LDO Regulator, 300mA,
Low Dropout Voltage, Ultra
Low Noise, High PSRR with
Power Good
NCP164C
The NCP164C is a 300 mA LDO, next generation of high PSRR,
ultra−low noise and low dropout regulators with Power Good open
collector output. Designed to meet the requirements of RF and
sensitive analog circuits, the NCP164C device provides ultra−low
noise, high PSRR and low quiescent current. The device also offer
excellent load/line transients. The NCP164C is designed to work with
a 1 mF input and a 1 mF output ceramic capacitor. It is available in
industry standard TSOP−5, WDFN6 0.65P, 2 mm x 2 mm and
DFNW8 0.65P, 3 mm x 3 mm.
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MARKING
DIAGRAMS
5
5
1
•
Operating Input Voltage Range: 1.6 V to 5.0 V
Available in Fixed Voltage Option: 1.2 V to 4.5 V
Adjustable Version Reference Voltage: 1.1 V
±2% Accuracy Over Load and Temperature
Ultra Low Quiescent Current Typ. 30 mA
Standby Current: Typ. 0.1 mA
Very Low Dropout: 110 mV at 300 mA for 3.3 V Variant
Ultra High PSRR: Typ. 85 dB at 10 mA, f = 1 kHz
Ultra Low Noise: 9 mVRMS (Fixed Version)
Stable with a 1 mF Small Case Size Ceramic Capacitors
Available in – TSOP−5 3 mm x 1.5 mm x 1 mm CASE 483
♦ WDFN6 2 mm x 2 mm x 0.75 mm CASE 511BR
♦ DFNW8 3 mm x 3 mm x 0.9 mm CASE 507AD
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
•
•
•
•
WDFN6 2x2, 0.65P
CASE 511BR
VIN
IN
XXMG
G
1
DFNW8 3x3, 0.65P
CASE 507AD
1
P164
XXX
ALYWG
G
XXX
= Specific Device Code
A
= Assembly Location
L
= Wafer Lot
M
= Month Code
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTONS
OUT 1
ADJ/SNS 2
Communication Systems
In−Vehicle Networking
Telematics, Infotainment and Clusters
General Purpose Automotive
6 IN
GND
PG 3
5 GND
4 EN
WDFN6 2x2 mm
(Top View)
OUT
NCP164C
CIN
1 mF
Ceramic
XXXAYWG
G
1
Features
•
•
•
•
•
•
•
•
•
•
•
TSOP−5
CASE 483
EN
ON
GND
COUT
1 mF
Ceramic
PG
OFF
ORDERING INFORMATION
See detailed ordering and shipping information on page 8 of
this data sheet.
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2019
January, 2020 − Rev. 1
1
Publication Order Number:
NCP164C/D
NCP164C
Table 1. PIN FUNCTION DESCRIPTION
Pin No.
TSOP−5
Pin No.
WDFN6
Pin No.
DFNW8
Pin
Name
1
6
8
IN
5
1
1
OUT
3
4
7
EN
Chip enable: Applying VEN < 0.2 V disables the regulator, Pulling VEN > 0.7 V
enables the LDO
4/−
3
3
PG
Power Good, open collector. Use 10 kW to 100 kW pull−up resistor connected to
output or input voltage
2
5
6
GND
Common ground connection
−/4
2
2
ADJ
Adjustable output feedback pin (for adjustable version only)
−
2
2
SNS
Sense feedback pin.
