DATA SHEET
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LDO Regulator for RF and
Analog Circuits - Ultra-Low
Noise and High PSRR
450 mA
WLCSP4
CASE 567JZ
WLCSP4
CASE 567KA
1
XDFN4
CASE 711AJ
NCP161
The NCP161 is a linear regulator capable of supplying 450 mA
output current. Designed to meet the requirements of RF and analog
circuits, the NCP161 device provides low noise, high PSRR, low
quiescent current, and very good load/line transients. The device is
designed to work with a 1 mF input and a 1 mF output ceramic capacitor.
It is available in two thickness ultra−small 0.35P, 0.64 mm x 0.64 mm
Chip Scale Package (CSP) and XDFN4 0.65P, 1 mm x 1 mm.
1
SOT23−5
CASE 527AH
MARKING DIAGRAMS
A1
X
X
A1
•
•
•
•
•
•
•
•
•
•
•
Operating Input Voltage Range: 1.9 V to 5.5 V
Available in Fixed Voltage Option: 1.8 V to 5.14 V
±2% Accuracy Over Load/Temperature
Ultra Low Quiescent Current Typ. 18 mA
Standby Current: Typ. 0.1 mA
Very Low Dropout: 150 mV at 450 mA
Ultra High PSRR: Typ. 98 dB at 20 mA, f = 1 kHz
Ultra Low Noise: 10 mVRMS
Stable with a 1 mF Small Case Size Ceramic Capacitors
Available in −WLCSP4 0.64 mm x 0.64 mm x 0.4 mm
−WLCSP4 0.64 mm x 0.64 mm x 0.33 mm
−XDFN4 1 mm x 1 mm x 0.4 mm
−SOT23−5 2.9 mm x 2.8 mm x 1.2 mm
These Devices are Pb−Free and are RoHS Compliant
XX M
1
X, XX, XXX = Specific Device Code
M
= Date Code
PIN CONNECTIONS (Top Views)
Battery−powered Equipment
Wireless LAN Devices
Smartphones, Tablets
Cameras, DVRs, STB and Camcorders
IN
1
GND
2
EN
3
IN
OUT
A1
A2
Typical Applications
•
•
•
•
XXX M
Features
5
OUT
4
NC
IN
4
EN
3
EPAD
B1
B2
EN
GND
1
OUT
2
GND
ORDERING INFORMATION
See detailed ordering and shipping information on page 17 of
this data sheet.
© Semiconductor Components Industries, LLC, 2017
September, 2022 − Rev. 19
1
Publication Order Number:
NCP161/D
NCP161
VOUT
VIN
IN
OUT
NCP161
CIN
1 mF
Ceramic
EN
COUT
1 mF
Ceramic
ON
GND
OFF
Figure 1. Typical Application Schematics
IN
EN
ENABLE
THERMAL
LOGIC
SHUTDOWN
BANDGAP
MOSFET
REFERENCE
INTEGRATED
DRIVER WITH
SOFT−START
CURRENT LIMIT
OUT
* ACTIVE DISCHARGE
Version A only
EN
GND
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
CSP4
Pin No.
SOT23−5
Pin No.
XDFN4
Pin
Name
A1
1
4
IN
A2
5
1
OUT
Regulated output voltage. The output should be bypassed with small 1 mF ceramic capacitor.
B1
3
3
EN
Chip enable: Applying VEN < 0.4 V disables the regulator, Pulling VEN > 1.2 V enables the LDO.
B2
2
2
GND
Common ground connection
−
−
EPAD
EPAD
Expose pad should be tied to ground plane for better power dissipation
Description
Input voltage supply pin
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2
NCP161
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VIN
−0.3 V to 6
V
Output Voltage
VOUT
−0.3 to VIN + 0.3, max. 6
V
Chip Enable Input
VCE
−0.3 to 6
V
Output Short Circuit Duration
tSC
unlimited
s
Maximum Junction Temperature
TJ
150
°C
Input Voltage (Note 1)
Storage Temperature
TSTG
−55 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114
ESD Machine Model tested per EIA/JESD22−A115
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS
Rating
Symbol
Thermal Characteristics, CSP4 (Note 3)
Thermal Resistance, Junction−to−Air
Thermal Characteristics, XDFN4 (Note 3)
Thermal Resistance, Junction−to−Air
Thermal Characteristics, SOT23−5 (Note 3)
Thermal Resistance, Junction−to−Air
3
Unit
108
RqJA
3. Measured according to JEDEC board specification. Detailed description of the board can be found in JESD51−7
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Value
198.1
218
°C/W
NCP161
ELECTRICAL CHARACTERISTICS −40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 1 V; IOUT = 1 mA, CIN = COUT = 1 mF, unless otherwise
noted. VEN = 1.2 V. Typical values are at TJ = +25°C (Note 4).
Parameter
Test Conditions
Operating Input Voltage
Output Voltage Accuracy
Line Regulation
Load Regulation
Dropout Voltage (Note 5)
VIN = VOUT(NOM) + 1 V
0 mA ≤ IOUT ≤ 450 mA
WLCSP4, XDFN4
VIN = VOUT(NOM) + 1 V
SOT23−5
VOUT(NOM) + 1 V ≤ VIN ≤ 5.5 V
IOUT = 1 mA to 450 mA
WLCSP4, XDFN4
WLCSP4, XDFN4
IOUT = 450 mA
WLCSP4, XDFN4
IOUT = 450 mA
SOT23−5
Min
Max
Unit
VIN
1.9
5.5
V
−2
+2
−2
+2
VOUT
LineReg
Typ
0.02
LoadReg
0.008
VOUT(NOM) = 1.8 V
300
450
VOUT(NOM) = 1.85 V
290
393
VOUT(NOM) = 2.5 V
190
315
VOUT(NOM) = 2.8 V
175
290
VOUT(NOM) = 2.85 V
170
290
165
275
VOUT(NOM) = 3.3 V
160
260
VOUT(NOM) = 3.5 V
150
255
VOUT(NOM) = 4.5 V
120
210
VOUT(NOM) = 5.0 V
105
190
VOUT(NOM) = 5.14 V
105
185
VOUT(NOM) = 1.8 V
365
480
VOUT(NOM) = 2.8 V
260
345
240
330
225
305
VOUT(NOM) = 3.0 V
VDO
VDO
VOUT(NOM) = 3.3 V
mV
mV
VOUT = 90% VOUT(NOM)
ICL
Short Circuit Current
VOUT = 0 V
ISC
690
Quiescent Current
IOUT = 0 mA
IQ
18
23
mA
Shutdown Current
VEN ≤ 0.4 V, VIN = 4.8 V
IDIS
0.01
1
mA
EN Input Voltage “H”
VENH
EN Input Voltage “L”
VENL
VEN = 4.8 V
IEN
EN Pull Down Current
Turn−On Time
Power Supply Rejection Ratio
Output Voltage Noise
Thermal Shutdown Threshold
Active output discharge resistance
Line transient (Note 6)
0.4
0.2
0.5
V
mA
120
ms
f = 100 Hz
f = 1 kHz
f = 10 kHz
f = 100 kHz
PSRR
91
98
82
48
dB
IOUT = 1 mA
IOUT = 250 mA
VN
14
10
mVRMS
Temperature rising
TSDH
160
°C
Temperature falling
TSDL
140
°C
VEN < 0.4 V, Version A only
RDIS
280
W
f = 10 Hz to 100 kHz
VIN = (VOUT(NOM) + 1 V) to (VOUT(NOM) + 1.6 V)
in 30 ms, IOUT = 1 mA
VIN = (VOUT(NOM) + 1.6 V) to (VOUT(NOM) + 1 V)
in 30 ms, IOUT = 1 mA
Load transient (Note 6)
mA
1.2
COUT = 1 mF, From assertion of VEN to
VOUT = 95% VOUT(NOM)
IOUT = 20 mA
700
%/mA
Output Current Limit
EN Pin Threshold Voltage
450
%
%/V
0.001
0.005
SOT23−5
VOUT(NOM) = 3.0 V
Dropout Voltage (Note 5)
Symbol
IOUT = 1 mA to 450 mA in 10 ms
IOUT = 450 mA to 1mA in 10 ms
−1
TranLINE
TranLOAD
mV
+1
−40
+40
mV
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at TA = 25°C.
Low duty cycle pulse techniques are used during the testing to maintain the junction temperature as close to ambient as possible.
