NCP114AMX300TCG

Voltage Regulator - CMOS Low Dropout 300 mA NCP114 The NCP114 is 300 mA LDO that provides the engineer with a very stable, accurate voltage with low noise suitable for space constrained, noise sensitive applications. In order to optimize performance for battery operated portable applications, the NCP114 employs the dynamic quiescent current adjustment for very low IQ consumption at no−load. www.onsemi.com MARKING DIAGRAMS UDFN4 MX SUFFIX CASE 517CU Features • Operating Input Voltage Range: 1.7 V to 5.5 V • Available in Fixed Voltage Options: 0.75 V to 3.6 V • • • • • • • • • 1 XX = Specific Device Code M = Date Code Contact Factory for Other Voltage Options Very Low Quiescent Current of Typ. 50 mA Standby Current Consumption: Typ. 0.1 mA Low Dropout: 135 mV Typical at 300 mA ±1% Accuracy at Room Temperature High Power Supply Ripple Rejection: 75 dB at 1 kHz Thermal Shutdown and Current Limit Protections Stable with a 1 mF Ceramic Output Capacitor Available in UDFN and TSOP Packages These are Pb−Free Devices 5 TSOP−5 SN SUFFIX CASE 483 XXXAYWG G 1 XXX = Specific Device Code A = Assembly Location Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) Typical Applicaitons • • • • XX M 1 PIN CONNECTIONS PDAs, Mobile phones, GPS, Smartphones Wireless Handsets, Wireless LAN, Bluetooth®, Zigbee® Portable Medical Equipment Other Battery Powered Applications VIN EN IN 3 4 2 1 VOUT IN CIN EN ON OFF OUT NCP114 GND COUT 1 mF Ceramic GND OUT (Bottom View) Figure 1. Typical Application Schematic IN 1 GND 2 EN 3 5 OUT 4 N/C (Top View) ORDERING INFORMATION See detailed ordering, marking and shipping information on page 15 of this data sheet. © Semiconductor Components Industries, LLC, 2016 August, 2020 − Rev. 30 1 Publication Order Number: NCP114/D NCP114 IN ENABLE LOGIC EN THERMAL SHUTDOWN BANDGAP REFERENCE MOSFET DRIVER WITH CURRENT LIMIT OUT AUTO LOW POWER MODE ACTIVE DISCHARGE* EN GND *Active output discharge function is present only in NCP114AMXyyyTCG devices. yyy denotes the particular VOUT option. Figure 2. Simplified Schematic Block Diagram PIN FUNCTION DESCRIPTION Pin No. (UDFN4) Pin No. (TSOP5) Pin Name Description 1 5 OUT Regulated output voltage pin. A small ceramic capacitor with minimum value of 1 mF is needed from this pin to ground to assure stability. 2 2 GND Power supply ground. 3 3 EN Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown mode. 4 1 IN Input pin. A small capacitor is needed from this pin to ground to assure stability. − 4 N/C − − EPAD Not connected. This pin can be tied to ground to improve thermal dissipation. Exposed pad should be connected directly to the GND pin. Soldered to a large ground copper plane allows for effective heat removal. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit VIN −0.3 V to 6 V V Output Voltage VOUT −0.3 V to VIN + 0.3 V or 6 V V Enable Input VEN −0.3 V to 6 V V Input Voltage (Note 1) Output Short Circuit Duration tSC ∞ s TJ(MAX) 150 °C TSTG −55 to 150 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V ESD Capability, Machine Model (Note 2) ESDMM 200 V Maximum Junction Temperature Storage Temperature Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per EIA/JESD22−A114, ESD Machine Model tested per EIA/JESD22−A115, Latchup Current Maximum Rating tested per JEDEC standard: JESD78. THERMAL CHARACTERISTICS (Note 3) Rating Symbol Value Unit Thermal Characteristics, UDFN4 1x1 mm Thermal Resistance, Junction−to−Air RqJA 170 °C/W Thermal Characteristics, TSOP−5 Thermal Resistance, Junction−to−Air RqJA 236 °C/W 3. Single component mounted on 1 oz, FR 4 PCB with 645 mm2 Cu area. www.onsemi.com 2 NCP114 ELECTRICAL CHARACTERISTICS −40°C ≤ TJ ≤ 85°C; VIN = VOUT(NOM) + 1 V for VOUT options greater than 1.5 V. Otherwise VIN = 2.5 V, whichever is greater; IOUT = 1 mA, CIN = COUT = 1 mF, unless otherwise noted. VEN = 0.9 V. Typical values are at TJ = +25°C. Min./Max. are for TJ = −40°C and TJ = +85°C respectively (Note 4). Parameter Test Conditions Operating Input Voltage Output Voltage Accuracy Line Regulation Load Regulation − UDFN package Load Regulation − TSOP−5 package Load Transient Dropout Voltage − UDFN package (Note 5) Dropout Voltage − TSOP package (Note 5) −40°C ≤ TJ ≤ 85°C VOUT ≤ 2.0 V Symbol Min VIN VOUT VOUT > 2.0 V VOUT + 0.5 V ≤ VIN ≤ 5.5 V (VIN ≥ 1.7 V) IOUT = 1 mA to 300 mA RegLOAD IOUT = 1 mA to 300 mA or 300 mA to 1 mA in 1 ms, COUT = 1 mF TranLOAD 1.7 5.5 V −40 +40 mV −2 +2 % 0.01 0.1 %/V 12 30 mV 28 45 −50/ +30 460 VOUT = 1.85 V 245 330 155 230 145 220 VOUT = 3.1 V 140 210 VOUT = 3.3 V 135 200 VOUT = 1.5 V 380 485 VOUT = 1.85 V 260 355 170 255 160 245 155 235 150 225 VOUT = 2.8 V VOUT = 3.0 V VDO VDO VOUT = 3.1 V VOUT = 3.3 V Output Current Limit mV 365 VOUT = 3.0 V IOUT = 300 mA Unit VOUT = 1.5 V VOUT = 2.8 V IOUT = 300 mA Max RegLINE Typ ICL IOUT = 0 mA IQ 50 95 mA Shutdown Current VEN ≤ 0.4 V, VIN = 5.5 V IDIS 0.01 1 mA EN Pin Threshold Voltage High Threshold Low Threshold VEN Voltage increasing VEN Voltage decreasing VEN_HI VEN_LO EN Pin Input Current VEN = 5.5 V mA V 0.9 0.4 IEN 0.3 1.0 PSRR 75 dB VN 70 mVrms mA Power Supply Rejection Ratio VIN = 3.6 V, VOUT = 3.1 V IOUT = 150 mA Output Noise Voltage VIN = 2.5 V, VOUT = 1.8 V, IOUT = 150 mA f = 10 Hz to 100 kHz Thermal Shutdown Temperature Temperature increasing from TJ = +25°C TSD 160 °C Temperature falling from TSD TSDH 20 °C VEN < 0.4 V, Version A only RDIS 100 W Thermal Shutdown Hysteresis Active Output Discharge Resistance f = 1 kHz 600 mV VOUT = 90% VOUT(nom) Ground Current 300 mV Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 5. Characterized when VOUT falls 100 mV below the regulated voltage at VIN = VOUT(NOM) + 1 V. www.onsemi.com 3 NCP114 TYPICAL CHARACTERISTICS 2.83 IOUT = 1 mA 1.205 1.200 1.195 IOUT = 300 mA 1.190 1.185 1.180 1.175 VIN = 2.5 V VOUT = 1.2 V CIN = 1 mF COUT = 1 mF 1.170 1.165 1.160 −40 −30 −20 −10 0 10 20 30 40 2.82 VOUT, OUTPUT VOLTAGE (V) VOUT, OUTPUT VOLTAGE (V) 1.210 2.80 2.78 2.77 2.76 2.74 2.73 −40 −30 −20 −10 0 10 20 30 40 50 60 70 80 90 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 3. Output Voltage vs. Temperature VOUT = 1.2 V (UDFN) Figure 4. Output Voltage vs. Temperature VOUT = 2.8 V (UDFN) 1000 70 IGND, GROUND CURRENT (mA) IQ, QUIESCENT CURRENT (mA) VIN = 3.8 V VOUT = 2.8 V CIN = 1 mF COUT = 1 mF 2.75 50 60 70 80 90 −40°C 60 85°C 50 25°C 40 30 20 VOUT = 2.8 V CIN = 1 mF COUT = 1 mF 10 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 900 800 700 VIN = 3.8 V VOUT = 2.8 V CIN = 1 mF COUT = 1 mF 600 500 400 300 200 85°C 25°C −40°C 100 0 0.001 0.01 0.1 1 10 100 1000 VIN, INPUT VOLTAGE (V) IOUT, OUTPUT CURRENT (mA) Figure 5. Quiescent Current vs. Input Voltage Figure 6. Ground Current vs. Output Current 1000 0.1 900 IOUT = 300 mA 800 VIN = 3.8 V VOUT = 2.8 V CIN = 1 mF COUT = 1 mF 700 600 500 400 300 200 IOUT = 1 mA 100 0 −40 −30 −20 −10 0 10 20 30 40 50 60 70 REGLINE, LINE REGULATION (%/V) IGND, GROUND CURRENT (mA) IOUT = 300 mA 2.79 80 0 0.0 IOUT = 1 mA 2.81 80 90 0.08 0.06 0.04 0.02 0 −0.02 −0.04 −0.06 −0.08 −1 −40 −30 −20 −10 0 VIN = 1.7 V to 5.5 V VOUT = 1.2 V IOUT = 1 mA CIN = 1 mF COUT = 1 mF 10 20 30 40 50 60 70 80 90 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 7. Ground Current vs. Temperature Figure 8. Line Regulation vs. Output Current VOUT = 1.2 V www.onsemi.com 4 NCP114 TYPICAL CHARACTERISTICS 0.06 0.04 0.02 0 −0.02 VIN = 3.8 V to 5.5 V VOUT = 2.8 V IOUT = 1 mA CIN = 1 mF COUT = 1 mF −0.04 −0.06 −0.08 −0.1 10 20 30 40 50 60 70 80 90 18 16 14 12 10 8 4 2 0 −40 −30 −20 −10 0 20 30 40 50 60 70 80 90 Figure 9. Line Regulation vs. Temperature VOUT = 2.8 V Figure 10. Load Regulation vs. Temperature VOUT = 1.2 V (UDFN) 20 200 180 16 14 12 10 8 VIN = 3.8 V VOUT = 2.8 V IOUT = 1 mA to 300 mA CIN = 1 mF COUT = 1 mF 6 4 2 0 −40 −30 −20 −10 0 10 20 30 40 160 140 120 TJ = −40°C 80 60 VIN = 3.8 V VOUT = 2.8 V CIN = 1 mF COUT = 1 mF 40 TJ = 25°C 20 0 50 60 70 80 90 TJ = 85°C 100 0 50 100 150 200 250 300 TJ, JUNCTION TEMPERATURE (°C) IOUT, OUTPUT CURRENT (mA) Figure 11. Load Regulation vs. Temperature VOUT = 2.8 V (UDFN) Figure 12. Dropout Voltage vs. Output Current VOUT = 2.8 V (UDFN) 180 250 160 225 140 120 100 TJ = 85°C 80 TJ = −40°C 60 VIN = 4.45 V VOUT = 3.45 V CIN = 1 mF COUT = 1 mF 40 20 TJ = 25°C 0 10 TJ, JUNCTION TEMPERATURE (°C) 18 0 VIN = 2.5 V VOUT = 1.2 V IOUT = 1 mA to 300 mA CIN = 1 mF COUT = 1 mF 6 TJ, JUNCTION TEMPERATURE (°C) VDROP, DROPOUT VOLTAGE (mV) REGLOAD, LOAD REGULATION (mV) −40 −30 −20 −10 0 VDROP, DROPOUT VOLTAGE (mV) REGLOAD, LOAD REGULATION (mV) 20 50 100 150 200 250 VDROP, DROPOUT VOLTAGE (mV) REGLINE, LINE REGULATION (%/V) 0.1 0.08 200 175 VIN = 3.8 V VOUT = 2.8 V CIN = 1 mF COUT = 1 mF 150 125 100 75 IOUT = 100 mA 50 IOUT = 0 mA 25 0 −40 −30 −20 −10 0 300 IOUT = 300 mA 10 20 30 40 50 60 70 80 90 TJ, JUNCTION TEMPERATURE (°C) IOUT, OUTPUT CURRENT (mA) Figure 13. Dropout Voltage vs. Output Current VOUT = 3.45 V (UDFN) Figure 14. Dropout Voltage vs. Temperature VOUT = 2.8 V (UDFN) www.onsemi.com 5 NCP114 TYPICAL CHARACTERISTICS 140 120 750 IOUT = 300 mA 100 80 60 IOUT = 100 mA 40 IOUT = 0 mA 20 0 −40 −30 −20 −10 0 ISC, SHORT−CIRCUIT CURRENT (mA) 800 VIN = 4.45 V VOUT = 3.45 V CIN = 1 mF COUT = 1 mF ICL, CURRENT LIMIT (mA) 160 700 650 VOUT = 2.8 V 600 VOUT = 1.2 V 550 500 450 10 20 30 40 50 60 70 300 −40 −30 −20 −10 0 80 90 10 20 30 40 50 60 70 80 90 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 15. Dropout Voltage vs. Temperature VOUT = 3.45 V (UDFN) Figure 16. Current Limit vs. Temperature 800 750 700 VOUT = 2.8 V 650 VOUT = 1.2 V 600 550 500 450 VIN = VOUT(nom) + 1 V or 2.5 V VOUT = 0 V CIN = 1 mF COUT = 1 mF 400 350 300 −40 −30 −20 −10 0 10 20 30 40 50 60 70 80 90 800 750 700 650 600 550 500 450 VOUT = 0 V CIN = 1 mF COUT = 1 mF 400 350 300 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 TJ, JUNCTION TEMPERATURE (°C) VIN, INPUT VOLTAGE (V) Figure 17. Short−Circuit Current vs. Temperature Figure 18. Short−Circuit Current vs. Input Voltage 1 350 0.9 315 0.8 OFF −> ON 0.7 0.6 ON −> OFF 0.5 0.4 0.3 VIN = 3.8 V VOUT = 2.8 V CIN = 1 mF COUT = 1 mF 0.2 0.1 0 −40 −30 −20 −10 0 10 20 30 40 IEN, ENABLE CURRENT (nA) VEN, VOLTAGE ON ENABLE PIN (V) VIN = VOUT(nom) + 1 V or 2.5 V VOUT = 90% VOUT(nom) CIN = 1 mF COUT = 1 mF 400 350 ISC, SHORT−CIRCUIT CURRENT (mA) VDROP, DROPOUT VOLTAGE (mV) 180 VEN = 5.5 V 280 245 210 VEN = 0.4 V 175 140 105 35 0 −40 −30 −20 −10 0 50 60 70 80 90 VIN = 5.5 V VOUT = 2.8 V CIN = 1 mF COUT = 1 mF 70 10 20 30 40 50 60 70 80 90 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 19. Enable Voltage Threshold vs. Temperature Figure 20. Current to Enable Pin vs. Temperature www.onsemi.com 6 NCP114 TYPICAL CHARACTERISTICS IDIS, DISABLE CURRENT (nA) 100 80 60 40 20 0 −20 −40 VIN = 5.5 V VOUT = 2.8 V CIN = 1 mF COUT = 1 mF −60 −80 −100 −40 −30 −20 −10 0 10 20 30 40 50 60 70 80 90 TJ, JUNCTION TEMPERATURE (°C) Figure 21. Disable Current vs. Temperature www.onsemi.com 7 NCP114 TYPICAL CHARACTERISTICS OUTPUT VOLTAGE NOISE (nV/rtHz) 10000 IOUT = 300 mA 1000 IOUT 100 10 VIN = 2.5 V VOUT = 1.2 V CIN = 1 mF COUT = 1 mF 1 0.01 0.1 IOUT = 10 mA RMS Output Noise (mV) 10 Hz − 100 kHz 100 Hz − 100 kHz 1 mA 60.93 59.11 10 mA 52.73 50.63 300 mA 52.06 50.17 IOUT = 1 mA 1 100 10 1000 FREQUENCY (kHz) Figure 22. Output Voltage Noise Spectral Density for VOUT = 1.2 V, COUT = 1 mF OUTPUT VOLTAGE NOISE (nV/rtHz) 10000 IOUT = 300 mA 1000 IOUT 100 10 IOUT = 10 mA VIN = 3.8 V VOUT = 2.8 V CIN = 1 mF COUT = 1 mF 1 0.01 0.1 RMS Output Noise (mV) 10 Hz − 100 kHz 100 Hz − 100 kHz 74.66 1 mA 79.23 10 mA 75.03 70.37 300 mA 87.74 83.79 IOUT = 1 mA 1 10 100 1000 FREQUENCY (kHz) Figure 23. Output Voltage Noise Spectral Density for VOUT = 2.8 V, COUT = 1 mF OUTPUT VOLTAGE NOISE (nV/rtHz) 10000 IOUT = 300 mA 1000 IOUT 100 10 1 mA VIN = 3.8 V VOUT = 2.8 V CIN = 1 mF COUT = 4.7 mF 1 0.01 0.1 IOUT = 10 mA RMS Output Noise (mV) 10 Hz − 100 kHz 100 Hz − 100 kHz 80.17 75.29 10 mA 81.28 76.46 300 mA 93.23 89.62 IOUT = 1 mA 1 10 100 1000 FREQUENCY (kHz) Figure 24. Output Voltage Noise Spectral Density for VOUT = 2.8 V, COUT = 4.7 mF www.onsemi.com 8 NCP114 TYPICAL CHARACTERISTICS 100 70 RR, RIPPLE REJECTION (dB) RR, RIPPLE REJECTION (dB) 80 60 50 40 30 IOUT = 1 mA IOUT = 10 mA IOUT = 150 mA IOUT = 300 mA 20 10 0 0.1 1 10 100 1000 60 50 40 30 IOUT = 1 mA IOUT = 10 mA IOUT = 150 mA IOUT = 300 mA 20 10 0.1 1 10 100 1000 10000 FREQUENCY (kHz) Figure 26. Power Supply Rejection Ratio, VOUT = 2.8 V, COUT = 4.7 mF 100 VIN = 4.4 V, VOUT = 3.45 V CIN = none, COUT = 1 mF MLCC, X7R, 1206 size 80 70 10 ESR (W) 60 50 40 30 IOUT = 1 mA IOUT = 10 mA IOUT = 150 mA IOUT = 300 mA 20 10 0.1 70 FREQUENCY (kHz) 90 0 80 0 10000 VIN = 3.8 V, VOUT = 2.8 V CIN = none, COUT = 4.7 mF MLCC, X7R, 1206 size 90 Figure 25. Power Supply Rejection Ratio, VOUT = 2.8 V, COUT = 1 mF 100 RR, RIPPLE REJECTION (dB) 100 VIN = 3.8 V, VOUT = 2.8 V CIN = none, COUT = 1 mF MLCC, X7R, 1206 size 90 1 10 UNSTABLE OPERATION 1 STABLE OPERATION VIN = 5.5 V CIN = 1 mF COUT = 1 mF MLCC, X7R, 1206 size 0.1 100 1000 10000 0.01 0 50 100 150 200 250 FREQUENCY (kHz) IOUT, OUTPUT CURRENT (mA) Figure 27. Power Supply Rejection Ratio, VOUT = 3.45 V, COUT = 1 mF Figure 28. Output Capacitor ESR vs. Output Current www.onsemi.com 9 300 NCP114 VOUT IINRUSH VOUT 40 ms/div 40 ms/div 1 V/div VOUT VIN = 3.8 V VOUT = 2.8 V VEN = 1 V COUT = 1 mF CIN = 1 mF IOUT = 300 mA VEN IINRUSH VOUT 40 ms/div 40 ms/div Figure 31. Enable Turn−on Response, COUT = 4.7 mF, IOUT = 1 mA Figure 32. Enable Turn−on Response, COUT = 4.7 mF, IOUT = 300 mA tRISE = 1 ms 500 mV/div VIN VIN = 3.8 V to 4.8 V VOUT = 2.8 V COUT = 1 mF CIN = 1 mF IOUT = 1 mA VOUT 10 mV/div 1 V/div 500 mV/div 500 mV/div VIN = 3.8 V VOUT = 2.8 V VEN = 1 V COUT = 1 mF CIN = 1 mF IOUT = 1 mA IINRUSH 10 mV/div Figure 30. Enable Turn−on Response, COUT = 1 mF, IOUT = 300 mA 200 mA/div 500 mV/div Figure 29. Enable Turn−on Response, COUT = 1 mF, IOUT = 1 mA VEN 200 mA/div VEN 1 V/div 1 V/div IINRUSH VIN = 3.8 V VOUT = 2.8 V VEN = 1 V COUT = 1 mF CIN = 1 mF IOUT = 300 mA VIN tFALL = 1 ms VIN = 4.8 V to 3.8 V VOUT = 2.8 V COUT = 1 mF CIN = 1 mF IOUT = 1 mA VOUT 20 ms/div 10 ms/div Figure 33. Line Transient Response − Rising Edge, VOUT = 2.8 V, IOUT = 1 mA Figure 34. Line Transient Response − Falling Edge, VOUT = 2.8 V, IOUT = 1 mA www.onsemi.com 10 200 mA/div VEN 500 mV/div VIN = 3.8 V VOUT = 2.8 V VEN = 1 V COUT = 1 mF CIN = 1 mF IOUT = 1 mA 200 mA/div 500 mV/div TYPICAL CHARACTERISTICS NCP114 500 mV/div tRISE = 1 ms 20 mV/div VIN VIN = 3.8 V to 4.8 V VOUT = 2.8 V COUT = 10 mF CIN = 1 mF IOUT = 300 mA VOUT VIN tFALL = 1 ms VIN = 4.8 V to 3.8 V VOUT = 2.8 V COUT = 1 mF CIN = 1 mF IOUT = 300 mA VOUT 4 ms/div Figure 36. Line Transient Response − Falling Edge, VOUT = 2.8 V, IOUT = 300 mA 100 mA/div 4 ms/div Figure 35. Line Transient Response − Rising Edge, VOUT = 2.8 V, IOUT = 300 mA 100 mA/div 20 mV/div 500 mV/div TYPICAL CHARACTERISTICS VIN = 2.5 V VOUT = 1.2 V CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) IOUT IOUT tFALL = 1 ms VIN = 2.5 V VOUT = 1.2 V CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) tRISE = 1 ms COUT = 1 mF 20 mV/div COUT = 4.7 mF COUT = 4.7 mF COUT = 1 mF VOUT 4 ms/div 20 ms/div Figure 37. Load Transient Response − Rising Edge, VOUT = 1.2 V, IOUT = 1 mA to 300 mA, COUT = 1 mF, 4.7 mF Figure 38. Load Transient Response − Falling Edge, VOUT = 1.2 V, IOUT = 1 mA to 300 mA, COUT = 1 mF, 4.7 mF IOUT tRISE = 1 ms VIN = 3.8 V VOUT = 2.8 V CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) 100 mA/div 100 mA/div 20 mV/div VOUT IOUT tFALL = 1 ms COUT = 1 mF COUT = 1 mF 20 mV/div 20 mV/div VOUT COUT = 4.7 mF VIN = 3.8 V VOUT = 2.8 V CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) COUT = 4.7 mF VOUT 4 ms/div 10 ms/div Figure 39. Load Transient Response − Rising Edge, VOUT = 2.8 V, IOUT = 1 mA to 300 mA, COUT = 1 mF, 4.7 mF Figure 40. Load Transient Response − Falling Edge, VOUT = 2.8 V, IOUT = 1 mA to 300 mA, COUT = 1 mF, 4.7 mF www.onsemi.com 11 NCP114 IOUT VIN = 3.8 V VOUT = 2.8 V CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) IOUT 100 mA/div 100 mA/div TYPICAL CHARACTERISTICS tRISE = 1 ms tFALL = 1 ms VIN = 3.8 V VOUT = 2.8 V CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) VIN = 3.8 V 20 mV/div VIN = 5.5 V VIN = 3.8 V VOUT VIN = 5.5 V 2 ms/div 10 ms/div Figure 41. Load Transient Response − Rising Edge, VOUT = 2.8 V, IOUT = 1 mA to 300 mA, VIN = 3.8 V, 5.5 V Figure 42. Load Transient Response − Falling Edge, VOUT = 2.8 V, IOUT = 1 mA to 300 mA, VIN = 3.8 V, 5.5 V VIN = 5.5 V VOUT = 2.8 V IOUT = 10 mA CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) VIN Full Load 200 mA/div 20 mV/div VOUT VOUT Overheating VIN = 5.5 V VOUT = 1.2 V CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) IOUT Thermal Shutdown 1 V/div 500 mA/div VOUT TSD Cycling 4 ms/div 10 ms/div Figure 43. Turn−on/off − Slow Rising VIN Figure 44. Short−Circuit and Thermal Shutdown www.onsemi.com 12 NCP114 APPLICATIONS INFORMATION General The NCP114 is a high performance 300 mA Low Dropout Linear Regulator. This device delivers very high PSRR (over 75 dB at 1 kHz) and excellent dynamic performance as load/line transients. In connection with very low quiescent current this device is very suitable for various battery powered applications such as tablets, cellular phones, wireless and many others. The device is fully protected in case of output overload, output short circuit condition and overheating, assuring a very robust design. disable state the device consumes as low as typ. 10 nA from the VIN. If the EN pin voltage >0.9 V the device is guaranteed to be enabled. The NCP114 regulates the output voltage and the active discharge transistor is turned−off. The EN pin has internal pull−down current source with typ. value of 300 nA which assures that the device is turned−off when the EN pin is not connected. In the case where the EN function isn’t required the EN should be tied directly to IN. Input Capacitor Selection (CIN) Output Current Limit It is recommended to connect at least a 1 mF Ceramic X5R or X7R capacitor as close as possible to the IN pin of the device. This capacitor will provide a low impedance path for unwanted AC signals or noise modulated onto constant input voltage. There is no requirement for the min. /max. ESR of the input capacitor but it is recommended to use ceramic capacitors for their low ESR and ESL. A good input capacitor will limit the influence of input trace inductance and source resistance during sudden load current changes. Larger input capacitor may be necessary if fast and large load transients are encountered in the application. Output Current is internally limited within the IC to a typical 600 mA. The NCP114 will source this amount of current measured with a voltage drops on the 90% of the nominal VOUT. If the Output Voltage is directly shorted to ground (VOUT = 0 V), the short circuit protection will limit the output current to 630 mA (typ). The current limit and short circuit protection will work properly over whole temperature range and also input voltage range. There is no limitation for the short circuit duration. Thermal Shutdown When the die temperature exceeds the Thermal Shutdown threshold (TSD − 160°C typical), Thermal Shutdown event is detected and the device is disabled. The IC will remain in this state until the die temperature decreases below the Thermal Shutdown Reset threshold (TSDU − 140°C typical). Once the IC temperature falls below the 140°C the LDO is enabled again. The thermal shutdown feature provides the protection from a catastrophic device failure due to accidental overheating. This protection is not intended to be used as a substitute for proper heat sinking. Output Decoupling (COUT) The NCP114 requires an output capacitor connected as close as possible to the output pin of the regulator. The recommended capacitor value is 1 mF and X7R or X5R dielectric due to its low capacitance variations over the specified temperature range. The NCP114 is designed to remain stable with minimum effective capacitance of 0.22mF to account for changes with temperature, DC bias and package size. Especially for small package size capacitors such as 0402 the effective capacitance drops rapidly with the applied DC bias. There is no requirement for the minimum value of Equivalent Series Resistance (ESR) for the COUT but the maximum value of ESR should be less than 2 W. Larger output capacitors and lower ESR could improve the load transient response or high frequency PSRR. It is not recommended to use tantalum capacitors on the output due to their large ESR. The equivalent series resistance of tantalum capacitors is also strongly dependent on the temperature, increasing at low temperature. Power Dissipation As power dissipated in the NCP114 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. The maximum power dissipation the NCP114 can handle is given by: Enable Operation P D(MAX) + The NCP114 uses the EN pin to enable/disable its device and to deactivate/activate the active discharge function. If the EN pin voltage is VIN. Due to this fact in cases, where the extended reverse current condition can be anticipated the device may require additional external protection. PCB Layout Recommendations To obtain good transient performance and good regulation characteristics place CIN and COUT capacitors close to the device pins and make the PCB traces wide. In order to minimize the solution size, use 0402 capacitors. Larger copper area connected to the pins will also improve the device thermal resistance. The actual power dissipation can be calculated from the equation above (Equation 2). Expose pad should be tied the shortest path to the GND pin. Power Supply Rejection Ratio The NCP114 features very good Power Supply Rejection ratio. If desired the PSRR at higher frequencies in the range 100 kHz − 10 MHz can be tuned by the selection of COUT capacitor and proper PCB layout. Turn−On Time The turn−on time is defined as the time period from EN assertion to the point in which VOUT will reach 98% of its www.onsemi.com 14 NCP114 ORDERING INFORMATION Voltage Option Marking Marking Rotation NCP114AMX075TCG 0.75 V AW 0° NCP114AMX080TCG 0.80 V AT 0° NCP114AMX090TAG 0.9 V AP 0° NCP114AMX090TCG 0.9 V AP 0° NCP114AMX092TAG 0.92 V A2 0° Device NCP114AMX100TCG 1.0 V 6 180° NCP114AMX105TCG 1.05 V R 0° NCP114AMX110TBG 1.1 V F 180° NCP114AMX110TCG 1.1 V F 180° NCP114AMX115TCG 1.15 V AM 0° NCP114AMX120TBG 1.2 V T 0° NCP114AMX120TCG 1.2 V T 0° NCP114AMX125TCG 1.25 V A 180° NCP114AMX130TCG 1.3 V AA 0° NCP114AMX135TCG 1.35 V AN 0° NCP114AMX150TCG 1.5 V V 0° NCP114AMX160TCG 1.6 V 2 180° NCP114AMX180TBG 1.8 V J 180° NCP114AMX180TCG 1.8 V J 180° NCP114AMX185TCG 1.85 V Y 0° NCP114AMX210TCG 2.1 V L 180° NCP114AMX220TCG 2.2 V Q 180° NCP114AMX240TCG 2.4 V AH 0° NCP114AMX250TBG 2.5 V AF 0° NCP114AMX250TCG 2.5 V AF 0° NCP114AMX260TCG 2.6 V T 180° NCP114AMX270TCG 2.7 V AJ 0° NCP114AMX280TBG 2.8 V 2 0° NCP114AMX280TCG 2.8 V 2 0° NCP114AMX285TCG 2.85 V 3 0° NCP114AMX290TCG 2.9 V AZ 0° NCP114AMX300TCG 3.0 V 4 0° NCP114AMX310TBG 3.1 V 5 0° NCP114AMX310TCG 3.1 V 5 0° NCP114AMX320TCG 3.2 V AG 0° NCP114AMX330TBG 3.3 V 6 0° NCP114AMX330TCG 3.3 V 6 0° NCP114AMX345TCG 3.45 V AC 0° NCP114AMX350TCG 3.5 V 4 180° NCP114AMX360TCG 3.6 V AU 0° Option Package Shipping† With active output discharge function UDFN4 (Pb-Free) 3000 / Tape & Reel www.onsemi.com 15 NCP114 ORDERING INFORMATION Voltage Option Marking Marking Rotation NCP114BMX075TCG 0.75 V CW 0° NCP114BMX100TCG 1.0 V 6 270° NCP114BMX120TCG 1.2 V T 90° NCP114BMX150TCG 1.5 V V 90° NCP114BMX180TCG 1.8 V J 270° NCP114BMX250TCG 2.5 V CF 0° NCP114BMX280TCG 2.8 V 2 90° NCP114BMX300TCG 3.0 V 4 90° NCP114BMX330TCG 3.3 V 6 90° Device Option Package Shipping† Without active output discharge function UDFN4 (Pb-Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ORDERING INFORMATION Device Voltage Option Marking NCP114ASN080T1G 0.8 V CAY NCP114ASN120T1G 1.2 V CAC 1.5 V CAX 1.8 V CAD 2.5 V CAG Option Package Shipping† TSOP−5 (Pb−Free) 3000 / Tape & Reel NCP114ASN120T2G NCP114ASN150T1G NCP114ASN150T2G NCP114ASN180T1G NCP114ASN180T2G NCP114ASN250T1G With output active discharge function NCP114ASN250T2G NCP114ASN260T1G 2.6 V CAQ NCP114ASN270T1G 2.7 V CAV NCP114ASN280T1G 2.8 V CAH NCP114ASN290T1G 2.9 V CAU NCP114ASN300T1G 3.0 V CAK NCP114ASN330T1G 3.3 V CAL 3.3 V CDL NCP114ASN280T2G NCP114ASN330T2G NCP114BSN330T1G Without output active discharge †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 16 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSOP−5 CASE 483 ISSUE N 5 1 SCALE 2:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION A. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. D 5X NOTE 5 2X DATE 12 AUG 2020 0.20 C A B 0.10 T M 2X 0.20 T 5 B 1 4 2 B S 3 K DETAIL Z G A A TOP VIEW DIM A B C D G H J K M S DETAIL Z J C 0.05 H C SIDE VIEW SEATING PLANE END VIEW GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT* 0.95 0.037 MILLIMETERS MIN MAX 2.85 3.15 1.35 1.65 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 0_ 10 _ 2.50 3.00 1.9 0.074 5 5 XXXAYWG G 1 1 Analog 2.4 0.094 XXX = Specific Device Code A = Assembly Location Y = Year W = Work Week G = Pb−Free Package 1.0 0.039 XXX MG G Discrete/Logic XXX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) 0.7 0.028 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98ARB18753C TSOP−5 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN4 1.0x1.0, 0.65P CASE 517CU ISSUE A 1 SCALE 4:1 A B D PIN ONE REFERENCE 2X 0.05 C 0.05 C 2X ÉÉ ÉÉ 3X C0.18 X 45 5 C0.27 x 0.25 E L2 A 0.10 C DIM A A1 A3 b D D2 E e L L2 (A3) A1 0.05 C C SIDE VIEW e DETAIL A 3X 2 SEATING PLANE MILLIMETERS MIN MAX −−− 0.60 0.00 0.05 0.15 REF 0.20 0.30 1.00 BSC 0.38 0.58 1.00 BSC 0.65 BSC 0.20 0.30 0.27 0.37 GENERIC MARKING DIAGRAM* e/2 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.03 AND 0.07 FROM THE TERMINAL TIPS. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DETAIL A TOP VIEW NOTE 4 DATE 18 DEC 2014 L XX M 1 D2 D2 45 5 4 XX = Specific Device Code M = Date Code 3 4X BOTTOM VIEW b 0.10 M C A B 0.05 M C *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. NOTE 3 RECOMMENDED MOUNTING FOOTPRINT* 2X 0.65 PITCH 0.58 DETAIL B 3X 0.43 PACKAGE OUTLINE 4X 0.23 1.30 0.53 1 4X 0.30 3X 0.10 DETAIL B DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON76666F UDFN4, 1.0X1.0, 0.65P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative