NCP1086T-033G

NCP1086 1.5 A Adjustable and 3.3 V Fixed Output Linear Regulator The NCP1086 linear regulator provides 1.5 A at 3.3 V or adjustable output voltage. The adjustable output voltage device uses two external resistors to set the output voltage within a 1.25 V to 5.5 V range. The regulators is intended for use as post regulator and microprocessor supply. The fast loop response and low dropout voltage make this regulator ideal for applications where low voltage operation and good transient response are important. The circuit is designed to operate with dropout voltages less than 1.4 V at 1.5 A output current. Device protection includes overcurrent and thermal shutdown. This device is pin compatible with LT1086 family of linear regulators and has lower dropout voltage. The regulators are available in TO−220−3, surface mount D2PAK−3, and SOT−223 packages. http://onsemi.com TO−220−3 T SUFFIX CASE 221A 1 2 3 D2PAK−3 DP SUFFIX CASE 418AB Features • • • • • • Output Current to 1.5 A Output Accuracy to ±1% Over Temperature Dropout Voltage (Typical) 1.05 V @ 1.5 A Fast Transient Response Fault Protection Circuitry ♦ Current Limit ♦ Thermal Shutdown Pb−Free Packages are Available 12 3 1 SOT−223 ST SUFFIX CASE 318E 23 Adjustable Output Tab = VOUT Pin 1. Adj 2. VOUT 3. VIN 3.3 V Fixed Output Tab = VOUT Pin 1. GND 2. VOUT 3. VIN ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 10 of this data sheet. 5.0 V VIN NCP1086 3.3 V @ 1.5 A VOUT Adj 10 mF 5.0 V VIN 124 W 1.0% December, 2009 − Rev. 9 VOUT GND 22 mF 5.0 V 10 mF 5.0 V 200 W 1.0% Figure 1. Application Diagram, Adjustable Output © Semiconductor Components Industries, LLC, 2009 NCP1086 3.3 V @ 1.5 A 22 mF 5.0 V Figure 2. Application Diagram, 3.3 V Fixed Output 1 Publication Order Number: NCP1086/D NCP1086 MAXIMUM RATINGS* Parameter Supply Voltage, VCC Operating Temperature Range Junction Temperature Storage Temperature Range Lead Temperature Soldering: Wave Solder (through hole styles only) Note 1 Reflow (SMD styles only) Note 2 ESD Damage Threshold Value Unit 7.0 V −40 to +70 °C 150 °C −60 to +150 °C 260 Peak 230 Peak °C 2.0 kV Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. 10 second maximum. 2. 60 second maximum above 183°C. ELECTRICAL CHARACTERISTICS (CIN = 10 mF, COUT = 22 mF Tantalum, VOUT + VDROPOUT < VIN < 7.0 V, 0°C ≤ TA ≤ 70°C, TJ ≤ +150°C, unless otherwise specified, Ifull load = 1.5 A.) Test Conditions Characteristic Min Typ Max Unit 1.241 (−1%) 1.254 1.266 (+1%) V ADJUSTABLE OUTPUT VOLTAGE Reference Voltage (Notes 3 and 4) VIN − VOUT = 1.5 V; VAdj = 0 V, 10 mA ≤ IOUT ≤ 1.5 A Line Regulation 1.5 V ≤ VIN − VOUT ≤ 5.75 V; IOUT = 10 mA − 0.02 0.2 % Load Regulation (Notes 3 and 4) VIN − VOUT = 1.5 V; 10 mA ≤ IOUT ≤ 1.5 A − 0.04 0.4 % Dropout Voltage (Note 5) IOUT = 1.5 A − 1.05 1.4 V Current Limit VIN − VOUT = 3.0 V; TJ ≥ 25°C 1.6 3.1 − A Minimum Load Current (Note 6) VIN = 7.0 V; VAdj = 0 − 0.6 2.0 mA Adjust Pin Current VIN − VOUT = 3.0 V; IOUT = 10 mA − 50 100 mA Thermal Regulation (Note 7) 30 ms pulse; TA = 25°C − 0.002 0.02 %/W Ripple Rejection (Note 7) f = 120 Hz; IOUT = 1.5 A; VIN − VOUT = 3.0 V; VRIPPLE = 1.0 VP−P − 80 − dB Thermal Shutdown (Note 8) − 150 180 210 °C Thermal Shutdown Hysteresis (Note 8) − − 25 − °C 3.25 (−1.5%) 3.3 3.35 (+1.5%) V FIXED OUTPUT VOLTAGE Output Voltage (Notes 3 and 4) VIN − VOUT = 1.5 V, 0 ≤ IOUT ≤ 1.5 A Line Regulation 2.0 V ≤ VIN − VOUT ≤ 3.7 V; IOUT = 10 mA − 0.02 0.2 % Load Regulation (Notes 3 and 4) VIN − VOUT = 2.0 V; 10 mA ≤ IOUT ≤ 1.5 A − 0.04 0.4 % Dropout Voltage (Note 5) IOUT = 1.5 A − 1.05 1.4 V Current Limit VIN − VOUT = 3.0 V 1.6 3.1 − A Quiescent Current IOUT = 10 mA − 5.0 10 mA Thermal Regulation (Note 7) 30 ms pulse; TA = 25°C − 0.002 0.02 %/W 3. Load regulation and output voltage are measured at a constant junction temperature by low duty cycle pulse testing. Changes in output voltage due to thermal gradients or temperature changes must be taken into account separately. 4. Specifications apply for an external Kelvin sense connection at a point on the output pin 1/4” from the bottom of the package. 5. Dropout voltage is a measurement of the minimum input/output differential at full load. 6. The minimum load current is the minimum current required to maintain regulation. Normally the current in the resistor divider used to set the output voltage is selected to meet the minimum requirement. 7. Guaranteed by design, not 100% tested in production. 8. Thermal shutdown is 100% functionally tested in production. http://onsemi.com 2 NCP1086 ELECTRICAL CHARACTERISTICS (continued) (CIN = 10 mF, COUT = 22 mF Tantalum, VOUT + VDROPOUT < VIN < 7.0 V, 0°C ≤ TA ≤ 70°C, TJ ≤ +150°C, unless otherwise specified, Ifull load = 1.5 A.) Test Conditions Characteristic Min Typ Max Unit − 80 − dB FIXED OUTPUT VOLTAGE (continued) f = 120 Hz; IOUT = 1.5 A; VIN − VOUT = 3.0 V; VRIPPLE = 1.0 VP−P Ripple Rejection (Note 9) Thermal Shutdown (Note 10) − 150 180 210 °C Thermal Shutdown Hysteresis (Note 10) − − 25 − °C 9. Guaranteed by design, not 100% tested in production. 10. Thermal shutdown is 100% functionally tested in production. PACKAGE PIN DESCRIPTION, ADJUSTABLE OUTPUT Package Pin Number D2PAK−3 TO−220−3 SOT−223 Pin Symbol 1 1 1 Adj 2 2 2 VOUT 3 3 3 VIN Function Adjust pin (low side of the internal reference). Regulated output voltage (case). Input voltage. PACKAGE PIN DESCRIPTION, 3.3 V FIXED OUTPUT Package Pin Number D2PAK−3 TO−220−3 SOT−223 Pin Symbol 1 1 1 GND Ground connection. 2 2 2 VOUT Regulated output voltage (case). 3 3 3 VIN Function Input voltage. VOUT VIN VOUT VIN Output Current Limit Thermal Shutdown − + Output Current Limit Thermal Shutdown Error Amplifier Bandgap − + Error Amplifier Bandgap Adj GND Figure 3. Block Diagram, Adjustable Output Figure 4. Block Diagram, 3.3 V Fixed Output http://onsemi.com 3 NCP1086 TYPICAL PERFORMANCE CHARACTERISTICS 1.05 0.10 TCASE = 0°C 0.08 Output Voltage Deviation (%) 1.00 V Drop Out (V) 0.95 0.90 TCASE = 25°C 0.85 0.80 TCASE = 125°C 0.75 0 300 600 900 IOUT (mA) 1200 0.04 0.00 −0.04 −0.08 −0.12 0 1500 TJ (°C) Figure 5. Dropout Voltage vs. Output Current Figure 6. Reference Voltage vs. Temperature 3.5 65 3.1 IO = 10mA 60 ISC (A) Adjust Pin Current (mA) 70 55 50 40 0 2.7 2.3 1.9 45 20 40 60 80 Temperature (°C) 100 1.5 1.0 120 Voltage Deviation (mV) 200 100 0 VOUT = 3.3 V COUT = CIN = 22 mF Tantalum −120 0 −200 1500 750 0 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 2.0 3.0 4.0 5.0 VIN − VOUT (V) 7.0 6.0 Figure 8. Short Circuit Current vs VIN − VOUT Load Step (mA) Voltage Deviation (mV) Figure 7. Adjust Pin Current vs. Temperature (Adjustable Output) Load Step (mA) 10 20 30 40 50 60 70 80 90 100 110 120 130 9.0 10 Time, ms Figure 9. Transient Response (Adjustable Output) 200 100 0 −120 0 −200 COUT = CIN = 22 mF Tantalum 1500 750 0 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10 Time, ms Figure 10. Transient Response (3.3 V Fixed Output) http://onsemi.com 4 85 85 75 75 Ripple Rejection (dB) Ripple Rejection (dB) NCP1086 65 55 45 TCASE = 25°C IOUT = 6A (VIN − VOUT = 3V) VRIPPLE = 1.6VPP CAdj = 0.1 mF 35 25 15 101 102 65 55 45 TCASE = 25°C IOUT = 6A (VIN − VOUT = 3V) VRIPPLE = 1.6VPP 35 25 103 104 Frequency (Hz) 105 15 101 106 Figure 11. Ripple Rejection vs. Frequency (Adjustable Output) Minimum Load Current (mA) Output Voltage Deviation, (%) 105 106 0.65 0.075 0.050 TCASE = 125°C 0 0 103 104 Frequency (Hz) Figure 12. Ripple Rejection vs. Frequency (3.3 V Fixed Output) 0.100 0.025 102 TCASE = 25°C TCASE = 0°C 0.55 TCASE = 125°C TCASE = 25°C 0.50 0.45 CIN = COUt = 22 mF Tantalum TCASE = 0°C 1.0 0.60 2.0 Output Current (A) 0.40 1.0 2.0 3.0 4.0 5.0 6.0 7.0 VIN − VOUT (V) Figure 13. Load Regulation vs. Output Current (Adjustable Output) Figure 14. Minimum Load Current vs VIN − VOUT (Adjustable Output) APPLICATIONS INFORMATION A resistor divider network R1 and R2 causes a fixed current to flow to ground. This current creates a voltage across R2 that adds to the 1.25 V across R1 and sets the overall output voltage. The adjust pin current (typically 50 mA) also flows through R2 and adds a small error that should be taken into account if precise adjustment of VOUT is necessary. The output voltage is set according to the formula: The NCP1086 voltage regulator series provides adjustable and 3.3 V output voltages at currents up to 1.5 A. The regulator is protected against overcurrent conditions and includes thermal shutdown. The NCP1086 series has a composite PNP−NPN output transistor and requires an output capacitor for stability. A detailed procedure for selecting this capacitor is included in the Stability Considerations section. VOUT + VREF Adjustable Operation The adjustable output device has an output voltage range of 1.25 V to 5.5 V. An external resistor divider sets the output voltage as shown in Figure 15. The regulator maintains a fixed 1.25 V (typical) reference between the output pin and the adjust pin. ) R2Ǔ ) I ǒR1 R1 Adj R2 The term IAdj × R2 represents the error added by the adjust pin current. http://onsemi.com 5 NCP1086 R1 is chosen so that the minimum load current is at least 2.0 mA. R1 and R2 should be the same type, e.g. metal film for best tracking over temperature. must be able to withstand the short circuit condition indefinitely while protecting the IC. EXTERNAL VIN VOUT VIN C1 SUPPLY VOUT NCP1086 VREF Adj R1 C2 VIN NCP1086 VOUT Adj IAdj R2 VOUT Figure 15. Resistor Divider Scheme Figure 16. Short Circuit Protection Circuit for High Voltage Application The adjustable output linear regulator has an absolute maximum specification of 7.0 V for the voltage difference between VIN and VOUT. However, the IC may be used to regulate voltages in excess of 7.0 V. The main considerations in such a design are powerup and short circuit capability. In most applications, ramp−up of the power supply to VIN is fairly slow, typically on the order of several tens of milliseconds, while the regulator responds in less than one microsecond. In this case, the linear regulator begins charging the load as soon as the VIN to VOUT differential is large enough that the pass transistor conducts current. The load at this point is essentially at ground, and the supply voltage is on the order of several hundred mV, with the result that the pass transistor is in dropout. As the supply to VIN increases, the pass transistor will remain in dropout, and current is passed to the load until VOUT reaches the point at which the IC is in regulation. Further increase in the supply voltage brings the pass transistor out of dropout. The result is that the output voltage follows the power supply ramp−up, staying in dropout until the regulation point is reached. In this manner, any output voltage may be regulated. There is no theoretical limit to the regulated voltage as long as the VIN to VOUT differential of 7.0 V is not exceeded. However, the possibility of destroying the IC in a short circuit condition is very real for this type of design. Short circuit conditions will result in the immediate operation of the pass transistor outside of its safe operating area. Overvoltage stresses will then cause destruction of the pass transistor before overcurrent or thermal shutdown circuitry can become active. Additional circuitry may be required to clamp the VIN to VOUT differential to less than 7.0 V if fail−safe operation is required. One possible clamp circuit is illustrated in Figure 16; however, the design of clamp circuitry must be done on an application by application basis. Care must be taken to ensure the clamp actually protects the design. Components used in the clamp design Stability Considerations The output or compensation capacitor helps determine three main characteristics of a linear regulator: startup delay, load transient response and loop stability. The capacitor value and type is based on cost, availability, size and temperature constraints. A tantalum or aluminum electrolytic capacitor is best, since a film or ceramic capacitor with almost zero ESR can cause instability. The aluminum electrolytic capacitor is the least expensive solution. However, when the circuit operates at low temperatures, both the value and ESR of the capacitor will vary considerably. The capacitor manufacturers’ data sheet provides this information. A 22 mF tantalum capacitor will work for most applications, but with high current regulators such as the NCP1086 series the transient response and stability improve with higher values of capacitance. The majority of applications for this regulator involve large changes in load current, so the output capacitor must supply the instantaneous load current. The ESR of the output capacitor causes an immediate drop in output voltage given by: DV + DI ESR For microprocessor applications it is customary to use an output capacitor network consisting of several tantalum and ceramic capacitors in parallel. This reduces the overall ESR and reduces the instantaneous output voltage drop under load transient conditions. The output capacitor network should be as close as possible to the load for the best results. http://onsemi.com 6 NCP1086 Protection Diodes When large external capacitors are used with a linear regulator it is sometimes necessary to add protection diodes. If the input voltage of the regulator gets shorted, the output capacitor will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage and the rate at which VIN drops. In the NCP1086 series linear regulator, the discharge path is through a large junction and protection diodes are not usually needed. If the regulator is used with large values of output capacitance and the input voltage is instantaneously shorted to ground, damage can occur. In this case, a diode connected as shown in Figure 17 or Figure 18 is recommended. VIN VIN C1 NCP1086 VOUT Adj RLOAD Figure 19. Conductor Parasitic Resistance Effects Can Be Minimized with the Above Grounding Scheme for Fixed Output Regulators For the adjustable regulator, the best load regulation occurs when R1 is connected directly to the output pin of the regulator as shown in Figure 20. If R1 is connected to the load, RC is multiplied by the divider ratio and the effective resistance between the regulator and the load becomes VOUT R1 RC VOUT NCP1086 IN4002 (optional) VIN VIN Conductor Parasitic Resistance RC C2 ) R2Ǔ ǒR1 R1 where RC = conductor parasitic resistance. R2 VIN Figure 17. Protection Diode Scheme for Large Output Capacitors (Adjustable Output) VIN RC VOUT NCP1086 Conductor Parasitic Resistance R1 Adj RLOAD IN4002 (optional) VIN VIN C1 NCP1086 GND VOUT R2 VOUT C2 Figure 20. Grounding Scheme for the Adjustable Output Regulator to Minimize Parasitic Resistance Effects Figure 18. Protection Diode Scheme for Large Output Capacitors (3.3 V Fixed Output) Calculating Power Dissipation and Heatsink Requirements Output Voltage Sensing The NCP1086 linear regulator includes thermal shutdown and current limit circuitry to protect the device. High power regulators such as these usually operate at high junction temperatures so it is important to calculate the power dissipation and junction temperatures accurately to ensure that an adequate heatsink is used. Since the NCP1086 is a three terminal regulator, it is not possible to provide true remote load sensing. Load regulation is limited by the resistance of the conductors connecting the regulator to the load. For best results the fixed output regulator should be connected as shown in Figure 19. http://onsemi.com 7 NCP1086 The case is connected to VOUT, and electrical isolation may be required for some applications. Thermal compound should always be used with high current regulators such as these. The thermal characteristics of an IC depend on the following four factors: 1. 2. 3. 4. Each material in the heat flow path between the IC and the outside environment has a thermal resistance. Like series electrical resistances, these resistances are summed to determine RqJA, the total thermal resistance between the junction and the surrounding air. 1. Thermal Resistance of the junction to case, RqJC (°C/W) 2. Thermal Resistance of the case to Heatsink, RqCS (°C/W) 3. Thermal Resistance of the Heatsink to the ambient air, RqSA (°C/W) These are connected by the equation: Maximum Ambient Temperature TA (°C) Power dissipation PD (W) Maximum junction temperature TJ (°C) Thermal resistance junction to ambient RqJA (°C/W) These four are related by the equation TJ + TA ) PD RqJA RqJA + RqJC ) RqCS ) RqSA (eq. 1) (eq. 3) The value for RqJA is calculated using Equation 3 and the result can be substituted in Equation 1. The value for RqJC is 3.5°C/W. For a high current regulator such as the NCP1086 the majority of the heat is generated in the power transistor section. The value for RqSA depends on the heatsink type, while RqCS depends on factors such as package type, heatsink interface (is an insulator and thermal grease used?), and the contact area between the heatsink and the package. Once these calculations are complete, the maximum permissible value of RqJA can be calculated and the proper heatsink selected. For further discussion on heatsink selection, see application note “Thermal Management,” document number AND8036/D via our website at www.onsemi.com. The maximum ambient temperature and the power dissipation are determined by the design while the maximum junction temperature and the thermal resistance depend on the manufacturer and the package type. The maximum power dissipation for a regulator is: PD(max) + {VIN(max) * VOUT(min)}IOUT(max) ) VIN(max)IQ (eq. 2) where: VIN(max) is the maximum input voltage, VOUT(min) is the minimum output voltage, IOUT(max) is the maximum output current, for the application IQ is the maximum quiescent current at IOUT(max). A heatsink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. http://onsemi.com 8 NCP1086 ORDERING INFORMATION Package Shipping† NCP1086D2T−ADJ D2PAK 50 Units/Rail NCP1086D2T−ADJG D2PAK 50 Units/Rail Device Type (Pb−Free) NCP1086D2T−ADJR4 D2PAK NCP1086D2TADJR4G D2PAK (Pb−Free) NCP1086ST−ADJT3 Adjustable 750 Tape & Reel SOT−223 NCP1086ST−ADJT3G SOT−223 (Pb−Free) NCP1086T−ADJ 2500 Tape & Reel TO220 NCP1086T−ADJG TO220 (Pb−Free) 50 Units/Rail NCP1086D2T−033 D2PAK 50 Units/Rail NCP1086D2T−33R4 D2PAK D2PAK (Pb−Free) NCP1086D2T−33R4G NCP1086ST−33T3 NCP1086ST−33T3G 750 Tape & Reel SOT−223 3.3 V SOT−223 (Pb−Free) NCP1086T−033 2500 Tape & Reel TO220 NCP1086T−033G TO220 (Pb−Free) 50 Units/Rail †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 9 NCP1086 MARKING DIAGRAMS Adjustable Output TO−220−3 T SUFFIX CASE 221A D2PAK−3 D2T SUFFIX CASE 418AB 3.3 V Fixed Output SOT−223 ST SUFFIX CASE 318E AYW 086−AG NCP1086−A AWLYWWG NCP1086−A AWLYWWG TO−220−3 T SUFFIX CASE 221A D2PAK−3 D2T SUFFIX CASE 418AB SOT−223 ST SUFFIX CASE 318E AYW 08633G 1086−33 AWLYWWG G 1086−33 AWLYWWG 1 1 1 1 1 1 A WL, L YY, Y WW, W G or G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package http://onsemi.com 10 G NCP1086 PACKAGE DIMENSIONS TO−220 3−LEAD T SUFFIX CASE 221AF−01 ISSUE A SEATING PLANE −T− E Q P A H1 A1 4 D D1 1 2 3 L L1 A2 b2 c e b http://onsemi.com 11 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH AND GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.005 PER SIDE. THESE DIMENSIONS ARE TO BE MEASURED AT OUTERMOST EXTREME OF THE PLASTIC BODY. 3. DIMENSION b2 DOES NOT INCLUDE DAMBAR PROTRUSION. LEAD WIDTH INCLUDING PROTRUSION SHALL NOT EXCEED 0.080. DIM A A1 A2 b b2 c D D1 E e H1 L L1 P Q INCHES MIN MAX 0.140 0.190 0.045 0.055 0.080 0.115 0.025 0.040 0.045 0.070 0.014 0.025 0.560 0.625 0.320 0.390 0.380 0.420 0.100 BSC 0.235 0.255 0.500 0.580 --0.280 0.139 0.161 0.100 0.135 MILLIMETERS MIN MAX 3.56 4.83 1.14 1.40 2.03 2.92 0.64 1.02 1.14 1.78 0.36 0.64 14.22 15.88 8.13 9.91 9.65 10.67 2.54 BSC 5.97 6.48 12.70 14.73 --7.11 3.53 4.09 2.54 3.43 NCP1086 PACKAGE DIMENSIONS D2PAK−3 CASE 418AB−01 ISSUE A A SEATING PLANE B A E L1 0.10 A M NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH AND GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.005 MAXIMUM PER SIDE. THESE DIMENSIONS TO BE MEASURED AT DATUM H. 4. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS E, L1, D1, AND E1. DIMENSIONS D1 AND E1 ESTABLISH A MINIMUM MOUNTING SURFACE FOR THE THERMAL PAD. M E1 c2 E/2 B A D1 D DETAIL C H c A e 3X b 0.13 M B A VIEW A−A B M H RECOMMENDED MOUNTING FOOTPRINT* SEATING PLANE A1 L3 0.424 GAUGE PLANE DIM A A1 b c c2 D D1 E E1 e H L L1 L3 M INCHES MIN MAX 0.170 0.180 0.000 0.010 0.026 0.036 0.017 0.026 0.045 0.055 0.325 0.368 0.270 −−− 0.380 0.420 0.245 −−− 0.100 BSC 0.580 0.620 0.090 0.110 −−− 0.066 0.010 BSC 0° 8° L 0.310 M DETAIL C 0.631 0.180 3X 0.100 PITCH 0.040 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE THERMAL DATA Parameter D2PAK−3 TO−220−3 SOT−223 Unit RqJC Typical 3.5 3.5 15 °C/W RqJA Typical 50 10−50* 156 °C/W * Depending on thermal properties of substrate. RqJA = RqJC + RqCA http://onsemi.com 12 MILLIMETERS MIN MAX 4.32 4.57 0.00 0.25 0.66 0.91 0.43 0.66 1.14 1.40 8.25 9.53 6.86 −−− 9.65 10.67 6.22 −−− 2.54 BSC 14.73 15.75 2.29 2.79 −−− 1.68 0.25 BSC 0° 8° NCP1086 PACKAGE DIMENSIONS SOT−223 (TO−261) ST SUFFIX CASE 318E−04 ISSUE N D b1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 4 HE 1 2 3 b e1 e A1 C q A 0.08 (0003) DIM A A1 b b1 c D E e e1 L L1 HE E q L MIN 1.50 0.02 0.60 2.90 0.24 6.30 3.30 2.20 0.85 0.20 1.50 6.70 0° MILLIMETERS NOM MAX 1.63 1.75 0.06 0.10 0.75 0.89 3.06 3.20 0.29 0.35 6.50 6.70 3.50 3.70 2.30 2.40 0.94 1.05 −−− −−− 1.75 2.00 7.00 7.30 10° − MIN 0.060 0.001 0.024 0.115 0.009 0.249 0.130 0.087 0.033 0.008 0.060 0.264 0° INCHES NOM 0.064 0.002 0.030 0.121 0.012 0.256 0.138 0.091 0.037 −−− 0.069 0.276 − MAX 0.068 0.004 0.035 0.126 0.014 0.263 0.145 0.094 0.041 −−− 0.078 0.287 10° L1 SOLDERING FOOTPRINT 3.8 0.15 2.0 0.079 2.3 0.091 2.3 0.091 6.3 0.248 2.0 0.079 1.5 0.059 SCALE 6:1 mm Ǔ ǒinches ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 13 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NCP1086/D