NCN7200

NCN7200 Gigabit Ethernet LAN Switch with 2:1 Mux/ DeMux and Power-down Feature The NCN7200 is pin−compatible to the PI3L720ZHE and comes in a 42−pin WQFN package (3.5 mm x 9 mm x 0.5 mm Pitch). The NCN7200 is an 8−channel, bidirectional switch with a power shutdown feature that puts all outputs in a high−impedance state. The switch is compatible with 10/100/1000 Base−T Ethernet standards. The device has 3 additional lines for status indicator LEDs which are switched together with the Ethernet pairs. Features http://onsemi.com MARKING DIAGRAM NCN7200 AWLYYWWG 1 • • • • • • • • 2:1 Mux/ DeMux LAN Switch Three Extra Channels Facilitate LED Switching Fully Specified for Power Supply Range: 3 V to 3.6 V Powerdown Feature Conserves Energy ESD Protection ♦ 8 kV HBM (Human Body Model, I/O to GND) ♦ 10 kV Contact Discharge (IEC61000−4−2) Low Crosstalk: −70 dB Pin−to−Pin Replacement for PI3L720ZHE This is a Pb−Free Device WQFN42 CASE 510AP A WL YY WW G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. Typical Applications • Routes signals for 10/100/1000 Mbps Ethernet • Facilitates Docking System by Interfacing One Controller to Dual Connectors © Semiconductor Components Industries, LLC, 2011 March, 2011 − Rev. 2 1 Publication Order Number: NCN7200/D NCN7200 A0+ A0− B0+ B0− C0+ . . . A3+ A3− C0− . . . B3+ B3− C3+ C3− LEDA0 LEDB0 LEDC0 LEDA1 LEDB1 LEDC1 LEDA2 LEDB2 LEDC2 SEL PD POWER DOWN Figure 1. Detailed Block Diagram TRUTH TABLE PD L L H SEL L H X Function AX to BX; LEDAX to LEDBX AX to CX; LEDAX to LEDCX Hi−Z http://onsemi.com 2 NCN7200 LEDC2 LEDA2 LEDB2 VDD 39 42 41 VDD A0+ A0− VDD PD A1+ A1− VDD A2+ A2− A3+ A3− SEL VDD LEDA0 LEDA1 LEDB0 1 40 38 B0+ 2 37 B0− C0+ C0− B1+ B1− C1+ C1− VDD B2+ B2− C2+ C2− B3+ B3− C3+ C3− 3 4 5 6 7 8 9 10 11 12 13 14 15 Exposed Pad on Underside (Connect to GND) 36 35 34 33 32 31 30 29 28 27 26 25 24 16 17 23 22 18 19 20 LEDC0 LEDC1 LEDB1 Figure 2. Pin Description (Top View) http://onsemi.com 3 VDD 21 NCN7200 PIN DESCRIPTION Pin Name AX+, AX− BX+, BX− CX+, CX− GND LEDZX PD SEL VDD Description Port A DeMux I/O Port B Mux I/O Port C LED Mux I/O Ground LED I/O Powerdown, Active high, with internal pulldown resistor Select Power MAXIMUM RATINGS Description Storage Temperature Supply Voltage to Ground Potential DC Input Voltage DC Output Current (Note 1) Power Dissipation (Note 1) Value −65 to +150 −0.5 to +4.0 −0.5 to +5.5 120 0.5 Unit °C V V mA W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Continuous short−circuit operation to ground at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of 45 mA over long term may adversely affect reliability. Shorting output to either V+ or V− will adversely affect reliability. GIGABIT ETHERNET LAN SWITCH WITH 2:1 MUX/ DEMUX AND POWER DOWN FEATURE (Min / Max values are at VDD = 3.3 V ±10%, TA = −40°C to +85°C. Typ values are at VDD = 3.3 V and TA = 25°C) Symbol Description Test Conditions Min Typ Max Unit POWER SUPPLY CHARACTERISTICS (Note 2) VDD IDD−Standby IDD−Active IDD−PD Power DC Supply Voltage Quiescent Power Supply Current Active Power Supply Current Power Down Current VDD = 3.6 V, VIN = GND or VDD VDD = 3.6 V, VIN = VDD or GND PD = 1, VDD = 3.6 V, VIN = VDD or GND 3.0 3.3 0.38 1.0 0.13 3.6 0.45 1.5 0.16 V mA mA mA 2. Active power represents normal data communication. Standby power is when the device is enabled for operation but there is no LAN traffic (cable not connected). Power down current is the minimum power state used when not connected and mobile. 