NCP151
LDO Regulator - Dual,
High PSRR
300mA
The NCP151 is a dual linear regulator capable of supplying 300 mA
output current from 1.7 V input voltage. The device provides wide
output voltage range from 0.8 V up to 3.6 V. In order to optimize
performance for battery operated portable applications, the NCP151
employs the dynamic quiescent current adjustment for very low IQ
consumption at no−load.
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1
Features
•
•
•
•
•
•
•
•
•
•
Operating Input Voltage Range 1.7 V to 5.5 V
Available in Fixed Voltage Option: 0.8 V to 3.6 V
±2% Accuracy Over Load/Temperature
Low Quiescent Current Typ. 100 mA
Low Dropout: 210 mV for 300 mA @ 2.8 V
Low Dropout: 370 mV for 300 mA @ 1.8 V
High PSRR: Typ. 70 dB at 1 kHz @ OUT1, OUT2
Stable with a 1 mF Small Case Size Ceramic Capacitors
Available in XDFN4, 1 mm × 1 mm × 0.4 mm
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
•
•
•
•
•
PDAs, Mobile Phones, GPS, Smartphones
Wireless Handsets, Wireless LAN Devices, Bluetooth®, Zigbee®
Bitcoin Miners
Portable Medical Equipment
Other Battery Powered Equipment
VIN1
XDFN4
CASE 711AJ
MARKING DIAGRAM
XX M
1
XX
M
= Specific Device Code
= Date Code
PIN CONNECTIONS
IN
OUT2
4
3
EPAD
1
2
OUT1
GND
(Top View)
NCP151
IN
OUT2
GND
OUT1
CIN1
1 mF
ORDERING INFORMATION
VOUT2
VOUT1
COUT1
1 mF
See detailed ordering and shipping information on page 2 of
this data sheet.
COUT2
1 mF
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2017
September, 2019 − Rev. 4
1
Publication Order Number:
NCP151/D
NCP151
IN
Thermal
shutdown
Bandgap
reference
−
Integrated
soft−start
+
MOSFET driver
with current limit
OUT1
GND
OUT2
−
Bandgap
reference
Integrated
soft−start
+
MOSFET driver
with current limit
Thermal
shutdown
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
XDFN4
Pin Name
4
IN
1
OUT1
Regulated output voltage. The output should be bypassed with small 1 mF ceramic capacitor.
3
OUT2
Regulated output voltage. The output should be bypassed with small 1 mF ceramic capacitor.
2
GND
Common ground connection.
EPAD
EPAD
Expose pad can be tied to ground plane for better power dissipation.
Description
Input voltage supply pin.
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VIN
−0.3 V to 6 V
V
VOUT1, VOUT2
−0.3 to VIN + 0.3,
max 6 V
V
Output Short Circuit Duration
tSC
unlimited
s
Maximum Junction Temperature
TJ
150
°C
TSTG
−55 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Input Voltage (Note 1)
Output Voltage
Storage Temperature
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114.
ESD Machine Model tested per EIA/JESD22−A115.
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
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2
NCP151
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
RqJA
170
°C/W
Thermal Characteristics, XDFN4 (Note 3), Thermal Resistance,
Junction−to−Air
3. Measured according to JEDEC board specification. Detailed description of the board can be found in JESD51−7.
ELECTRICAL CHARACTERISTICS
−40°C ≤ TJ ≤ 85°C; VIN = VOUT(NOM) + 1 V for VOUT options greater than 1.5 V. Otherwise VIN = 2.5 V , whichever is greater,
IOUT = 1 mA; CIN = COUT = 1 mF, unless otherwise noted. Typical values are at TJ = +25°C.
