver. Where Npri = Primary Turns and Nsec = Secondary Turns We can now find Rsense for a given output current. Rsense + Vref Nps 2 Iout Line Feedforward R3 sets the line feedforward which compensates for power stage delay times by reducing the current threshold as the line voltage increases. R3 is also used by the shorted pin detection. At start up the controller generates a current from the CS pin to check for a short to ground. If R3 is zero, the current sense resistor is too low a value and the controller will not start because it will detect a shorted pin. So R3 is required to make the controller operate properly. Voltage Sense The voltage sense pin has several functions: 1. Basis for the reference of the PFC control loop 2. Line Range detection The reference scaling is automatically controller inside the controller. While the voltage on Vs is not critical for the PFC loop control it is important for range detection. Generally the voltage on Vs should be 3.5 V peak at the highest input voltage of interest. The voltage on Vs determines which valley the power stage will operate at in full load. At low line and maximum load, the power stage operates in the first valley (standard CrM operation). At the higher line range, the power stage moves to the second valley to lower the switching frequency while retaining the advantage of CrM soft switching. Output Voltage Sense The auxiliary winding voltage is proportional to the output voltage by the turns ratio of the output winding and the auxiliary winding. The controller has an overvoltage limit on the Vcc pin at about 26 V minimum. Above that threshold, the controller will stop operation and enter a fault mode for overvoltage. This is the open load protection. In cases where the output has a lot of ripple current and the LED has high dynamic resistance, the peak output voltage can be much higher than the average output voltage. The auxiliary winding will charge the Cvcc to the peak of the output voltage which may trigger the OVP sooner than expected. www.onsemi.com 2 NCL30088FLYGEVB SD Pin Step Dimming The SD pin is a multifunction protection input. 1. Thermal Foldback Protection 2. Programmable OVP Step dimming is only available on the NCL30085FLYGEVB. Cbulk is added to keep Vcc active for brief AC power interruptions. There are 3 dimming current levels for the NCL30085FLYGEVB after the driver is powered on. ON 100% 1. 70% 2. 25% 3. 4% AC power interruption is detected on Vs when the voltage on Vs is below 1 V for 30 ms. Internally, the controller steps the internal Vref down to the next dimming level. After the lowest level, Vref cycles back to 100%. Issues with step dimming can be traced to Vcc dropping below the undervoltage cutoff before the input has been detected as off for 35 ms minimum.. This is caused by one of the following: 1. Operating Vcc too low (related to Vled) 2. Cbulk too small 3. Cout too large and discharges too much during the AC interruption. This is particularly seen at the lowest dim levels where the output current cannot recharge Cout fast enough. For a more detailed discussion of step dimming, refer to DN05065/D. Thermal Foldback The OCV of the SD pin is 1.35 V. There is an internal current source connected to the SD pin even though the voltage is soft clamped to 1.35 V. Output current is reduced when the voltage on the SD pin drops below 1 V. Placing an NTC on the SD pin will allow the designer to choose the level of protection from over temperature. Below 0.5 volts on SD, the controller stops. Series or parallel resistors on the NTC can shape the foldback curve. An online EXCEL® based design tool is available at onsemi.com which provides support to select the appropriate value. Programmable OVP While the SD pin has a current source for the OTP, it can be overcome raising the voltage on the SD pin. At about 2.75 V, the SD pin detects an OVP and shuts down the controller. Typically, a zener to Vcc is used for this. In this way, the designer can set the OVP to a lower value that the OVP threshold built into the Vcc pin. Circuit Modifications Output Current The output current is set by the value of Rsense as shown above. It’s possible to adjust easily change the output current within ±10% of the set value by changing R7. Further adjustments may require changes to the transformer depending on the LED VF and current. www.onsemi.com 3 NCL30088FLYGEVB SCHEMATIC +HVDC R10 L3 +HVDC_iso 1.5mH 10k 1 AC_L AC_N F1 L2 FUSE 2.7mH L1 1 C4 D4 AC1 + AC2 − C5 120nF 400V 120nF 400V MB6S 2.7mH R11 10k Figure 2. Input Circuit Cbulk is not stuffed on the NCL30088 version. R4 +HVDC R5 75k T1 +HVDC_iso 75k Rclmp D9 Dout MURA220T3 100k BAS21DW5T1G LED+ 1 Rpre 20k C14 620k CVcc Cbulk 4.7 mF 27 mF 470p 250VAC Y2 Dclmp C15 UFM15PL 470p 250VAC Y2 Rzcd 56k 8 U1 ZCD 2 Vs 3 Comp 4 SD Rtco 1n C10 1 mF Vcc 1 7 Q1 Com GDrv NDD02N60Z CS 5 C13 R3 6 C12 R2 330uF 35V 1 R6 10k Cout t 1000p 630V 820 NCL30085/8 100 kW NTC R7 16 Figure 3. Main Schematic www.onsemi.com 4 Rsens 1.43 LED− NCL30088FLYGEVB BILL OF MATERIAL Table 2. BILL OF MATERIAL* Qty Reference Part Manufacturer Mfr_PN PCB Footprint Substitution Allowed 1 Cvcc 4.7 mF AVX TAJB475M035RNJ 1210 Yes 1 Cbulk 27 mF Panasonic EEU−FC1E270 CAP−ALEL−4X11− HOR Yes 1 Cout 330 mF 35 V Nichicon UHE1V331MPD CAP−ALEL−10X16 −HOR Yes 2 C4, C5 120 nF 400 V Epcos B32559C6124+*** CAP−BOX−LS5− 5M0X7M2 Yes 1 C10 1 mF Taiyo Yuden GMK107AB7105KAHT 603 Yes 1 C12 1n Kemet C0402C102K3GACTU 402 Yes 1 C13 1000 p 630 V Kemet C0805C102KBRACTU 805 Yes 2 C14, C15 470 p 250 VAC Y2 Murata GA342QR7GF471KW01L 1808 Yes 1 Dclmp UFM15PL MCC UFM15PL SOD123FL Yes 1 Dout MURA220T3 ON Semiconductor MURA220T3 SMA No 1 D4 MB6S MCC MB6S MB6S Yes 1 D9 BAS21DW5T1G ON Semiconductor BAS21DW5T1G SC−88A No 1 F1 FUSE Littelfuse 0263.500WRT1L FUSE−HAIRPIN− LS250 Yes 2 L1, L2 2.7 mH Bourns RL875S−272K Drum_Core_Hor_ LS5_875S Yes 1 L3 1.5 mH Wurth 7447462152 IND−UPRIGHT− LS25 Yes 1 Q1 NDD02N60Z ON Semiconductor NDD02N60Z IPAK No 1 Rclmp 100 k Yaego RC1206FR−07100KL 1206 Yes 1 Rpre 20 k Yaego RC0603FR−0720KL 603 Yes 1 Rsens 1.43 Yaego RC1206FR−071R43L 1206 Yes 1 Rtco 100 kW NTC Epcos B57331V2104J60 603 Yes 1 Rzcd 56k Yaego RC0805FR−0756KL 805 Yes 1 R2 10k Yaego RC0402FR−0710KL 402 Yes 1 R3 820 Yaego RC0402FR−07820RL 402 Yes 2 R4, R5 75 k Yaego RC1206FR−0775KL 1206 Yes 1 R6 620 k Yaego RC1206FR−07620KL 1206 Yes 1 R7 16 Yaego RT0402FRE0716RL 603 Yes 2 R10, R11 10 k Yaego RC0805JR−0710KL 805 Yes 1 T1 XFRM_LINEAR Wurth 7508112342 RM6−4P−TH− FLYLEADS Yes 1 U1 NCL30085B ON Semiconductor NCL30085B SO8 No NCL30088B NCL30088B 6” W1 Wire, Red, 24AWG McMaster Carr 7587K922 UL1569 Yes 6” W2 Wire, Blk, 24AWG McMaster Carr 7587K921 UL1569 Yes 12” W3, W4 Wire, Wht, 24AWG McMaster Carr 7587K924 UL1569 Yes *All Components to comply with RoHS 2002/95/EC www.onsemi.com 5 NCL30088FLYGEVB GERBER VIEWS Figure 4. Top Side PCB Figure 5. Bottom Side PCB Figure 6. PCB Outline www.onsemi.com 6 NCL30088FLYGEVB Mark the appropriate Version Here White Wires Here Cbulk not stuffed on NCL30088FLYGEVB Short Flying Lead Here Black Wire Here Long Flying Lead Here 1. Trim Transformer flying leads for minimum length. 2. Strip and tin lead wires to 6” ± 0.5” 4 Places. Figure 7. Assembly Notes www.onsemi.com 7 Red Wire Here NCL30088FLYGEVB CIRCUIT BOARD FABRICATION NOTES 11. Size tolerance of plated holes: ±0.003 in. : non−plated holes ±0.002 in. 12. All holes shall be ±0.003 in. of their true position U.D.S. 13. Construction to be SMOBC, using liquid photo image (LPI) solder mask in accordance with IPC−SM−B40C, Type B, Class 2, and be green in color. 14. Solder mask mis-registration ±0.004 in. max. 15. Silkscreen shall be permanent non−conductive white ink. 16. The fabrication process shall be UL approved and the PCB shall have a flammability rating of UL94V0 to be marked on the solder side in silkscreen with date, manufactures approved logo, and type designation. 17. Warp and twist of the PCB shall not exceed 0.0075 in. per in. 18. 100% electrical verification required. 19. Surface finish: electroless nickel immersion gold (ENIG) 20. RoHS 2002/95/EC compliance required. 1. Fabricate per IPC−6011 and IPC6012. Inspect to IPA−A−600 Class 2 or updated standard. 2. Printed Circuit Board is defined by files listed in fileset. 3. Modification to copper within the PCB outline is not allowed without permission, except where noted otherwise. The manufacturer may make adjustments to compensate for manufacturing process, but the final PCB is required to reflect the associated gerber file design ±0.001 in. for etched features within the PCB outline. 4. Material in accordance with IPC−4101/21, FR4, Tg 125°C min. 5. Layer to layer registration shall not exceed ±0.004 in. 6. External finished copper conductor thickness shall be 0.0026 in. min. (ie 2oz) 7. Copper plating thickness for through holes shall be 0.0013 in. min. (ie 1oz) 8. All holes sizes are finished hole size. 9. Finished PCB thickness 0.031 in. 10. All un-dimensioned holes to be drilled using the NC drill data. www.onsemi.com 8 NCL30088FLYGEVB FLYBACK TRANSFORMER SPECIFICATION www.onsemi.com 9 NCL30088FLYGEVB ECA PICTURES Figure 8. Top View Figure 9. Bottom View www.onsemi.com 10 NCL30088FLYGEVB TEST PROCEDURE Equipment Needed Test Connections • AC Source – 90 to 305 V ac 50/60 Hz Minimum 500 W • • • • 1. Connect the LED Load to the red (+) and black (−) leads through the ammeter shown in Figure 10. CAUTION: Observe the correct polarity or the load may be damaged. 2. Connect the AC power to the input of the AC wattmeter shown in Figure 10. Connect the white leads to the output of the AC wattmeter 3. Connect the DC voltmeter as shown in Figure 10. capability AC Wattmeter – 300 W Minimum, True RMS Input Voltage, Current, Power Factor, and THD 0.2% accuracy or better DC Voltmeter – 300 V dc minimum 0.1% accuracy or better DC Ammeter – 1 A dc minimum 0.1% accuracy or better LED Load – 10 V – 30 V @ 1 A AC Power AC Source Wattmeter UUT DC Ammeter DC Voltmeter LED Test Load NOTE: Unless otherwise specified, all voltage measurements are taken at the terminals of the UUT. Figure 10. Test Set Up Functional Test Procedure 1. Set the LED Load for 26 V output. 2. Set the input power to 120 V 60 Hz. CAUTION: Do not touch the ECA once it is energized because there are hazardous voltages present. LINE AND LOAD REGULATION Table 3. 120 V / MAX LOAD Output Current 350 mA + 14 mA Output Power Power Factor THD < 20% Output Power Power Factor THD < 30% 14 V 21 V 28 V Table 4. 230 V / MAX LOAD Output Current 350 mA + 14 mA 14 V 21 V 28 V Efficiency + Vout Iout Pin 100% www.onsemi.com 11 NCL30088FLYGEVB TEST DATA Figure 11. Power Factor over Line and Load Figure 12. THD over Line and Load www.onsemi.com 12 NCL30088FLYGEVB Figure 13. Efficiency over Line and Load at Maximum Output Current Figure 14. Maximum Current Load Regulation over Line www.onsemi.com 13 NCL30088FLYGEVB Figure 15. 70% Load Regulation over Line (NCL30085FLYG only) Figure 16. 25% Load Regulation over Line (NCL30085FLYG only) www.onsemi.com 14 NCL30088FLYGEVB Figure 17. Minimum Load Regulation over Line (NCL30085FLYG only) Figure 18. Start Up with AC Applied 120 V Maximum Load www.onsemi.com 15 NCL30088FLYGEVB Figure 19. Start Up with AC Applied 230 V Maximum Load Figure 20. Conducted EMI Pre−compliance QP Data 150 kHz − 1 MHz www.onsemi.com 16 NCL30088FLYGEVB Figure 21. Conducted EMI Pre−compliance Peak Data 150 kHz − 30 MHz Excel is a registered trademark of Microsoft Corporation. www.onsemi.com 17 onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 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