3. Measured by the voltage drop between A and B pins at indicated current through the switch. ON resistance is determined by the lower of the voltages on the two (A & B) pins. 4. Guaranteed by design and/or characterization. 5. The bus switch contributes no propagational delay other than the RC delay of the ON resistance of the switch and the load capacitance. The time constant for the switch alone is of the order of 0.25 ns for 10 pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch when used in a system is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side. http://onsemi.com 4 NCN7200 GIGABIT ETHERNET LAN SWITCH WITH 2:1 MUX/ DEMUX AND POWER DOWN FEATURE (Min / Max values are at VDD = 3.3 V ±10%, TA = −40°C to +85°C. Typ values are at VDD = 3.3 V and TA = 25°C) Symbol Description Test Conditions Min Typ Max Unit CONTROL LOGIC (SEL AND PD PINS) DC ELECTRICAL CHARACTERISTICS FOR 1000 BASE−T ETHERNET SWITCHING VIH VIL VIK IIHSEL IIHPD IIL IOFF RON RFLAT(ON) DRON ION IOFF Input HIGH Voltage Input LOW Voltage Clamp Diode Voltage Input HIGH Current (SEL) Input High Current (PD) Input LOW Current Off−Leakage Current (SEL) Guaranteed HIGH level Guaranteed LOW level VDD = Max, IIN = −18 mA VDD = Max, VIN = VDD VDD = Max, VIN = VDD VDD = Max, VIN = GND VDD = 0 V, VIN = 0 V to VDD VDD = Min, 1.5 V < VIN < VDD, ITN = −40 mA VDD = Min, VIN @ 1.5 V and VDD, ITN = −40 mA VDD = Min, 1.5 V < VIN < VDD, ITN = −40 mA VDD = 3.6 V, VAX = 0 V or VDD, VOUT = Float VDD = 3.6 V, VIN = 0 V or VDD, VOUT = VDD or 0V −0.1 −0.1 2.0 0.3 0.5 1.0 +0.1 +0.1 mA mA 2.0 −0.5 −0.7 0.8 −1.0 ±0.1 ±1.2 ±0.1 ±0.1 mA V DATA PATH (AX TO BX, CX PINS) DC ELECTRICAL CHARACTERISTICS FOR 1000 BASE−T ETHERNET SWITCHING Switch On−Resistance (Note 3) On−Resistance Flatness (Note 3) On−Resistance match from center ports to any other port (Note 3) On Leakage Current (AX) Off Leakage Current (AX/BX/CX) 6.0 W DATA PATH (LEDAX TO LEDBX, LEDCX PINS) DC ELECTRICAL CHARACTERISTICS FOR 1000 BASE−T ETHERNET SWITCHING RON RFLAT(ON) DRON ION IOFF Switch On−Resistance (Note 3) On−Resistance Flatness (Note 3) On−Resistance match from center ports to any other port (Note 3) On Leakage Current (LEDAX) Off Leakage Current (LEDAX/LEDBX/LEDCX) VDD = Min, 1.5 V < VIN < VDD, ITN = −40 mA VDD = Min, VIN @ 1.5 V and VDD, ITN = −40 mA VDD = Min, 1.5 V < VIN < VDD, ITN = −40 mA VDD = 3.6 V, VAX = 0 V or VDD, VOUT = Float VDD = 3.6 V, VIN = 0 V or VDD, VOUT = VDD or 0V −0.1 −0.1 7.0 0.3 0.8 1.25 +0.1 +0.1 mA mA 16 W CONTROL LOGIC (SEL AND PD PINS) DC ELECTRICAL CHARACTERISTICS FOR 10/100 BASE−T ETHERNET SWITCHING VIH VIL VIK IIHSEL IIHPD IIL IOFF Input HIGH Voltage Input LOW Voltage Clamp Diode Voltage Input HIGH Current (SEL) Input HIGH Current (PD) Input LOW Current Off−Leakage Current (SEL) Guaranteed HIGH level (Control Pins) Guaranteed LOW level (Control Pins) VDD = Max, IN = −18 mA VDD = Max, VIN = VDD VDD = Max, VIN = VDD VDD = Max, VIN = GND VDD = 0 V, VIN = 0 V to VDD 2.0 −0.5 −0.7 0.8 −1.0 ±0.1 ±1.2 ±0.1 ±0.1 mA V 2. Active power represents normal data communication. Standby power is when the device is enabled for operation but there is no LAN traffic (cable not connected). Power down current is the minimum power state used when not connected and mobile. 3. Measured by the voltage drop between A and B pins at indicated current through the switch. ON resistance is determined by the lower of the voltages on the two (A & B) pins. 4. Guaranteed by design and/or characterization. 5. The bus switch contributes no propagational delay other than the RC delay of the ON resistance of the switch and the load capacitance. The time constant for the switch alone is of the order of 0.25 ns for 10 pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch when used in a system is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side. http://onsemi.com 5 NCN7200 GIGABIT ETHERNET LAN SWITCH WITH 2:1 MUX/ DEMUX AND POWER DOWN FEATURE (Min / Max values are at VDD = 3.3 V ±10%, TA = −40°C to +85°C. Typ values are at VDD = 3.3 V and TA = 25°C) Symbol Description Test Conditions Min Typ Max Unit DATA PATH (AX TO BX, CX PINS) DC ELECTRICAL CHARACTERISTICS FOR 10/100 BASE−T ETHERNET SWITCHING RON RFLAT(ON) DRON ION IOFF Switch On−Resistance (Note 3) On−Resistance Flatness (Note 3) On−Resistance match from center ports to any other port (Note 3) On Leakage Current (AX) Off Leakage Current (AX/BX/CX) VDD = Min, 1.25 V < VIN < VDD, ITN = −10 mA to −30 mA VDD = Min, 1.25 V < VIN < VDD, ITN = −10 mA to −30 mA VDD = Min, 1.25 V < VIN < VDD, ITN = −10 mA to −30 mA VDD = 3.6 V, VAX = 0 V or VDD, VOUT = Float VDD = 3.6 V, VIN = 0 V or VDD, VOUT = VDD or 0V −0.1 −0.1 2.0 0.8 0.8 1.3 +0.1 +0.1 mA mA 6.0 W DATA PATH (LEDAX TO LEDBX, LEDCX PINS) DC ELECTRICAL CHARACTERISTICS FOR 10/100 BASE−T ETHERNET SWITCHING RON RFLAT(ON) DRON ION IOFF Switch On−Resistance (Note 3) On−Resistance Flatness (Note 3) On−Resistance match from center ports to any other port (Note 3) On Leakage Current (LEDAX) Off Leakage Current (LEDAX/LEDBX/LEDCX) VDD = Min, 1.25 V < VIN < VDD, ITN = −10 mA to −30 mA VDD = Min, 1.25 V < VIN < VDD, ITN = −10 mA to −30 mA VDD = Min, 1.25 V < VIN < VDD, ITN = −10 mA to −30 mA VDD = 3.6 V, VAX = 0 V or VDD, VOUT = Float VDD = 3.6 V, VIN = 0 V or VDD, VOUT = VDD or 0V −0.1 −0.1 7.0 0.3 0.8 1.25 +0.1 +0.1 mA mA 16 W CAPACITANCE (AX TO BX, CX AND LEDAX TO LEDBX, LEDCX PINS) (Note 4) CIN COFF(B1, B2) Input Capacitance Port B Capacitance, Switch OFF A/B Capacitance, Switch ON VIN = 0 V, f = 1 MHz 3.0 5.0 10.5 4.0 7.0 12 pF CON(A/B) BW OIRR XTALK DYNAMIC ELECTRICAL CHARACTERISTICS (AX TO BX AND LEDAX TO LEDBX PINS) (Note 5) Bandwidth −3 dB OFF Isolation Crosstalk RL = 100 W (Figure 3) RL = 100 W, f = 250 MHz (Figure 7) RL = 100 W, f = 250 MHz (Figure 8) 750 −30 −70 MHz dB SWITCHING CHARACTERISTICS (AX TO BX AND LEDAX TO LEDBX PINS) (Notes 4 and 5) tPD tPZH, tPZL tPHZ, tPLZ tSK(o) tSK(p) Propagation Delay (Figure 4) Line Enable Time − SEL to AN, BN (Figure 4) Line Disable Time − SEL to AN, BN (Figure 4) Output Skew between center port to any other port Skew between opposite transitions of the same output (tHil, − tPLH) 0.5 0.5 0.1 0.1 0.3 15 25 0.2 0.2 ns 2. Active power represents normal data communication. Standby power is when the device is enabled for operation but there is no LAN traffic (cable not connected). Power down current is the minimum power state used when not connected and mobile. 3. Measured by the voltage drop between A and B pins at indicated current through the switch. ON resistance is determined by the lower of the voltages on the two (A & B) pins. 4. Guaranteed by design and/or characterization. 5. The bus switch contributes no propagational delay other than the RC delay of the ON resistance of the switch and the load capacitance. The time constant for the switch alone is of the order of 0.25 ns for 10 pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch when used in a system is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side. http://onsemi.com 6 NCN7200 50 W Reference Input Output 50 W VNA Source Port 1 Control Line 50 W VNA Return Port 2 DUT Figure 3. Bandwidth 1.2 V VDD Open 200W SEL Pulse Generator VIN D.U.T. VOUT Output RP tPZL VDD/2 tPZH 50W 10pF CL 200W Output VDD/2 tPHZ VOH − 0.3V tPLZ VOL + 0.3V SEL 1.25 V 1.25 V 0V VOH VOL VOH VOL 2.5 V Figure 4. Three−State and tpd Test Setup SWITCH POSITIONS Test tPLZ, tPZL (Output on B−Side) tPHZ, tPZH (Output on B−Side) tPD Switch 1.2 V GND OPEN Figure 5. Three−State Timing Diagram VCC 50% GND tPD(HL) VOUT 50% ANALOG IN tPD(LH) ANALOG OUT Figure 6. Propagation Delay http://onsemi.com 7 NCN7200 (Sense) Transmitted COM Output 50 W DUT NC 50 W Generator (Force) NO 50 W SEL Figure 7. Off−Isolation +3.3V 0.1 mF Network Analyzer 50 W 0V or VDD 0V SEL PD VDD A0+ PORT 1 VIN+ NCN7200 A0− PORT 2 VIN− 50 W 50 W All unused I/O ports B1+ PORT 3 VOUT+ 50 W B1− GND PORT 4 VOUT− 50 W Differential Crosstalk + 20log V OUT) * V OUT* V IN) * V IN* Measurements are standardized against shorts at IC terminals. Differential Crosstalk is measured between any two non−adjacent pairs. Figure 8. Differential Crosstalk http://onsemi.com 8 NCN7200 APPLICATION INFORMATION Logic Inputs Power−Supply Sequencing The logic control inputs can be driven up to +3.6 V regardless of the supply voltage. For example, given a +3.3 V supply, the output enables or select pins may be driven low to 0 V and high to 3.6 V: driving the control pins to the rails minimizes power consumption. ORDERING INFORMATION Device NCN7200MTTWG Package WQFN42 (Pb−Free) Proper power−supply sequencing is advised for all CMOS devices. It is recommended to always apply VDD before applying signals to the input/output or control pins. Shipping† 2000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 9 NCN7200 PACKAGE DIMENSIONS WQFN42 3.5x9, 0.5P CASE 510AP−01 ISSUE O D PIN ONE REFERENCE AB L L1 E DETAIL A ALTERNATE TERMINAL CONSTRUCTIONS L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D D2 E E2 e K L L1 MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.20 0.30 3.50 BSC 1.95 2.15 9.00 BSC 7.45 7.65 0.50 BSC 0.20 −−− 0.30 0.50 0.00 0.15 0.15 C 0.15 C TOP VIEW A 0.10 C 0.08 C NOTE 4 DETAIL B DETAIL B ALTERNATE CONSTRUCTION A3 A1 SIDE VIEW 0.10 C A B DETAIL A C SEATING PLANE 42X D2 22 K 3.80 2.16 1 42X 17 42X L 0.35 E2 PACKAGE OUTLINE DIMENSIONS: MILLIMETERS b 0.10 C A B 42X 0.05 C NOTE 3 1 38 0.10 C A B e e/2 BOTTOM VIEW ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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