5. Dropout voltage is characterized when VOUT falls 100 mV below VOUT(NOM).
6. Guaranteed by design.
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4
NCP161
TYPICAL CHARACTERISTICS
2.520
1.820
1.815
2.515
VOUT, OUTPUT VOLTAGE (V)
VOUT, OUTPUT VOLTAGE (V)
IOUT = 10 mA
1.805
2.505
IOUT = 450 mA
1.800
2.495
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
1.790
1.785
1.780
−40 −20
0
20
40
60
80
100
120
VIN = 3.5 V
VOUT = 2.5 V
CIN = 1 mF
COUT = 1 mF
2.490
2.485
2.480
−40 −20
140
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 3. Output Voltage vs. Temperature −
VOUT = 1.8 V − XDFN Package
Figure 4. Output Voltage vs. Temperature −
VOUT = 2.5 V − XDFN Package
3.33
3.35
3.32
3.34
VOUT, OUTPUT VOLTAGE (V)
VOUT, OUTPUT VOLTAGE (V)
IOUT = 450 mA
2.500
1.795
3.31
IOUT = 10 mA
3.30
3.29
IOUT = 450 mA
3.28
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
3.27
3.26
3.25
−40 −20
0
20
40
60
80
100
120
3.33
IOUT = 10 mA and 450 mA
3.32
3.31
3.30
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
3.29
3.28
3.27
−40 −20
140
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 5. Output Voltage vs. Temperature −
VOUT = 3.3 V − XDFN Package
Figure 6. Output Voltage vs. Temperature −
VOUT = 3.3 V − CSP Package
0.010
REGLINE, LINE REGULATION (%/V)
5.19
VOUT, OUTPUT VOLTAGE (V)
IOUT = 10 mA
2.510
1.810
5.18
5.17
IOUT = 10 mA
5.16
5.15
IOUT = 450 mA
5.14
VIN = 5.5 V
VOUT = 5.14 V
CIN = 1 mF
COUT = 1 mF
5.13
5.12
5.11
−40 −20
0
20
40
60
80
100
120
140
0.009
0.008
0.007
0.006
0.005
0.004
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
0.003
0.002
0.001
0
−40 −20
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 7. Output Voltage vs. Temperature −
VOUT = 5.14 V − XDFN Package
Figure 8. Line Regulation vs. Temperature −
VOUT = 1.8 V
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NCP161
TYPICAL CHARACTERISTICS
REGLINE, LINE REGULATION (%/V)
0.020
REGLINE, LINE REGULATION (%/V)
0.010
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
0.009
0.008
0.007
0.016
0.014
0.012
0.006
0.005
0.010
0.008
0.004
0.006
0.003
0.004
0.002
0.001
0
−40 −20
0
20
40
60
80
100
120
140
40
60
80
100
120 140
Figure 10. Line Regulation vs. Temperature −
VOUT = 5.14 V
0.0014
0.0012
0.0010
0.0008
0.0006
VIN = 2.8 V, VOUT = 1.8 V
CIN = 1 mF, COUT = 1 mF
IOUT = 1 mA to 450 mA
0.0004
0.0002
0
−40 −20
0
20
40
60
80
100
120
REGLOAD, LOAD REGULATION (%/mA)
REGLOAD, LOAD REGULATION (%/mA)
20
Figure 9. Line Regulation vs. Temperature −
VOUT = 3.3 V
0.0016
0.0020
0.0018
0.0016
0.0014
0.0012
0.0010
0.0008
0.0006
VIN = 4.3 V, VOUT = 3.3 V
CIN = 1 mF, COUT = 1 mF
IOUT = 1 mA to 450 mA
0.0004
0.0002
0
140
−40 −20
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 11. Load Regulation vs. Temperature −
VOUT = 1.8 V (WLCSP4)
Figure 12. Load Regulation vs. Temperature −
VOUT = 3.3 V (WLCSP4)
REGLOAD, LOAD REGULATION (mV)
0.0020
0.0016
0
TJ, JUNCTION TEMPERATURE (°C)
0.0018
0.0018
0.002
0
−40 −20
TJ, JUNCTION TEMPERATURE (°C)
0.0020
REGLOAD, LOAD REGULATION (%/mA)
VIN = 5.5 V
VOUT = 5.14 V
CIN = 1 mF
COUT = 1 mF
0.018
VIN = 5.5 V, COUT = 1 mF
VOUT = 5.14 V, CIN = 1 mF
IOUT = 1 mA to 450 mA
0.0014
0.0012
0.0010
0.0008
0.0006
0.0004
0.0002
0
−40 −20
0
20
40
60
80
100
120
140
70
IOUT = 1 mA to 450 mA
60 CIN = 1 mF
SOT23−5 Package
50
40
30
XDFN4 Package
20
10
WLCSP4 Package
0
−40 −20
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 13. Load Regulation vs. Temperature −
VOUT = 5.14 V (WLCSP4)
Figure 14. Load Regulation vs. Temperature
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NCP161
TYPICAL CHARACTERISTICS
IGND, GROUND CURRENT (mA)
2.0
1.8
TJ = 125°C
1.6
1.4
TJ = 25°C
1.2
1.0
0.8
TJ = −40°C
0.6
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
0.4
0.2
0
0
50
100 150 200 250 300 350 400 450 500
IOUT, OUTPUT CURRENT (mA)
2.0
2.50
1.8
2.25
IGND, GROUND CURRENT (mA)
IGND, GROUND CURRENT (mA)
Figure 15. Ground Current vs. Load Current −
VOUT = 1.8 V
TJ = 125°C
1.6
1.4
TJ = 25°C
1.2
1.0
0.8
TJ = −40°C
0.6
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
0.4
0.2
0
0
50
100 150 200 250 300 350 400
450 500
TJ = 25°C
1.50
1.25
1.00
TJ = −40°C
0.75
VIN = 5.5 V
VOUT = 5.14 V
CIN = 1 mF
COUT = 1 mF
0.50
0.25
0
0
50
100 150 200 250 300 350 400 450 500
IOUT, OUTPUT CURRENT (mA)
Figure 16. Ground Current vs. Load Current −
VOUT = 3.3 V
Figure 17. Ground Current vs. Load Current −
VOUT = 5.14 V
225
360
VDROP, DROPOUT VOLTAGE (mV)
VDROP, DROPOUT VOLTAGE (mV)
1.75
IOUT, OUTPUT CURRENT (mA)
400
TJ = 125°C
320
280
TJ = 25°C
240
200
TJ = −40°C
160
120
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
80
40
0
TJ = 125°C
2.00
0
50
100 150 200 250 300 350 400
200
175
TJ = 25°C
150
125
100
TJ = −40°C
75
50
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
25
0
450 500
TJ = 125°C
0
50
100 150 200 250 300 350 400 450 500
IOUT, OUTPUT CURRENT (mA)
IOUT, OUTPUT CURRENT (mA)
Figure 18. Dropout Voltage vs. Load Current −
VOUT = 1.8 V
Figure 19. Dropout Voltage vs. Load Current −
VOUT = 3.3 V
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NCP161
TYPICAL CHARACTERISTICS
400
TJ = 125°C
135
120
VDROP, DROPOUT VOLTAGE (mV)
VDROP, DROPOUT VOLTAGE (mV)
150
TJ = 25°C
105
90
75
TJ = −40°C
60
45
VOUT = 5.14 V
CIN = 1 mF
COUT = 1 mF
30
15
0
0
50
100 150 200 250 300 350 400
450 500
320
IOUT = 450 mA
280
240
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
200
160
120
80
40
0
−40 −20
IOUT = 0 mA
0
20
40
60
80
100
120 140
IOUT, OUTPUT CURRENT (mA)
TJ, JUNCTION TEMPERATURE (°C)
Figure 20. Dropout Voltage vs. Load Current −
VOUT = 5.14 V
Figure 21. Dropout Voltage vs. Temperature−
VOUT = 1.8 V
150
VDROP, DROPOUT VOLTAGE (mV)
250
225
IOUT = 450 mA
200
175
150
125
100
75
IOUT = 0 mA
50
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
25
0
−40 −20
0
20
40
60
80
100
120
140
135
120
IOUT = 450 mA
105
90
IOUT = 0 mA
75
60
45
VOUT = 5.14 V
CIN = 1 mF
COUT = 1 mF
30
15
0
−40 −20
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 22. Dropout Voltage vs. Temperature−
VOUT = 3.3 V
Figure 23. Dropout Voltage vs. Temperature−
VOUT = 5.14 V
500
VDROP, DROPOUT VOLTAGE (mV)
VDROP, DROPOUT VOLTAGE (mV)
360
450
SOT23−5 Package
XDFN4 Package
400
350
300
WLCSP4 Package
250
200
150
IOUT = 450 mA
CIN = 1 mF
COUT = 1 mF
100
50
0
−40 −20
0
20
40
60
80
100
120
TJ, JUNCTION TEMPERATURE (°C)
Figure 24. Dropout Voltage vs. Temperature
VOUT = 1.8 V
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140
NCP161
TYPICAL CHARACTERISTICS
ISC, SHORT CIRCUIT CURRENT (mA)
750
730
720
710
700
690
680
660
650
−40 −20
VEN, ENABLE VOLTAGE THRESHOLD (V)
VIN = 4.3 V
VOUT = 90% VOUT(nom)
CIN = 1 mF
COUT = 1 mF
670
0
20
40
60
80
100
120
140
690
680
670
660
650
640
630
610
600
−40 −20
0.50
0.45
0.8
OFF −> ON
0.7
0.6
ON −> OFF
0.5
0.4
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
0.3
0.2
0.1
0
−40 −20
0
20
40
60
80
100
120
140
40
60
80
100
120 140
0.40
0.35
0.30
0.25
0.20
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
0.15
0.10
0.05
0
−40 −20
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 27. Enable Threshold Voltage vs.
Temperature
Figure 28. Enable Current Temperature
300
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
RDIS, DISCHARGE RESISTIVITY
70
20
Figure 26. Short Circuit Current vs.
Temperature
0.9
80
0
Figure 25. Current Limit vs. Temperature
1.0
90
VIN = 4.3 V
VOUT = 0 V (Short)
CIN = 1 mF
COUT = 1 mF
620
TJ, JUNCTION TEMPERATURE (°C)
100
IDIS, DISABLE CURRENT (nA)
700
TJ, JUNCTION TEMPERATURE (°C)
IEN, ENABLE PIN CURRENT (mA)
ICL, CURRENT LIMIT (mA)
740
60
50
40
30
20
10
0
−40 −20
0
20
40
60
80
100
120 140
290
280
270
260
250
240
230
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
220
210
200
−40 −20
0
20
40
60
80
100
120 140
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 29. Disable Current vs. Temperature
Figure 30. Discharge Resistivity vs.
Temperature
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NCP161
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE NOISE (nV/√Hz)
10,000
IOUT = 450 mA
IOUT = 250 mA
1000
IOUT = 10 mA
IOUT = 1 mA
100
10
1
RMS Output Noise (mV)
VIN = 2.8 V
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
0.01
0.1
1
10
100
IOUT
10 Hz − 100 kHz
100 Hz − 100 kHz
1 mA
14.62
14.10
10 mA
11.12
10.48
250 mA
10.37
9.82
450 mA
10.22
9.62
1000
FREQUENCY (kHz)
Figure 31. Output Voltage Noise Spectral Density − VOUT = 1.8 V
OUTPUT VOLTAGE NOISE (nV/√Hz)
10,000
IOUT = 250 mA
IOUT = 450 mA
1000
IOUT = 10 mA
IOUT = 1 mA
100
10
1
RMS Output Noise (mV)
VIN = 4.3 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
0.01
0.1
1
10
100
IOUT
10 Hz − 100 kHz
100 Hz − 100 kHz
1 mA
16.9
15.79
10 mA
12.64
11.13
250 mA
11.96
10.64
450 mA
11.50
10.40
1000
FREQUENCY (kHz)
Figure 32. Output Voltage Noise Spectral Density − VOUT = 3.3 V
www.onsemi.com
10
NCP161
TYPICAL CHARACTERISTICS
120
120
80
60
IOUT = 100 mA
IOUT = 250 mA
20
0.01
0.1
1
10
100
1k
IOUT = 20 mA
40
IOUT = 100 mA
IOUT = 250 mA
20
IOUT = 450 mA
0.01
0.1
1
10
100
1k
FREQUENCY (kHz)
Figure 33. Power Supply Rejection Ratio,
VOUT = 1.8 V
Figure 34. Power Supply Rejection Ratio,
VOUT = 3.3 V
10k
100
IOUT = 20 mA
VIN = 5.5 V
VOUT = 5.14 V
COUT = 1 mF
Unstable Operation
10
50
ESR (W)
60
IOUT = 10 mA
40
IOUT = 100 mA
30
1
Stable Operation
IOUT = 250 mA
20
IOUT = 450 mA
0.01
0.1
1
10
100
1k
0.1
10k
0
50
100 150 200
250 300 350 400 450 500
FREQUENCY (kHz)
IOUT, OUTPUT CURRENT (mA)
Figure 35. Power Supply Rejection Ratio,
VOUT = 5.14 V
Figure 36. Stability vs. ESR
VEN
IINPUT
VOUT
500 mV/div
0
60
FREQUENCY (kHz)
70
10
VIN = 3.6 V
VOUT = 3.3 V
COUT = 1 mF
80
0
10k
IOUT = 10 mA
100
VIN = 2.8 V, VOUT = 1.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
200 mA/div
80
IOUT = 450 mA
1 V/div
RR, RIPPLE REJECTION (dB)
IOUT = 20 mA
40
90
500 mV/div
RR, RIPPLE REJECTION (dB)
100
0
1 V/div
VIN = 2.5 V
VOUT = 1.8 V
COUT = 1 mF
200 mA/div
RR, RIPPLE REJECTION (dB)
IOUT = 10 mA
VEN
IINPUT
VOUT
VIN = 2.8 V, VOUT = 1.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
100 ms/div
100 ms/div
Figure 37. Enable Turn−on Response −
COUT = 1 mF, IOUT = 10 mA
Figure 38. Enable Turn−on Response −
COUT = 1 mF, IOUT = 250 mA
www.onsemi.com
11
NCP161
TYPICAL CHARACTERISTICS
500 mV/div
10 mV/div
2.3 V
VIN
VOUT
VOUT = 1.8 V, IOUT = 10 mA
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
3.8 V
VIN
VOUT
VOUT = 3.3 V, IOUT = 10 mA
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
20 ms/div
20 ms/div
Figure 39. Line Transient Response −
VOUT = 1.8 V
Figure 40. Line Transient Response −
VOUT = 3.3 V
5.5 V
VIN
VIN
5.3 V
VOUT
1 V/div
VOUT
VOUT = 5.14 V, IOUT = 10 mA
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
VOUT = 2.8 V, CIN = 1 mF (MLCC)
IOUT = 10 mA, COUT = 1 mF (MLCC)
4 ms/div
Figure 42. Turn−on/off − Slow Rising VIN
IOUT
200 mA/div
20 ms/div
Figure 41. Line Transient Response −
VOUT = 5.14 V
tRISE = 1 ms
100 mV/div
100 mV/div
200 mA/div
10 mV/div
200 mV/div
10 mV/div
500 mV/div
4.8 V
3.3 V
VOUT
VIN = 2.8 V, VOUT = 1.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
IOUT
tFALL = 1 ms
VOUT
VIN = 2.8 V, VOUT = 1.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
4 ms/div
20 ms/div
Figure 43. Load Transient Response −
1 mA to 450 mA − VOUT = 1.8 V
Figure 44. Load Transient Response −
450 mA to 1 mA − VOUT = 1.8 V
www.onsemi.com
12
NCP161
TYPICAL CHARACTERISTICS
200 mA/div
IOUT
tRISE = 1 ms
100 mV/div
100 mV/div
200 mA/div
IOUT
VOUT
VIN = 4.3 V, VOUT = 3.3 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
tFALL = 1 ms
VOUT
VIN = 4.3 V, VOUT = 3.3 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
4 ms/div
20 ms/div
Figure 45. Load Transient Response −
1 mA to 450 mA − VOUT = 3.3 V
Figure 46. Load Transient Response −
450 mA to 1 mA − VOUT = 3.3 V
VOUT
VIN = 5.5 V, VOUT = 5.14 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
VOUT
VIN = 5.5 V, VOUT = 5.14 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
20 ms/div
Figure 47. Load Transient Response −
1 mA to 450 mA − VOUT = 5.14 V
Figure 48. Load Transient Response −
450 mA to 1 mA − VOUT = 5.14 V
TSD Cycling
500 mV/div
500 mA/div
tFALL = 1 ms
4 ms/div
Short Circuit Event
Overheating
1 V/div
200 mA/div
tRISE = 1 ms
100 mV/div
IOUT
VEN
IOUT
VOUT
Thermal Shutdown
VOUT
VIN = 5.5 V
VOUT = 3.3 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
COUT = 4.7 mF
1 V/div
100 mV/div
200 mA/div
IOUT
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF
10 ms/div
400 ms/div
Figure 49. Short Circuit and Thermal
Shutdown
Figure 50. Enable Turn−off
www.onsemi.com
13
NCP161
APPLICATIONS INFORMATION
General
transient response or high frequency PSRR. It is not
recommended to use tantalum capacitors on the output due
to their large ESR. The equivalent series resistance of
tantalum capacitors is also strongly dependent on the
temperature, increasing at low temperature.
The NCP161 is an ultra−low noise 450 mA low dropout
regulator designed to meet the requirements of RF
applications and high performance analog circuits. The
NCP161 device provides very high PSRR and excellent
dynamic response. In connection with low quiescent current
this device is well suitable for battery powered application
such as cell phones, tablets and other. The NCP161 is fully
protected in case of current overload, output short circuit and
overheating.
Enable Operation
Input capacitor connected as close as possible is necessary
for ensure device stability. The X7R or X5R capacitor
should be used for reliable performance over temperature
range. The value of the input capacitor should be 1 mF or
greater to ensure the best dynamic performance. This
capacitor will provide a low impedance path for unwanted
AC signals or noise modulated onto constant input voltage.
There is no requirement for the ESR of the input capacitor
but it is recommended to use ceramic capacitors for their low
ESR and ESL. A good input capacitor will limit the
influence of input trace inductance and source resistance
during sudden load current changes.
The NCP161 uses the EN pin to enable/disable its device
and to deactivate/activate the active discharge function.
If the EN pin voltage is 1.2 V the device is guaranteed to
be enabled. The NCP161 regulates the output voltage and
the active discharge transistor is turned−off.
The EN pin has internal pull−down current source with
typ. value of 200 nA which assures that the device is
turned−off when the EN pin is not connected. In the case
where the EN function isn’t required the EN should be tied
directly to IN.
Output Decoupling (COUT)
Output Current Limit
Input Capacitor Selection (CIN)
The NCP161 requires an output capacitor connected as
close as possible to the output pin of the regulator. The
recommended capacitor value is 1 mF and X7R or X5R
dielectric due to its low capacitance variations over the
specified temperature range. The NCP161 is designed to
remain stable with minimum effective capacitance of 0.7 mF
to account for changes with temperature, DC bias and
package size. Especially for small package size capacitors
such as 0201 the effective capacitance drops rapidly with the
applied DC bias. Please refer Figure 51.
Output Current is internally limited within the IC to a
typical 700 mA. The NCP161 will source this amount of
current measured with a voltage drops on the 90% of the
nominal VOUT. If the Output Voltage is directly shorted to
ground (VOUT = 0 V), the short circuit protection will limit
the output current to 690 mA (typ). The current limit and
short circuit protection will work properly over whole
temperature range and also input voltage range. There is no
limitation for the short circuit duration.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
threshold (TSD * 160°C typical), Thermal Shutdown event
is detected and the device is disabled. The IC will remain in
this state until the die temperature decreases below the
Thermal Shutdown Reset threshold (TSDU − 140°C typical).
Once the IC temperature falls below the 140°C the LDO is
enabled again. The thermal shutdown feature provides the
protection from a catastrophic device failure due to
accidental overheating. This protection is not intended to be
used as a substitute for proper heat sinking.
Power Dissipation
As power dissipated in the NCP161 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
Figure 51. Capacity vs DC Bias Voltage
There is no requirement for the minimum value of
Equivalent Series Resistance (ESR) for the COUT but the
maximum value of ESR should be less than 2 Ω. Larger
output capacitors and lower ESR could improve the load
www.onsemi.com
14
NCP161
ambient temperature affect the rate of junction temperature
rise for the part.
The maximum power dissipation the NCP161 can handle
is given by:
P D [ V IN @ I GND ) I OUTǒV IN * V OUTǓ
(eq. 1)
q JA
160
1.6
PD(MAX), TA = 25°C, 2 oz Cu
150
PD(MAX), TA = 25°C, 1 oz Cu
140
1.4
1.2
130
1.0
120
0.8
qJA, 1 oz Cu
110
0.6
0.4
100
qJA, 2 oz Cu
90
80
0
100
200
300
400
500
0.2
600
PD(MAX), MAXIMUM POWER DISSIPATION (W)
qJA, JUNCTION TO AMBIENT THERMAL RESISTANCE (°C/W)
P D(MAX) +
ƪ125oC * T Aƫ
The power dissipated by the NCP161 for given
application conditions can be calculated from the following
equations:
0
700
PCB COPPER AREA (mm2)
220
1.0
qJA, 1 oz Cu
210
0.9
200
0.8
qJA, 2 oz Cu
190
PD(MAX), TA = 25°C, 2 oz Cu
PD(MAX), TA = 25°C, 1 oz Cu
180
0.7
0.6
170
0.5
160
0.4
150
0
100
200
300
400
PCB COPPER AREA (mm2)
500
600
Figure 53. qJA and PD (MAX) vs. Copper Area (XDFN4)
www.onsemi.com
15
0.3
700
PD(MAX), MAXIMUM POWER DISSIPATION (W)
qJA, JUNCTION TO AMBIENT THERMAL RESISTANCE (°C/W)
Figure 52. qJA and PD (MAX) vs. Copper Area (CSP4)
(eq. 2)
0.7
325
PD(MAX), TA = 25°C, 2 oz Cu
300
0.6
PD(MAX), TA = 25°C, 1 oz Cu
275
0.5
250
0.4
qJA, 1 oz Cu
225
0.3
qJA, 2 oz Cu
200
0.2
175
150
0.1
0
100
200
300
400
PCB COPPER AREA (mm2)
500
600
PD(MAX), MAXIMUM POWER DISSIPATION (W)
qJA, JUNCTION TO AMBIENT THERMAL RESISTANCE (°C/W)
NCP161
0
700
Figure 54. qJA and PD (MAX) vs. Copper Area (SOT23−5)
Reverse Current
Turn−On Time
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case that VOUT > VIN.
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
The turn−on time is defined as the time period from EN
assertion to the point in which VOUT will reach 98% of its
nominal value. This time is dependent on various
application conditions such as VOUT(NOM), COUT, TA.
Power Supply Rejection Ratio
To obtain good transient performance and good regulation
characteristics place CIN and COUT capacitors close to the
device pins and make the PCB traces wide. In order to
minimize the solution size, use 0402 or 0201 capacitors with
appropriate capacity. Larger copper area connected to the
pins will also improve the device thermal resistance. The
actual power dissipation can be calculated from the equation
above (Equation 2). Expose pad can be tied to the GND pin
for improvement power dissipation and lower device
temperature.
PCB Layout Recommendations
The NCP161 features very high Power Supply Rejection
ratio. If desired the PSRR at higher frequencies in the range
100 kHz – 10 MHz can be tuned by the selection of COUT
capacitor and proper PCB layout.
www.onsemi.com
16
NCP161
ORDERING INFORMATION
Nominal
Output
Voltage
Description
NCP161AFCS180T2G
1.8 V
450 mA, Active Discharge
NCP161AFCS250T2G
2.5 V
NCP161AFCS270T2G
2.7 V
V
180°
NCP161AFCS280T2G
2.8 V
E
180°
NCP161AFCS285T2G
2.85 V
F
180°
NCP161AFCS300T2G
3.0 V
J
180°
NCP161AFCS320T2G
3.2 V
T
180°
NCP161AFCS330T2G
3.3 V
K
180°
NCP161AFCS350T2G
3.5 V
L
180°
NCP161AFCS450T2G
4.5 V
P
180°
NCP161AFCS500T2G
5.0 V
R
180°
NCP161AFCS514T2G
5.14 V
Q
180°
NCP161BFCS180T2G
1.8 V
A
270°
NCP161BFCS250T2G
2.5 V
D
270°
Device
450 mA, Non-Active
Discharge
Marking
Rotation
Package
Shipping†
A
180°
D
180°
WLCSP4
CASE 567KA*
(Pb-Free)
5000 / Tape
& Reel
WLCSP4
CASE 567KA*
(Pb-Free)
5000 / Tape
& Reel
WLCSP4
CASE 567JZ
(Pb-Free)
5000 / Tape
& Reel
WLCSP4
CASE 567JZ
(Pb-Free)
5000 / Tape
& Reel
NCP161BFCS280T2G
2.8 V
E
270°
NCP161BFCS285T2G
2.85 V
F
270°
NCP161BFCS300T2G
3.0 V
J
270°
NCP161BFCS330T2G
3.3 V
K
270°
NCP161BFCS350T2G
3.5 V
L
270°
NCP161BFCS450T2G
4.5 V
P
270°
NCP161BFCS500T2G
5.0 V
R
270°
NCP161BFCS514T2G
5.14 V
Q
270°
NCP161AFCT180T2G
1.8 V
A
180°
NCP161AFCT185T2G
1.85 V
V
180°
NCP161AFCT250T2G
2.5 V
D
180°
NCP161AFCT280T2G
2.8 V
E
180°
NCP161AFCT285T2G
2.85 V
F
180°
NCP161AFCT290T2G
2.9 V
T
180°
NCP161AFCT300T2G
3.0 V
J
180°
NCP161AFCT310T2G
3.1 V
6
180°
NCP161AFCT330T2G
3.3 V
K
180°
NCP161AFCT350T2G
3.5 V
L
180°
NCP161AFCT450T2G
4.5 V
P
180°
450 mA, Active Discharge
NCP161AFCT500T2G
5.0 V
R
180°
NCP161AFCT514T2G
5.14 V
Q
180°
NCP161AFCTC280T2G
2.8 V
E
180°
NCP161AFCTC350T2G
3.5 V
450 mA, Active
Discharge, Backside
Coating
L
180°
450 mA, Non-Active
Discharge
A
270°
NCP161BFCT180T2G
1.8 V
NCP161BFCT185T2G
1.85 V
V
270°
NCP161BFCT250T2G
2.5 V
D
270°
NCP161BFCT280T2G
2.8 V
E
270°
NCP161BFCT285T2G
2.85 V
F
270°
NCP161BFCT300T2G
3.0 V
J
270°
NCP161BFCT330T2G
3.3 V
K
270°
NCP161BFCT350T2G
3.5 V
L
270°
NCP161BFCT450T2G
4.5 V
P
270°
NCP161BFCT500T2G
5.0 V
R
270°
NCP161BFCT514T2G
5.14 V
Q
270°
*UBM = 180 mm (±5 mm)
www.onsemi.com
17
NCP161
ORDERING INFORMATION (continued)
Device
Nominal Output
Voltage
Description
Marking
Package
Shipping†
450 mA,
Active
Discharge
DN
XDFN4
(Pb-Free)
3000 or 5000 /
Tape & Reel
(Note 7)
XDFN4
(Pb-Free)
3000 or 5000 /
Tape & Reel
(Note 7)
SOT23−5L
(Pb-Free)
3000 / Tape & Reel
NCP161AMX180TBG (Note 7)
1.8 V
NCP161AMX185TBG (Note 7)
1.85 V
NCP161AMX250TBG
2.5 V
DP
NCP161AMX280TBG (Note 7)
2.8 V
DQ
NCP161AMX285TBG
2.85 V
DR
NCP161AMX300TBG (Note 7)
3.0 V
DT
NCP161AMX320TBG (Note 7)
3.2 V
DZ
NCP161AMX330TBG (Note 7)
3.3 V
DD
NCP161AMX350TBG
3.5 V
DU
NCP161AMX450TBG
4.5 V
DV
NCP161AMX500TBG
5.0 V
DX
NCP161AMX514TBG (Note 7)
5.14 V
DE
NCP161BMX180TBG (Note 7)
1.8 V
NCP161BMX250TBG (Note 7)
2.5 V
NCP161BMX280TBG (Note 7)
2.8 V
EQ
NCP161BMX285TBG
2.85 V
ER
NCP161BMX300TBG
3.0 V
ET
NCP161BMX330TBG (Note 7)
3.3 V
ED
NCP161BMX350TBG (Note 7)
3.5 V
EU
NCP161BMX450TBG
4.5 V
EV
NCP161BMX500TBG
5.0 V
EX
NCP161BMX514TBG (Note 7)
5.14 V
EE
NCP161ASN180T1G
1.8 V
NCP161ASN250T1G
2.5 V
NCP161ASN280T1G
2.8 V
JAC
NCP161ASN300T1G
3.0 V
JAD
NCP161ASN330T1G
3.3 V
JAG
NCP161ASN350T1G
3.5 V
JAH
NCP161ASN500T1G
5.0 V
JAE
450 mA,
Non-Active
Discharge
450 mA,
Active
Discharge
EY
EN
EP
JAF
JAA
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
7. Product processed after October 1, 2022 are shipped with quantity 5000 units / tape & reel.
www.onsemi.com
18
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−23, 5 Lead
CASE 527AH
ISSUE A
DATE 09 JUN 2021
q
q
q
q
q
q1
q2
GENERIC
MARKING DIAGRAM*
XXXM
XXX = Specific Device Code
M = Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34320E
SOT−23, 5 LEAD
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP4, 0.64x0.64x0.33
CASE 567JZ
ISSUE B
DATE 16 MAY 2022
GENERIC
MARKING DIAGRAM*
XM
X
M
= Specific Device Code
= Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
DOCUMENT NUMBER:
DESCRIPTION:
98AON85781F
WLCSP4, 0.64X0.64x0.33
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP4, 0.64x0.64
CASE 567KA
ISSUE B
SCALE 4:1
DATE 24 MAR 2020
GENERIC
MARKING DIAGRAM*
XM
X
M
= Specific Device Code
= Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
DOCUMENT NUMBER:
DESCRIPTION:
98AON85783F
WLCSP4, 0.64X0.64
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN4 1.0x1.0, 0.65P
CASE 711AJ
ISSUE C
GENERIC
MARKING DIAGRAM*
XX M
1
DOCUMENT NUMBER:
DESCRIPTION:
XX = Specific Device Code
M = Date Code
98AON67179E
XDFN4, 1.0X1.0, 0.65P
DATE 08 MAR 2022
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
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A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
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