NCN3411MTTWG

NCN3411 4-Differential Channel 1:2 Mux/Demux Switch for PCI Express Gen3 The NCN3411 is a 4−Channel differential SPDT switch designed to route PCI Express Gen3 signals. When used in a PCI Express application, the switch can handle up to two PCIe lanes. Due to the ultra−low ON−state capacitance (2 pF typ) and resistance (7.5 W typ), these switches are ideal for switching high frequency data signals up to a signal bit rate of 8 Gbps. This switch pinout is designed to be used in BTX form factor desktop PCs and is available in a space−saving 3.5 x 9 x 0.75 mm WQFN42 package. http://onsemi.com MARKING DIAGRAM 1 Features • • • • • • • • • • • • NCN3411 AWLYYWWG WQFN42 CASE 510AP VDD Power Supply from 1.5 V to 2.0 V 4 Differential Channels 2:1 MUX/DEMUX Compatible with PCIe 3.0 Data Rate: Supports 8 Gbps Low Crosstalk −30 dB @ 4 GHz Low Bit−to−Bit Skew: 5 ps Low RON Resistance: 13 W max Low CON Capacitance: 2 pF Low Supply Current: 200 mA Off Isolation: −20 dB @ 4 GHz Space Saving Small WQFN−42 Package This is a Pb−Free Device XXXXX A WL YY WW G = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION Device NCN3411MTTWG Package Shipping† WQFN42 2000 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Typical Applications • Notebook Computer • Desktop computer • Server/Storage Area Network PCIe Slot B0 +/− B1 +/− A0 +/− A1 +/− A2 +/− NCN3411 A3 +/− B3 +/− C0 +/− PCIe Slot PCI Express Controller B2 +/− C1 +/− C2 +/− C3 +/− Figure 1. Application Schematic © Semiconductor Components Industries, LLC, 2011 September, 2011 − Rev. 0 1 Publication Order Number: NCN3411/D NCN3411 A0+ B0+ A0− B0− A1+ B1+ A1− B1− C0+ C0− C1+ C1− A2+ B2+ A2− B2− A3+ B3+ A3− B3− C2+ C2− C3+ C3− SEL Figure 2. NCN3411 Functional Block Diagram (Top View) TRUTH TABLE Function SEL AN to BN L AN to CN H http://onsemi.com 2 VDD GND VDD GND 42 41 40 39 NCN3411 GND 1 38 B0+ A0+ 2 37 B0− A0− 3 36 B1+ GND 4 35 B1− VDD 5 34 C0+ A1+ 6 33 C0− A1− 7 32 C1+ VDD 8 31 C1− SEL 9 30 VDD GND 10 29 B2+ A2+ 11 28 B2− A2− 12 27 B3+ VDD 13 26 B3− GND 14 25 C2+ A3+ 15 24 C2− A3− 16 23 C3+ GND 17 22 C3− Exposed Pad on Underside 20 21 VDD GND 19 GND VDD 18 (Connect to Gnd) Figure 3. Pin Description (Top View) http://onsemi.com 3 NCN3411 PIN FUNCTION AND DESCRIPTION Pin Pin Name 2 3 A0+ A0− Signal I/0, Channel 0, Port A Description 6 7 A1+ A1− Signal I/0, Channel 1, Port A 11 12 A2+ A2− Signal I/0, Channel 2, Port A 15 16 A3+ A3− Signal I/0, Channel 3, Port A 38 37 B0+ B0− Signal I/0, Channel 0, Port B 36 35 B1+ B1− Signal I/0, Channel 1, Port B 29 28 B2+ B2− Signal I/0, Channel 2, Port B 27 26 B3+ B3− Signal I/0, Channel 3, Port B 34 33 C0+ C0− Signal I/0, Channel 0, Port C 32 31 C1+ C1− Signal I/0, Channel 1, Port C 25 24 C2+ C2− Signal I/0, Channel 2, Port C 23 22 C3+ C3− Signal I/0, Channel 3, Port C 9 SEL Operational Mode Select (When SEL = 0: A → B, When SEL = 1: A → C) 5, 8, 13, 18, 20, 30, 40, 42 VDD DC Supply: 1.5 V to 2.0 V 1, 4, 10, 14, 17, 19, 21, 39, 41 GND Power Ground Exposed Pad − The exposed pad on the backside of package is internally connected to GND. Externally the pad should also be user−connected to GND. http://onsemi.com 4 NCN3411 MAXIMUM RATINGS Symbol Rating Units Power Supply Voltage Parameter VDD −0.5 to 2.5 VDC Input/Output Voltage Range of the Switch (AN, BN, CN) VIS −0.5 to VDD VDC VSEL −0.5 to VDD VDC Continuous Current Through One Switch Icc ±120 mA Maximum Junction Temperature (Note 1) TJ 150 °C Selection Pin Voltages Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Range Tstg −65 to +150 °C Thermal Resistance, Junction−to−Air RqJA 75 °C/W ILU ±100 mA Human Body Model (HBM) ESD Rating (Note 3) ESD HBM 7000 V Machine Model (MM) ESD Rating (Note 3) ESD MM 400 V MSL Level 1 − Latch−up Current (Note 2) Moisture Sensitivity (Note 4) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Power dissipation must be considered to ensure maximum junction temperature (TJ) is not exceeded. 2. Latch up Current Maximum Rating: ±100 mA per JEDEC standard: JESD78. 3. This device series contains ESD protection and passes the following tests: Human Body Model (HBM) ±7.0 kV per JEDEC standard: JESD22−A114 for all pins. Machine Model (MM) ±400 V per JEDEC standard: JESD22−A115 for all pins. 4. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A. http://onsemi.com 5 NCN3411 DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE (TA = −40°C to +85°C, VDD = 1.5 V to 2.0 V, GND = 0V) Symbol Pins Parameters Conditions (Note 5) Min. Typ (Note 6) Max. Units 1.5 1.8 2.0 V 200 300 mA 1.2 V POWER SUPPLY VDD VDD, GND Supply Voltage Range With respect to GND IDD VDD, GND Quiescent Supply Current VDD = 2 V, VSEL = GND or VDD DATA SWITCH PERFORMANCE VIS AN, BN, CN Data Input/Output Voltage Range 0 RON BN On Resistance (BN) VDD = 1.5 V, VIS = 0 V to 1.2 V, IIS = 15 mA 7.5 13 W RON CN On Resistance (CN) VDD = 1.5 V, VIS = 0 V to 1.2 V, IIS = 15 mA 8.0 13 W RON(flat) BN On Resistance Flatness VDD = 1.5 V, VIS = 0 V to 1.2 V, IIS = 15 mA (Note 7) 0.1 1.24 W RON(flat) CN On Resistance Flatness VDD = 1.5 V, VIS = 0 V to 1.2 V, IIS = 15 mA (Note 7) 0.1 1.24 W DRON BN On Resistance Matching(BN) VDD = 1.5 V, VIS = 0 V, IIS = 15 mA (Note 7) 0.35 W DRON CN On Resistance Matching(CN) VDD = 1.5 V, VIS = 0 V, IIS = 15 mA (Note 7) 0.35 W CON AN to BN, AN to CN On Capacitance f = 1 MHz, Switch On, Open Output 2.0 pF COFF AN to BN, AN to CN Off Capacitance f = 1 MHz, Switch Off 1.5 pF ION AN to BN, AN to CN On Leakage Current VDD = 2 V, VAN = 0 V, 1.2 V, Switch On to BN/CN, BN/CN pins are unconnected −1 +1 mA IOFF AN to BN, AN to CN Off Leakage Current VDD = 2 V, VAN = 0 V, 1.2 V, Switch Off to BN/CN, VBN/VCN = 1.2 V, 0 V −1 +1 mA LOGIC INPUT CHARACTERISTICS (SEL Pin) VIH SEL Input HIGH Voltage (Note 7) 0.65 x VDD VDD V VIL SEL Input LOW Voltage (Note 7) 0 0.35 x VDD V VIK SEL Clamp Diode Voltage VDD = Max, ISEL = −18mA −1.2 V IIH SEL Input HIGH Current VDD = Max, VSEL = VDD ±5 mA IIL SEL Input LOW Current VDD = Max, VSEL = GND ±5 mA −0.7 SWITCHING CHARACTERISTICS tSELON SEL, AN, BN/CN Line Enable Time SEL to AN, BN, CN RL = 50 W, CL = 20 pF 8.0 ns tSELOFF SEL, AN, BN/CN Line Disable Time SEL to AN, BN, CN RL = 50 W, CL = 20 pF 5.0 ns tb−b AN, BN/CN Bit−to−bit skew Within the same differential pair 5.0 ps tch−ch AN, BN Channel−to channel skew Maximum skew between all channels 50 ps 5. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device type. 6. Typical values are at VDD = 1.8 V, TA = 25°C ambient and maximum loading. 7. Guaranteed by design and/or characterization. http://onsemi.com 6 NCN3411 DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE (TA = −40°C to +85°C, VDD = 1.5 V to 2.0 V, GND = 0V) Symbol Pins Conditions (Note 5) Parameters Min. Typ (Note 6) Max. Units DYNAMIC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE BR AN to BN, AN to CN Signal Bit Rate DIL AN to BN, AN to CN Differential Insertion Loss DCTK AN, BN, CN Differential Crosstalk DISO AN to BN, AN to CN Differential Off Isolation AN to BN, AN to CN Differential Return Loss DRL 8.0 Gbps f = 4 GHz −2.0 dB f = 100 MHz −0.7 dB f = 4 GHz −30 dB f = 100 MHz −58 dB f = 4 GHz −20 dB f = 100 MHz −58 dB f = 4 GHz −9.0 dB f = 100 MHz −22 dB 5. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device type. 6. Typical values are at VDD = 1.8 V, TA = 25°C ambient and maximum loading. 7. Guaranteed by design and/or characterization. TYPICAL OPERATING CHARACTERISTICS Figure 4. Reference PCIe 3.0 Eye Diagram without Switch at 8 Gbps, 800 mVpp Differential Swing Figure 5. PCIe 3.0 Eye Diagram through NCN3411 at 8 Gbps, 800 mVpp Differential Swing http://onsemi.com 7 NCN3411 0 0 −2 −10 −20 −4 −30 MAGNITUDE (dB) MAGNITUDE (dB) TYPICAL OPERATING CHARACTERISTICS −6 −8 −10 −12 −40 −50 −60 −70 −80 −14 −90 −16 100000000 −100 1E+10 100000000 1E+09 1E+09 FREQUENCY (Hz) FREQUENCY (Hz) Figure 6. Differential Insertion Loss Figure 7. Differential Crosstalk 0 1E+10 0 −10 −5 MAGNITUDE (dB) −30 −40 −50 −60 −70 −10 −15 −20 −80 −25 −90 100000000 1E+09 1E+10 100000000 1E+09 FREQUENCY (Hz) FREQUENCY (Hz) Figure 8. Differential Off Isolation Figure 9. Differential Return Loss 9 RON, ON RESISTANCE (W) MAGNITUDE (dB) −20 8.5 8 7.5 7 6.5 6 0 0.2 0.4 0.6 0.8 1 VIS (V) Figure 10. RON vs. VIS http://onsemi.com 8 1.2 1.4 1E+10 NCN3411 PARAMETER MEASUREMENT INFORMATION Figure 11. Differential Insertion Loss (SDD21) and Differential Return Loss (SDD11) Figure 12. Differential Off Isolation (SDD21) tskew = |tPLH1-tPLH2| or |tPHL1-tPHL2| Figure 13. Differential Crosstalk (SDD21) Figure 14. Bit−to−Bit and Channel−to−Channel Skew Figure 15. tON and tOFF Figure 16. Off State Leakage Figure 17. On State Leakage http://onsemi.com 9 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WQFN42 3.5x9, 0.5P CASE 510AP−01 ISSUE O DATE 15 FEB 2010 1 SCALE 2:1 PIN ONE REFERENCE ÇÇ ÇÇ ÇÇ ÇÇ NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B D L L L1 DETAIL A E ALTERNATE TERMINAL CONSTRUCTIONS DIM A A1 A3 b D D2 E E2 e K L L1 ÉÉ ÉÉ EXPOSED Cu 0.15 C 0.15 C MOLD CMPD DETAIL B TOP VIEW ALTERNATE CONSTRUCTION A 0.10 C A3 GENERIC MARKING DIAGRAM* 0.08 C DETAIL B NOTE 4 A1 SIDE VIEW C XXXXXXXX XXXXXXXX AWLYYWWG SEATING PLANE 0.10 C A B D2 DETAIL A 17 42X 22 L b 0.10 C A B 0.05 C XXXXX A WL YY WW G K 42X NOTE 3 38 = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G”, may or not be present. E2 1 MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.20 0.30 3.50 BSC 1.95 2.15 9.00 BSC 7.45 7.65 0.50 BSC 0.20 −−− 0.30 0.50 0.00 0.15 RECOMMENDED MOUNTING FOOTPRINT 0.10 C A B 9.30 42X e 0.63 e/2 BOTTOM VIEW 0.50 PITCH 3.80 2.16 1 42X 0.35 PACKAGE OUTLINE DIMENSIONS: MILLIMETERS DOCUMENT NUMBER: DESCRIPTION: 98AON48316E WQFN42 3.5X9, 0.5P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative