Voltage Regulator - CMOS
Low Dropout
300 mA
NCP114
The NCP114 is 300 mA LDO that provides the engineer with a very
stable, accurate voltage with low noise suitable for space constrained,
noise sensitive applications. In order to optimize performance for
battery operated portable applications, the NCP114 employs the
dynamic quiescent current adjustment for very low IQ consumption at
no−load.
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MARKING
DIAGRAMS
UDFN4
MX SUFFIX
CASE 517CU
Features
• Operating Input Voltage Range: 1.7 V to 5.5 V
• Available in Fixed Voltage Options: 0.75 V to 3.6 V
•
•
•
•
•
•
•
•
•
1
XX = Specific Device Code
M = Date Code
Contact Factory for Other Voltage Options
Very Low Quiescent Current of Typ. 50 mA
Standby Current Consumption: Typ. 0.1 mA
Low Dropout: 135 mV Typical at 300 mA
±1% Accuracy at Room Temperature
High Power Supply Ripple Rejection: 75 dB at 1 kHz
Thermal Shutdown and Current Limit Protections
Stable with a 1 mF Ceramic Output Capacitor
Available in UDFN and TSOP Packages
These are Pb−Free Devices
5
TSOP−5
SN SUFFIX
CASE 483
XXXAYWG
G
1
XXX = Specific Device Code
A
= Assembly Location
Y
= Year
W = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
Typical Applicaitons
•
•
•
•
XX M
1
PIN CONNECTIONS
PDAs, Mobile phones, GPS, Smartphones
Wireless Handsets, Wireless LAN, Bluetooth®, Zigbee®
Portable Medical Equipment
Other Battery Powered Applications
VIN
EN
IN
3
4
2
1
VOUT
IN
CIN
EN
ON
OFF
OUT
NCP114
GND
COUT
1 mF
Ceramic
GND
OUT
(Bottom View)
Figure 1. Typical Application Schematic
IN
1
GND
2
EN
3
5 OUT
4 N/C
(Top View)
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 15 of this data sheet.
© Semiconductor Components Industries, LLC, 2016
August, 2020 − Rev. 30
1
Publication Order Number:
NCP114/D
NCP114
IN
ENABLE
LOGIC
EN
THERMAL
SHUTDOWN
BANDGAP
REFERENCE
MOSFET
DRIVER WITH
CURRENT LIMIT
OUT
AUTO LOW
POWER MODE
ACTIVE
DISCHARGE*
EN
GND
*Active output discharge function is present only in NCP114AMXyyyTCG devices.
yyy denotes the particular VOUT option.
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
(UDFN4)
Pin No.
(TSOP5)
Pin Name
Description
1
5
OUT
Regulated output voltage pin. A small ceramic capacitor with minimum value of 1 mF is needed from this pin to ground to assure stability.
2
2
GND
Power supply ground.
3
3
EN
Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into
shutdown mode.
4
1
IN
Input pin. A small capacitor is needed from this pin to ground to assure stability.
−
4
N/C
−
−
EPAD
Not connected. This pin can be tied to ground to improve thermal dissipation.
Exposed pad should be connected directly to the GND pin. Soldered to a large ground copper plane allows for effective heat removal.
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VIN
−0.3 V to 6 V
V
Output Voltage
VOUT
−0.3 V to VIN + 0.3 V or 6 V
V
Enable Input
VEN
−0.3 V to 6 V
V
Input Voltage (Note 1)
Output Short Circuit Duration
tSC
∞
s
TJ(MAX)
150
°C
TSTG
−55 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Maximum Junction Temperature
Storage Temperature
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114,
ESD Machine Model tested per EIA/JESD22−A115,
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS (Note 3)
Rating
Symbol
Value
Unit
Thermal Characteristics, UDFN4 1x1 mm
Thermal Resistance, Junction−to−Air
RqJA
170
°C/W
Thermal Characteristics, TSOP−5
Thermal Resistance, Junction−to−Air
RqJA
236
°C/W
3. Single component mounted on 1 oz, FR 4 PCB with 645 mm2 Cu area.
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2
NCP114
ELECTRICAL CHARACTERISTICS
−40°C ≤ TJ ≤ 85°C; VIN = VOUT(NOM) + 1 V for VOUT options greater than 1.5 V. Otherwise VIN = 2.5 V, whichever is greater; IOUT = 1 mA,
CIN = COUT = 1 mF, unless otherwise noted. VEN = 0.9 V. Typical values are at TJ = +25°C. Min./Max. are for TJ = −40°C and TJ = +85°C
respectively (Note 4).
Parameter
Test Conditions
Operating Input Voltage
Output Voltage Accuracy
Line Regulation
Load Regulation − UDFN package
Load Regulation − TSOP−5 package
Load Transient
Dropout Voltage − UDFN package (Note 5)
Dropout Voltage − TSOP package (Note 5)
−40°C ≤ TJ ≤ 85°C
VOUT ≤ 2.0 V
Symbol
Min
VIN
VOUT
VOUT > 2.0 V
VOUT + 0.5 V ≤ VIN ≤ 5.5 V (VIN ≥ 1.7 V)
IOUT = 1 mA to 300 mA
RegLOAD
IOUT = 1 mA to 300 mA or 300 mA to 1 mA
in 1 ms, COUT = 1 mF
TranLOAD
1.7
5.5
V
−40
+40
mV
−2
+2
%
0.01
0.1
%/V
12
30
mV
28
45
−50/
+30
460
VOUT = 1.85 V
245
330
155
230
145
220
VOUT = 3.1 V
140
210
VOUT = 3.3 V
135
200
VOUT = 1.5 V
380
485
VOUT = 1.85 V
260
355
170
255
160
245
155
235
150
225
VOUT = 2.8 V
VOUT = 3.0 V
VDO
VDO
VOUT = 3.1 V
VOUT = 3.3 V
Output Current Limit
mV
365
VOUT = 3.0 V
IOUT = 300 mA
Unit
VOUT = 1.5 V
VOUT = 2.8 V
IOUT = 300 mA
Max
RegLINE
Typ
ICL
IOUT = 0 mA
IQ
50
95
mA
Shutdown Current
VEN ≤ 0.4 V, VIN = 5.5 V
IDIS
0.01
1
mA
EN Pin Threshold Voltage
High Threshold
Low Threshold
VEN Voltage increasing
VEN Voltage decreasing
VEN_HI
VEN_LO
EN Pin Input Current
VEN = 5.5 V
mA
V
0.9
0.4
IEN
0.3
1.0
PSRR
75
dB
VN
70
mVrms
mA
Power Supply Rejection Ratio
VIN = 3.6 V, VOUT = 3.1 V
IOUT = 150 mA
Output Noise Voltage
VIN = 2.5 V, VOUT = 1.8 V, IOUT = 150 mA
f = 10 Hz to 100 kHz
Thermal Shutdown Temperature
Temperature increasing from TJ = +25°C
TSD
160
°C
Temperature falling from TSD
TSDH
20
°C
VEN < 0.4 V, Version A only
RDIS
100
W
Thermal Shutdown Hysteresis
Active Output Discharge Resistance
f = 1 kHz
600
mV
VOUT = 90% VOUT(nom)
Ground Current
300
mV
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at
TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
5. Characterized when VOUT falls 100 mV below the regulated voltage at VIN = VOUT(NOM) + 1 V.
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3
NCP114
TYPICAL CHARACTERISTICS
2.83
IOUT = 1 mA
1.205
1.200
1.195
IOUT = 300 mA
1.190
1.185
1.180
1.175
VIN = 2.5 V
VOUT = 1.2 V
CIN = 1 mF
COUT = 1 mF
1.170
1.165
1.160
−40 −30 −20 −10 0
10
20 30 40
2.82
VOUT, OUTPUT VOLTAGE (V)
VOUT, OUTPUT VOLTAGE (V)
1.210
2.80
2.78
2.77
2.76
2.74
2.73
−40 −30 −20 −10 0
10
20 30 40
50 60 70 80 90
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 3. Output Voltage vs. Temperature
VOUT = 1.2 V (UDFN)
Figure 4. Output Voltage vs. Temperature
VOUT = 2.8 V (UDFN)
1000
70
IGND, GROUND CURRENT (mA)
IQ, QUIESCENT CURRENT (mA)
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
2.75
50 60 70 80 90
−40°C
60
85°C
50
25°C
40
30
20
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
10
0.5
1.0 1.5
2.0 2.5
3.0 3.5
4.0 4.5 5.0
5.5
900
800
700
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
600
500
400
300
200
85°C
25°C
−40°C
100
0
0.001
0.01
0.1
1
10
100
1000
VIN, INPUT VOLTAGE (V)
IOUT, OUTPUT CURRENT (mA)
Figure 5. Quiescent Current vs. Input Voltage
Figure 6. Ground Current vs. Output Current
1000
0.1
900
IOUT = 300 mA
800
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
700
600
500
400
300
200
IOUT = 1 mA
100
0
−40 −30 −20 −10 0
10 20 30 40 50 60 70
REGLINE, LINE REGULATION (%/V)
IGND, GROUND CURRENT (mA)
IOUT = 300 mA
2.79
80
0
0.0
IOUT = 1 mA
2.81
80 90
0.08
0.06
0.04
0.02
0
−0.02
−0.04
−0.06
−0.08
−1
−40 −30 −20 −10 0
VIN = 1.7 V to 5.5 V
VOUT = 1.2 V
IOUT = 1 mA
CIN = 1 mF
COUT = 1 mF
10 20 30 40 50 60 70
80 90
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 7. Ground Current vs. Temperature
Figure 8. Line Regulation vs. Output Current
VOUT = 1.2 V
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4
NCP114
TYPICAL CHARACTERISTICS
0.06
0.04
0.02
0
−0.02
VIN = 3.8 V to 5.5 V
VOUT = 2.8 V
IOUT = 1 mA
CIN = 1 mF
COUT = 1 mF
−0.04
−0.06
−0.08
−0.1
10
20 30 40
50 60 70 80 90
18
16
14
12
10
8
4
2
0
−40 −30 −20 −10 0
20 30 40
50 60 70 80 90
Figure 9. Line Regulation vs. Temperature
VOUT = 2.8 V
Figure 10. Load Regulation vs. Temperature
VOUT = 1.2 V (UDFN)
20
200
180
16
14
12
10
8
VIN = 3.8 V
VOUT = 2.8 V
IOUT = 1 mA to 300 mA
CIN = 1 mF
COUT = 1 mF
6
4
2
0
−40 −30 −20 −10 0
10
20 30
40
160
140
120
TJ = −40°C
80
60
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
40
TJ = 25°C
20
0
50 60 70 80 90
TJ = 85°C
100
0
50
100
150
200
250
300
TJ, JUNCTION TEMPERATURE (°C)
IOUT, OUTPUT CURRENT (mA)
Figure 11. Load Regulation vs. Temperature
VOUT = 2.8 V (UDFN)
Figure 12. Dropout Voltage vs. Output Current
VOUT = 2.8 V (UDFN)
180
250
160
225
140
120
100
TJ = 85°C
80
TJ = −40°C
60
VIN = 4.45 V
VOUT = 3.45 V
CIN = 1 mF
COUT = 1 mF
40
20
TJ = 25°C
0
10
TJ, JUNCTION TEMPERATURE (°C)
18
0
VIN = 2.5 V
VOUT = 1.2 V
IOUT = 1 mA to 300 mA
CIN = 1 mF
COUT = 1 mF
6
TJ, JUNCTION TEMPERATURE (°C)
VDROP, DROPOUT VOLTAGE (mV)
REGLOAD, LOAD REGULATION (mV)
−40 −30 −20 −10 0
VDROP, DROPOUT VOLTAGE (mV)
REGLOAD, LOAD REGULATION (mV)
20
50
100
150
200
250
VDROP, DROPOUT VOLTAGE (mV)
REGLINE, LINE REGULATION (%/V)
0.1
0.08
200
175
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
150
125
100
75
IOUT = 100 mA
50
IOUT = 0 mA
25
0
−40 −30 −20 −10 0
300
IOUT = 300 mA
10 20 30 40 50 60 70
80 90
TJ, JUNCTION TEMPERATURE (°C)
IOUT, OUTPUT CURRENT (mA)
Figure 13. Dropout Voltage vs. Output Current
VOUT = 3.45 V (UDFN)
Figure 14. Dropout Voltage vs. Temperature
VOUT = 2.8 V (UDFN)
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5
NCP114
TYPICAL CHARACTERISTICS
140
120
750
IOUT = 300 mA
100
80
60
IOUT = 100 mA
40
IOUT = 0 mA
20
0
−40 −30 −20 −10 0
ISC, SHORT−CIRCUIT CURRENT (mA)
800
VIN = 4.45 V
VOUT = 3.45 V
CIN = 1 mF
COUT = 1 mF
ICL, CURRENT LIMIT (mA)
160
700
650
VOUT = 2.8 V
600
VOUT = 1.2 V
550
500
450
10 20 30 40 50 60 70
300
−40 −30 −20 −10 0
80 90
10 20 30 40 50 60 70
80 90
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 15. Dropout Voltage vs. Temperature
VOUT = 3.45 V (UDFN)
Figure 16. Current Limit vs. Temperature
800
750
700
VOUT = 2.8 V
650
VOUT = 1.2 V
600
550
500
450
VIN = VOUT(nom) + 1 V or 2.5 V
VOUT = 0 V
CIN = 1 mF
COUT = 1 mF
400
350
300
−40 −30 −20 −10 0
10
20 30 40
50 60 70 80 90
800
750
700
650
600
550
500
450
VOUT = 0 V
CIN = 1 mF
COUT = 1 mF
400
350
300
3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6
TJ, JUNCTION TEMPERATURE (°C)
VIN, INPUT VOLTAGE (V)
Figure 17. Short−Circuit Current vs.
Temperature
Figure 18. Short−Circuit Current vs. Input
Voltage
1
350
0.9
315
0.8
OFF −> ON
0.7
0.6
ON −> OFF
0.5
0.4
0.3
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
0.2
0.1
0
−40 −30 −20 −10 0
10
20 30 40
IEN, ENABLE CURRENT (nA)
VEN, VOLTAGE ON ENABLE PIN (V)
VIN = VOUT(nom) + 1 V or 2.5 V
VOUT = 90% VOUT(nom)
CIN = 1 mF
COUT = 1 mF
400
350
ISC, SHORT−CIRCUIT CURRENT (mA)
VDROP, DROPOUT VOLTAGE (mV)
180
VEN = 5.5 V
280
245
210
VEN = 0.4 V
175
140
105
35
0
−40 −30 −20 −10 0
50 60 70 80 90
VIN = 5.5 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
70
10
20 30 40
50 60 70 80 90
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 19. Enable Voltage Threshold vs.
Temperature
Figure 20. Current to Enable Pin vs.
Temperature
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6
NCP114
TYPICAL CHARACTERISTICS
IDIS, DISABLE CURRENT (nA)
100
80
60
40
20
0
−20
−40
VIN = 5.5 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
−60
−80
−100
−40 −30 −20 −10 0
10 20 30 40 50 60 70
80 90
TJ, JUNCTION TEMPERATURE (°C)
Figure 21. Disable Current vs. Temperature
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7
NCP114
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE NOISE (nV/rtHz)
10000
IOUT = 300 mA
1000
IOUT
100
10
VIN = 2.5 V
VOUT = 1.2 V
CIN = 1 mF
COUT = 1 mF
1
0.01
0.1
IOUT = 10 mA
RMS Output Noise (mV)
10 Hz − 100 kHz
100 Hz − 100 kHz
1 mA
60.93
59.11
10 mA
52.73
50.63
300 mA
52.06
50.17
IOUT = 1 mA
1
100
10
1000
FREQUENCY (kHz)
Figure 22. Output Voltage Noise Spectral Density for VOUT = 1.2 V, COUT = 1 mF
OUTPUT VOLTAGE NOISE (nV/rtHz)
10000
IOUT = 300 mA
1000
IOUT
100
10
IOUT = 10 mA
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
1
0.01
0.1
RMS Output Noise (mV)
10 Hz − 100 kHz
100 Hz − 100 kHz
74.66
1 mA
79.23
10 mA
75.03
70.37
300 mA
87.74
83.79
IOUT = 1 mA
1
10
100
1000
FREQUENCY (kHz)
Figure 23. Output Voltage Noise Spectral Density for VOUT = 2.8 V, COUT = 1 mF
OUTPUT VOLTAGE NOISE (nV/rtHz)
10000
IOUT = 300 mA
1000
IOUT
100
10
1 mA
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 4.7 mF
1
0.01
0.1
IOUT = 10 mA
RMS Output Noise (mV)
10 Hz − 100 kHz
100 Hz − 100 kHz
80.17
75.29
10 mA
81.28
76.46
300 mA
93.23
89.62
IOUT = 1 mA
1
10
100
1000
FREQUENCY (kHz)
Figure 24. Output Voltage Noise Spectral Density for VOUT = 2.8 V, COUT = 4.7 mF
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NCP114
TYPICAL CHARACTERISTICS
100
70
RR, RIPPLE REJECTION (dB)
RR, RIPPLE REJECTION (dB)
80
60
50
40
30
IOUT = 1 mA
IOUT = 10 mA
IOUT = 150 mA
IOUT = 300 mA
20
10
0
0.1
1
10
100
1000
60
50
40
30
IOUT = 1 mA
IOUT = 10 mA
IOUT = 150 mA
IOUT = 300 mA
20
10
0.1
1
10
100
1000
10000
FREQUENCY (kHz)
Figure 26. Power Supply Rejection Ratio,
VOUT = 2.8 V, COUT = 4.7 mF
100
VIN = 4.4 V, VOUT = 3.45 V
CIN = none, COUT = 1 mF
MLCC, X7R,
1206 size
80
70
10
ESR (W)
60
50
40
30
IOUT = 1 mA
IOUT = 10 mA
IOUT = 150 mA
IOUT = 300 mA
20
10
0.1
70
FREQUENCY (kHz)
90
0
80
0
10000
VIN = 3.8 V, VOUT = 2.8 V
CIN = none, COUT = 4.7 mF
MLCC, X7R,
1206 size
90
Figure 25. Power Supply Rejection Ratio,
VOUT = 2.8 V, COUT = 1 mF
100
RR, RIPPLE REJECTION (dB)
100
VIN = 3.8 V, VOUT = 2.8 V
CIN = none, COUT = 1 mF
MLCC, X7R,
1206 size
90
1
10
UNSTABLE OPERATION
1
STABLE OPERATION
VIN = 5.5 V
