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NCP12700BDNR2G

NCP12700BDNR2G

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    MSOP10

  • 描述:

    NCP12700BDNR2G

  • 数据手册
  • 价格&库存
NCP12700BDNR2G 数据手册
PWM Controller, Input Current Mode, Ultra Wide NCP12700 The NCP12700 is a fixed frequency, peak current mode, PWM controller containing all of the features necessary for implementing single−ended power converter topologies. The device features a high voltage startup capable of operating over a wide input range and supplying at least 15 mA to provide temporary bias to VCC during system startup. The device contains a programmable oscillator capable of operating from 100 kHz to 1 MHz and integrates slope compensation to prevent subharmonic oscillations. The controller offers an adjustable soft−start, input voltage UVLO protection, and an adjustable Over−Power Protection circuit which limits the total power capability of the circuit as the input voltage increases, easing the system thermal design. The UVLO pin also features a shutdown comparator which allows for an external signal to disable switching and bring the controller into a low quiescent state. The NCP12700 contains a suite of protection features including cycle−by−cycle peak current limiting, timer−based overload protection, and a FLT pin which can be interfaced with an NTC and an auxiliary winding to provide system thermal protection and output over−voltage protection. All protection features place the device into a low quiescent fault mode and recovery from fault mode is dependent on the device option. www.onsemi.com 1 WQFN10 MT SUFFIX CASE 511DV MARKING DIAGRAMS 12700x ALYWG G 10 700x ALYW Common General Features • • • • • • • • • • • Wide Input Range (9 – 120/200 V; MSOP10/WQFN10) Startup Regulator Circuit with 15 mA Capability Current Mode Control with Integrated Slope Compensation Suitable for Flyback or Forward Converters Single Resistor Programmable Oscillator 1 A / 2.8 A Source / Sink Gate Driver User Adjustable Soft−Start Ramp Input Voltage UVLO with Hysteresis Shutdown Threshold for External Disable Skip Cycle Mode for Low Standby Power This is a Pb−Free Device Fault Protection Features 12700 or 700 = Specific Device Code x = A, B or C A = Assembly Site L = Wafer Lot Number YW = Assembly Start Week G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. • Single−ended Power Converters including CCM/DCM • • • • Protection • Output OVP Fault Interface • Fault Auto−recovery Mode with 1 s Auto−recovery Period November, 2020 − Rev. 3 1 Typical Applications • User Adjustable Over−Power Protection • Overload Protection with 30 ms Overload Timer • NTC−Compatible Fault Interface for Thermal © Semiconductor Components Industries, LLC, 2018 MSOP DN SUFFIX CASE 846AE 1 Flyback and Forward Converters Telecommunications Power Converters Industrial Power Converter Modules Transportation & Railway Power Modules Power over Ethernet Powered Devices (PoE PD) Publication Order Number: NCP12700/D NCP12700 VOUT VIN UVLO VIN FLT VCC SS DRV RT GND COMP CS FEEDBACK WITH ISOLATION Figure 1. Typical Application Circuit for Vin = 12 − 160 V VIN VOUT UVLO VIN FLT VCC SS DRV RT GND COMP CS FEEDBACK WITH ISOLATION Figure 2. Typical Application Circuit for Vin = 9 − 18 V www.onsemi.com 2 NCP12700 V CC HV Startup VIN 9 10 VCC LOGIC VCCON VCC(OVP) VCC(UVLO) VDD VDRV Regulation Over−Power Protection UVLO ICS(OPP) SHDN UVLO Detection 1 C CC INTERNAL REGULATOR VCCON ENABLE FAULT 7 GND 3 SS START MAIN LOGIC STOP VDD ISS ENABLE IUVLO(HYS) START SS_END TSD TSD VSS SS CONTROL START D MAX RT VDD I FLT OSC 4 CLK FAULT TSD SS_END SHDN OVLD VDD FAULT Logic 2 FLT 8 DRV VCC(OVP) VCC(UVLO) ICS(OPP) DMAX CS LEB Block 6 VDD STOP OVLD Slope Comp DRV VDRV 5k COMP PWM LOGIC 1/6 5 CLK S Q R VCOMP(skip) VCOMP(skip_hys) V SS 1/6 Figure 3. Block Diagram www.onsemi.com 3 UVLO FLT SS RT COMP VIN PINOUTS VIN VCC DRV GND CS DRV GND CS EP SS RT COMP UVLO FLT VCC NCP12700 (Top Views) Table 1. PIN FUNCTION DESCRIPTION MSOP10 WQFN10 Pin Name Pin Description 1 9 UVLO The UVLO pin is the input to the Standby and UVLO comparators. A resistor divider between the power supply input voltage and ground is connected to the UVLO pin to set the input voltage level at which the controller will be enabled. UVLO Hysteresis is set by a 5 mA pull−down current source. An externally supplied pull−down signal can also be used to disable the controller. The UVLO pin is also used to determine the Over−Power Protection current supplied to the CS pin. 2 10 FLT The FLT pin is the input to a window comparator which provides an upper and lower fault threshold. When either threshold is tripped, the controller enters the fault mode which can be a permanent latch off or a minimum 1 s auto−recovery period. A precision current source is output from the FLT pin allowing an NTC to ground to be placed at the pin for system Over−temperature protection. The upper threshold can be used for output over−voltage protection sensed through the auxiliary winding or as a general purpose fault. 3 1 SS The SS pin sets the soft−start ramp of the peak current limit when the controller is enabled. An internal 15 mA current source and an external capacitor to ground are used to control the ramp rate. Typical soft start capacitor values will be in the range of 10 nF to 100 nF. 4 2 RT The RT pin sets the oscillator frequency in the controller. This pin requires a resistor to ground located close to the IC. Typical RT values are in the range of 10 kW – 100 kW. 5 3 COMP 6 4 CS 7 5 GND This pin is the controller ground. For the WQFN package the exposed pad (EP) should be connected to GND. 8 6 DRV The DRV pin is a high current output used to drive the external MOSFET gate. DRV has source and sink capability of 1 A and 2.8 A, respectively. 9 7 VCC The VCC pin provides bias to the controller. An external decoupling capacitor to ground in the range of 1 – 10 mF is recommended. 10 8 VIN The VIN pin is the input to the high voltage startup regulator. The regulator is capable of sourcing > 15 mA to temporarily bias VCC while the application is starting up. The COMP pin provides the compensated error voltage for the PWM and Skip comparators. An internal 5 kW pull−up resistor is connected to the COMP pin and can be used to bias the transistor of an opto−coupler. The CS pin is the current sense input for the PWM and Current Limit comparators. The comparator input is held low for 60 ns after the DRV goes high to prevent leading edge current spikes from tripping the comparators. An external low pass filter is recommended for improved noise immunity. The external filter resistor is also used to determine the amount of Over−Power Protection applied to the current sense. ORDERING INFORMATION Package VCS(LIM) OTP Fault OVP Fault Shipping† NCP12700ADNR2G MSOP10 495 mV Latch Latch 4000 / Tape & Reel NCP12700BDNR2G MSOP10 495 mV Autorecovery Autorecovery 4000 / Tape & Reel NCP12700CDNR2G (In Development) MSOP10 250 mV Autorecovery Autorecovery 4000 / Tape & Reel NCP12700BMTTXG WQFN10 495 mV Autorecovery Autorecovery 3000 / Tape & Reel NCP12700CMTTXG (In Development) WQFN10 250 mV Autorecovery Autorecovery 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. www.onsemi.com 4 NCP12700 Table 2. MAXIMUM RATINGS Rating Symbol Value Unit VIN(MAX) 120 200 V IIN(MAX) 50 mA Supply Voltage VCC(MAX) −0.3 to 30 V Supply Current ICC(MAX) 50 mA DRV Voltage (Note 1) VDRV(MAX) −0.3 V to VDRV(high) V DRV Current (Peak) IDRV(MAX) 3.25 A FLT Voltage VFLT(MAX) VCC + 1.25 V FLT Current IFLT(MAX) 10 mA Max Voltage on Signal Pins VSIG(MAX) −0.3 to 5.5 V Max Current on Signal Pins ISIG(MAX) 10 mA High Voltage Startup Voltage (MSOP10) (WQFN10) High Voltage Startup Current Thermal Resistance Junction−to−Air (Note 2) (MSOP10) (WQFN10) RθJ−A 165 51 °C/W Junction−to−Top Thermal Characterization Parameter (MSOP10) (WQFN10) YJ−C 10 12 °C/W TJMAX 150 °C PD Internally Limited W TSTG −55 to 150 °C TJ −40 to 125 °C Maximum Junction Temperature Maximum Power Dissipation (MSOP10) (WQFN10) Storage Temperature Range Operating Temperature Range ESD Capability (Note 3) Human Body Model per JEDEC Standard JESD22−A114E Charge Device Model per JEDEC Standard JESD22−C101E V 2000 1000 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Maximum driver voltage is limited by the driver clamp voltage, VDRV(high), when VCC exceeds the driver clamp voltage. Otherwise, the maximum driver voltage is VCC. 2. Per JEDEC specification JESD51.7 using two 1 oz copper planes with board size = 80x80x1.6 mm 3. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per JEDEC Standard JESD22−A114E Charge Device Model TBD per JEDEC Standard JESD22−C101E 4. This device contains latch−up protection and has been tested per JEDEC JESD78D, Class I and exceeds +/−100 mA (TBD). Table 3. RECOMMENDED OPERATING CONDITIONS Rating VIN Voltage (MSOP10) (WQFN10) Supply Voltage − All Operating Temperature Range Symbol Value Unit VIN 9 – 100 12 – 160 V VCC 9 – 20 V V TJ −40 to 125 °C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 5 NCP12700 Table 4. ELECTRICAL CHARACTERISTICS (VIN = 12 V, VCC = 12 V, VCOMP = Open, VFLT = Open, CDRV = 1 nF, RT = 49.9k, VCS = 0 V, VSS = Open, VUVLO = 1.2, for typical values TJ = 25°C, for min/max values, TJ is – 40°C to 125°C, unless otherwise noted) Characteristics Test Condition Symbol Min Typ Max Unit VCC = Open, ICC = 5 mA VCC(REG) 7.6 8 8.4 V VIN = 9 V, VCC = 7 V IVIN(SRC) 15 VCC = VCC(off) + 100 mV IVIN(LIM) Off−State Leakage Current (xMTTXG) VCC = Open, VIN = 160 V, VUVLO = 0 IVIN(OFF) 100 mA Off−State Leakage Current (xDNR2G) VCC = Open, VIN = 120 V, VUVLO = 0 IVIN(OFF) 100 mA Supply Voltage Startup Threshold VCC increasing VCC(on) Minimum Operating Voltage VCC decreasing VCC(off) HIGH VOLTAGE STARTUP REGULATOR Regulated Voltage Current Source Capability Current Source Limit mA 30 mA SUPPLY CIRCUIT V VCC(REG) – 350 mV 6.2 6.5 VCC(REG) – 100 mV 6.8 Supply Over−Voltage Protection VCC(OVP) 28 V VCC OVP Detection Filter Delay tVCCOVP 3 ms (DLY) Startup Delay Measured from VCC(ON) to SS tON(Dly) VUVLO = 0 V VUVLO = 0.7 V CDRV = Open, VCOMP = 2 V VFLT = 0 V ICC(SHDN) ICC(STBY) ICC(EN) ICC(FLT) − − − − NCP12700CDNR2G Other parts VCS(LIM) Step VCS from 0 – 0.6 V tCS(DLY) Short Circuit Protection (SCP) Current Limit Threshold NCP12700CDNR2G Other parts VSCP(LIM) Propagation Delay From Short Circuit Limit to DRV Low VCS = 0.75 V tSCP(DLY) Short Circuit Counter VCS = 0.75 V NSCP Supply Current SHDN STBY Enable Fault 25 ms − − − − 50 750 4 500 mA mA mA mA 235 465 250 495 265 525 mV − − 75 ns CURRENT SENSE Current Limit Comparator Threshold Propagation Delay From Current Sense Limit to DRV Low 312.5 625 − − mV 75 ns 4 CS Leading Edge Blanking (LEB) tLEB(CS) 75 100 125 ns SCP Leading Edge Blanking tLEB(SCP) 45 60 75 ns − 55 W 24 30 36 ms 35 83 50 102 65 123 CS LEB Pull−down Resistance Overload Timer Duration Applied Slope Compensation @ Current Limit Comparator RPD(LEB) VCS = 0.6 V tCS(OVLD) VCOMP = Open; Measured at D80% NCP12700CDNR2G Other parts VSLP(ILIM) Duty Cycle Where Slope Compensating Ramp Begins D40% 40 VCOMP = 2 V KPWM 6 VCOMP = 2 V, Step from CS 0– 0.4 V tPWM(Dly) − mV % COMP SECTION PWM to COMP Gain Through Resistor Divider PWM Propagation Delay to DRV Low COMP Open Pin Voltage VCOMP(open) 4 75 4.7 ns V COMP Output Current VCOMP = 0 ICOMP 0.84 1 1.2 mA Maximum Duty Cycle VCOMP = Open DMAX 76 80 84 % www.onsemi.com 6 NCP12700 Table 4. ELECTRICAL CHARACTERISTICS (VIN = 12 V, VCC = 12 V, VCOMP = Open, VFLT = Open, CDRV = 1 nF, RT = 49.9k, VCS = 0 V, VSS = Open, VUVLO = 1.2, for typical values TJ = 25°C, for min/max values, TJ is – 40°C to 125°C, unless otherwise noted) Characteristics Test Condition Symbol Min Typ Max Unit COMP SECTION COMP Skip Threshold VCOMP(skip) 300 mV COMP Skip Hysteresis VCOMP (skip_hys) 25 mV Minimum Duty Cycle Applied Slope Compensation @ PWM Comparator VCOMP = 0 DMIN VCOMP = 2 V; Measured at D80% NCP12700CDNR2G Other parts VSLP(PWM) 0 30 77 40 98 50 117 % mV SOFT START Soft−Start Open Pin Voltage VSS(open) Soft−Start End Threshold VSS(end) 2.85 3 3.15 V VSS = 3 V ISS 12 15 18 mA NCP12700CDNR2G Other parts KSS 100 W Soft−Start Current Soft−Start to CS Divider Soft−Start Discharge Resistance 5.0 V 12 6 RSS(DIS) OSCILLATOR FOSC1 185 200 215 kHz RT = 100 kW FOSC2 95 100 105 kHz Oscillator Frequency 3 RT = 20 kW FOSC3 450 500 550 kHz Oscillator Frequency 4 RT = 9.09 kW FOSC4 Standby Threshold VUVLO increasing VSTBY(th) 0.35 0.5 0.65 V Reset Threshold VUVLO decreasing VRST(th) 0.3 0.45 0.6 V Standby Hysteresis VUVLO decreasing VSTBY(HYS) Oscillator Frequency 1 Oscillator Frequency 2 1000 kHz UNDER−VOLTAGE LOCKOUT (UVLO) Standby Detection RC Filter tSTBY(DLY) UVLO Threshold VUVLO increasing VUVLO(th) UVLO Threshold Hysteresis VUVLO decreasing VUVLO(HYS) UVLO Hysteresis Current UVLO Detection Delay Filter 50 VUVLO = VUVLO(th) − 20 mV mV 5 765 800 ms 830 15 IUVLO(HYS) 4.5 tUVLO(DLY) 0.5 5 mV mV 5.5 mA 1 ms OVER−POWER PROTECTION (OPP) VOPP(START) UVLO Voltage Above Which OPP Applied OPP Gain Maximum Current (Operating Point) Maximum Current 1 V Gm(OPP) 135 150 165 mA / V VUVLO = 2.33 V ICS(OPP1) 180 200 220 mA VUVLO = 4 V ICS (OPP_MAX) 200 mA VOPP(0%) 0.8 V VOPP(100%) 2 V COMP Threshold Voltage Above Which OPP is Applied COMP Threshold Voltage For 100% OPP GATE DRIVE DRV Rise Time VDRV = 1.2 V to 10.8 V tDRV(rise) 6 10 15 ns DRV Fall Time VDRV = 10.8 V to 1.2 V tDRV(fall) 2.5 4 10 ns VDRV = 6 V IDRV(SRC) DRV Source Current www.onsemi.com 7 1.0 A NCP12700 Table 4. ELECTRICAL CHARACTERISTICS (VIN = 12 V, VCC = 12 V, VCOMP = Open, VFLT = Open, CDRV = 1 nF, RT = 49.9k, VCS = 0 V, VSS = Open, VUVLO = 1.2, for typical values TJ = 25°C, for min/max values, TJ is – 40°C to 125°C, unless otherwise noted) Characteristics Test Condition Symbol Min Typ Max Unit VDRV = 6 V IDRV(SNK) DRV Clamp Voltage VCC = 20 V, RDRV = 10 kW VDRV(clamp) 10 Minimum DRV Voltage VCC = VCC(OFF) + 100 mV, RDRV = 10 kW VDRV(MIN) 6 Fault Source Current IFLT 80 85 90 mA OTP Fault Threshold VFLT(OTP) 0.47 0.5 0.53 V OTP Detection Filter Delay tOTP(DLY) 10 20 30 ms OTP Fault Recovery Threshold VFLT(REC) 0.846 0.9 0.954 V OVP Fault Threshold VFLT(OVP) 2.8 3 3.2 V OVP Detection Filter Delay tOVP(DLY) 3 5 7 ms VFLT(CLAMP) 1.13 1.35 1.57 V GATE DRIVE DRV Sink Current 2.8 12 A 14 V V FAULT PROTECTION Fault Clamp Voltage VFLT = Open Fault Clamp Resistance RFLT(CLAMP) Auto−recovery Timer 1.6 kW tAR 0.8 1 1.2 s TSHDN 150 165 180 °C THERMAL SHUTDOWN Thermal Shutdown Thermal Shutdown Hysteresis TSHDN(hys) www.onsemi.com 8 25 °C NCP12700 Application Information Figure 4 details the operation of the startup regulator. When VIN is applied, the regulator will immediately begin sourcing current to charge VCC. Initially the startup will supply approximately 10 mA. Once VCC builds up to ~ 3 V, the control loop for the HV regulator will activate and the source current will be regulated to 30 mA until VCC reaches the VCC(REG) level of 8 V. The HV startup is a linear regulator which can continue to supply and regulate VCC at 8 V. The recommended VCC capacitance to ensure stability of the regulator is 1 – 10 mF. While the VCC voltage is below the VCC(ON) threshold the controller will remain in a low quiescent state to allow for rapid charging of VCC and fast startup of the application. Once the VCC voltage reaches the VCC(ON) threshold, approximately 200 mV below the VCC(REG) level, the controller will exit the low quiescent state and begin delivering drive pulses. While the output voltage is building up, the startup regulator will continue to supply the current necessary to maintain VCC at the VCC(REG) level. For low input voltage applications, the startup regulator has been designed to guarantee a minimum of 15 mA source capability with 2 V of headroom. In typical applications an auxiliary winding will be used to provide bias to VCC once the converter is switching. This allows for the most efficient operation of the system. Once the auxiliary winding pulls the VCC voltage above VCC(REG), the HV regulator will shut off. In normal operation the VCC voltage can be biased above the voltage at VIN and can support voltages up to 28 V. A VCC OVP protection feature will trigger at 28 V, disabling switching of the converter to prevent the auxiliary winding voltage from damaging the controller. The NCP12700 is a fixed frequency, peak current mode, PWM controller containing all of the features necessary for implementing single−ended power converter topologies. The device features an ultra−wide range, high voltage startup regulator capable of regulating VCC across an input voltage range of 9 – 120 V (xDNR2G) or 9 – 200 V (xMTTXG). The controller is designed for high speed operation including a programmable oscillator capable of operating from 100 kHz to 1 MHz and total propagation delays less than 75 ns in the PWM path. The NCP12700 integrates slope compensation to prevent subharmonic oscillations and an Input Voltage Compensation / Over−Power Protection (OPP) feature that limits the converter power delivery capability across input voltage, easing system thermal design. The controller offers an adjustable soft−start, input voltage UVLO protection, and a suite of protection features including cycle−by−cycle current limit and a FLT pin with a NTC interface for system thermal protection. The UVLO pin also features a shutdown comparator which allows for an externally applied pull−down signal to disable switching and bring the controller into a low quiescent state. Ultra−Wide Range HV Startup Regulator The NCP12700 features a high voltage startup regulator capable of operating across input voltage ranges of 9−120 V (xDNR2G) or 9−200 V (xMTTXG). The ultra−wide range capability of the regulator allows for direct connection of VIN to the converter input voltage without requiring external components. The regulator’s input voltage capabilities support a wide range of industrial, medical, telecom, and transportation applications. www.onsemi.com 9 NCP12700 VCC VIN = 12 V VCC(REG) VCC(ON) VCC(OFF) VCC = 3 V Output Voltage IVIN IVIN = 30 mA IVIN = ICC IVIN ~ 10 mA time Figure 4. Startup Timing Diagram When input voltage is initially applied to the converter the device will be in a shutdown/reset (SHDN) state until the UVLO voltage crosses the VSTBY(th) threshold of 0.5 V. In the SHDN state the device consumption will be limited to the ICC(SHDN) value of 50 mA. When the UVLO voltage goes above VSTBY(th) the device transitions into standby mode and the consumption increases to the ICC(STBY) limit of 750 mA maximum. The low current consumption in the shutdown and standby modes allow VCC to rapidly charge to the VCC(ON) threshold. Once VCC has charged to VCC(ON) the device will enable drive pulses when the UVLO voltage exceeds the VUVLO(th) of 0.8 V and disables drive pulses when the UVLO voltage falls below 0.8 V by VUVLO(HYS). Prior to enabling drive pulses the device also activates a pull−down current source, IUVLO(HYS), of 5 mA. The current source works in combination with VUVLO(HYS) to set the input voltage hysteresis for enabling and disabling switching operation of the converter. A resistor, RUVLO(HYS), can be used to provide additional hysteresis between the enable and disable thresholds. Equation 1 and Equation 2 can be used to calculate the necessary component values in the resistor divider network. Once the device has begun delivering drive pulses it will remain active as long as VCC remains above the VCC(OFF) threshold of 6.5 V. Either the auxiliary winding or the HV startup regulator will provide the bias necessary to keep VCC above this level. If VCC does drop below the VCC(OFF) threshold the controller will inhibit drive pulses, the device will reset and once again enter a low quiescent state. This should only occur if the input voltage to the converter has been removed but can also be an indication of excessive external loading on VCC. Input Voltage UVLO Detection The NCP12700 features line voltage UVLO detection to ensure that the converter becomes operational only after meeting a minimum input voltage threshold thereby protecting the converter from thermal stress at low input voltages. A functional block diagram of the UVLO detection circuitry is shown in Figure 5. The input line voltage is monitored through a resistor divider network allowing the user to set the thresholds for when to enable and disable the converter. Typical pull−down resistors in the divider network will be in the range of 5 – 20 kW and pull−up resistors will typically be in the range of 50 – 500 kW. External capacitive filtering on the order of 10 nF is also advisable. www.onsemi.com 10 NCP12700 5 ms VSTBY(th) V IN V RST(th) S Q STBY R Q SHDN R UVLO1 V UVLO(th) R UVLO(HYS) ENABLE IUVLO(HYS) UVLO RUVLO2 Figure 5. UVLO Block Diagram V IN,START + ǒ V UVLO(th) ) ǒ Ǔ R UVLO1R UVLO2 ) R UVLO(HYS) R UVLO1 ) R UVLO2 V IN,STOP + ǒV UVLO(th) * V UVLO(HYS)Ǔ ǒ Ǔǒ I UVLO(HYS) Ǔ R UVLO1 ) R UVLO2 R UVLO2 Ǔ R UVLO1 ) R UVLO2 R UVLO2 (eq. 1) (eq. 2) Input Voltage Compensation / Over−Power Protection P + 0.5 L ǒI 2 P * I 2 VǓ f SW input line voltage through the UVLO pin. When the UVLO voltage crosses the VOPP(START) threshold, typically 1 V, the OTA begins sourcing a current out of the CS pin. The current injected out of the CS pin will be according to Equation 4 where the typical transconductance, Gm(OPP), is 150 mA/V and the maximum current is limited to the ICS(OPP_MAX) value of 200 mA. (eq. 3) In a CCM flyback converter the output power capability is defined by Equation 3 where IP is the peak transformer current, IV is the valley or minimum transformer current, L is the primary inductance, and fSW is switching frequency. In a DCM flyback converter the valley current becomes 0 and Equation 3 still applies. The peak current capability of the converter can be impacted by several variables including input voltage and the operating duty cycle due to the internal slope compensation in the NCP12700. Managing the peak current limit over the operating input voltage range will limit the total power capability and ease system thermal design. The NCP12700 features the Input Voltage Compensation / Over−Power Protection (OPP) circuitry shown in Figure 6. The Over−Power Protection circuit functions as a transconductance amplifier which senses an image of the I CS(OPP) + G m(OPP) @ ǒV UVLO * V OPP(START)Ǔ (eq. 4) Good SMPS design practice for current mode control includes a small RC filter in series between the current sense resistor and the CS pin of the controller. Typical values for the resistor in the RC filter are 500 – 1 kW. The user can then limit the peak current capability of the converter by setting the RCS resistor value and can reduce the peak current capability of the converter by 20 – 40% with these values. V IN V DD R UVLO1 COMP UVLO R UVLO2 DRV VOPP(START) ICS(OPP) CS RCS CCS Figure 6. Over−Power Protection Diagram www.onsemi.com 11 RSNS NCP12700 Another aspect of the Over−Power Protection feature is that the current sourced out of the CS pin is modulated as a function of the COMP voltage to ensure that the current is only available when necessary. This is detailed in Figure 7 below with typical values for VOPP(0%) = 0.8 V and VOPP(100%) = 2 V. The typical values of 0.8 V and 2 V equate to ~ 27% and 67% of the full load capability of the device, hence the OPP current should begin being applied at 27% load and should ramp up to 100% OPP current at 67% load. V COMP 2V 0.8 V ICS(OPP) 100% 0 Figure 7. OPP Current Profile vs. COMP Voltage www.onsemi.com 12 time NCP12700 PWM Operation RT Pin & Oscillator where FOSC is the switching frequency. The curve in Figure 8 below shows the Oscillator frequency vs. RT resistor for values between ~10 kW to 100 kW. The NCP12700 is designed to operate between 100 kHz and 1 MHz but will have tighter tolerance at lower switching frequencies. The oscillator in the NCP12700 uses an external resistor from the RT pin to ground to set the switching frequency of the converter. The frequency set by the RT resistor follows F OSC + 1 100 RT (eq. 5) 10 −12 1,000 900 800 Oscillator Frequency (kHz) 700 600 500 400 300 200 100 0 0 10 20 30 40 50 60 70 80 90 100 RT Resistor Value (kΩ) Figure 8. Oscillator Frequency vs. RT Resistor Value Gate Driver (DRV) PWM Reset Path The NCP12700 is equipped with a gate driver for driving the primary side MOSFET. The driver applies VCC up to the clamped voltage, VDRV(clamp), of 12 V as a high signal and 0 V to the gate of the power MOSFET as a low signal. The rate of charging and discharging of the gate of the MOSFET is dependent upon the input capacitance of the MOSFET and the impedance of the driver. The NCP12700 is equipped with an IDRV(SRC) pull−up current, typically 1 A, and a pull down current of IDRV(SNK), typically 2.8 A ensuring fast turn on/off transitions of the power MOSFET and minimizing the switching losses. The NCP12700 is intended for isolated DC−DC converters where the control loop compensation circuitry is located on the secondary side of the power converter. The converter output voltage is compared against a reference voltage and an error amplifier produces a compensated error signal which is communicated to the NCP12700 through an optocoupler. The compensated error signal interfaces with the COMP pin where it is divided down by a 5R/R voltage divider and sent to the PWM S/R to modulate the switching duty cycle. A detailed functional diagram of the PWM path is shown in Figure 9. The PWM comparator compares the attenuated error signal from the COMP pin to the current ramp signal sensed at the CS pin to determine when the drive pulse should be terminated. This comparator serves as the primary modulation path for the converter duty cycle. www.onsemi.com 13 NCP12700 VDD VSCP(LIM) t LEB(SCP) SCP COMPARATOR NSCP Counter ICS(OPP) SCP CS SLOPE COMPENSATION DRV t CS(OVLD) OVLD LEB CURRENT LIMIT COMPARATOR VCS(LIM) VDD t LEB(CS) ISS SCP DMAX Soft−Start COMPARATOR SS Switching Disabled DRV VDD 1/6 CLK PWM LOGIC S Q R SLOPE COMPENSATION PWM COMPARATOR 5k 5R COMP R SKIP COMPARATOR V COMP(skip) VCOMP(skip_hys) Figure 9. NCP12700 PWM Path DRV V PWM VSLP 0 D40% D80% Figure 10. Slope Compensation Timing Diagram Slope Compensation sub−harmonic oscillation the NCP12700 implements an internal slope compensation circuit which is applied to the attenuated COMP signal at the input of the PWM comparator. The slope compensation timing diagram is shown in Figure 10. The compensating ramp begins reducing the In fixed frequency peak current mode control, converters operating at duty cycles greater than 50% of the switching period are susceptible to sub−harmonic oscillation, characterized by successive switching cycles with alternating wide and narrow pulse−widths. To avoid www.onsemi.com 14 NCP12700 attenuated COMP voltage when the switching duty cycle is nominally 40% and reduces the voltage by a peak, VSLP(PK), at the 80% duty cycle limit. The slope compensating ramp is synchronized to the duty cycle of the oscillator, effectively adjusting itself based on the switching frequency, providing the converter with a compensating dv/dt ramp appropriate for the particular switching frequency. An image of the slope compensating ramp is also applied at the input of the Current Limit comparator to prevent sub−harmonic oscillations from occurring during overload conditions. The chart below summarizes the dv/dt of the compensating ramp at some common operating frequencies. FSW (kHz) TSW (ms) D = 40% (ms) D = 80% (ms) VSLP (mV) Ramp (mV/ms) 100 10.00 4.00 8.00 98 / 40 25 / 10 200 5.00 2.00 4.00 98 / 40 49 / 20 250 4.00 1.60 3.20 98 / 40 61 / 25 330 3.03 1.21 2.42 98 / 40 81 / 33 400 2.50 1.00 2.00 98 / 40 98 / 40 500 2.00 0.80 1.60 98 / 40 123 / 50 Cycle−by−Cycle Current Limit and Overload Protection pulses and take the device into a Fault mode when the timer has expired. The 30 ms timer allows the converter to sustain a short term overload but still protects the converter from thermal overstress in the event of a continuously applied overload condition. The overload timer is also an integrating timer, it will continue ramping up while the Current Limit Comparator is terminating drive pulses but will begin ramping down, not reset completely, if the drive pulse is terminated by another signal such as the PWM comparator. This operation is depicted in Figure 11. The NCP12700 implements cycle−by−cycle current limiting with a dedicated Current Limit Comparator. The input to the comparator is the primary FET current ramp sensed at the CS pin. If the sensed voltage exceeds the current limit threshold, VCS(LIM), then the drive pulse is terminated. There are device options for VCS(LIM) of 250 mV and 495 mV. The Current Limit Comparator is very fast with a total propagation delay, tCS(DLY), of 75 ns maximum ensuring that drive pulses are quickly terminated minimizing current overshoot in the converter. The Current Limit comparator also triggers an overload timer, tCS(OVLD), nominally 30 ms, and will disable drive VCOMP V DRV Overload Timer time t1 t2 t3 t4 t5 t6 Figure 11. Integrating Overload Timer Short Circuit (SCP) Comparator secondary side rectifier or a shorted winding in the transformer it may be possible to sense an abnormally high current pulse at the CS pin and disable drive pulses to The NCP12700 also includes a fast Short Circuit Comparator with a threshold, VSCP(LIM), of 312.5 mV and 625 mV. In certain extreme fault conditions such as a shorted www.onsemi.com 15 NCP12700 dedicated Skip Comparator which monitors the voltage at the COMP pin and blanks drive pulses if the COMP voltage falls below the VCOMP(skip) threshold of 300 mV. To re−enable new drive pulses, the COMP voltage must exceed a skip hysteresis, VCOMP(skip_hys) of 25 mV above the 300 mV threshold. The skip hysteresis is designed to prevent the converter from oscillating in and out of skip mode due to noise on the COMP pin. prevent the converter from further damage. If the voltage at the CS pin rapidly exceeds VSCP(LIM) and the SCP comparator trips, then the drive pulse will be terminated and a counter will be incremented. If the SCP comparator trips on 4 consecutive drive pulses then drive pulses will be disabled and the controller is put into the Fault mode. Leading Edge Blanking (LEB) Converters operating in peak current mode control require a high quality current ramp signal to ensure stable and clean PWM operation. In the NCP12700 the current ramp signal is sensed at the CS pin and is routed through a LEB circuit which blanks the current sense information for a brief period after the DRV voltage is delivered to the primary MOSFET. The LEB prevents noise generated during the switching transition from terminating drive pulses prematurely. The blanking is performed by an internal pulldown switch and series disconnect switch. The internal pulldown switch has an on resistance, RPD(LEB), specified as 55 ohms maximum. The pulldown switch is turned on whenever the DRV is low and remains on for a period of time equal to tLEB(SCP), 60 ns typical, after the DRV is set high. After tLEB(SCP) has expired the current ramp signal is delivered to the SCP comparator allowing it to sense an abnormal overcurrent situation. A longer series LEB, tLEB(CS), of 100 ns continues to hold open the signal path to the CS and PWM comparators. This switch closes when tLEB(CS) has expired, allowing the CS information to be delivered to the other two comparators. In addition to the LEB network, the user of the controller will usually place a small RC filter in between the current sense components and the CS pin to provide noise suppression. The resistor value in the RC filter is typically in the range of 500 – 1 kW, sized appropriately for the Over−Power protection feature, and the capacitor value is typically chosen to provide a time constant for the RC filter of about 50 – 100 ns. Maximum Duty Cycle The NCP12700 also includes a maximum duty cycle clamp which terminates a drive pulse which has been high for DMAX of the switching period. The default value of DMAX will be 80%. Soft Start The soft start feature in the NCP12700 is implemented with a dedicated comparator that compares the current ramp signal from the CS pin against an attenuated soft start ramp generated at the SS pin. Prior to enabling switching, an internal pull−down transistor with an on resistance, RSS(DIS), of 100 W is activated to discharge the external soft start capacitor and hold the SS pin to GND. Once switching is enabled the pull−down transistor is released and a current source, ISS, of 15 mA charges the soft start capacitor forming the soft start ramp voltage. The soft start ramp voltage is then divided down by a factor of KSS and fed into the soft start comparator which resets drive pulses when the CS voltage exceeds the soft start voltage. The soft start comparator will continue to reset drive pulses until another comparator enters the reset path which typically occurs when the secondary side control loop responds allowing the PWM comparator to take control. The NCP12700 monitors the external soft start voltage and sets a flag when the voltage exceeds 3 V, declaring that the soft start period has ended. At 3 V, the drive pulse reset control will have been handed off to either the PWM comparator or the Current limit comparator. The SS_END flag is used internally by the controller for fault management, gating detection of certain faults that may be erroneously triggered during power up of the converter. This is shown in the FLT pin block diagram of Figure 12. Skip Comparator For a power converter operating at light loads it is sometimes desired to skip drive pulses in order to maintain output voltage regulation or improve the light load efficiency of the system. The NCP12700 features a To V CC VDD IFLT SS_END V FLT(OTP) t OTP(DLY) V FLT(OTP_HYS) V FLT(OVP) t OVP(DLY) Figure 12. FLT Pin Block Diagram www.onsemi.com 16 To Fault Logic NCP12700 Fault (FLT) Pin Summary of Fault Handling The FLT pin is intended to provide the system with a NTC interface for thermal protection and a pull−up fault which can be coupled to the auxiliary winding to provide output over−voltage protection. The FLT pin can also be used as a general purpose fault where it interfaces with a simple pull−down BJT, open collector comparator, or optocoupler for monitoring of secondary side faults. The internal circuitry includes a precision pull−up current source, IFLT, of 85 mA and a window comparator to signal a fault whenever the pin voltage goes below the OTP fault threshold, VFLT(OTP), of 0.5 V or above the OVP fault threshold, VFLT(OVP), of 3 V. Both of the fault comparators also include a delay filter to prevent noise or glitches from setting the fault. The over−temperature fault filter, tOTP(DLY), is nominally 20 ms and the over−voltage fault filter, tOVP(DLY), is typically 5 ms. An external filter capacitor is also advisable. Both faults have an option to permanently latch off the controller or restart after a 1 s auto−recovery period. The OVP fault is intended to monitor an auxiliary winding and when triggered, the controller will disable switching which will inhibit the aux winding from generating voltage and allow the controller to restart after the auto−recovery timer has expired. If the OVP fault comparator is continuously held above 3 V, the NCP12700 will remain in the fault mode and not restart. The OTP fault detection is gated by the SS_END flag to prevent the comparator from triggering while the external filter capacitor charges up. Once the SS_END flag is set the OTP fault can be acknowledged so there is a practical limit on the size of the filter capacitor. Equation 6 and Equation 7 should assist the user with properly setting the external capacitance of the fault pin. The NCP12700 has 6 fault detectors which will place the device into the fault mode. In the fault mode switching is inhibited and the controller bias is maintained by the HV startup regulator. The controller also reduces current consumption to ICC(FLT), 500 mA maximum, so that the regulator is not thermally overstressed. The NCP12700 remains in the fault mode until the fault signal has been cleared and/or the auto−recovery timer has expired. The fault signal can be cleared when the fault detector senses that the fault has been removed or by a controller reset which occurs if VCC drops below VCC(OFF) or the UVLO pin is pulled below the VRST(th) level. Below is a brief summary of the different fault detectors and their basic operation. • Thermal Shutdown (TSD): Thermal shutdown is declared when the internal junction temperature of the device exceeds the TSHDN temperature of 165°C. The thermal shutdown fault is auto−recoverable when the device junction temperature reduces to TSHDN – TSHDN(hys) where TSHDN(hys) is typically 25°C. • Fault OTP: An OTP fault is declared when fault pin voltage decreases below the VFLT(OTP) threshold of 0.5 V and the OTP filter, tOTP(DLY), expires. The OTP filter delay is typically 20 ms. The OTP fault is blanked at startup until the SS_END flag has been set to allow the external capacitance of the pin to charge up. For the device to recover from the Fault OTP, the auto−recovery timer must expire and the voltage at the fault pin must recover to VFLT(REC) value of 0.9 V. • Fault OVP: The OVP fault is declared when fault pin the voltage exceeds the VFLT(OVP) threshold of 3 V and the OVP filter, tOVP(DLY), expiring. The OVP filter delay is typically 5 ms. The OVP fault is cleared when the auto−recovery timer expires. There is no hysteresis on the OVP fault but if the pin voltage is permanently held above 3 V, DRV will pulses will be permanently inhibited. • Overload (OVLD): The OVLD fault is set when the overload timer, tOVLD, expires. The overload timer is an integrating timer which counts up as long as the Current Limit comparator is terminating DRV pulses. The typical value for tOVLD is 30 ms. The controller will recover from the OVLD fault when the auto−recovery timer expires. • SCP Fault: The SCP fault occurs when the NSCP counter has reaches 4 consecutive DRV pulses terminated by the SCP comparator. The controller will recover from the SCP fault when the auto−recovery timer expires. • VCC OVP: The VCC OVP is set when VCC voltage exceeds the VCC(OVP) threshold of 28 V and the VCC OVP filter, tVCC_OVP(DLY), expires. The VCC OVP filter is typically 3 ms. VCC OVP will permanently latch the device off so that it remains in the Fault mode indefinitely until the controller is reset. t SS_END + C FLT t C SS V SS_END I SS I FLT t SS_END V FLT(OTP) (eq. 6) (eq. 7) When the OTP fault is triggered the NCP12700 will again disable drive pulses and transition into a fault mode. The OTP fault is auto−recoverable based on the auto−recovery timer and a hysteresis set by the VFLT(REC) threshold of 0.9 V. The auto−recovery timer must expire and the voltage at the fault pin must exceed 0.9 V. This methodology guarantees a minimum amount of time for the system to recover from thermal overstress but will not allow the converter to restart unless the hysteresis is met. Given the IFLT and VFLT(OTP) specifications the critical NTC resistance for declaring a fault is ~ 5.9 kW. The critical resistance for recovering from the OTP fault becomes ~ 10.6 kW. This fault recovery threshold provides for about ~20°C of hysteresis for many NTC resistors. www.onsemi.com 17 NCP12700 Evaluation Board Designs DN05109 describes the operation of a 18 – 160 V input flyback converter delivering 12 V out at 15 W. This demonstration board switches at 100 kHz and operates in discontinuous conduction mode across the entire input voltage range. The key performance specifications are shown in Table 6. Two evaluation boards have been developed to highlight the features of the NCP12700. Detailed schematics, operating waveforms, and bill of materials are available in the design notes, DN05108 and DN05109. DN05108 describes the operation of a 9 – 36 V input flyback converter delivering 12 V out at 15 W. This evaluation board switches at 200 kHz and operates in both continuous and discontinuous conduction modes. The key performance specifications are shown in Table 5 below. Table 6. WIDE RANGE FLYBACK EVALUATION BOARD SPECIFICATIONS Evaluation Board # 2 Table 5. LOW VOLTAGE FLYBACK EVALUATION BOARD SPECIFICATIONS Evaluation Board # 1 Vin 9 − 36 V Operating Vo 12 V − 1.25 A Po 15 W < 30 ms Full Load Efficiency > 87 % Transient Response < 250 ms Over Power Protection 120% − 150% Over Voltage Protection 16 VDC Max No Load Output Ripple 200 mVpp Max No Load Power Dissipation 120 mW Max Input Current in SHDN < 1 mA 18 − 160 V Operating Vo 12 V − 1.25 A Po 15 W Specifications Specifications Startup time Vin Startup time < 20 ms Full Load Efficiency > 85 % Transient Response < 250 ms Over Power Protection 115% − 155% Over Voltage Protection 16 VDC Max No Load Output Ripple 150 mVpp Max No Load Power Dissipation 500 mW Max Input Current in SHDN < 1 mA www.onsemi.com 18 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WQFN10 4x3, 0.8P CASE 511DV ISSUE C 1 SCALE 2:1 DATE 15 JUL 2019 GENERIC MARKING DIAGRAM* XXXXXX XXXXXX ALYWG G XXXXX = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Some products may not follow the Generic Marking. DOCUMENT NUMBER: DESCRIPTION: 98AON30094G WQFN10 4x3, 0.8P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS MSOP10, 3x3 CASE 846AE ISSUE A SCALE 1:1 A 10 E PIN ONE INDICATOR D 6 ÉÉ ÉÉ e 1 F B q E1 L L2 L1 DETAIL A 5 10X TOP VIEW b 0.08 C B M S A S DETAIL A A A1 0.10 C C c END VIEW SEATING PLANE SIDE VIEW RECOMMENDED SOLDERING FOOTPRINT* 10X 10X 0.29 0.85 C DATE 20 JUN 2017 NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSIONS: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.10 MM IN EXCESS OF MAXIMUM MATERIAL CONDITION. 4. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 MM PER SIDE. DIMENSION E DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 MM PER SIDE. DIMENSIONS D AND E ARE DETERMINED AT DATUM F. 5. DATUMS A AND B TO BE DETERMINED AT DATUM F. 6. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. MILLIMETERS MIN NOM MAX −−− −−− 1.10 0.00 0.05 0.15 0.75 0.85 0.95 0.17 −−− 0.27 0.13 −−− 0.23 2.90 3.00 3.10 4.75 4.90 5.05 2.90 3.00 3.10 0.50 BSC 0.40 0.70 0.80 0.95 REF 0.25 BSC 0° −−− 8° DIM A A1 A2 b c D E E1 e L L1 L2 q GENERIC MARKING DIAGRAM* 10 5.35 XXXX AYWG G 1 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. XXXX A Y W G = Specific Device Code = Assembly Location = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present and may be in either location. Some products may not follow the Generic Marking. DOCUMENT NUMBER: DESCRIPTION: 98AON34098E MSOP10, 3X3 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. 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