Parameter
Symbol
Operating Input Voltage
VIN
Output Voltage Accuracy
VOUT
Test Conditions
Min
Typ
Max
Unit
1.7
5.5
V
VOUT(NOM) ≤ 2 V
−40
+40
mV
VOUT(NOM) > 2 V
−2
+2
%
Line Regulation
LineReg
VOUT(NOM) + 0.5 V ≤ VIN ≤ 5.5 V,
(VIN ≥ 1.7 V)
0.01
0.1
%/V
Load Regulation
LoadReg
IOUT = 1 mA to 300 mA
12
30
mV
mV
Dropout Voltage (Note 5)
VDO1
OUT1
VOUT(NOM) = 2.8 V
IOUT = 300 mA
210
370
VDO2
OUT2
VOUT(NOM) = 1.8 V
IOUT = 300 mA
370
560
Current Limit
ICL
OUT1, OUT2, VOUT = 90% VOUT(NOM)
Short Circuit Current
ISC
OUT1, OUT2, VOUT = 0 V
600
Quiescent Current
IQ
IOUT1 = 0 mA, IOUT2 = 0 mA
100
VOUT Slew Rate (Note 6)
Power Supply Rejection Ratio
Output Voltage Noise
Thermal Shutdown Threshold
VOUT_SR
PSSR
VOUT = 1.8 V, IOUT = 10 mA
325
mA
600
200
mA
Normal
(Version A)
100
Slow
(Version C)
30
f = 1 kHz
70
dB
VIN = 3.8 V, VOUT1 = 2.8 V,
IOUT = 10 mA
mV/ms
VN
f = 10 Hz to 100 kHz, IOUT1 = 10 mA
70
mVRMS
TSDH
Temperature rising
160
°C
TSDL
Temperature failing
140
°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at TA = 25°C.
Low duty cycle pulse techniques are used during the testing to maintain the junction temperature as close to ambient as possible.
5. Dropout voltage is characterized when VOUT falls 100 mV below VOUT(NOM).
6. Please refer OPN to determine slew rate. NCP151A − normal speed. NCP151C − slower speed.
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3
NCP151
TYPICAL CHARACTERISTICS
2.802
1.800
VOUT, OUTPUT VOLTAGE (V)
1.798
VOUT, OUTPUT VOLTAGE (V)
1 mA
1.796
1.794
1.792
1.790
300 mA
1.788
1.786
1.784
−20
0
20
40
60
80
100
2.796
2.794
2.792
2.788
2.786
2.784
−40
20
40
60
80
Figure 4. Output Voltage vs. Temperature
8
6
4
VIN = VOUT,NOM + 1 V
IOUT = 1 mA to 300 mA
2
−20
0
20
40
60
80
100
100
1.0
0.8
0.6
0.4
0.2
0
−40
−20
0
20
40
60
80
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 5. Load Regulation vs. Temperature
Figure 6. Line Regulation vs. Temperature
600
100
1.2
IGND, GROUND CURRENT (mA)
IGND, GROUND CURRENT (mA)
0
Figure 3. Output Voltage vs. Temperature
10
500
400
300
TJ = 25°C
200
0
−20
TJ, JUNCTION TEMPERATURE (°C)
12
100
300 mA
2.790
TJ, JUNCTION TEMPERATURE (°C)
14
0
−40
2.798
LINEREG, LINE REGULATION (mV/V)
LOADREG, LOAD REGULATION (mV)
1.782
−40
1 mA
2.800
TJ = −40°C
TJ = 85°C
1u
10u
100u
1m
10m
100m
1.0
0.8
0.6
0.4
0.2
0
1
IOUT1 = IOUT2
IOUT1−LOAD, IOUT2 = 0 A
1u
10u
100u
1m
10m
100m
IOUT, OUTPUT CURRENT (A)
IOUT, OUTPUT CURRENT (A)
Figure 7. Ground Current vs. Output Current
VOUT,NOM = 1.8 V − One Output Load
Figure 8. Ground Current vs. Output Current −
Different Load Combinations
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1
NCP151
TYPICAL CHARACTERISTICS
450
350
TJ = 25°C
300
250
TJ = −40°C
200
150
100
50
0
30
60
90
200
IOUT = 100 mA
150
100
IOUT = 20 mA
50
−20
0
20
40
60
80
100
Figure 10. Dropout Voltage vs. Temperature −
VOUT,NOM = 1.8 V
250
TJ = 25°C
150
TJ = −40°C
100
50
0
30
60
90
IOUT = 300 mA
200
150
100
IOUT = 100 mA
50
IOUT = 20 mA
0
−40
120 150 180 210 240 270 300
−20
0
20
40
60
80
100
IOUT, OUTPUT CURRENT (mA)
TJ, JUNCTION TEMPERATURE (°C)
Figure 11. Dropout Voltage vs. Output Current
− VOUT,NOM = 2.8 V
Figure 12. Dropout Voltage vs. Temperature −
VOUT,NOM = 2.8 V
800
750
ICL, CURRENT LIMIT,
ISC, SHORT−CIRCUIT CURRENT
250
Figure 9. Dropout Voltage vs. Output Current −
VOUT,NOM = 1.8 V
200
650
300
TJ, JUNCTION TEMPERATURE (°C)
TJ = 85°C
700
350
IOUT, OUTPUT CURRENT (mA)
250
0
IOUT = 300 mA
400
0
−40
120 150 180 210 240 270 300
VDO, DROPOUT VOLTAGE (mV)
0
VDO, DROPOUT VOLTAGE (mV)
VDO, DROPOUT VOLTAGE (mV)
TJ = 85°C
400
ISC
600
ICL
550
500
VIN = 2.8 V
VOUT = 1.8 V
CIN = COUT = 1 mF
ICL: VOUT = 90% VOUT,NOM
ISC: VOUT = 0 V
450
400
350
300
−40
−20
0
20
40
60
80
100
EQUIVALENT SERIES RESISTANCE (W)
VDO, DROPOUT VOLTAGE (mV)
450
100
Stable Region
10
1
Unstable Region
0.1
0.01
VOUT = 1.8 V
CIN = COUT = 1 mF
0
50
100
150
200
250
TJ, JUNCTION TEMPERATURE (°C)
IOUT, OUTPUT CURRENT (mA)
Figure 13. Short−circuit Current, Current Limit
vs. Temperature
Figure 14. Maximum COUT ESR Value vs.
Output Current
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300
NCP151
SPECTRAL NOISE DENSITY (mV/sqrtHz)
TYPICAL CHARACTERISTICS
10
IOUT = 300 mA
1
RMS Output Noise (mV)
IOUT
0.1
IOUT = 10 mA
0.01
0.001
VIN = 2.8 V
VOUT = 1.8 V
CIN = COUT = 1 mF
10
100
10 Hz − 100 kHz
100 Hz − 100 kHz
69.2
1 mA
72.7
10 mA
71.5
67.9
300 mA
78.7
76.1
IOUT = 1 mA
1K
100K
10K
1M
FREQUENCY (kHz)
SPECTRAL NOISE DENSITY (mV/sqrtHz)
Figure 15. Spectral Noise Density vs. Frequency, VOUT = 1.8 V
10
IOUT = 300 mA
1
RMS Output Noise (mV)
IOUT
0.1
IOUT = 10 mA
0.01
0.001
VIN = 3.8 V
VOUT = 2.8 V
CIN = COUT = 1 mF
10
100
10 Hz − 100 kHz
100 Hz − 100 kHz
88.5
1 mA
93.8
10 mA
92.3
86.9
300 mA
111.1
106.2
IOUT = 1 mA
1K
10K
100K
1M
FREQUENCY (kHz)
90
80
IOUT = 1 mA
70
60
50
40
30
20
10
0
VIN = 2.8 V + 100 mVPP
VOUT = 1.8 V
CIN = COUT = 1 mF
10
100
1K
IOUT = 10 mA
IOUT = 300 mA
10K
100K
1M
PSRR, POWER SUPPLY REJECTION
RATIO (dB)
PSRR, POWER SUPPLY REJECTION
RATIO (dB)
Figure 16. Spectral Noise Density vs. Frequency, VOUT = 2.8 V
10M
90
80
IOUT = 1 mA
70
60
50
40
30
VIN = 3.8 V + 100 mVPP
VOUT = 2.8 V
CIN = COUT = 1 mF
20
10
0
10
100
1K
IOUT = 10 mA
IOUT = 300 mA
10K
100K
1M
10M
f, FREQUENCY (Hz)
f, FREQUENCY (Hz)
Figure 17. PSRR vs. Frequency, VOUT = 1.8 V
Figure 18. PSRR vs. Frequency, VOUT = 2.8 V
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NCP151
1 V/div
1 V/div
TYPICAL CHARACTERISTICS
4.8 V
3.8 V
tEDGE = 1 ms
3.8 V
3.8 V
20 mV/div
VOUT1 = 2.8 V
VOUT2 = 1.8 V
IOUT1 = 300 mA
IOUT2 = 1 mA
20 mV/div
20 mV/div
VOUT1
VOUT2
VOUT1
1 mA
1 mA
tEDGE = 1 ms
VOUT1
10 mV/div
VIN = 3.8 V
VOUT1 = 2.8 V
VOUT2 = 1.8 V
IOUT2 = 0 A
VOUT2
300 mA
1 mA
IOUT2
VOUT1
tEDGE = 1 ms
1 mA
VIN = 3.8 V
VOUT1 = 2.8 V
VOUT2 = 1.8 V
IOUT1 = 0 A
VOUT2
Figure 21. Load Transient Response,
IOUT1 = 1 mA to 300 mA to 1 mA
100 mA/div 400 mV/div
VOUT1 = 2.8 V
VOUT2 = 1.8 V
IOUT1 = 1 mA
IOUT2 = 300 mA
Figure 20. Line Transient Response,
VIN = 3.8 V to 4.8 V to 3.8 V
10 mV/div 300 mA/div
300 mA
500 mV/div
10 mV/div 300 mA/div
10 mV/div
3.8 V
VOUT2
Figure 19. Line Transient Response,
VIN = 3.8 V to 4.8 V to 3.8 V
IOUT1
tEDGE = 1 ms
VIN
VIN
20 mV/div
4.8 V
Figure 22. Load Transient Response,
IOUT2 = 1 mA to 300 mA to 1 mA
VOUT1
IOUT2
VOUT2
VIN = 5.5 V
VOUT1 = 2.8 V
VOUT2 = 1.8 V
IOUT1 = 0 A
CIN = COUT = 1 mF
Figure 23. Thermal Shutdown
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NCP151
APPLICATIONS INFORMATION
General
Larger output capacitors and lower ESR could improve
the load transient response or high frequency PSRR. It is not
recommended to use tantalum capacitors on the output due
to their large ESR. The equivalent series resistance of
tantalum capacitors is also strongly dependent on the
temperature, increasing at low temperature.
The NCP151 is a dual output 300 mA Low Dropout Linear
Regulator. This device delivers high PSRR (70 dB at 1 kHz)
and very good dynamic performance as load/line transients.
In connection with low quiescent current this device is very
suitable for various battery powered applications such as
tablets, cellular phones, wireless and many others. Each
output is fully protected in case of output overload, output
short circuit condition and overheating, assuring a very robust
design. The NCP151 device is housed in DFN−4 1 mm x 1 mm
package which is useful for space constrains application.
Output Current Limit
Output Current is internally limited within the IC to a
typical 600 mA. The NCP151 will source this amount of
current measured with a voltage drops on the 90% of the
nominal VOUT. If the Output Voltage is directly shorted to
ground (VOUT = 0 V), the short circuit protection will limit
the output current to 600 mA (typ). The current limit and
short circuit protection will work properly over whole
temperature range and also input voltage range. There is no
limitation for the short circuit duration.
Input Capacitor Selection (CIN)
Input capacitor connected as close as possible is necessary
for ensure device stability. The X7R or X5R capacitor
should be used for reliable performance over temperature
range. The value of the input capacitor should be 1 mF or
greater to ensure the best dynamic performance. This
capacitor will provide a low impedance path for unwanted
AC signals or noise modulated onto constant input voltage.
There is no requirement for the ESR of the input capacitor
but it is recommended to use ceramic capacitors for their low
ESR and ESL. A good input capacitor will limit the
influence of input trace inductance and source resistance
during sudden load current changes.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
threshold (TSD − 160°C typical), Thermal Shutdown event
is detected and the affected channel is turn−off. Second
channel still working. The channel which is overheated will
remain in this state until the die temperature decreases below
the Thermal Shutdown Reset threshold (TSDU − 140°C
typical).
The channel which is overheated will remain in this state
until the die temperature decreases below the Thermal
Shutdown Reset threshold (TSDU − 140°C typical). Once
the device temperature falls below the 140°C the appropriate
channel is enabled again. The thermal shutdown feature
provides the protection from a catastrophic device failure
due to accidental overheating. This protection is not
intended to be used as a substitute for proper heat sinking.
The long duration of the short circuit condition to some
output channel could cause turn−off other output when heat
sinking is not enough and temperature of the other output
reach TSD temperature.
Output Decoupling
The NCP151 requires an output capacitor connected as
close as possible to the output pin of the regulator. The
recommended capacitor value is 1 mF and X7R or X5R
dielectric due to its low capacitance variations over the
specified temperature range. The NCP151 is designed to
remain stable with minimum effective capacitance of
0.68ĂmF to account for changes with temperature, DC bias
and package size. Especially for small package size
capacitors such as 0201 the effective capacitance drops
rapidly with the applied DC bias. Please refer to Figure 24.
There is no requirement for the minimum value of
Equivalent Series Resistance (ESR) for the COUT but the
maximum value of ESR should be less than 1.7 W.
Power Dissipation
As power dissipated in the NCP151 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part. The maximum power dissipation the
NCP151 can handle is given by:
P D(MAX) +
ƪ85° C * T Aƫ
q JA
(eq. 1)
The power dissipated by the NCP151 for given
application conditions can be calculated from the following
equations:
Figure 24. Capacity vs. DC Bias Voltage
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8
NCP151
P D [ V IN
I GND ) I OUT1ǒV IN * V OUT1Ǔ
Turn−On Time
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case that VOUT > VIN.
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
The turn−on time is defined as the time period from EN
assertion to the point in which VOUT will reach 98% of its
nominal value. This time is dependent on various
application conditions such as VOUT(NOM) COUT and TA.
The NCP151 provides two options of VOUT ramp−up time.
The NCP151A have normal slew rate, typical 100 mV/ms
and NCP151C and provide slower option with typical value
30 mV/ms which is suitable for camera sensor and other
sensitive devices.
Power Supply Rejection Ratio
PCB Layout Recommendations
Reverse Current
To obtain good transient performance and good regulation
characteristics place CIN and COUT capacitors close to the
device pins and make the PCB traces wide. In order to
minimize the solution size, use 0402 capacitors. Larger
copper area connected to the pins will also improve the
device thermal resistance. The actual power dissipation can
be calculated from the equation above (Equation 2). Expose
pad should be tied the shortest path to the GND pin.
The NCP151 features very good Power Supply Rejection
ratio. If desired the PSRR at higher frequencies in the range
100 kHz − 10 MHz can be tuned by the selection of COUT
capacitor and proper PCB layout.
qJA, JUNCTION−TO−AMBIENT
THERMAL RESISTANCE (°C/W)
200
PD(MAX), TA = 25°C, 2 oz Cu
0.35
195
qJA, 1 oz Cu
190
0.34
185
0.33
180
PD(MAX), TA = 25°C, 1 oz Cu
175
0.32
0.31
qJA, 2 oz Cu
170
165
0.36
0
100
200
300
400
500
0.30
600
PD(MAX), MAXIMUM POWER
DISSIPATION (W)
) I OUT2ǒV IN * V OUT2Ǔ
(eq. 2)
0.29
PCB COPPER AREA (mm2)
Figure 25. qJA vs. Copper Area (XDFN4)
ORDERING INFORMATION
Marking
Voltage option
OUT1/OUT2
Vout Slew Rate
OUT1/OUT2
NCP151AAMX180070TCG
YE
1.8 V/0.70 V
Normal/Normal
NCP151AAMX180075TCG
YA
1.8 V/0.75 V
Normal/Normal
NCP151AAMX280180TCG
YC
2.8 V/1.8 V
Normal/Normal
NCP151AAMX330180TCG
YD
3.3 V/1.8 V
Normal/Normal
NCP151CCMX280180TCG
ZC
2.8 V/1.8 V
Slow/Slow
Device
Package
Shipping†
XDFN4
CASE 711AJ
(Pb−Free)
3000 Units/
Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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9
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN4 1.0x1.0, 0.65P
CASE 711AJ
ISSUE B
1
SCALE 4:1
GENERIC
MARKING DIAGRAM*
XX M
1
DOCUMENT NUMBER:
DESCRIPTION:
XX = Specific Device Code
M = Date Code
98AON67179E
XDFN4, 1.0X1.0, 0.65P
DATE 25 JUN 2021
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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onsemi Website: www.onsemi.com
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TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative