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NCP1201P60

NCP1201P60

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    DIP8

  • 描述:

    IC CTRLR PWM CM OTP 8DIP

  • 数据手册
  • 价格&库存
NCP1201P60 数据手册
ON Semiconductor Is Now To learn more about onsemi™, please visit our website at www.onsemi.com onsemi and       and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. NCP1201 PWM Current-- Mode Controller for Universal Off-- Line Supplies Featuring Low Standby Power with Fault Protection Modes Housed in SOIC--8 or PDIP--8 package, the NCP1201 enhances the previous NCP1200 series by offering a reduced optocoupler current with additional Brownout Detection Protection (BOK). Similarly, the circuit allows the implementation of complete off--line AC--DC adapters, battery chargers or Switchmode Power Supplies (SMPS) where standby power is a key parameter. The NCP1201 features efficient protection circuitry. When in the presence of a fault (e.g. failed optocoupler, overcurrent condition, etc.) the control permanently disables the output pulses to avoid subsequent damage to the system. The IC only restarts when the user cycles the mains power supply. With the low power internal structure, operating at a fixed 60 or 100 kHz, the controller supplies itself from the high--voltage rail, avoiding the need of an auxiliary winding. This feature naturally eases the designer’s task in battery charger applications. Finally, current--mode control provides an excellent audio--susceptibility and inherent pulse--by--pulse control. When the load current falls down to a pre--defined setpoint (VSKIP) value, e.g. the output power demand diminishes, the IC automatically enters the skip cycle mode and can provide excellent efficiency under light load conditions. The skip mode is designed to operate at relatively lower peak current so that acoustic noise that commonly takes place will not happen with NCP1201. Features              AC Line Brownout Detect Protection, BOK Function Latchoff Mode Fault Protection No Auxiliary Winding Operation Internal Output Short--Circuit Protection Extremely Low No--Load Standby Power Current--Mode with Skip--Cycle Capability Internal Overtemperature Shutdown Internal Leading Edge Blanking 250 mA Gate Peak Current Driving Capability Internally Fixed Switching Frequency at 60 or 100 kHz Built--in Frequency Jittering for EMI Reduction Direct Optocoupler Connection These Devices are Pb--Free, Halogen Free/BFR Free and are RoHS Compliant http://onsemi.com MARKING DIAGRAMS 8 SOIC--8 D SUFFIX CASE 751 8 1 201Dx ALYW G 1 8 1201Py0 AWL YYWWG PDIP--8 P SUFFIX CASE 626 8 1 1 x y y xx A L Y, YY W, WW G or G = Device Code: 6 for 60 kHz 1 for 100 kHz = Device Code: 6 for 60 kHz 10 for 100 kHz = Assembly Location = Wafer Lot = Year = Work Week = Pb--Free Package PIN CONNECTIONS BOK 1 8 HV FB 2 7 NC CS 3 6 VCC GND 4 5 DRV (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 17 of this data sheet. Typical Applications  AC--DC Adapters  Offline Battery Chargers  Auxiliary Power Supplies (USB, Appliances, TVs, etc.)  Semiconductor Components Industries, LLC, 2010 December, 2010 -- Rev. 6 1 Publication Order Number: NCP1201/D NCP1201 C3 R3 470 p 100 k 250 V 1.0 W L1 DF06S U1 1 3 D1 8 C1 4.7 m 400 V C2 4.7 m 400 V + L3 1N5819 47 mH 1.0 A + C5 10 m 6 3 + D2 1N4937 2 4 5 NCP1201 Q1 MTD1N60E C7 1.0 n 250 VAC Y1 + C4 10 mF 4 R2 4.3 k R4 2.7 0.5 W L2 470 mH 0.2 A * Please refer to the application information section. Figure 1. Typical Application Example http://onsemi.com 2 SFH6156--2 1 2 3 90~264 Vac 4 BR1 6.5 V, 600 mA * R1 195.7 k 2 + -- 1 470 mH 0.2 A T1 U2 D3 5V1 + C6 10 m NCP1201 Iref BOK 1 8 + + -50 mA 10.5 V/12.5 V Oscillator 60 or 100 kHz Clock + CS 3 1.92 V -- Output -80 K 1.07 V Skip Cycle Comparator + Set Output Reset Reset 24 K GND 4 20 k + -- 57 k 25 k Vref NC 6 Q VCC TSD + -- 7 -- Maximum 83% Duty Cycle -- 250 ns L.E.B. HV Current Source Enable + -- -- Reset FB 2 + + Output HV Startup Blanking Output 0.9 V Overload Figure 2. Simplified Functional Block Diagram http://onsemi.com 3 5 250 mA Internal Regulator Vref DRV NCP1201 PIN FUNCTION DESCRIPTION Pin No. Pin Name Function Description 1 BOK Bulk OK This pin detects the input line voltage by sensing the bulk capacitor, and disables the PWM when line voltage is lower than normal. 2 FB Sets the Peak Current Setpoint By connecting an optocoupler to this pin, the peak current setpoint is adjusted according to the output power demand. Internal monitoring of this pin level triggers the fault management circuitry. 3 CS Current Sense Input This pin senses the primary inductor current and routes it to the internal comparator via an LEB circuit. 4 GND The IC Ground -- 5 DRV Driving Pulses The driver’s output to an external MOSFET. 6 VCC Supplies the IC This pin is connected to an external bulk capacitor of typically 10 mF. 7 NC No Connection This unconnected pin ensures adequate creepage distance between High Voltage pin to other pins. 8 HV Generates the VCC from the Line Connected to the high--voltage rail, this pin injects a constant current into the VCC capacitor. MAXIMUM RATINGS (TJ = 25C unless otherwise noted) Rating Symbol Value Unit Power Supply Voltage, Pin 6 VCC --0.3, 16 V Input/Output Pins Pins 1, 2, 3, 5 VIO --0.3, 6.5 V Maximum Voltage on Pin 8 (HV) VHV 500 V Thermal Resistance, Junction--to--Air, PDIP--8 Version Thermal Resistance, Junction--to--Air, SOIC Version RθJA RθJA 100 178 C/W C/W Operating Junction Temperature Range TJ --40 to +150 C Operating Ambient Temperature Range TA --25 to +125 C Storage Temperature Range Tstg --55 to +150 C ESD Capability, HBM (All pins except VCC and HV pins) (Note 1) -- 2.0 kV ESD Capability, Machine Model (All pins except VCC and HV pins) (Note 1) -- 200 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model (HBM) > 2.0 kV per JEDEC standard: JESD22--A114. Machine Model (MM) > 200 V per JEDEC standard: JESD22--A115. 2. Latchup Current Maximum Rating: 150 mA per JEDEC standard: JESD78. http://onsemi.com 4 NCP1201 ELECTRICAL CHARACTERISTICS (For typical values TJ = 25C, for min/max values TJ = --25C to +125C, VCC = 11 V unless otherwise noted) Symbol Min Typ Max Unit VCC Increasing Level at which the Current Source Turns--Off VCCOFF 11.5 12.5 13.5 V VCC Decreasing Level at which the Current Source Turns--On VCCON 9.6 10.5 11.3 V Internal IC Current Consumption, No Output Load on Pin 5 ICC1 440 905 1300 mA Internal IC Current Consumption, 1.0 nF Output Load on Pin 5 NCP1201P60, NCP1201D60 NCP1201P100, NCP1201D100 ICC2 0.75 1.6 1.6 2.1 2.2 2.8 Internal IC Current Consumption, Latchoff Phase ICC3 405 575 772 mA High--Voltage Current Source at VCCON – 0.2 V IC1 3.6 5.3 7.1 mA High--Voltage Current Source at VCC = 0 V IC2 7.5 11.1 15 mA ILEAK -- 30 70 mA Output Voltage Rise--Time (CL = 1.0 nF, 10 V Output) Tr -- 116 -- ns Output Voltage Fall--Time (CL = 1.0 nF, 10 V Output) Tf -- 41 -- ns Characteristic DYNAMIC SELF--SUPPLY mA INTERNAL STARTUP CURRENT SOURCE HV Pin Leakage Current @ 450 V, VCC Pin Connected to Ground OUTPUT SECTION Source Resistance (VDRV = ) ROH 26 38 60 Ω Sink Resistance (VDRV = ) ROL 4.0 10 22 Ω CURRENT SENSE SECTION (Pin 5 Unloaded) Input Bias Current @ 1.0 V Input Level on Pin 3 IIB--CS -- 10 100 nA Maximum Current Sense Input Threshold VILIMIT 0.8 0.9 1.0 V Default Current Sense Threshold for Skip Cycle Operation VILSKIP 250 325 390 mV Propagation Delay from Current Detection to Gate OFF State TDEL 35 65 160 ns Leading Edge Blanking Duration TLEB 150 260 400 ns 52 92 60 100 72 117 --- 493 822 --- 74 83 87 % OSCILLATOR SECTION (VCC = 11 V, Pin 5 Loaded by 1.0 kΩ) Oscillation Frequency NCP1201P60, NCP1201D60 NCP1201P100, NCP1201D100 FOSC Built--in Frequency Jittering (as a function of Vcc voltage) NCP1201P60, NCP1201D60 NCP1201P100, NCP1201D100 Fjitter Maximum Duty Cycle Dmax kHz Hz/V FEEDBACK SECTION (VCC = 11 V, Pin 5 Unloaded) Internal Pullup Resistor RUP 10 17 24 kΩ Feedback Pin to Pin 3 Current Setpoint Division Ratio Iratio 2.9 3.3 4.0 -- BROWNOUT DETECT SECTION BOK Input Threshold Voltage BOK Input Bias Current (VBOK < Vth) Source Bias Current (Turn on After VBOK > Vth) Vth 1.75 1.92 2.05 V IIB--BOK -- 11 100 nA ISC 40 50 58 mA VSKIP 0.96 1.07 1.18 V TSD -- 145 -- C THYST -- 25 -- C FREQUENCY SKIP CYCLE SECTION Built--in Frequency Skip Cycle Comparator Voltage Threshold THERMAL SHUTDOWN Thermal Shutdown Trip Point, Temperature Rising (Note 3) Thermal Shutdown Hysteresis 3. Verified by design. http://onsemi.com 5 NCP1201 VCCON, VCC ON THRESHOLD VOLTAGE (V) VCCOFF, VCC OFF THRESHOLD VOLTAGE (V) TYPICAL CHARACTERISTICS 12.9 12.7 12.5 12.3 12.1 11.9 11.7 --25 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) 125 10.8 10.6 10.4 10.2 10 9.8 --25 Figure 3. VCC OFF Threshold Voltage vs. Junction Temperature ICC2, CURRENT CONSUMPTION (mA) ICC1, CURRENT CONSUMPTION WITH NO LOAD (mA) 1000 900 800 700 --25 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) 125 1 nF Load 2.4 2.2 100 KHz 2.0 1.8 60 KHz 1.6 1.4 --25 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) 125 Figure 6. IC Current Consumption, ICC2 vs. Junction Temperature 700 8.0 IC1, HV PIN STARTUP CURRENT SOURCE (mA) ICC3, IC CURRENT CONSUMPTION AT LATCHOFF PHASE (mA) 125 2.6 Figure 5. IC Current Consumption, ICC1 vs. Junction Temperature 600 500 400 300 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) Figure 4. VCC ON Threshold Voltage vs. Junction Temperature 1100 600 0 --25 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) 125 Figure 7. IC Current Consumption at Latchoff Phase vs. Junction Temperature VCC = 11 V 6.5 5.0 3.5 2.0 0.5 --25 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) Figure 8. HV Pin Startup Current Source vs. Junction Temperature http://onsemi.com 6 125 NCP1201 TYPICAL CHARACTERISTICS 80 ILEAK, LEAKAGE CURRENT (mA) IC2, HV PIN STARTUP CURRENT SOURCE (mA) 14 12 10 8 6 VCC = 0 V 4 --25 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) 60 40 20 0 125 --25 Figure 9. HV Pin Startup Current Source vs. Junction Temperature ROL, SINK RESISTANCE (Ω) ROH, SOURCE RESISTANCE (Ω) 50 40 30 20 10 --25 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) 16 12 8 4 0 125 --25 12 11 10 9 8 7 --25 0 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) 125 Figure 12. Output Sink Resistance vs. Junction Temperature VILIMIT, MAXIMUM CURRENT SENSE THRESHOLD (V) Figure 11. Output Source Resistance vs. Junction Temperature IIB--CS, CS PIN INPUT BIAS CURRENT (nA) 125 20 60 6 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) Figure 10. Leakage Current vs. Junction Temperature 70 0 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) 125 Figure 13. CS Pin Input Bias Current @ 1.0 V vs. Junction Temperature 1.00 0.96 0.92 0.88 0.84 0.80 --25 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) Figure 14. Maximum Current Sense Threshold vs. Junction Temperature http://onsemi.com 7 0 125 NCP1201 340 100 TDEL, PROPAGATION DELAY (nS) VILSKIP, DEFAULT CURRENT SENSE THRESHOLD FOR SKIP CYCLE (mV) TYPICAL CHARACTERISTICS 330 320 310 300 290 --25 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) 55 40 25 --25 125 FOSC, OSCILLATOR FREQUENCY (kHz) 100 KHz 100 300 250 200 150 100 50 --25 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) 125 80 60 KHz 60 40 20 0 --25 Figure 17. Leading Edge Blanking Duration vs. Junction Temperature 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) 125 Figure 18. Oscillator Frequency vs. Junction Temperature 1400 85 Dmax, MAXIMUM DUTY CYCLE (%) Fjitter, FREQUENCY JITTER (Hz/V) 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) 120 350 1200 1000 100 KHz 800 600 60 KHz 400 200 0 0 Figure 16. Propagation Delay from Current Detection to Gate Driver vs. Junction Temperature 400 TLEB, LEADING EDGE BLANKING DURATION (nS) 70 10 125 Figure 15. Default Current Setpoint for Skip Cycle vs. Junction Temperature 0 85 --25 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) 125 84 83 82 81 80 79 --25 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) Figure 20. Maximum Duty Cycle vs. Junction Temperature Figure 19. Frequency Jittering vs. Junction Temperature http://onsemi.com 8 125 NCP1201 3.40 Iratio, FEEDBACK PIN TO PIN 3 CURRENT RATIO RUP, INTERNAL PULLUP RESISTOR (kΩ) TYPICAL CHARACTERISTICS 19 18 17 16 15 14 13 --25 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) 3.20 3.15 3.10 3.05 IIB--BOK, BOK INPUT BIAS CURRENT (nA) Vth, BOK INPUT THRESHOLD VOLTAGE (V) 3.25 --25 125 1.95 1.90 1.85 1.80 1.75 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) 125 12 11 10 9 8 7 VBOK < Vth 6 --25 Figure 23. BOK Threshold Voltage vs. Junction Temperature 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) 125 Figure 24. BOK Input Bias Current vs. Junction Temperature 1.15 VSKIP, SKIP CYCLE COMPARATOR THRESHOLD VOLTAGE (V) 51 ISC, BOK BIAS CURRENT (mA) 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) Figure 22. Feedback Pin to Pin 3 Current Setpoint Ratio vs. Junction Temperature 2.00 --25 3.30 3.00 125 Figure 21. FB Pin Pullup Resistor vs. Junction Temperature 1.70 3.35 50 1.10 49 1.05 48 47 1.00 46 45 VBOK < Vth --25 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) 0.95 125 Figure 25. BOK Source Bias Current vs. Junction Temperature --25 0 25 50 75 100 TJ, JUNCTION TEMPERATURE (C) Figure 26. Skip Mode Threshold Voltage vs. Junction Temperature http://onsemi.com 9 125 NCP1201 DETAILED OPERATING DESCRIPTION Introduction The NCP1201 implements a standard current mode architecture where the switch--off time is dictated by the peak current setpoint. This component represents the ideal candidate where low part--count is the key criteria, particularly in low--cost AC--DC adapters, auxiliary supplies etc. Due to its high--performance High--Voltage technology, the NCP1201 incorporates all the necessary components normally needed in UC384X based supplies: timing components, feedback devices, low--pass filter and self--supply. This later point emphasizes the fact that ON Semiconductor’s NCP1201 does NOT need an auxiliary winding to operate: the device is self supplied from the high--voltage rail and delivers a VCC to the IC. This system is named the Dynamic Self--Supply (DSS). Vripple = 2 V Dynamic Self--Supply The DSS principle is based on the charge/discharge of the VCC bulk capacitor from a low level up to a higher level. We can easily describe the current source operation following simple logic equations: POWER--ON: IF VCC < VCCOFF THEN Current Source is ON, no output pulses IF VCC decreasing > VCCON THEN Current Source is OFF, output is pulsing IF VCC increasing < VCCOFF THEN Current Source is ON, output is pulsing Typical values are: VCCOFF = 12.5 V, VCCON = 10.5 V To better understand the operation principle, Figure 27 sketch offers the necessary explanation, VCCOFF = 12.5 V VCC VCCON = 10.5 V ON OFF Current Source Output Pulses 10 mS 30 mS 50 mS 70 mS 90 mS Figure 27. The Charge/Discharge Cycle Over a 10 mF VCC Capacitor The DSS behavior actually depends on the internal IC consumption and the MOSFET’s gate charge Qg. If we select a MOSFET like the MTP2N60E, Qg max equals 22 nC. With a maximum switching frequency of 70 kHz for the oscillator 60 kHz, the average power necessary to drive the MOSFET (excluding the driver efficiency and neglecting various voltage drops) is: Pdriver = Fsw(max) × Qg × VCC The total standby power consumption at no--load will therefore heavily rely on the internal IC current consumption plus the driving current (altered by the driver’s efficiency). Suppose that the IC is supplied from a 350 VDC line. The current flowing through pin 8 is a direct image of the NCP1201 current consumption (neglecting the switching losses of the HV current source). If ICC2 equals 2.1 mA @ TA = 25C, then the power dissipated (lost) by the IC is simply: 350 V x 2.1 mA = 735 mW. For design and reliability reasons, it would be interesting to reduce this source of wasted power. In order to achieve that, different methods can be used. 1. Use a MOSFET with lower gate charge Qg; 2. Connect pin through a diode (1N4007 typically) to one of the mains input. The average value on pin 8 becomes: (eq. 1) Where, Pdriver = Average Power to drive the MOSFET Fsw(max) = Maximum switching frequency Qg = MOSFET’s gate charge VCC = VGS level applied to the gate of the MOSFET To obtain an estimation of the driving current, simply divide Pdriver by VCC, VmainsPEAK × 2 π Idriver = Fsw(max) × Qg = 1.54 mA (eq. 2) http://onsemi.com 10 (eq. 3) NCP1201 Skipping Cycle Mode The NCP1201 automatically skips switching cycles when the output power demand drops below a preset level. This is accomplished by monitoring the FB pin. In normal operation, FB pin imposes a peak current according to the load value. If the load demand decreases, the internal loop asks for less peak current. When this set--point reaches the skip mode threshold level, 1.07 V, the IC prevents the current from decreasing further down and starts to blank the output pulses, i.e. the controller enters the so--called Skip Cycle Mode, also named Controlled Burst Operation. The power transfer now depends upon the width of the pulse bunches, Figure 29. Suppose we have the following component values: Lp, primary inductance = 1.0 mH Fsw, switching frequency = 60 kHz Ip (skip) = 200 mA (or 333 mV/Rsense) The theoretical power transfer is therefore: Our power contribution example drops to 223 V x 2.1 m = 468.3 mW. If a resistor is installed between the mains and the diode, you further force the dissipation to migrate from the package to the resistor. The resistor value should be carefully selected to account for low--line startup. HV Mains Cbulk 1 8 2 7 3 6 4 5 Figure 28. A Simple Diode Naturally Reduces the Average Voltage on Pin 8 1×L ×I 2×F p p sw = 1.2 W 2 3. Permanently force the VCC level above VCCOFF with an auxiliary winding. It will automatically disconnect the internal startup source and the IC will be fully self--supplied from this winding. Again, the total power drawn from the mains will significantly decrease. By using this approach, user need to make sure the auxiliary voltage never exceeds the 16 V limit for all line conditions. (eq. 4) If the controller enters Skip Cycle Mode with a pulse packet length of 20 ms over a recurrent period of 100 ms, then the total power transfer reduced to 1.2 W x 0.2 = 240 mW. To better understand how this Skip Cycle Mode takes place, a look at the operation mode versus the FB pin voltage level shown below, immediately gives the necessary insight. FB 4.2 V, FB Pin Open 2.97 V, Upper Dynamic Range Normal Current Mode Operation Skip Cycle Operation Ip(min) = 333 mV / Rsense 1.07 V Figure 29. Feedback Pin Voltage and Modes of Operation When FB pin voltage level is above the skip cycle threshold (1.07 V by default), the peak current cannot exceed 0.9 V/Rsense. When the IC enters the skip cycle mode, the peak current cannot go below VSKIP/3.3. By using the peak current limit reduction scheme, the skip cycle takes place at a lower peak current, which guarantees noise free operation. http://onsemi.com 11 NCP1201 P1 = 0.4 W P2 = 1.8 W P3 = 3.6 W Figure 30. MOSFET VDS at Various Power Levels, P1
NCP1201P60 价格&库存

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