NCN1188MUTAG

NCN1188 Data Switch, 3:1 High Speed USB Switch with Audio and MHL Capability The NCN1188 allows portable systems to share a single USB 2.0 or 3.0 receptacle to transmit and receive paired signals from three separate locations. All of the three differential channels are compliant to High Speed USB 2.0, Full Speed USB 1.1, Low Speed USB 1.0 and any generic UART protocol. The two dedicated high speed data paths also support Mobile High Definition Link (MHL) video up to resolutions of 1080i (2.25 Gbps) and 1080p (3 Gbps in Packed Pixel mode). The multi−purpose audio path is capable of passing signals with negative voltages as low as 2 V below ground and features shunt resistors to reduce Pop and Click noise in the audio system. The NCN1188 is housed in a space saving, ultra low profile 2.0 x 1.7 x 0.5 mm, 12 pins UQFN package. Features • • • • • • • • • www.onsemi.com MARKING DIAGRAM UQFN12 MU SUFFIX CASE 523AE 1 AGM G AG = Specific Device Code M = Date Code G = Pb−Free Package High Bandwidth of 1.8 GHz VCC Operating Range from 2.7 V to 5.5 V VIS Signal from 0 V to 3.7 V for Data Transfer VIS Signal from −2 V to 2 V for Stereo Headphone Connection Audio Shunt resistor for Pop & Click Noise Reduction VIO Control Pins Compatible to 1.8V Interfaces Low Power Consumption of 23 mA Small UQFN 2.0 x 1.7 x 0.5 mm Package These Devices are Pb−Free and are RoHS Compliant PIN ASSIGNMENTS Typical Applications • • • • • USB 2.0 / 3.0 Micro−B Applications USB to HDMI Video Interfaces via MHL Features Phones and Smart Phones Digital Cameras Handset Media Players (Top View) ORDERING INFORMATION Device Package Shipping† NCN1188MUTAG UQFN12 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Figure 1. NCN1188 Typical Application Schematic © Semiconductor Components Industries, LLC, 2016 January, 2016 − Rev. 4 1 Publication Order Number: NCN1188/D NCN1188 NCN1188 TRUTH TABLE IN1 IN2 Shunt Hi−Z Function 0 0 Enable DN / DP 0 1 Enable AUDN / AUDP 1 0 Disable HDN / HDP 1 1 Enable SIMPLIFIED BLOCK DIAGRAM D+ VCC D− Charge Pump IN1 IN2 Logic Control DN DP HDN HDP AUDN AUDP GND Figure 2. Simplified Block Diagram www.onsemi.com 2 NCN1188 PIN DIAGRAM Figure 3. Pin Assignments (Top View) PIN DESCRIPTION Name Pin Description DP 1 USB Positive Path. If active, this pin is connected to D+ pin. HDP 2 HD Positive Path. If active, this pin is connected to D+ pin. VCC 3 Analog Supply. This pin is the analog and digital supply of the device. A 100 nF ceramic capacitor or larger must bypass this input to the ground. This capacitor should be placed as close a possible to this input. HDN 4 HD Negative Path. If active, this pin is connected to D− pin. DN 5 USB Negative Path. If active, this pin is connected to D− pin. AUDN 6 Audio N. If active, this pin is connected to D− pin. IN2 7 Input Selection 2. Do not float this pin. D− 8 Negative data line. Must be connected to the D− pin of USB receptacle. GND 9 Ground Reference. Must be connected to the system ground. D+ 10 Positive data line. Must be connected to the D+ pin of USB receptacle. IN1 11 Input Selection 1. Do not float this pin. AUDP 12 Audio P. If active, this pin is connected to D+ pin. www.onsemi.com 3 NCN1188 MAXIMUM RATINGS (Note 1) Rating Symbol Value Unit Maximum Supply Voltage Range on VCC pin VCCMAX − 0.3 to 6.0 V Maximum Analog Signal Voltage Range on DN, DP, HDN, HDP pins VISMAX − 0.3 to 5.5 V Maximum Analog Signal Voltage Range on D+, D− pins VCOMMAX − 2.5 to 5.5 V Maximum Analog Signal Voltage Range on IN1, IN2 pins VIOMAX −0.3 to VCC+ 0.3 V VAUDMAX −2.5 to VCC+ 0.3 V ILU ±100 mA Human Body Model (HBM) ESD Rating (Note 3) ESD HBM 4000 V Machine Model (MM) ESD Rating (Note 3) ESD MM 100 V Maximum Junction Temperature TJMAX +150 °C Storage Temperature Range TSTG −55 to + 150 °C Moisture Sensitivity (Note 4) MSL Level 1 Maximum Analog Signal Voltage Range on AUDN, AUDP pins Latch up Current (Note 2) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = 25°C. 2. Latch up Current Maximum Rating: ±100 mA per JEDEC standard: JESD78. 3. This device series contains ESD protection and passes the following tests: Human Body Model (HBM) ±4.0 kV per JEDEC standard: JESD22−A114 for all pins. Machine Model (MM) ±100 V per JEDEC standard: JESD22−A115 for all pins. 4. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Conditions Min Typ Max Unit 2.7 − 5.5 V 0 −2.0 − − 3.7 2.0 V VOLTAGE RANGES VCC VCC pin operating range VIS Analog Signal Voltage range (Note 5) High Speed Data Audio TEMPERATURE RANGES TA Operating Ambient Temperature −40 − 85 °C TJ Operating Junction Temperature −40 − 125 °C 5. If the audio channel is not in use, it is recommended that no signals are applied on the audio inputs AUDN and AUDP ELECTRICAL CHARACTERISTICS Min and Max limits apply for TA from −40°C to +85°C (unless otherwise noted). Typical values are referenced to VCC = 3.6 V, TA = +25°C (unless otherwise noted). Parameter Symbol Conditions Min Typ Max Unit VCC = 4.2 V, IIS = 0 − 23 35 mA CURRENT CONSUMPTION ICC Product Supply Current CONTROL LOGIC (IN1, IN2 pins) VIL Low Voltage Input Threshold VCC = 2.7 V VCC = 3.6 V VCC = 4.2 V − − − − − − 0.4 0.4 0.4 V VIH High Voltage Input Threshold VCC = 2.7 V VCC = 3.6 V VCC = 4.2 V 1.3 1.4 1.5 − − − − − − V Voltage Input Hysteresis − 250 − mV Leakage Current − − ±100 nA VIHYS IIN www.onsemi.com 4 NCN1188 ELECTRICAL CHARACTERISTICS Min and Max limits apply for TA from −40°C to +85°C (unless otherwise noted). Typical values are referenced to VCC = 3.6 V, TA = +25°C (unless otherwise noted). Symbol Parameter Conditions Min Typ Max Unit On Resistance VCC = 3.0 V VIS from 0 V to 2.4 V, IIS = 15 mA − 5 7.5 W RON_MAT On Resistance Matching VCC = 3.0 V VIS from 0 V to 1.7 V, IIS = 15 mA − 0.09 − W RON_FLT On Resistance Flatness VCC = 3.0 V VIS from 0 V to 1.7 V, IIS = 15 mA − 0.06 − W ISW_OFF Off State Leakage VCC = 3.6 V VIS From 0 V to 3.6 V − − 200 nA ISW_ON On State Leakage VCC = 3.6 V VIS From 0 V to 3.6 V − − ±200 nA DATA SWITCHES DC CHARACTERISCTICS RON DATA SWITCHES AC CHARACTERISTICS CON Equivalent On Capacitance Switch ON, f = 1 MHz − 4.5 − pF COFF Equivalent Off Capacitance Switch OFF, f = 1 MHz − 3 − pF f = 10 MHz f = 800 MHz f = 1.1 GHz − −0.5 −1.8 −2.1 − dB f = 10 MHz f = 800 MHz f = 1.1 GHz − −53 −19 −18 − dB f = 10 MHz f = 800 MHz f = 1.1 GHz − −55 −20 −18 − dB From VCC onto D+ / D− f = 217 Hz, RL = 50 W − 90 − dB VCC = 3.0 V VIS from −2.0 V to 2.0 V, IIS = 50 mA − 3 5 W VCC = 3.0 V VIS from −2.0 V to 2.0 V, IIS = 50 mA − 0.04 − W VCC = 3.0 V VIS from −2.0 V to 2.0 V, IIS = 50 mA − 0.02 − W VCC = 3.6 V − 125 200 W From 20 Hz to 20 kHz VIS = 0.4 VRMS, DC bias = 0V, Load = 16 W − 0.01 − % From VCC onto AUDN / AUDP f = 217 Hz, RL = 16 W − 90 − dB DIL DISO DCTK PSRRSW Differential Insertion Loss Differential Off Isolation Differential Crosstalk Power Supply Ripple Rejection AUDIO SWITCHES DC CHARACTERISCTICS RON RON_MAT RON_FLT RSH On Resistance On Resistance Matching On Resistance Flatness Shunt Resistance AUDIO SWITCHES AC CHARACTERISTICS THDAUD PSRRAUD Audio THD Power Supply Ripple Rejection www.onsemi.com 5 NCN1188 ELECTRICAL CHARACTERISTICS Min and Max limits apply for TA from −40°C to +85°C (unless otherwise noted). Typical values are referenced to VCC = 3.6 V, TA = +25°C (unless otherwise noted). Symbol Parameter Conditions Min Typ Max Unit (Notes 6 and 7) − 0.25 − ns SWITCHES TIMING CHARACTERISCTICS tPD Propagation Delay tON Turn On Time VIS = 1 V, RL = 50 W, CL = 7 pF (fixture only) − 2.2 − ms tOFF Turn Off Time VIS = 1 V, RL = 50 W, CL = 7 pF (fixture only) − 67 − ns tb−b Bit−to−Bit Skew Within the same differential channel − 5 − ps Channel−to−Channel Skew Maximum skew between all channels − 15 − ps tch−ch 6. Specification guarantee by design 7. No other delays than the RC network formed by the load resistance and the load capacitance of the switch are added on the bus. For a 10 pF load, this delay is 5 ns which is much smaller than rise and fall time of typical driving systems. Propagation delays on the bus are determined by the driving circuit on the driving side and its interactions with the load of the driven side. TABLE OF GRAPHS Symbol Parameter Figure 1080pEYE MHL Video Eye Diagram at 3 Gbps (1080p) 4 720pEYE 1080iEYE MHL Video Eye Diagram at 2.25 Gbps (720p, 1080i) 5 USB2.0EYE USB 2.0 High Speed 480 Mbps Eye Diagram 6, 7 USB1.1EYE USB 1.1 Full Speed 12 Mbps Eye Diagram 8, 9 USB1.0EYE USB 1.0 Low Speed 1.5 Mbps Eye Diagram 10, 11 ICC Product Supply Current vs. VCC 12 RON Data Path On Resistance vs. VIS 13 DIL Data Switch Differential Insertion Loss vs. Frequency 14 DISO Data Switch Differential Off Isolation vs. Frequency 15 DCTK Data Switch Differential Crosstalk vs. Frequency 16 RON Audio Path On Resistance vs. VIS 17 Audio THD vs. Frequency 18 THDAUD www.onsemi.com 6 NCN1188 TYPICAL OPERATING CHARACTERISTICS Figure 4. MHL Video Eye Diagram at 3 Gbps (1080p) Figure 5. MHL Video Eye Diagram at 2.25 Gbps (720p, 1080i) Figure 6. USB 2.0 High Speed Eye Diagram Figure 7. USB 2.0 High Speed Pattern www.onsemi.com 7 NCN1188 TYPICAL OPERATING CHARACTERISTICS Figure 8. USB 1.1 Full Speed Eye Diagram Figure 9. USB 1.0 Full Speed Pattern Figure 10. USB 1.0 Low Speed Eye Diagram Figure 11. USB 1.0 Low Speed Pattern 6.3 DATA PATH ON RESISTANCE (W) QUIESCENT CURRENT (mA) 35 30 25 20 15 10 5 0 6.1 5.9 5.7 5.5 5.3 5.1 4.9 4.7 4.5 2 2.5 3 3.5 4 4.5 5 5.5 0 1 2 3 VCC (V) VIS (V) Figure 12. Product Supply Current Figure 13. Data Path On Resistance www.onsemi.com 8 4 NCN1188 TYPICAL OPERATING CHARACTERISTICS 0 −5 −10 −15 −1 MAGNITUDE (dB) MAGNITUDE (dB) −2 −3 −4 −5 −6 −7 −8 −9 −10 10000000 100000000 1E+09 1E+10 −30 −35 −40 −45 −50 −55 −60 −65 10000000 100000000 1E+09 FREQUENCY (Hz) FREQUENCY (Hz) Figure 14. Data Switch Differential Insertion Loss Figure 15. Data Switch Differential Off Isolation 1E+10 5 AUDIO PATH ON RESISTANCE (W) 0 −10 −20 −30 −40 −50 −60 −70 10000000 100000000 1E+09 1E+10 4.5 4 3.5 3 2.5 2 −2 −1 0 1 FREQUENCY (Hz) VIS (V) Figure 16. Data Switch Differential Crosstalk Figure 17. Audio Path On Resistance 0.03 0.025 0.02 %THD+N MAGNITUDE (dB) −20 −25 0.015 0.01 0.005 0 10 100 1000 FREQUENCY (Hz) Figure 18. Audio THD www.onsemi.com 9 10000 2 NCN1188 PARAMETER MEASUREMENT INFORMATION Figure 19. Differential Insertion Loss (SDD21) Figure 20. Differential Off Isolation (SDD21) Figure 21. Differential Crosstalk (SDD21) Figure 22. Bit−to−Bit and Channel−to−Channel Skew tskew = |tPLH1-tPLH2| or |tPHL1-tPHL2| Figure 23. tON and tOFF Figure 25. On State Leakage Figure 24. Off State Leakage www.onsemi.com 10 NCN1188 DETAILED APPLICATION from 3.0 V to 4.2 V. The NCN1188 switch connects a 5−pin micro−USB connector to a Communication Processor, an MHL Application Processor, and the Audio Management IC headphone amplifier. Each function is active pending on power management IC accessory detection to control IN1 and IN2. This decision is usually made on the D−, D+, and ID pins to detect and differentiate accessory types such as USB cable, USB to HDMI MHL cable and micro−USB stereo headset. For solutions related to portable devices accessory detection, contact your ON Semiconductor Field Applications Engineer. The USB 3.0 Micro−B receptacle may be considered a combination of the USB 2.0 Micro−B interface and USB 3.0 SuperSpeed contacts and maintains backward compatibility with USB 2.0 Micro−B plugs. As a consequence, the NCN1188’s USB 2.0 capability is fully compatible to the USB 3.0 Micro−B receptacle, as well as USB 2.0 accessories. The NCN1188 voltage range and high bandwidth performance permits switching between audio, video and data signals on a portable device. It allows D+ and D− data pins of a single USB connector to be used for many different functions as pictured by Figure 1: • USB 2.0 data transfer with backward compatibility to USB 1.1 and USB 1.0 • MHL high definition video transfer up to 3 Gbps for 1080p resolutions • Audio headset with negative voltage capability to connect true ground audio amplifier • UART to address programming and testing in factory • Any other analog or digital data sources within the recommended operating conditions Figures 26 and 27 detail two design examples with different switching combinations using NCN1188. In the first example shown in Figure 26, the device is directly supplied from a single Li−Ion battery, typically Single Cell Li−ion 3.0V to 4.2V Power Management IC Battery Charger D− D+ ID Vcc_core 100n Vcc_IO 3 9 ID_in USB 2.0 Communication Processor USB− 5 USB+ 1 MHL− 4 MHL+ 2 6 Vcc_core 12 Vcc_IO HD ID_out Video 11 IN1 IN2 7 Accessory Detect VCC USB2.0_MICROB GND DN DP HDN D− 8 D+ 10 VBUS D− D+ ID 1 2 3 4 5 HDP AUDN AUDP NCN1188 CBUS MHL Application Processor Control Audio Left Headset Amps Audio Right Audio Management IC Figure 26. Schematic Example for USB 2.0, MHL, and Audio Combination; NCN1188 being supplied from battery www.onsemi.com 11 NCN1188 Single Cell Li−ion 3.0V to 4.2V Power Management IC Over Voltage Protection Protected 5V Battery Charger D− D+ ID IN2 Vcc_core 3 100n Vcc_IO 9 ID_in USB 2.0 USB− 5 USB+ 1 4 MicB_SSTX− 2 MicB_SSTX+ 6 USB 3.0 MicB_SSRX− 12 11 7 OVP 28V IN1 Accessory Detect VCC USB3.0_MICROB GND DN DP HDN HDP AUDN D− 8 D+ 10 VBUS D− D+ ID MicB_SSTX− MicB_SSTX+ MicB_SSRX− MicB_SSRX+ 1 2 3 4 5 6 7 8 9 10 AUDP MicB_SSRX+ NCN1188 UART Rx Tx Communication Processor Vcc_core MHL− Vcc_IO HD ID_out Video MHL+ CBUS MHL Application Processor Figure 27. Schematic Example for USB 2.0, MHL, and UART Combination; NCN1188 Being Supplied by Protected VBUS 5 V In this second design proposal, as NCN1188 must be active only when VBUS accessories are connected (USB cable, UART cable and MHL cable), the device is supplied from a protected VBUS 5 V. This design arrangement limits the system’s overall quiescent current and saves battery life. Figure 27 also pictures NCN1188 around a USB 3.0 Micro−B topology: USB 2.0, UART and MHL Video pairs remain multiplexed with D− and D+ while the two USB 3.0 differential pairs are directly connected to the main communication processor. Pull−down resistors of 1 MW down to 100 kW can optionally be added on the D− and D+ I/Os for preventing eventual floating voltage situation on the NCN1188. This is not systematically necessary and has to be considered in regards to the application. The flexibility of the NCN1188 offers many extra application and design combinations. www.onsemi.com 12 NCN1188 PCB DESIGN PROCEDURE • Make the signal traces as short as possible to reduce Implementing a high speed device requires careful design of signal traces to preserve signal integrity. The following electrical layout guidelines are basic rules to follow when designing boards capable of high speed transmission. • The bypass capacitor must be placed as close as possible to the VCC input pin for noise immunity. • The PCB should be designed to comply with the characteristic impedance requirements of MHL and USB. • losses through the PCB. Furthermore, all corresponding D+ / D− line segment pairs should be the same length. The use of turns or bends to route these signals should be avoided when possible. Use 45° bends instead of 90° bends where bends are needed. The use of vias to route these signals should be avoided when possible. www.onsemi.com 13 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UQFN12 1.7x2.0, 0.4P CASE 523AE−01 ISSUE A DATE 11 JUN 2007 1 SCALE 4:1 A B D ÉÉÉ ÉÉÉ ÉÉÉ PIN 1 REFERENCE 2X 0.10 C 2X 0.10 C L1 DETAIL A E NOTE 5 TOP VIEW DETAIL B A 0.05 C 12X 0.05 C A1 A3 8X C SIDE VIEW SEATING PLANE DIM A A1 A3 b D E e K L L1 L2 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.70 BSC 2.00 BSC 0.40 BSC 0.20 ---0.45 0.55 0.00 0.03 0.15 REF K 5 GENERIC MARKING DIAGRAM* 7 DETAIL A e 1 12X DETAIL B OPTIONAL CONSTRUCTION NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH 0.03 MAX ON BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. 11 L L2 12X XXM G b 0.10 M C A B 0.05 M C BOTTOM VIEW NOTE 3 XX = Specific Device Code M = Date Code G = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. MOUNTING FOOTPRINT SOLDERMASK DEFINED 2.00 1 0.40 PITCH 0.32 2.30 11X 0.22 12X 0.69 DIMENSIONS: MILLIMETERS DOCUMENT NUMBER: DESCRIPTION: 98AON23418D UQFN12 1.7 X 2.0, 0.4P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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