CIN = 1 mF
COUT = 1 mF
MLCC, X7R,
1206 size
0.1
100
1000
10000
0.01
0
50
100
150
200
250
FREQUENCY (kHz)
IOUT, OUTPUT CURRENT (mA)
Figure 27. Power Supply Rejection Ratio,
VOUT = 3.45 V, COUT = 1 mF
Figure 28. Output Capacitor ESR vs. Output
Current
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300
NCP114
VOUT
IINRUSH
VOUT
40 ms/div
40 ms/div
1 V/div
VOUT
VIN = 3.8 V
VOUT = 2.8 V
VEN = 1 V
COUT = 1 mF
CIN = 1 mF
IOUT = 300 mA
VEN
IINRUSH
VOUT
40 ms/div
40 ms/div
Figure 31. Enable Turn−on Response,
COUT = 4.7 mF, IOUT = 1 mA
Figure 32. Enable Turn−on Response,
COUT = 4.7 mF, IOUT = 300 mA
tRISE = 1 ms
500 mV/div
VIN
VIN = 3.8 V to 4.8 V
VOUT = 2.8 V
COUT = 1 mF
CIN = 1 mF
IOUT = 1 mA
VOUT
10 mV/div
1 V/div
500 mV/div
500 mV/div
VIN = 3.8 V
VOUT = 2.8 V
VEN = 1 V
COUT = 1 mF
CIN = 1 mF
IOUT = 1 mA
IINRUSH
10 mV/div
Figure 30. Enable Turn−on Response,
COUT = 1 mF, IOUT = 300 mA
200 mA/div
500 mV/div
Figure 29. Enable Turn−on Response,
COUT = 1 mF, IOUT = 1 mA
VEN
200 mA/div
VEN
1 V/div
1 V/div
IINRUSH
VIN = 3.8 V
VOUT = 2.8 V
VEN = 1 V
COUT = 1 mF
CIN = 1 mF
IOUT = 300 mA
VIN
tFALL = 1 ms
VIN = 4.8 V to 3.8 V
VOUT = 2.8 V
COUT = 1 mF
CIN = 1 mF
IOUT = 1 mA
VOUT
20 ms/div
10 ms/div
Figure 33. Line Transient Response − Rising
Edge, VOUT = 2.8 V, IOUT = 1 mA
Figure 34. Line Transient Response − Falling
Edge, VOUT = 2.8 V, IOUT = 1 mA
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10
200 mA/div
VEN
500 mV/div
VIN = 3.8 V
VOUT = 2.8 V
VEN = 1 V
COUT = 1 mF
CIN = 1 mF
IOUT = 1 mA
200 mA/div
500 mV/div
TYPICAL CHARACTERISTICS
NCP114
500 mV/div
tRISE = 1 ms
20 mV/div
VIN
VIN = 3.8 V to 4.8 V
VOUT = 2.8 V
COUT = 10 mF
CIN = 1 mF
IOUT = 300 mA
VOUT
VIN
tFALL = 1 ms
VIN = 4.8 V to 3.8 V
VOUT = 2.8 V
COUT = 1 mF
CIN = 1 mF
IOUT = 300 mA
VOUT
4 ms/div
Figure 36. Line Transient Response − Falling
Edge, VOUT = 2.8 V, IOUT = 300 mA
100 mA/div
4 ms/div
Figure 35. Line Transient Response − Rising
Edge, VOUT = 2.8 V, IOUT = 300 mA
100 mA/div
20 mV/div
500 mV/div
TYPICAL CHARACTERISTICS
VIN = 2.5 V
VOUT = 1.2 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
IOUT
IOUT
tFALL = 1 ms
VIN = 2.5 V
VOUT = 1.2 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
tRISE = 1 ms
COUT = 1 mF
20 mV/div
COUT = 4.7 mF
COUT = 4.7 mF
COUT = 1 mF
VOUT
4 ms/div
20 ms/div
Figure 37. Load Transient Response − Rising
Edge, VOUT = 1.2 V, IOUT = 1 mA to 300 mA,
COUT = 1 mF, 4.7 mF
Figure 38. Load Transient Response − Falling
Edge, VOUT = 1.2 V, IOUT = 1 mA to 300 mA,
COUT = 1 mF, 4.7 mF
IOUT
tRISE = 1 ms
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
100 mA/div
100 mA/div
20 mV/div
VOUT
IOUT
tFALL = 1 ms
COUT = 1 mF
COUT = 1 mF
20 mV/div
20 mV/div
VOUT
COUT = 4.7 mF
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
COUT = 4.7 mF
VOUT
4 ms/div
10 ms/div
Figure 39. Load Transient Response − Rising
Edge, VOUT = 2.8 V, IOUT = 1 mA to 300 mA,
COUT = 1 mF, 4.7 mF
Figure 40. Load Transient Response − Falling
Edge, VOUT = 2.8 V, IOUT = 1 mA to 300 mA,
COUT = 1 mF, 4.7 mF
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11
NCP114
IOUT
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
IOUT
100 mA/div
100 mA/div
TYPICAL CHARACTERISTICS
tRISE = 1 ms
tFALL = 1 ms
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
VIN = 3.8 V
20 mV/div
VIN = 5.5 V
VIN = 3.8 V
VOUT
VIN = 5.5 V
2 ms/div
10 ms/div
Figure 41. Load Transient Response − Rising
Edge, VOUT = 2.8 V, IOUT = 1 mA to 300 mA,
VIN = 3.8 V, 5.5 V
Figure 42. Load Transient Response − Falling
Edge, VOUT = 2.8 V, IOUT = 1 mA to 300 mA,
VIN = 3.8 V, 5.5 V
VIN = 5.5 V
VOUT = 2.8 V
IOUT = 10 mA
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
VIN
Full Load
200 mA/div
20 mV/div
VOUT
VOUT
Overheating
VIN = 5.5 V
VOUT = 1.2 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
IOUT
Thermal Shutdown
1 V/div
500 mA/div
VOUT
TSD Cycling
4 ms/div
10 ms/div
Figure 43. Turn−on/off − Slow Rising VIN
Figure 44. Short−Circuit and Thermal
Shutdown
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12
NCP114
APPLICATIONS INFORMATION
General
The NCP114 is a high performance 300 mA Low Dropout
Linear Regulator. This device delivers very high PSRR
(over 75 dB at 1 kHz) and excellent dynamic performance
as load/line transients. In connection with very low
quiescent current this device is very suitable for various
battery powered applications such as tablets, cellular
phones, wireless and many others. The device is fully
protected in case of output overload, output short circuit
condition and overheating, assuring a very robust design.
disable state the device consumes as low as typ. 10 nA from
the VIN.
If the EN pin voltage >0.9 V the device is guaranteed to
be enabled. The NCP114 regulates the output voltage and
the active discharge transistor is turned−off.
The EN pin has internal pull−down current source with
typ. value of 300 nA which assures that the device is
turned−off when the EN pin is not connected. In the case
where the EN function isn’t required the EN should be tied
directly to IN.
Input Capacitor Selection (CIN)
Output Current Limit
It is recommended to connect at least a 1 mF Ceramic X5R
or X7R capacitor as close as possible to the IN pin of the
device. This capacitor will provide a low impedance path for
unwanted AC signals or noise modulated onto constant
input voltage. There is no requirement for the min. /max.
ESR of the input capacitor but it is recommended to use
ceramic capacitors for their low ESR and ESL. A good input
capacitor will limit the influence of input trace inductance
and source resistance during sudden load current changes.
Larger input capacitor may be necessary if fast and large
load transients are encountered in the application.
Output Current is internally limited within the IC to a
typical 600 mA. The NCP114 will source this amount of
current measured with a voltage drops on the 90% of the
nominal VOUT. If the Output Voltage is directly shorted to
ground (VOUT = 0 V), the short circuit protection will limit
the output current to 630 mA (typ). The current limit and
short circuit protection will work properly over whole
temperature range and also input voltage range. There is no
limitation for the short circuit duration.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
threshold (TSD − 160°C typical), Thermal Shutdown event
is detected and the device is disabled. The IC will remain in
this state until the die temperature decreases below the
Thermal Shutdown Reset threshold (TSDU − 140°C typical).
Once the IC temperature falls below the 140°C the LDO is
enabled again. The thermal shutdown feature provides the
protection from a catastrophic device failure due to
accidental overheating. This protection is not intended to be
used as a substitute for proper heat sinking.
Output Decoupling (COUT)
The NCP114 requires an output capacitor connected as
close as possible to the output pin of the regulator. The
recommended capacitor value is 1 mF and X7R or X5R
dielectric due to its low capacitance variations over the
specified temperature range. The NCP114 is designed to
remain stable with minimum effective capacitance of
0.22mF to account for changes with temperature, DC bias
and package size. Especially for small package size
capacitors such as 0402 the effective capacitance drops
rapidly with the applied DC bias.
There is no requirement for the minimum value of
Equivalent Series Resistance (ESR) for the COUT but the
maximum value of ESR should be less than 2 W. Larger
output capacitors and lower ESR could improve the load
transient response or high frequency PSRR. It is not
recommended to use tantalum capacitors on the output due
to their large ESR. The equivalent series resistance of
tantalum capacitors is also strongly dependent on the
temperature, increasing at low temperature.
Power Dissipation
As power dissipated in the NCP114 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part.
The maximum power dissipation the NCP114 can handle
is given by:
Enable Operation
P D(MAX) +
The NCP114 uses the EN pin to enable/disable its device
and to deactivate/activate the active discharge function.
If the EN pin voltage is VIN.
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
PCB Layout Recommendations
To obtain good transient performance and good regulation
characteristics place CIN and COUT capacitors close to the
device pins and make the PCB traces wide. In order to
minimize the solution size, use 0402 capacitors. Larger
copper area connected to the pins will also improve the
device thermal resistance. The actual power dissipation can
be calculated from the equation above (Equation 2). Expose
pad should be tied the shortest path to the GND pin.
Power Supply Rejection Ratio
The NCP114 features very good Power Supply Rejection
ratio. If desired the PSRR at higher frequencies in the range
100 kHz − 10 MHz can be tuned by the selection of COUT
capacitor and proper PCB layout.
Turn−On Time
The turn−on time is defined as the time period from EN
assertion to the point in which VOUT will reach 98% of its
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14
NCP114
ORDERING INFORMATION
Voltage
Option
Marking
Marking
Rotation
NCP114AMX075TCG
0.75 V
AW
0°
NCP114AMX080TCG
0.80 V
AT
0°
NCP114AMX090TAG
0.9 V
AP
0°
NCP114AMX090TCG
0.9 V
AP
0°
NCP114AMX092TAG
0.92 V
A2
0°
Device
NCP114AMX100TCG
1.0 V
6
180°
NCP114AMX105TCG
1.05 V
R
0°
NCP114AMX110TBG
1.1 V
F
180°
NCP114AMX110TCG
1.1 V
F
180°
NCP114AMX115TCG
1.15 V
AM
0°
NCP114AMX120TBG
1.2 V
T
0°
NCP114AMX120TCG
1.2 V
T
0°
NCP114AMX125TCG
1.25 V
A
180°
NCP114AMX130TCG
1.3 V
AA
0°
NCP114AMX135TCG
1.35 V
AN
0°
NCP114AMX150TCG
1.5 V
V
0°
NCP114AMX160TCG
1.6 V
2
180°
NCP114AMX180TBG
1.8 V
J
180°
NCP114AMX180TCG
1.8 V
J
180°
NCP114AMX185TCG
1.85 V
Y
0°
NCP114AMX210TCG
2.1 V
L
180°
NCP114AMX220TCG
2.2 V
Q
180°
NCP114AMX240TCG
2.4 V
AH
0°
NCP114AMX250TBG
2.5 V
AF
0°
NCP114AMX250TCG
2.5 V
AF
0°
NCP114AMX260TCG
2.6 V
T
180°
NCP114AMX270TCG
2.7 V
AJ
0°
NCP114AMX280TBG
2.8 V
2
0°
NCP114AMX280TCG
2.8 V
2
0°
NCP114AMX285TCG
2.85 V
3
0°
NCP114AMX290TCG
2.9 V
AZ
0°
NCP114AMX300TCG
3.0 V
4
0°
NCP114AMX310TBG
3.1 V
5
0°
NCP114AMX310TCG
3.1 V
5
0°
NCP114AMX320TCG
3.2 V
AG
0°
NCP114AMX330TBG
3.3 V
6
0°
NCP114AMX330TCG
3.3 V
6
0°
NCP114AMX345TCG
3.45 V
AC
0°
NCP114AMX350TCG
3.5 V
4
180°
NCP114AMX360TCG
3.6 V
AU
0°
Option
Package
Shipping†
With active output
discharge function
UDFN4
(Pb-Free)
3000 / Tape & Reel
www.onsemi.com
15
NCP114
ORDERING INFORMATION
Voltage
Option
Marking
Marking
Rotation
NCP114BMX075TCG
0.75 V
CW
0°
NCP114BMX100TCG
1.0 V
6
270°
NCP114BMX120TCG
1.2 V
T
90°
NCP114BMX150TCG
1.5 V
V
90°
NCP114BMX180TCG
1.8 V
J
270°
NCP114BMX250TCG
2.5 V
CF
0°
NCP114BMX280TCG
2.8 V
2
90°
NCP114BMX300TCG
3.0 V
4
90°
NCP114BMX330TCG
3.3 V
6
90°
Device
Option
Package
Shipping†
Without active output
discharge function
UDFN4
(Pb-Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
ORDERING INFORMATION
Device
Voltage Option
Marking
NCP114ASN080T1G
0.8 V
CAY
NCP114ASN120T1G
1.2 V
CAC
1.5 V
CAX
1.8 V
CAD
2.5 V
CAG
Option
Package
Shipping†
TSOP−5
(Pb−Free)
3000 / Tape & Reel
NCP114ASN120T2G
NCP114ASN150T1G
NCP114ASN150T2G
NCP114ASN180T1G
NCP114ASN180T2G
NCP114ASN250T1G
With output active
discharge function
NCP114ASN250T2G
NCP114ASN260T1G
2.6 V
CAQ
NCP114ASN270T1G
2.7 V
CAV
NCP114ASN280T1G
2.8 V
CAH
NCP114ASN290T1G
2.9 V
CAU
NCP114ASN300T1G
3.0 V
CAK
NCP114ASN330T1G
3.3 V
CAL
3.3 V
CDL
NCP114ASN280T2G
NCP114ASN330T2G
NCP114BSN330T1G
Without output
active discharge
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
16
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSOP−5
CASE 483
ISSUE N
5
1
SCALE 2:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
D 5X
NOTE 5
2X
DATE 12 AUG 2020
0.20 C A B
0.10 T
M
2X
0.20 T
5
B
1
4
2
B
S
3
K
DETAIL Z
G
A
A
TOP VIEW
DIM
A
B
C
D
G
H
J
K
M
S
DETAIL Z
J
C
0.05
H
C
SIDE VIEW
SEATING
PLANE
END VIEW
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
0.95
0.037
MILLIMETERS
MIN
MAX
2.85
3.15
1.35
1.65
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
1.9
0.074
5
5
XXXAYWG
G
1
1
Analog
2.4
0.094
XXX = Specific Device Code
A
= Assembly Location
Y
= Year
W = Work Week
G
= Pb−Free Package
1.0
0.039
XXX MG
G
Discrete/Logic
XXX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98ARB18753C
TSOP−5
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN4 1.0x1.0, 0.65P
CASE 517CU
ISSUE A
1
SCALE 4:1
A
B
D
PIN ONE
REFERENCE
2X
0.05 C
0.05 C
2X
ÉÉ
ÉÉ
3X C0.18
X 45 5
C0.27 x 0.25
E
L2
A
0.10 C
DIM
A
A1
A3
b
D
D2
E
e
L
L2
(A3)
A1
0.05 C
C
SIDE VIEW
e
DETAIL A
3X
2
SEATING
PLANE
MILLIMETERS
MIN
MAX
−−−
0.60
0.00
0.05
0.15 REF
0.20
0.30
1.00 BSC
0.38
0.58
1.00 BSC
0.65 BSC
0.20
0.30
0.27
0.37
GENERIC
MARKING DIAGRAM*
e/2
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.03 AND 0.07
FROM THE TERMINAL TIPS.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DETAIL A
TOP VIEW
NOTE 4
DATE 18 DEC 2014
L
XX M
1
D2
D2
45 5
4
XX = Specific Device Code
M = Date Code
3
4X
BOTTOM VIEW
b
0.10
M
C A B
0.05
M
C
*This information is generic. Please refer
to device data sheet for actual part
marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
NOTE 3
RECOMMENDED
MOUNTING FOOTPRINT*
2X
0.65
PITCH
0.58
DETAIL B
3X
0.43
PACKAGE
OUTLINE
4X
0.23
1.30
0.53
1
4X
0.30
3X 0.10
DETAIL B
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON76666F
UDFN4, 1.0X1.0, 0.65P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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