Buck Converter - DC-DC,
High Efficiency, Adjustable
Output Voltage, Low Ripple
1.7 MHz, 1 A
NCP1529
The NCP1529 step−down DC−DC converter is a monolithic
integrated circuit for portable applications powered from one cell
Li−ion or three cell Alkaline/NiCd/NiMH batteries. The device is able
to deliver up to 1.0 A on an output voltage range externally adjustable
from 0.9 V to 3.9 V or fixed at 1.2 V or 1.35 V. It uses synchronous
rectification to increase efficiency and reduce external part count. The
device also has a built−in 1.7 MHz (nominal) oscillator which reduces
component size by allowing a small inductor and capacitors. Automatic
switching PWM/PFM mode offers improved system efficiency.
Additional features include integrated soft−start, cycle−by−cycle
current limiting and thermal shutdown protection.
The NCP1529 is available in a space saving, low profile
2x2x0.5 mm UDFN6 package and TSOP−5 package.
www.onsemi.com
MARKING
DIAGRAM
5
5
1
DXJAYWG
G
1
DXJ
= Specific Device Code
A
= Assembly Location
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
TSOP−5
SN SUFFIX
CASE 483
Up to 96% Efficiency
Best In Class Ripple, including PFM mode
Source up 1.0 A
1.7 MHz Switching Frequency
Adjustable from 0.9 V to 3.9 V or Fixed at 1.2 V or 1.35 V
Synchronous rectification for higher efficiency
2.7 V to 5.5 V Input Voltage Range
Low Quiescent Current 28 mA
Shutdown Current Consumption of 0.3 mA
Thermal Limit Protection
Short Circuit Protection
All Pins are Fully ESD Protected
These are Pb−Free Devices
UDFN6
MU SUFFIX
CASE 517AB
1
2
3
6
XXMG 5
G
4
XX
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 14 of this data sheet.
Typical Applications
•
•
•
•
•
•
Cellular Phones, Smart Phones and PDAs
Digital Still Cameras
MP3 Players and Portable Audio Systems
Wireless and DSL Modems
USB Powered Devices
Portable Equipment
VIN
VIN
SW
CIN
OFF ON
L
VOUT
VIN
R1
Cff
R2
Figure 1. Typical Application for Adjustable Version
© Semiconductor Components Industries, LLC, 2010
August, 2020− Rev. 6
SW
CIN
COUT
EN
FB
GND
VIN
OFF ON
L
VOUT
COUT
EN
FB
GND
Figure 2. Typical Application for Fixed Version
1
Publication Order Number:
NCP1529/D
NCP1529
PIN FUNCTION DESCRIPTION
Pin
TSOP−5
Pin
UDFN6
Pin Name
Type
1
6
EN
Analog Input
2
2,4,7
(Note 1)
GND
Analog /
Power Ground
This pin is the GND reference for the NFET power stage and the analog
section of the IC. The pin must be connected to the system ground.
3
5
SW
Analog Output
Connection from power MOSFETs to the Inductor.
4
3
VIN
Analog /
Power Input
Power supply input for the PFET power stage, analog and digital blocks. The
pin must be decoupled to ground by a 4.7 mF ceramic capacitor.
5
1
FB
Analog Input
Feedback voltage from the output of the power supply. This is the input to the
error amplifier.
Description
Enable for switching regulators. This pin is active HIGH and is turned off by
logic LOW on this pin.
1. Exposed pad for UDFN6 package, named Pin 7, must be connected to system ground.
PIN CONNECTIONS
EN
1
GND
2
SW
3
5
FB
4 VIN
FB
1
GND
2
VIN
3
7
6
EN
5
SW
4
GND
(Top View)
(Top View)
Figure 3. Pin Connections − TSOP−5
Figure 4. Pin Connections − UDFN6
PERFORMANCES
100
90
EFFICIENCY (%)
80
70
60
50
40
30
20
10
0
0
500
IOUT (mA)
Figure 5. Efficiency vs Output Current
VIN = 3.6 V, VOUT = 3.3 V
www.onsemi.com
2
1000
NCP1529
FUNCTIONAL BLOCK DIAGRAM
Q1
Vbattery
Q2
VIN
2.2 mH
SW
PWM/PFM
CONTROL
10 mF
4.7 mF
GND
Enable
EN
R1
ILIMIT
LOGIC
CONTROL
& THERMAL
SHUTDOWN
FB
REFERENCE
VOLTAGE
R2
Figure 6. Simplified Block Diagram
www.onsemi.com
3
18 pF
NCP1529
MAXIMUM RATINGS
Symbol
Value
Unit
Minimum Voltage All Pins
Rating
Vmin
−0.3
V
Maximum Voltage All Pins (Note 2)
Vmax
7.0
V
Maximum Voltage EN
Vmax
VIN + 0.3
V
Thermal Resistance, Junction−to−Air (TSOP−5 Package)
Thermal Resistance using TSOP−5 Recommended Board Layout (Note 9)
RqJA
300
110
°C/W
Thermal Resistance, Junction−to−Air (UDFN6 Package)
Thermal Resistance using UDFN6 Recommended Board Layout (Note 9)
RqJA
220
40
°C/W
Operating Ambient Temperature Range (Notes 7 and 8)
TA
−40 to 85
°C
Storage Temperature Range
Tstg
−55 to 150
°C
Junction Operating Temperature (Notes 7 and 8)
Tj
−40 to 150
°C
Latchup Current Maximum Rating (TA = 85°C) (Note 5) Other Pins
Lu
$100
mA
2.0
200
kV
V
1
per IPC
ESD Withstand Voltage (Note 4)
Human Body Model
Machine Model
Vesd
Moisture Sensitivity Level (Note 6)
MSL
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
2. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = 25°C.
3. According to JEDEC standard JESD22−A108B.
4. This device series contains ESD protection and exceeds the following tests:
Human Body Model (HBM) per JEDEC standard: JESD22−A114.
Machine Model (MM) per JEDEC standard: JESD22−A115.
5. Latchup current maximum rating per JEDEC standard: JESD78.
6. JEDEC Standard: J−STD−020A.
7. In applications with high power dissipation (low VIN, high IOUT), special care must be paid to thermal dissipation issues. Board design
considerations − thermal dissipation vias, traces or planes and PCB material − can significantly improve junction to air thermal resistance
RqJA (for more information, see design and layout consideration section). Environmental conditions such as ambient temperature TA brings
thermal limitation on maximum power dissipation allowed.
The following formula gives calculation of maximum ambient temperature allowed by the application:
TA MAX = TJ MAX − (RqJA x Pd)
Where: TJ is the junction temperature,
Pd is the maximum power dissipated by the device (worst case of the application),
and RqJA is the junction−to−ambient thermal resistance.
8. To prevent permanent thermal damages, this device include a thermal shutdown which engages at 180°C (typ).
9. Board recommended TSOP−5 and UDFN6 layouts are described on Layout Considerations section.
1200
IOUTmax, MAXIMUM OUTPUT CURRENT (mA)
PD, POWER DISSIPATION (mW)
1200
UDFN6
1000
800
1000
TSOP−5
600
400
200
0
−40
−20
0
20
40
60
800
TSOP−5
600
400
200
0
2.7
80
UDFN6
TA, AMBIENT TEMPERATURE (°C)
3.7
4.2
4.7
VIN, INPUT VOLTAGE (V)
Figure 8. Power Derating
Figure 7. Maximum Output Current, TA = 455C
www.onsemi.com
4
3.2
5.2
NCP1529
ELECTRICAL CHARACTERISTICS (Typical values are referenced to TA = +25°C, Min and Max values are referenced −40°C to
+85°C ambient temperature, unless otherwise noted, operating conditions VIN = 3.6 V, VOUT = 1.2 V, unless otherwise noted.)
Rating
Conditions
Symbol
Min
Typ
Max
Vin
IQ
Unit
2.7
−
5.5
V
−
28
39
mA
INPUT VOLTAGE
Input Voltage Range
Quiescent Current
No Switching, No load
Standby Current
EN Low
Under Voltage Lockout
VIN Falling
Under Voltage Hysteretis
ISTB
−
0.3
1.0
mA
VUVLO
2.2
2.4
2.55
V
VUVLOH
−
100
−
mV
VIH
1.2
−
−
V
ANALOG AND DIGITAL PIN
Positive going Input High Voltage Threshold
Negative going Input High Voltage Threshold
VIL
−
−
0.4
V
VENH
−
100
−
mV
EN = 3.6 V
IENH
−
1.5
−
mA
Adjustable Version
Fixed Version at 1.2 V
Fixed Version at 1.35 V
VFB
−
−
−
0.6
1.2
1.35
−
−
−
V
VOUT
0.9
0.9
−
−
3.3
3.9
V
DVOUT
−
−3
$1
$2
−
+3
%
IOUTMAX
1
−
−
A
EN Threshold Hysteresis
EN High Input Current
OUTPUT
Feedback Voltage Level
Output Voltage Range (Notes 10, 11)
Output Voltage Accuracy
USB or 5 V Rail Powered Applications
(VIN from 4.3 V to 5.5 V) (Note 12)
Room Temperature (Note 13)
Overtemperature Range
Maximum Output Current (Note 10)
Output Voltage Load Regulation
Overtemperature
Load = 100 mA to 1000 mA (PWM Mode)
Load = 0 mA to 100 mA (PFM Mode)
VLOADR
−
−
−0.9
1.1
−
−
%
Load Transient Response
Rise/Fall Time 1 ms
10 mA to 100 mA Load Step
(PFM to PWM Mode)
200 mA to 600 mA Load Step
(PWM to PWM Mode)
VLOADT
−
40
−
mV
−
85
−
VLINER
−
0.05
−
%
Output Voltage Line Regulation Load = 100 mA VIN = 2.7 V to 5.5 V
Line Transient Response Load = 100 mA
3.6 V to 3.2 V Line Step (Fall Time = 50 ms)
VLINET
−
6.0
−
mVPP
Output Voltage Ripple
IOUT = 0 mA
IOUT = 300 mA
VRIPPLE
−
−
8.0
3.0
−
−
mVPP
FSW
1.2
1.7
2.2
MHz
Switching Frequency
Duty Cycle
D
−
−
100
%
tSTART
−
310
500
ms
High−Side MOSFET On−Resistance
RONHS
−
400
−
mW
Low−Side MOSFET On−Resistance
RONLS
−
300
−
mW
High−Side MOSFET Leakage Current
ILEAKHS
−
0.05
−
mA
Low−Side MOSFET Leakage Current
ILEAKLS
−
0.01
−
mA
IPK
−
1.6
−
A
Thermal Shutdown Threshold
TSD
−
180
−
°C
Thermal Shutdown Hysteresis
TSDH
−
40
−
°C
Soft−Start Time
Time from EN to 90% of Output Voltage
POWER SWITCHES
PROTECTION
DC−DC Short Circuit Protection
Peak Inductor Current
10. Functionality guaranteed per design and characterization.
11. Whole output voltage range is available for adjustable versions only. By topology, the maximum output voltage will be equal or lower than
the input voltage.
12. See chapter ”USB or 5 V Rail Powered Applications”.
13. For adjustable versions only, the overall output voltage tolerance depends upon the accuracy of the external resistor (R1 and R2). Specified
value assumes that external resistor have 0.1% tolerance.
www.onsemi.com
5
NCP1529
TABLE OF GRAPHS
Typical Characteristics for Step−down Converter
Figure
Efficiency
vs. Output Current
Iq ON
Quiescent Current, PFM no load
vs. Input Voltage
9
Iq OFF
Standby Current, EN Low
vs. Input Voltage
8
Switching Frequency
vs. Ambient Temperature
13
VLOADR
Load Regulation
vs. Load Current
14
VLOADT
Load Transient Response
VLINER
Line Regulation
VLINET
Line Transient Response
tSTART
Soft Start
20
Short Circuit Protection
21
h
FSW
IPK
10, 11, 12
16, 17
vs. Output Current
15
18, 19
VUVLO
Under Voltage Lockout Threshold
vs. Ambient Temperature
22
VIL, VIH
Enable Threshold
vs. Ambient Temperature
23
P, G
Phase & Gain Performance
24
www.onsemi.com
6
NCP1529
31
Iq, QUIESCENT CURRENT (mA)
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
2.5
3.0
3.5
4.0
4.5
5.5
29
28
27
2.5
4.0
4.5
5.0
5.5
Figure 10. Quiescent Current vs. Input Voltage
(Open Loop, Feedback = 1,
Temperature = 255C)
90
90
80
−40°C
70
60
25°C
50
85°C
40
30
60
50
10
600
800
1000
3.3 V
30
10
400
VBAT = 2.7 V
40
20
200
5.5 V
70
20
0
0
200
400
600
800
IOUT, OUTPUT CURRENT (mA)
IOUT, OUTPUT CURRENT (mA)
Figure 11. Efficiency vs. Output Current
(VIN = 3.3 V, VOUT = 1.2 V)
Figure 12. Efficiency vs. Output Current
(Vout = 1.2 V, Temperature = 255C)
1000
2.2
3.3 V
90
80
1.2 V
70
60
VOUT = 0.9 V
50
40
30
20
10
0
200
400
600
800
IOUT, OUTPUT CURRENT (mA)
SWITCHING FREQUENCY (MHz)
100
0
3.5
Figure 9. Standby Current vs. Input Voltage
(Enable = 0, Temperature = 255C)
100
0
3.0
VIN, INPUT VOLTAGE (V)
100
0
EFFICIENCY (%)
30
VIN, INPUT VOLTAGE (V)
80
EFFICIENCY (%)
5.0
EFFICIENCY (%)
Istb, STANDBY CURRENT (mA)
1.0
1000
2.1
2
1.9
VIN = 2.7 V
1.8
1.7
1.6
3.6 V
1.5
1.4
5.5 V
1.3
1.2
−60
Figure 13. Efficiency vs. Output Current
(VIN = 3.6 V, Temperature = 255C)
−20
20
60
TA, AMBIENT TEMPERATURE (°C)
100
Figure 14. Switching Frequency vs. Ambient
Temperature (Vout = 1.2 V, Iout = 200 mA)
www.onsemi.com
7
3.0
3.0
2.0
2.0
LINE REGULATION (%)
LOAD REGULATION (%)
NCP1529
1.0
−40°C
0.0
−1.0
25°C
−2.0
−3.0
0
200
400
85°C
600
800
1000
1.0
100 mA
0
−1.0
1 mA
IOUT = 800 mA
−2.0
−3.0
2.7
3.2
3.7
4.2
4.7
5.2
IOUT, OUTPUT CURRENT (mA)
VIN, INPUT VOLTAGE (V)
Figure 15. Load Regulation vs. Output Current
(VIN = 5.5 V, VOUT = 1.2 V)
Figure 16. Line Regulation vs. Input Voltage
(VOUT = 1.2 V, Temperature = 255C)
Figure 17. 10 mA to 100 mA Load Transient in 1 ms
(VIN = 3.6 V, VOUT = 1.2 V, Temperature = 255C)
Figure 18. 200 mA to 600 mA Load Transient in 1 ms
(VIN = 3.6 V, VOUT = 1.2 V, Temperature = 255C)
Figure 19. 3.0 V to 3.6 V Line Transient, Rise = 50 ms
(VIN = 1.2 V, IOUT = 100 mA, Temperature = 255C)
Figure 20. 3.6 V to 3.0 V Line Transient, Fall = 50 ms
(VIN = 1.2 V, IOUT = 100 mA, Temperature = 255C)
www.onsemi.com
8
NCP1529
Figure 22. Short−Circuit Protection (VIN = 3.6 V,
VOUT = 1.2 V, IOUT = CC, Temperature = 255C)
1.2
2.55
ENABLE THRESHOLD VOLTAGES (V)
2.60
UVLOrise
2.50
2.45
UVLOfall
2.40
2.35
2.30
2.25
−25
0
25
50
75
100
125
1.1
1.0
0.9
VIH
0.8
0.7
VIL
0.6
0.5
0.4
−40
−15
10
35
60
TA, AMBIENT TEMPERATURE (°C)
TA, AMBIENT TEMPERATURE (°C)
Figure 23. Undervoltage Lockout Threshold
vs. Ambient Temperature
Figure 24. Enable Threshold Voltages vs.
Ambient Temperature
70
200
160
50
120
30
Phase
40
10
0
Gain
−10
−40
−80
−30
−50
10
80
PHASE (°)
2.20
−50
GAIN (dB)
UNDERVOLTAGE LOCKOUT THRESHOLD (V)
Figure 21. Typical Soft−Start (VIN = 3.6 V, VOUT = 1.2 V,
IOUT = 100 mA, Temperature = 255C)
−120
100
1000
10000
100000
−160
1000000
FREQUENCY (Hz)
Figure 25. Phase and Gain Performance
(VIN = 3.6 V, VOUT = 1.2 V, IOUT = 200 mA, Temperature = 255C)
www.onsemi.com
9
85
NCP1529
DC/DC OPERATION DESCRIPTION
Detailed Description
VOUT
The NCP1529 uses a constant frequency, current mode
step−down architecture. Both the main (P−channel
MOSFET) and synchronous (N−channel MOSFET)
switches are internal.
The output voltage is set by an external resistor divider in
the range of 0.9 V to 3.9 V and can source at least 1A.
The NCP1529 works with two modes of operation;
PWM/PFM depending on the current required. In PWM
mode, the device can supply voltage with a tolerance of
$3% and 90% efficiency or better. Lighter load currents
cause the device to automatically switch into PFM mode to
reduce current consumption and extended battery life.
Additional features include soft−start, undervoltage
protection, current overload protection and thermal
shutdown protection. As shown on Figure 1, only six
external components are required. The part uses an internal
reference voltage of 0.6 V. It is recommended to keep
NCP1529 in shutdown mode until the input voltage is 2.7 V
or higher.
ISW
VSW
Figure 26. PWM Switching Waveforms
(VIN = 3.6 V, VOUT = 1.2 V, IOUT = 600 mA,
Temperature = 255C)
PFM Operating Mode
Under light load conditions, the NCP1529 enters in low
current PFM mode of operation to reduce power
consumption. The output regulation is implemented by
pulse frequency modulation. If the output voltage drops
below the threshold of PFM comparator a new cycle will be
initiated by the PFM comparator to turn on the switch Q1.
Q1 remains ON during the minimum on time of the structure
while Q2 is in its current source mode. The peak inductor
current depends upon the drop between input and output
voltage. After a short dead time delay where Q1 is switched
OFF, Q2 is turned in its ON state. The negative current
detector will detect when the inductor current drops below
zero and sends a signal to turn Q2 to current source mode to
prevent a too large deregulation of the output voltage. When
the output voltage falls below the threshold of the PFM
comparator, a new cycle starts immediately.
PWM Operating Mode
In this mode, the output voltage of the device is regulated
by modulating the on−time pulse width of the main switch
Q1 at a fixed 1.7 MHz frequency.
The switching of the PMOS Q1 is controlled by a flip−flop
driven by the internal oscillator and a comparator that
compares the error signal from an error amplifier with the
sum of the sensed current signal and compensation ramp.
The driver switches ON and OFF the upper side transistor
(Q1) while the lower side transistor is switched OFF then
ON.
At the beginning of each cycle, the main switch Q1 is
turned ON by the rising edge of the internal oscillator clock.
The inductor current ramps up until the sum of the current
sense signal and compensation ramp becomes higher than
the error amplifier’s voltage. Once this has occurred, the
PWM comparator resets the flip−flop, Q1 is turned OFF
while the synchronous switch Q2 is turned ON. Q2 replaces
the external Schottky diode to reduce the conduction loss
and improve the efficiency. To avoid overall power loss, a
certain amount of dead time is introduced to ensure Q1 is
completely turned OFF before Q2 is being turned ON.
VOUT
VSW
ISW
Figure 27. PFM Switching Waveforms
(VIN = 3.6 V, VOUT = 1.2 V, IOUT = 0 mA,
Temperature = 255C)
www.onsemi.com
10
NCP1529
Soft−Start
temperature exceeds 180°C, the device shuts down. In this
mode all power transistors and control circuits are turned
off. The device restarts in soft−start after the temperature
drops below 140°C. This feature is provided to prevent
catastrophic failures from accidental device overheating.
The NCP1529 uses soft−start to limit the inrush current
when the device is initially powered up or enabled. Soft start
is implemented by gradually increasing the reference
voltage until it reaches the full reference voltage. During
startup, a pulsed current source charges the internal
soft−start capacitor to provide gradually increasing
reference voltage. When the voltage across the capacitor
ramps up to the nominal reference voltage, the pulsed
current source will be switched off and the reference voltage
will switch to the regular reference voltage.
Short Circuit Protection
When the output is shorted to ground, the device limits the
inductor current. The duty−cycle is minimum and the
consumption on the input line is 550 mA (typ). When the
short circuit condition is removed, the device returns to the
normal mode of operation.
Cycle−by−cycle Current Limitation
USB or 5 V Rail Powered Applications
From the block diagram, an ILIM comparator is used to
realize cycle−by−cycle current limit protection. The
comparator compares the SW pin voltage with the reference
voltage, which is biased by a constant current. If the inductor
current reaches the limit, the ILIM comparator detects the
SW voltage falling below the reference voltage and releases
the signal to turn off the switch Q1. The cycle−by−cycle
current limit is set at 1600 mA (nom).
For USB or 5 V rail powered applications, NCP1529 is
able to supply voltages up to 3.9 V, 600 mA, operating in
PWM mode only, with high efficiency (Figure 28), low
output voltage ripple and good load regulation results over
all current range (Figure 29).
100
95
90
Low Dropout Operation
ǒ
V out + V OUT(max) ) I OUTǒR DS(on)_R INDUCTORǓ
•
•
•
•
Ǔ
EFFICIENCY (%)
The NCP1529 offers a low input to output voltage
difference. The NCP1529 can operate at 100% duty cycle.
In this mode the PMOS (Q1) remains completely ON. The
minimum input voltage to maintain regulation can be
calculated as:
(eq. 1)
VOUT: Output Voltage (V)
IOUT: Max Output Current
RDS(on): P−Channel Switch RDS(on)
RINDUCTOR: Inductor Resistance (DCR)
−40°C
85
80
75
70
65
60
55
50
45
40
25°C
85°C
0
200
400
600
800
1000
IOUT, OUTPUT CURRENT (mA)
Figure 28. Efficiency vs. Output Current
(VIN = 5.0 V, VOUT = 3.9 V)
Undervoltage Lockout
3.0
The Input voltage VIN must reach 2.4 V (typ) before the
NCP1529 enables the DC/DC converter output to begin the
start up sequence (see soft−start section). The UVLO
threshold hysteresis is typically 100 mV.
LOAD REGULATION (%)
2.5
2.0
Shutdown Mode
Forcing this pin to a voltage below 0.4 V will shut down
the IC. In shutdown mode, the internal reference, oscillator
and most of the control circuitries are turned off. Therefore,
the typical current consumption will be 0.3 mA (typical
value). Applying a voltage above 1.2 V to EN pin will enable
the DC/DC converter for normal operation. The device will
go through soft−start to normal operation.
1.5
1.0
0.5
−40°C
0.0
−0.5
−1.0
−1.5
25°C
85°C
−2.0
−2.5
−3.0
Thermal Shutdown
0
200
400
600
800
1000
IOUT, OUTPUT CURRENT (mA)
Internal Thermal Shutdown circuitry is provided to
protect the integrated circuit in the event that the maximum
junction Temperature is exceeded. If the junction
Figure 29. Load Regulation vs. Output Current
(VIN = 5.0 V, VOUT = 3.9 V)
www.onsemi.com
11
NCP1529
APPLICATION INFORMATION
Output Voltage Selection
Input Capacitor Selection
In case of adjustable versions, the output voltage is
programmed through an external resistor divider connected
from VOUT to FB then to GND.
For low power consumption and noise immunity, the
resistor from FB to GND (R2) should be in the [100k−600k]
range. If R2 is 200 k given the VFB is 0.6 V, the current
through the divider will be 3.0 mA.
The formula below gives the value of VOUT, given the
desired R1 and the R1 value:
In PWM operating mode, the input current is pulsating
with large switching noise. Using an input bypass capacitor
can reduce the peak current transients drawn from the input
supply source, thereby reducing switching noise
significantly. The capacitance needed for the input bypass
capacitor depends on the source impedance of the input
supply.
The maximum RMS current occurs at 50% duty cycle
with maximum output current, which is IO, max/2.
For NCP1529, a low profile ceramic capacitor of 4.7 mF
should be used for most of the cases. For effective bypass
results, the input capacitor should be placed as close as
possible to the VIN Pin
V out + V FB
•
•
•
•
(1 ) R1ńR2)
(eq. 2)
VOUT: Output Voltage (V)
VFB: Feedback Voltage = 0.6 V
R1: Feedback Resistor from VOUT to FB
R2: Feedback Resistor from FB to GND
Table 1. LIST OF INPUT CAPACITORS
Manufacturer
Part Number
Case Size
Value
(mF)
DC Bias
(V)
Technology
MURATA
GRM15 series
0402
4.7
6.3
X5R
MURATA
GRM18 series
0603
4.7
10
X5R
TDK
C1608 series
0603
4.7
6.3
X5R
TDK
C1608 series
0603
4.7
10
X5R
Output L−C Filter Design Considerations
Inductor Selection
The NCP1529 operates at 1.7 MHz frequency and uses
current mode architecture. The correct selection of the
output filter ensures good stability and fast transient
response.
Due to the nature of the buck converter, the output L−C
filter must be selected to work with internal compensation.
For NCP1529, the internal compensation is internally fixed
and it is optimized for an output filter of L = 2.2 mH and
COUT = 10 mF.
The corner frequency is given by:
The inductor parameters directly related to device
performances are saturation current and DC resistance and
inductance value. The inductor ripple current (DIL)
decreases with higher inductance:
f+
1
2p ǸL
C OUT
+
1
2p Ǹ2.2 mH
10 mF
DI L +
The device operates with inductance value of 2.2 mH. If
the corner frequency is moved, it is recommended to check
the loop stability depending of the accepted output ripple
voltage and the required output current. Take care to check
the loop stability. The phase margin is usually higher than
45°.
I L(max) + I O(max) )
10 mF
4.7 mH
4.7 mF
Ǔ
V OUT
V IN
DI L
2
• IL(max): Maximum inductor current
• IO(max): Maximum Output current
(eq. 4)
(eq. 5)
The inductor’s resistance will factor into the overall
efficiency of the converter. For best performances, the DC
resistance should be less than 0.3 W for good efficiency.
Table 2. L−C FILTER EXAMPLE
2.2 mH
f SW
1*
The saturation current of the inductor should be rated
higher than the maximum load current plus half the ripple
current:
(eq. 3)
Output Capacitor (COUT)
L
ǒ
• DIL: Peak to peak inductor ripple current
• L: Inductor value
• fSW: Switching frequency
+ 34 kHz
Inductance (L)
V OUT
www.onsemi.com
12
NCP1529
Table 3. LIST OF INDUCTORS
Manufacturer
Part Number
Case
Size
(mm)
Height
Max
(mm)
L
(mH)
DCR
Typ
(W)
DCR
Max
(W)
Rated
Current (mA)
Inductance
Drop
Rated
Current (mA)
Temperature
Drop
Structure
COILCRAFT
DO1605T-222
5.5 x 4.2
1.8
2.2
NA
0.070
1800 (-10%)
1700 (+40°C)
Wire Wound
COILCRAFT
EPL3015-222
3.0 x 3.0
1.5
2.2
0.082
0.094
1600 (-30%)
2000 (+40°C)
Wire Wound
COILCRAFT
EPL2014-222
2.0 x 2.0
1.4
2.2
0.120
0.132
1300 (-30%)
1810 (+40°C)
Wire Wound
MURATA
LQM2HPN2R2
2.5 x 2.0
1.0
2.2
0.080
0.100
NA
1300 (+40°C)
Multilayer
MURATA
LQH3NPN2R2
3.0 x 3.0
1.2
2.2
0.065
0.085
1150 (-30%)
1460 (+40°C)
Wire Wound
MURATA
LQH44PN2R2
4.0 x 4.0
1.8
2.2
0.049
0.059
2500 (-30%)
1800 (+40°C)
Wire Wound
TDK
MLP2520S2R2L
2.5 x 2.0
1.0
2.2
0.080
0.104
1300 (-30%)
NA
Multilayer
TDK
VLS252010T2R2
2.0 x 1.6
1.2
2.2
0.158
0.190
1400 (-30%)
1100 (+40°C)
Wire Wound
744 029 002
2.8 x 2.8
1.35
2.2
0.088
0.105
1150 (-35%)
1700 (+40°C)
Wire Wound
WURTH ELEC
Output Capacitor Selection
The output ripple voltage in PWM mode is given by:
Selecting the proper output capacitor is based on the
desired output ripple voltage. Ceramic capacitors with low
ESR values will have the lowest output ripple voltage and
are strongly recommended. The output capacitor requires
either an X7R or X5R dielectric.
DV OUT + DI L
ǒ
1
4
f SW
C OUT
) ESR
Ǔ
(eq. 6)
Table 4. LIST OF OUTPUT CAPACITORS
Manufacturer
Part Number
Case Size
Value
(mF)
DC Bias
(V)
Technology
MURATA
GRM15 series
0402
4.7
6.3
X5R
MURATA
GRM18 series
0603
4.7
10
X5R
MURATA
GRM18 series
0603
10
6.3
X5R
TDK
C1608 series
0603
4.7
6.3
X5R
TDK
C1608 series
0603
4.7
10
X5R
TDK
C1608 series
0603
10
6.3
X5R
Feed−Forward Capacitor Selection (Adjustable Only)
Having feed-forward capacitor of 1 nF or higher can
increase soft−start time and reduce inrush current. Choose a
small ceramic capacitor X7R or X5R or COG dielectric.
The feed-forward capacitor sets the feedback loop
response and acts on soft-start time. A minimum 18 pF
feed-forward capacitor is needed to ensure loop stability.
www.onsemi.com
13
NCP1529
LAYOUT CONSIDERATIONS
Electrical Layout Considerations
capacitor is recommended to meet compensation
requirements.
A four layer PCB with a ground plane and a power plane
will help NCP1529 noise immunity and loop stability.
Implementing a high frequency DC−DC converter
requires respect of some rules to get a powerful portable
application. Good layout is key to prevent switching
regulators to generate noise to application and to
themselves.
Electrical layout guide lines are:
• Use short and large traces when large amount of current
is flowing.
• Keep the same ground reference for input and output
capacitors to minimize the loop formed by high current
path from the battery to the ground plane.
• Isolate feedback pin from the switching pin and the
current loop to protect against any external parasitic
signal coupling. Add a feed−forward capacitor between
VOUT and FB which adds a zero to the loop and
participates to the good loop stability. A 18 pF
Thermal Layout Considerations
High power dissipation in small package leads to thermal
consideration such as:
• Enlarge VIN trace and added several vias connected to
power plane.
• Connect GND pin to top plane.
• Join top, bottom and each ground plane together using
several free vias in order to increase radiator size.
For high ambient temperature and high power dissipation
requirements, UDFN6 package using exposed pad
connected to main radiator is recommended. Refer to
Notes 7, 8, and 9.
VOUT
Trace
EN Trace
FB Trace
VIN Trace
SW
Trace
SW
Trace
VIN Trace
FB Trace
VOUT
Trace
GND Plane
GND Plane
EN Trace
Figure 30. TSOP−5 Recommended Board Layout
Figure 31. UDFN6 Recommended Board Layout
ORDERING INFORMATION
Nominal
Output Voltage
Marking
Package
Shipping†
NCP1529ASNT1G*
Adj
DXJ
TSOP−5
3000 / Tape & Reel
NCP1529MUTBG*
Adj
TL
NCP1529MU12TBG**
1.2 V
TC
UDFN6
3000 / Tape & Reel
NCP1529MU135TBG
1.35 V
RC
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*Not recommended for new designs.
**This device is End of Life. Please contact sales for additional information and assistance with replacement devices.
The product described herein (NCP1529), may be covered by the following U.S. patents: TBD. There may be other patents pending.
www.onsemi.com
14
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSOP−5
CASE 483
ISSUE N
5
1
SCALE 2:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
D 5X
NOTE 5
2X
DATE 12 AUG 2020
0.20 C A B
0.10 T
M
2X
0.20 T
5
B
1
4
2
B
S
3
K
DETAIL Z
G
A
A
TOP VIEW
DIM
A
B
C
D
G
H
J
K
M
S
DETAIL Z
J
C
0.05
H
C
SIDE VIEW
SEATING
PLANE
END VIEW
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
0.95
0.037
MILLIMETERS
MIN
MAX
2.85
3.15
1.35
1.65
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
1.9
0.074
5
5
XXXAYWG
G
1
1
Analog
2.4
0.094
XXX = Specific Device Code
A
= Assembly Location
Y
= Year
W = Work Week
G
= Pb−Free Package
1.0
0.039
XXX MG
G
Discrete/Logic
XXX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98ARB18753C
TSOP−5
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6 2x2, 0.65P
CASE 517AB
ISSUE C
DATE 10 APR 2013
SCALE 4:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED
BETWEEN 0.15 AND 0.25MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE
TERMINALS.
5. TIE BARS MAY BE VISIBLE IN THIS VIEW AND ARE CONNECTED TO
THE THERMAL PAD.
A B
D
NOTE 5
PIN ONE
REFERENCE
0.10 C
0.10 C
ÍÍ
ÍÍ
ÍÍ
E
END VIEW
TOP VIEW
ÉÉÉ
ÉÉÉ
ÇÇÇ
A3
DETAIL B
0.10 C
EXPOSED Cu
A
6X
0.08 C
A1
NOTE 4
C
SIDE VIEW
DETAIL A
D2
1
SEATING
PLANE
L
3
4
6X
L
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
b
e
BOTTOM VIEW
0.10
M
C A B
0.05
M
C
A1
GENERIC
MARKING DIAGRAM*
ALTERNATE
CONSTRUCTIONS
L1
6
A3
DETAIL B
L
E2
ÉÉ
ÉÉ
ÇÇ
MOLD CMPD
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.25
0.35
2.00 BSC
1.50
1.70
2.00 BSC
0.80
1.00
0.65 BSC
0.25
0.35
--0.15
DIM
A
A1
A3
b
D
D2
E
E2
e
L
L1
XXMG
G
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
1.70
6X
0.47
2.30
0.95
1
0.65
PITCH
6X
0.40
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON22162D
UDFN6 2X2, 0.65P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
onsemi Website: www.onsemi.com
◊
TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative
工商网监
湘ICP备2023018690号
