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NCN6000DTBR2G

NCN6000DTBR2G

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    TSSOP20

  • 描述:

    ATM Terminals, Gas Pumps, ISM Interface 20-TSSOP

  • 数据手册
  • 价格&库存
NCN6000DTBR2G 数据手册
NCN6000 Compact Smart Card Interface IC The NCN6000 is an integrated circuit dedicated to the smart card interface applications. The device handles any type of smart card through a simple and flexible microcontroller interface. On top of that, due to the built−in chip select pin, several couplers can be connected in parallel. The device is particularly suited for low cost, low power applications, with high extended battery life coming from extremely low quiescent current. http://onsemi.com MARKING DIAGRAM Features 20 • 100% Compatible with ISO7816−3 and EMV Standard • Wide Battery Supply Voltage Range: 2.7 v Vbat v 6.0 V • Programmable CRD_VCC Supply to Cope with either 3.0 V or 5.0 V Card Operation • Built−in DC−DC Converter Generates the CRD_VCC Supply with a • • • • • • • • Single External Low Cost Inductor only, providing a High Efficiency Power Conversion Full Control of the Power Up/Down Sequence Yields High Signal Integrity on both the Card I/O and the Signal Lines Programmable Card Clock Generator Built−in Chip Select Logic allows Parallel Coupling Operation ESD Protection on Card Pins (8.0 kV, Human Body Model) Fault Monitoring includes Vbatlow and Vcclow, providing Logic Feedback to External CPU Card Detection Programmable to Handle Positive or Negative Going Input Built−in Programmable CRD_CLK Stop Function Handles both High or Low State These are Pb−Free Devices** Typical Application • E−Commerce Interface • ATM Smart Card • Pay TV System 1 A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) PIN CONNECTIONS A0 1 20 Vbat A1 2 19 Lout_H PGM 3 18 Lout_L PWR_ON 4 17 PWR_GND STATUS 5 16 GROUND CS 6 15 CRD_VCC RESET 7 14 CRD_IO I/O 8 13 CRD_CLK INT 9 12 CRD_RST CLOCK_IN 10 11 CRD_DET (Top View) ORDERING INFORMATION ISO/EMV MICRO CONTROLLER NCN 6000 ALYWG G TSSOP−20 DTB SUFFIX CASE 948E 1 NCN6000 SMART CARD INTERFACE Device Package Shipping † NCN6000DTB TSSOP−20* 75 Units / Rail NCN6000DTBG TSSOP−20* 75 Units / Rail NCN6000DTBR2 TSSOP−20* 2500/Tape & Reel NCN6000DTBR2G TSSOP−20* 2500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. Figure 1. Simplified Application **For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 March, 2006 − Rev. 4 1 Publication Order Number: NCN6000/D NCN6000 +5 V PB7 2 PB6 3 PB5 PB4 PB3 PB2 PB1 PB0 4 5 6 7 8 9 IRQ 10 MCU 20 A0 Vbat A1 Lout_H PGM Lout_L PWR_ON PWR_GND STATUS GROUND CS CRD_VCC RESET 10 F C1 U1 1 CRD_IO I/O CRD_CLK INT CRD_RST XTAL CLOCK_IN CRD_DET GND NCN6000 GND 19 L1 18 22 H 17 16 GND 15 C2 10 F C3 100 nF 14 13 GND 17 18 12 8 11 4 3 2 1 GND GND 5 7 Swb C8 C4 CLK RST VCC GND I/O VPP J1 SMARTCARD Figure 2. Typical Application http://onsemi.com 2 GND GND Swa ISO7816 VCC NCN6000 +Vbat + − Vbat_OK 20 Vbat 2.0 V 50 k INT 9 500 k Vbat GND 11 Q R GND +Vbat CARD DETECTION POLARITY PROGRAMMABLE 50 k CS CRD_DET 50 s Delay S STATUS INT 6 CLK STOP PGM 3 A1 2 A0 1 Fout DC−DC CONVERTER DATA SELECT DECODER 1:16 VCC CLOCK 15 CRD_VCC 19 Lout_H 3V/5V Set_VCC Power Down Active Pwr_Down 1/1 1/2 1/4 1/8 CLOCK_IN 10 CLOCK DIVIDER 18 Lout_L GND FAULT 17 PWR_GND ON/OFF STATUS INT DC−DC STATUS ENABLE VCC CARD STATUS PWR_ON 4 16 GROUND LOGIC & CARD PINS SEQUENCER SEQ 3 50 k SEQ 2 SEQ 1 Vbat STATUS GND 5 Vbat VCC Vbat_OK CLOCK CLK_STOP CLOCK 13 CRD_CLK SEQ 2 2 A GND Vbat 1 20 k Vbat_OK I/O 20 k SEQ 1 8 I/O DATA DATA 14 CRD_IO I/O 1 RESET 7 2 Vbat 3 SEQ 3 PWR_ON Figure 3. Block Diagram http://onsemi.com 3 RESET 12 CRD_RST L L L L L L L L L L L L L L L L H H H H − − − − − − − − − − − − − − − − H/L H/L L/H H/L 2 3 4 5 6 7 4 8 9 10 11 http://onsemi.com 12 13 14 15 16 17 18 19 20 Z Z Z Z H H H H H H H H L L L L L L L L H H L L H H H H L L L L H H H H L L L L STATUS PGM RESET A1 1 H L H L H H L L H H L L H H L L H H L L A0 Z Z Z Z H L H L H L L H H L H L H L H L I/O Program Chip Normal Chip Operation CARD PRESENT NO CARD DC−DC OK DC−DC OVERLOADED Figure 4. Programming and Normal Operation Basic Timing Read CRD_VCC status−> Low = CRD_VCC Low Voltage Read STATUS = 1−>DC−DCOK/ = 0−> DC−DC Overloaded Read Vbat status−> Low = Battery OK CRD_DET = Normally Close Read STATUS = 1−> Card Present/ = 0−> No Card CRD_DET = Normally Close CRD_DET = Normally Close CRD_DET = Normally Open Reserved STOP CRD_CLKLow STOP CRD_CLKHigh 5 V CLOCK_IN 1/8 ENABLE CRD_CLK 5 V CLOCK_IN 1/2 5 V CLOCK_IN 1/4 3 V CLOCK_IN 1/8 5 V CLOCK_IN 1/1 3 V CLOCK_IN 1/2 3 V CLOCK_IN 1/4 3 V CLOCK_IN 1/1 CS I/O A0 A1 RESET PGM STATUS NCN6000 NCN6000 The programming can be achieved with the card powered ON or OFF. The identification of the interrupt is carried out by polling the STATUS pin, the Vbat voltage and the DC−DC results being provided on the same pin as depicted INTERRUPT ACKNOWLEDGE by the table in Figure 4. During the programming mode, the PGM pin can be released to High since the mode is internally latched by the Negative going transition presents on the Chip Select pin. CARD IDENTIFICATION POLLING 50 s CARD EXTRACTED 50 s CRD_DET INT CS PGM High A0 Low A1 Low STATUS S1 CLEAR INTERRUPT S2 CARD PRESENT: STATUS = 1 S3 CLEAR INTERRUPT S4 CARD PRESENT: STATUS = 0 Figure 5. Interrupt Servicing and Card Polling otherwise a Low is presented pin 5. The 50 s digital filter is activated during both Insertion and Extraction of the card. The MPU shall clear the INT line when the card has been extracted, making the interrupt function available for other purposes. However, neither the NCN6000 operation nor the smart card I/O line or commands are affected by the state of the INT pin. On the other hand, clearing the INT and reading the STATUS register can be performed by a single read by the MPU: states S1 and S2 can be combined in a single instruction, the same for S3 and S4. When a card is either inserted or extracted, the CRD_DET pin signal is debounced internally prior to pull the INT pin to Low. The built−in logic circuit automatically accommodates positive or negative input signal slope, on both insertion and extraction state, depending upon the polarity defined during the initialization sequence. The default condition is Normally Open switch, negative going card detection. The external CPU shall acknowledge the request by forcing CS = L which, in turn, releases the INT pin to High upon positive going of Chip Select (Table 4). Polling the STATUS pin as depicted in Table 3 identifies the active card. If a card is present, the STATUS returns High, http://onsemi.com 5 NCN6000 ABBREVIATIONS Lout_H DC−DC External Inductor Lout_L DC−DC External Inductor Cout Output Capacitor VCC Card Power Supply Input Icc Current at CRD_VCC Pin Class A 5.0 V Smart Card Class B 3.0 V Smart Card CS Chip Select (from MPU) Z High Impedance Logic State (according to ISO7816) CRD_VCC Interface IC Card Power Supply Output CRD_CLK Interface IC Card Clock Output CRD_RST Interface IC Card Reset Output CRD_IO Interface IC Card I/O Signal Line CRD_DET Interface IC Card Detection ATR Answer to Reset PGM Select Programming or Normal Operation INT Interrupt (to MPU) tr Rise Time tf Fall Time td Delay Time ts Storage Time PIN FUNCTIONS AND DESCRIPTION Pin Name Type Description 1 A0 INPUT This pin is combined with A1, PGM, RESET and I/O to program the chip mode of operation and to read the data provided by STATUS. (Figures 4 and 5 and Tables 2 and 3) 2 A1 INPUT This pin is combined with A0, PGM, RESET and I/O to program the chip mode of operation and to read the data provided by STATUS. (Figures 4 and 5 and Tables 2 and 3) 3 PGM INPUT This pin is combined with A0, A1, RESET and I/O to program the chip mode of operation and to read the data provided by STATUS. (Figures 4 and 5 and Tables 2 and 3) 4 PWR_ON INPUT Pull Down This pin validates the operation of the internal DC−DC converter: CS = L + PWR_ON = Negative going: DC−DC is OFF CS = L + PWR_ON = Positive going: DC−DC is ON Note: The PWR_ON bit must be combined with a Low state CS signal to activate the function. (Table 2) 5 STATUS OUTPUT This pin provides logic state related to the card and NCN6000 status. According to the A0, A1 and PGM logic state, this pin carries either the Card present status or the Vbat or the DC−DC operation state. When PGM = L, STATUS is not affected, see Table 2. 6 CS INPUT Pull Up This pin provides the NCN6000 chip select function. The PWR_ON, RESET, I/O, A0, A1 and PGM signals are disabled when CS = H. When PGM = L and CS = L, the device jumps to the programming mode (Figure 4 and Tables 1, 2 and 3). The Chip Select pin must be a unique physical address when more than one card are controlled by a single MPU. The data presented by the MPU are latched upon positive going edge of the Chip Select pin. 7 RESET INPUT Pull Down This pin provides two modes of operation depending upon the logic state of PGM pin 3: PGM = 1: The signal present at this pin is translated to pin 12 (card reset signal) when CS = L and PWR_ON = H. It is latched when CS = H. PGM = 0: The signal present on this pin is used as a logic input to program the internal functions (Figure 5 and Tables 2 and 3). http://onsemi.com 6 NCN6000 PIN FUNCTIONS AND DESCRIPTION (continued) Pin Name Type Description 8 I/O Input/Output Pull Up This pin is connected to an external microcontroller interface. A bidirectional level translator adapts the serial I/O signal between the smart card and the microcontroller. The level translator is enabled when CS = L. The signal present on this pin is latched when CS = H. This pin is also used in programming mode (Tables 1, 2 and 3, Figures 4 and 5). 9 INT OUTPUT Pull Down This pin is activated LOW when a card has been inserted and detected by the interface or when the NCN6000 reports Vbat or CRD_VCC status (See Table 6). The signal is reset to a logic 1 on the rising edge of either CS or PWR_ON. The Collector open mode makes possible the wired AND/OR external logic. When two or more interfaces share the INT function with a single microcontroller, the software must poll the STATUS pin to identify the origin of the interrupt (Figure 5). 10 CLOCK_IN CLOCK INPUT High Impedance This pin can be connected to either the microcontroller master clock, or to any clock signal, to drive the external smart cards. The signal is fed to internal clock selector circuit and translated to the CRD_CLK pin at either the same frequency, or divided by 2 or 4 or 8, depending upon the programming mode (Tables 1, 2 and 3). Care must be observed, at PCB level, to minimize the pick−up noise coming from the CLOCK_IN line. It is recommended to put a shield, built with a 10 mil copper track, around this line and terminated to the GND. 11 CRD_DET INPUT The signal coming from the external card connector is used to detect the presence of the card. A built−in pull up low current source makes this pin active LOW or HIGH, assuming one side of the external switch is connected to ground. At Vbat start up, the default condition is Normally Open switch, negative going insertion detection. The Normally Closed switch, positive going insertion detection, can be defined by programming the NCN6000 accordingly. In this case, the polarity must be set up during the first cycles of the system initialization, otherwise an already inserted card will not be detected by the chip. 12 CRD_RST OUTPUT This pin is connected to the RESET pin of the card connector. A level translator adapts the RESET signal from the microcontroller to the external card. The output current is internally limited to 15 mA. The CRD_RST is validated when PWR_ON = H and PGM = H and hard wired to Ground when the card is deactivated. 13 CRD_CLK OUTPUT This pin is connected to the CLK pin of the card connector. The CRD_CLK signal comes from the clock selector circuit output. Combining A0, A1, PGM and I/O, as depicted in Table 3 and Figure 3, programs the clock selection. This signal can be forced into a standby mode with CRD_CLK either High or Low, depending upon the mode defined by the programming sequence (Tables 1, 2 and 3 and Figure 4). Care must be observed, at PCB level, to minimize the pick−up noise coming from the CRD_CLK line. It is recommended to put a shield, built with a 10mil copper track, around this line and terminated to the GND. 14 CRD_IO I/O This pin handles the connection to the serial I/O pin of the card connector. A bidirectional level translator adapts the serial I/O signal between the card and the microcontroller. The CRD_IO pin current is internally limited to 15 mA. A built−in register holds the previous state presents on the I/O input pin. 15 CRD_VCC POWER This pin provides the power to the external card. It is the logic level “1” for CRD_IO, CRD_RST and CRD_CLK signals. The energy stored by the DC−DC external inductor Lout must be smoothed by a 10 F capacitor, associated with a 100 nF ceramic in parallel, connected across CRD_VCC and GND. In the event of a CRD_VCC UVLOW voltage, the NCN6000 detects the situation and feedback the information in the STATUS bit. The device does not take any further action, particularly the DC−DC converter is neither stopped nor reprogrammed by the NCN6000. It is up to the external MPU to handle the situation. However, when the CRD_VCC is overloaded, the NCN6000 shut off the DC−DC converter, pulls the INT pin Low and reports the fault in the STATUS register. 16 GROUND SIGNAL The logic and low level analog signals shall be connected to this ground pin. This pin must be externally connected to the PWR_GND pin 17. The designer must make sure no high current transients are shared with the low signal currents flowing into this pin. 17 PWR_GND POWER This pin is the Power Ground associated with the built−in DC−DC converter and must be connected to the system ground together with GROUND pin 11. Using good quality ground plane is recommended to avoid spikes on the logic signal lines. 18 Lout_L POWER The High Side of the external inductor is connected between this pin and Lout_H to provide the DC−DC function. The built−in MOS devices provide the switching function together with the CRD_VCC voltage rectification. http://onsemi.com 7 NCN6000 PIN FUNCTIONS AND DESCRIPTION (continued) Pin Name Type Description 19 Lout_H POWER The High Side of the external inductor is connected between this pin and Lout_L to provide the DC−DC function. The current flowing into this inductor is limited by a sense resistor internally connected from Vbat/pin 20 and pin 19. Typically, Lout = 22H, with ESR < 2.0 , for a nominal 55 mA output load. 20 Vbat POWER This pin is connected to the supply voltage and monitored by the NCN6000. The operation is inhibited when Vbat is below the minimum 2.70 V value, followed by a PWR_DOWN sequence and a Low STATUS state. MAXIMUM RATINGS (Note 1) Rating Symbol Value Unit Battery Supply Voltage Vbat 7.0 V Battery Supply Current (Note 2) Ibat 300 mA Power Supply Voltage Vcc 6.0 V Power Supply Current Icc "100 mA Digital Input Pins Vin −0.5 V < Vin < Vbat +0.5 V, but < 7.0 V V Iin "5.0 mA Digital Output Pins Vout −0.5 V < Vin < Vbat +0.5 V, but < 7.0 V V Digital Output Pins Iout "10 mA Card Interface Pins Vcard −0.5 V < Vcard < CRD_VCC +0.5 V V Card Interface Pins, except CRD_CLK Icard "15 mA Inductor Current ILout 300 mA ESD Capability (Note 3) Standard Pins Card Interface Pins and CRD_DET VESD Digital Input Pins kV 2.0 8.0 TSSOP−20 Package Power Dissipation @ Tamb = +85°C Thermal Resistance Junction to Air (Rja) PDS Rja 320 125 mW °C/W Operating Ambient Temperature Range TA −25 to +85 °C Operating Junction Temperature Range TJ −25 to +125 °C TJmax +150 °C Tsg −65 to +150 °C Maximum Junction Temperature (Note 4) Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = +25°C. 2. This current represents the maximum peak current the pin can sustain, not the NCN6000 consumption (see Ibatop). 3. Human Body Model, R = 1500 , C = 100 pF. 4. Absolute Maximum Rating beyond which damage to the device may occur. http://onsemi.com 8 NCN6000 POWER SUPPLY SECTION (−25°C to +85°C ambient temperature, unless otherwise noted.) Rating Symbol Pin Min Typ Max Unit Power Supply Vbat 20 2.7 − 6.0 V Standby Supply Current Conditions: PWR_ON = L, STATUS = H, CLOCK_IN = H, CS = H. All other logic inputs and outputs are open: Vbat = 3.0 V Vbat = 5.0 V Ibatsb 20 DC Operating Current (Figure 19) PWR_ON = H, CLOCK_IN = 0, CS = H, all CRD pins unloaded @ Vbat = 6.0 V, CRD_VCC = 5.0 V @ Vbat = 3.6 V, CRD_VCC = 5.0 V Ibatop Vbat Undervoltage DetectionHigh Vbat Undervoltage DetectionLow Vbat Undervoltage DetectionHysteresis VbatLH VbatLL VbatHY 20 Vcc 15 Output Card Supply Voltage @ Icc = 55 mA @ 2.70 V vVbat v6.0 V CRD_VCC = 3.0 V CRD_VCC = 5.0 V @ VbatLL < Vbat < 2.70 V CRD_VCC = 5.0 V Output Card Supply Peak Current @ Vcc = 5.0 V @ CRD_VCC = 5.0 V @ CRD_VCC = 3.0 V @ Vbat = 3.6 V, CRD_VCC = 5.0 V, Tamb < 65°C A − − 3.0 − 8.0 15 20 mA − − 7.0 2.0 − 5.0 2.1 2.0 − − − 100 2.7 2.6 − V VC3H VC5H 2.75 4.75 − − 3.25 5.25 VC5H 4.50 − − 55 55 65 − − − − − − Iccp V V mV 15 mA Output Current Limit Time Out tdoff 15 − 4.0 − ms Output Over Current Limit Iccov 15 − − 100 mA Output Dynamic Peak Current @ CRD_VCC = 3.0 V or 5.0 V, Cout = 10 F Ceramic XR7, Pulse Width 400 ns (Notes 5 and 6) Iccd 15 100 − − mA Battery Start−Up Current @ CRD_VCC = 3.0 V, −25°C v TA v+ 85°C @ CRD_VCC = 5.0 V, −25°CvTAv+ 85°C Iccst 20 − − 140 300 − − Output Card Supply Voltage Ripple @ Lout = 22 H, Cout 1 = 10 F, Cout 2 = 100 nF, Vbat = 3.6 V Iout = 55 mA CRD_VCC = 5.0 V (Note 5) CRD_VCC = 3.0V Vccrip Output Card Supply Turn On Time @ Lout = 22 F, Cout1 = 10 F, Cout2 = 100 nF, Vbat = 2.7 V, CRD_VCC = 5.0 V VccTON Output Card Supply Shut Off Time @ Cout1 = 10 F, Ceramic, Vbat = 2.7 V, CRD_VCC = 5.0 V, VccOFF < 0.4 V mA 15 mV − − − − 50 50 15 − − 2.0 ms VccTOFF 15 − − 250 s Fsw 18 − 600 − kHz Power Switch Drain/Source Resistor RONS 18 − 1.9 2.2  Output Rectifier ON Resistor ROND 15 − 2.8 3.4  DC−DC Converter Operating Frequency 5. Ceramic X7R, SMD types capacitors are mandatory to achieve the CRD_VCC specifications. When electrolytic capacitor is used, the external filter must include a 100 nF, max 50 m ESR capacitor in parallel, to reduce both the high frequency noise and ripple to a minimum. Depending upon the PCB layout, it might be necessary is to use two 6.8 F/10 V/ceramic/X7R//SMD1206 in parallel, yielding an improved CRD_VCC ripple over the temperature range. 6. According to ISO7816−3, paragraph 4.3.2. http://onsemi.com 9 NCN6000 DIGITAL PARAMETERS SECTION @ 2.70 VvVbatv6.0 V, NORMAL OPERATING MODE (−25°C to +85°C ambient temperature, unless otherwise noted.) Note: Digital inputs undershoot < −0.30 V to ground, Digital inputs overshoot
NCN6000DTBR2G 价格&库存

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