Must be connected to OUT pin on PCB (for fixed versions only)
−
−
4, 5
N/C
Not connected, pin can be tied to ground plane for better power dissipation
−
EPAD
EPAD
EPAD
Description
Input voltage supply pin
Regulated output voltage. The output should be bypassed with small 1 mF
ceramic capacitor
Expose pad should be tied to ground plane for better power dissipation
Table 2. ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VIN
−0.3 to 5.3
V
Output Voltage
VOUT
−0.3 to VIN+0.3, max. 5.3
V
Chip Enable Input
VCE
−0.3 to 5.3
V
Power Good Voltage
VPG
−0.3 to 5.3
V
Power Good Current
IPG
30
mA
Output Short Circuit Duration
tSC
unlimited
s
Maximum Junction Temperature
TJ
150
°C
TSTG
−55 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Charged Device Model (Note 2)
ESDCDM
1000
V
Input Voltage (Note 1)
Storage Temperature
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Charged Device Model tested per EIA/JESD22−C101, Field Induced Charge Model
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2
NCP164C
Table 3. THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
RqJA
158
°C/W
Thermal Resistance, Junction−to−Case (top)
RqJC(top)
155
°C/W
Thermal Resistance, Junction−to−Case (bottom) (Note 4)
RqJC(bot)
102
°C/W
Thermal Resistance, Junction−to−Board
RqJB
197
°C/W
Characterization Parameter, Junction−to−Top
YJT
40
°C/W
YJB
82
°C/W
RqJA
51
°C/W
Thermal Resistance, Junction−to−Case (top)
RqJC(top)
142
°C/W
Thermal Resistance, Junction−to−Case (bottom) (Note 4)
RqJC(bot)
2.0
°C/W
THERMAL CHARACTERISTICS, TSOP−5 PACKAGE
Thermal Resistance, Junction−to−Ambient (Note 3)
Characterization Parameter, Junction−to−Board
THERMAL CHARACTERISTICS, WDFN6−2X2, 0.65 PITCH PACKAGE
Thermal Resistance, Junction−to−Ambient (Note 3)
Thermal Resistance, Junction−to−Board
RqJB
117
°C/W
Characterization Parameter, Junction−to−Top
YJT
1.9
°C/W
Characterization Parameter, Junction−to−Board
YJB
7.7
°C/W
RqJA
50
°C/W
Thermal Resistance, Junction−to−Case (top)
RqJC(top)
142
°C/W
Thermal Resistance, Junction−to−Case (bottom) (Note 4)
THERMAL CHARACTERISTICS, DFNW8−3X3, 0.65 PITCH PACKAGE
Thermal Resistance, Junction−to−Ambient (Note 3)
RqJC(bot)
7.9
°C/W
Thermal Resistance, Junction−to−Board
RqJB
125
°C/W
Characterization Parameter, Junction−to−Top
YJT
2.0
°C/W
Characterization Parameter, Junction−to−Board
YJB
7.5
°C/W
3. The junction−to−ambient thermal resistance under natural convection is obtained in a simulation on a high−K board, following the JEDEC51.7
guidelines with assumptions as above, in an environment described in JESD51−2a.
4. The junction−to−case (bottom) thermal resistance is obtained by simulating a cold plate test on the IC exposed pad. Test description can
be found in the ANSI SEMI standard G30−88.
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3
NCP164C
Table 4. ELECTRICAL CHARACTERISTICS (−40°C ≤ TJ ≤ 150°C; VIN = VOUT(NOM) + 0.5 V; IOUT = 1 mA, CIN = COUT
= 1 mF, VEN = VIN, unless otherwise noted. Typical values are at TJ = +25°C (Note 5))
Parameter
Test Conditions
Symbol
Min
VIN
1.6
5.0
V
VIN = VOUT(NOM) + 0.5 V to 5.0 V,
0.1 mA ≤ IOUT ≤ 300 mA
VOUT
−2
+2
%
VIN = 1.6 V to 5.0 V,
0.1 mA ≤ IOUT ≤ 300 mA
VADJ
1.078
1.122
V
VOUT(NOM) + 0.5 V ≤ VIN ≤ 5.0 V
LineReg
IOUT = 1 mA to 300 mA
LoadReg
2
VDO
170
295
VOUT(NOM) = 1.8 V
155
255
VOUT(NOM) = 2.5 V
125
200
VOUT(NOM) = 2.8 V
115
185
VOUT(NOM) = 3.0 V
113
177
VOUT(NOM) = 3.3 V
110
170
VOUT(NOM) = 4.5 V
95
135
Operating Input Voltage
Output Voltage Accuracy
Reference Voltage (Adjustable Ver.
ADJ pin connected to OUT)
Line Regulation
Load Regulation
Dropout Voltage (Note 6)
TSOP−5, WDFN6
Dropout Voltage (Note 6)
DFNW8
IOUT = 300 mA
IOUT = 300 mA
VOUT(NOM) = 1.5 V
VOUT(NOM) = 1.5 V
Typ
1.1
Max
0.5
VDO
mV/V
mV
180
315
VOUT(NOM) = 1.8 V
165
275
VOUT(NOM) = 2.5 V
140
220
VOUT(NOM) = 2.8 V
130
205
VOUT(NOM) = 3.0 V
127
197
VOUT(NOM) = 3.3 V
125
190
VOUT(NOM) = 4.5 V
112
170
mV
mV
mA
Output Current Limit
VOUT = 90% VOUT(NOM)
ICL
Short Circuit Current
VOUT = 0 V
ISC
580
Quiescent Current
IOUT = 0 mA
IQ
30
40
mA
0.01
1.5
mA
Shutdown Current
350
Unit
560
VEN ≤ 0.4 V
IDIS
EN Input Voltage “H”
VENH
EN Input Voltage “L”
VENL
VEN = 5.0 V
IEN
0.2
Power Good Threshold Voltage
Output Voltage Raising
VPGUP
95
Output Voltage Falling
VPGDW
90
Power Good Output Voltage Low
IPG = 5 mA, Open drain
VPGLO
EN Pin Threshold Voltage
EN Pull Down Current
Turn−On Time (Note 7)
Power Supply Rejection Ratio
(Note 7)
COUT = 1 mF, From assertion of VEN
to VOUT = 95% VOUT(NOM)
VOUT(NOM) = 3.3 V,
IOUT = 10 mA
f = 100 Hz
PSRR
Thermal Shutdown Threshold
(Note 7)
Active output discharge resistance
f = 10 Hz to 100 kHz
0.2
mA
%
V
120
ms
83
dB
85
f = 10 kHz
80
IOUT = 10 mA
0.6
0.3
f = 1 kHz
f = 100 kHz
Output Voltage Noise (Fixed Ver.)
V
0.7
61
VN
9
mVRMS
Temperature rising
TSDH
165
°C
Temperature hysteresis
THYST
15
°C
VEN < 0.2 V, Version A only
RDIS
260
W
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
5. Performance guaranteed over the indicated operating temperature range by design and/or characterization.
Production tested at TJ = TA = 25°C.
6. Low duty cycle pulse techniques are used during the testing to maintain the junction temperature as close to ambient as possible. Dropout
voltage is characterized when VOUT falls 3% below VOUT(NOM).
7. Guaranteed by design and characterization.
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4
NCP164C
1.220
1.830
1.215
1.825
1.210
1.820
Output Voltage (V)
Output Voltage (V)
TYPICAL CHARACTERISTICS
1.205
1.200
1.195
VIN = 1.7 V
IOUT = 1 mA
COUT = 1 mF
1.190
1.185
1.180
−40 −20
0
20
40
60
80
1.815
1.810
1.805
1.795
1.790
−40 −20
100 120 140
40
60
80
100 120 140
Figure 2. Output Voltage vs. Temperature −
VOUT = 1.2 V
Figure 3. Output Voltage vs. Temperature −
VOUT = 1.8 V
Voltage Dropout (mV)
3.320
3.315
3.310
3.305
VIN = 3.8 V
IOUT = 1 mA
COUT = 1 mF
3.300
3.295
−40 −20
0
20
40
60
80
100 120 140
350
325
300
275
250
225
200
175
150
125
100
−40 −20
VOUT = 1.2 V
IOUT = 0.3 A
COUT = 1 mF
0
20
40
60
80
100 120 140
Temperature (°C)
Temperature (°C)
Figure 4. Output Voltage vs. Temperature −
VOUT = 3.3 V
Figure 5. Dropout Voltage vs. Temperature −
VOUT = 1.2 V
270
250
230
210
Voltage Dropout (mV)
Output Voltage (V)
20
Temperature (°C)
3.325
Voltage Dropout (mV)
0
Temperature (°C)
3.330
3.290
VIN = 2.3 V
IOUT = 1 mA
COUT = 1 mF
1.800
190
170
150
130
VOUT = 1.8 V
IOUT = 0.3 A
COUT = 1 mF
110
90
70
−40 −20
0
20
40
60
80
100 120 140
170
160
150
140
130
120
110
100
90
80
70
−40 −20
VOUT = 3.3 V
IOUT = 0.3 A
COUT = 1 mF
0
20
40
60
80
100 120 140
Temperature (°C)
Temperature (°C)
Figure 6. Dropout Voltage vs. Temperature −
VOUT = 1.8 V
Figure 7. Dropout Voltage vs. Temperature −
VOUT = 3.3 V
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5
NCP164C
40
38
36
34
32
30
28
26
24
22
20
−40 −20
140
VOUT = 1.8 V
IOUT = 10 mA
COUT = 1 mF
135
Turn−on Time (ms)
Quiescent Current (mA)
TYPICAL CHARACTERISTICS (continued)
VOUT = nom.
IOUT = 0 mA
COUT = 1 mF
0
20
40
60
80
130
125
120
115
110
105
100
−40 −20
100 120 140
0
Temperature (°C)
570
0.60
Enable Thresholds (V)
Current Limit (mA)
0.65
560
550
540
VOUT = nom.
COUT = 1 mF
510
500
−40 −20
0
20
40
60
80
80
100 120 140
0.55
0.50
Output ON
0.45
0.40
0.35
Output OFF
0.30
0.25
−40 −20
100 120 140
0
20
40
60
80
100 120 140
Temperature (°C)
Temperature (°C)
Figure 10. Current Limit vs. Temperature
Figure 11. Enable Thresholds vs Temperature
300
96,0
290
95,0
VOUT raising to nominal
94,0
Active Discharge (W)
Power Good Thresholds (%)
60
Figure 9. Turn−on Time vs. Temperature
580
520
40
Temperature (°C)
Figure 8. Quiescent Current va Temperature
530
20
93,0
92,0
91,0
90,0
VOUT falling from nominal
89,0
88,0
−40 −20
0
20
40
60
80
280
270
260
250
240
EN = low
COUT = 1 mF
230
220
−40 −20
100 120 140
Temperature (°C)
0
20
40
60
80
100 120 140
Temperature (°C)
Figure 12. Power Good Threshold vs.
Temperature
Figure 13. Active Discharge Resistance vs.
Temperature
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6
NCP164C
100
90
80
70
60
50
40
30
20
10
0
0.01
- IOUT = 10 mA
- IOUT = 100 mA
- IOUT = 200 mA
VIN = 3.2 V
VOUT = 2.8 V
TA = 25°C
COUT = 1 mF
0,1
1
10
100
1000
10000
Noise Spectral Density
(nV/sqrt(Hz))
PSRR (dB)
TYPICAL CHARACTERISTICS (continued)
- IOUT = 10 mA
- IOUT = 100 mA
- IOUT = 200 mA
1000
100
10
VIN = 3.3 V
VOUT = 2.8 V
TA = 25°C
COUT = 1 mF
1
0.01
10000
0.1
1
Frequency (kHz)
10
100
1000
10000
Frequency (kHz)
Figure 14. Power Supply Rejection Ration
for VOUT = 2.8 V, COUT = 1 mF
Figure 15. Output Voltage Noise Spectral Density
for VOUT = 2.8 V, COUT = 1 mF
APPLICATIONS INFORMATION
1 mA to obtain low saturation voltage. External pull−up
resistor can be connected to any voltage up to 5.0 V (please
see Absolute Maximum Ratings table).
The NCP164C is the member of new family of high output
current and low dropout regulators which delivers low
quiescent and ground current consumption, good noise and
power supply ripple rejection ratio performance. The
NCP164C incorporates EN pin and power good output for
simple controlling by MCU or logic. Standard features
include current limiting, soft−start feature and thermal
protection.
Power Dissipation and Heat Sinking
The maximum power dissipation supported by the device
is dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part. For reliable operation junction temperature
should be limited to +125°C, however device is capable to
work up to junction temperature +150°C. The maximum
power dissipation the NCP164C can handle is given by:
Input Decoupling (CIN)
It is recommended to connect at least 1 mF ceramic X5R
or X7R capacitor between IN and GND pin of the device.
This capacitor will provide a low impedance path for any
unwanted AC signals or noise superimposed onto constant
input voltage. The good input capacitor will limit the
influence of input trace inductances and source resistance
during sudden load current changes. Higher capacitance and
lower ESR capacitors will improve the overall line transient
response.
P D(MAX) +
ƪTJ(MAX) * TAƫ
(eq. 1)
R qJA
The power dissipated by the NCP164C for given
application conditions can be calculated from the following
equations:
P D [ V IN(I GND(I OUT)) ) I OUT (V IN * V OUT)
Output Decoupling (COUT)
(eq. 2)
or
The NCP164C does not require a minimum Equivalent
Series Resistance (ESR) for the output capacitor. The device
is designed to be stable with standard ceramics capacitors
with values of 1 mF or greater. The X5R and X7R types have
the lowest capacitance variations over temperature thus they
are recommended.
V IN(MAX) [
P D(MAX) ) ǒV OUT
I OUT ) I GND
I OUTǓ
(eq. 3)
Hints
VIN and GND printed circuit board traces should be as
wide as possible. When the impedance of these traces is
high, there is a chance to pick up noise or cause the regulator
to malfunction. Place external components, especially the
output capacitor, as close as possible to the NCP164C, and
make traces as short as possible.
Power Good Output Connection
The NCP164C include Power Good functionality for
better interfacing to MCU system. Power Good output is
open collector type, capable to sink up to 10 mA.
Recommended operating current is between 10 mA and
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7
NCP164C
Adjustable Version
where VFIX is voltage of original fixed version (from
1.2 V up to 4.5 V) or adjustable version (1.1 V). Do not
operate the device at output voltage about 4.7 V, as device
can be damaged.
In order to avoid influence of current flowing into SNS pin
to output voltage accuracy (SNS current varies with voltage
option and temperature, typical value is 300 nA) it is
recommended to use values of R1 and R2 below 500 kW.
Not only adjustable version, but also any fixed version can
be used to create adjustable voltage, where original fixed
voltage becomes reference voltage for resistor divider and
feedback loop. Output voltage can be equal or higher than
original fixed option, while possible range is from 1.1 V up
to 4.5 V. Figure 16 shows how to add external resistors to
increase output voltage above fixed value.
Output voltage is then given by equation
V OUT + V FIX
(1 ) R1ńR2)
(eq. 4)
VIN
CIN
IN
NCP164C
ADJ or FIX version
SNS
EN
GND
1 mF
Ceramic
VOUT
OUT
ON
R1
COUT
10 mF
Ceramic
R2
OFF
Figure 16. Adjustable Variant Application
Please note that output noise is amplified by VOUT / VFIX
ratio. For example, if original 1.2 V fixed variant is used to
create 3.6 V output voltage, output noise is increased 3.6 /
1.2 = 3 times and real value will be 3 × 9 mVrms = 27ĂmVrms.
For noise sensitive applications it is recommended to use as
high fixed variant as possible – for example in case above it
is better to use 3.3 V fixed variant to create 3.6 V output
voltage, as output noise will be amplified only 3.6 / 3.3 =
1.09 × (9.8 mVrms).
ORDERING INFORMATION
Device Part No.
Voltage Variant
Marking
Package Option
Package
NCP164CSN180T1G
1.8 V
EJ
N/A
TSOP5
(Pb−Free)
3000 / Tape & Reel
NCP164CSN280T1G
2.8 V
EK
N/A
TSOP5
(Pb−Free)
3000 / Tape & Reel
NCP164CSN300T1G
3.0 V
EQ
N/A
TSOP5
(Pb−Free)
3000 / Tape & Reel
NCP164CSN330T1G
3.3 V
EL
N/A
TSOP5
(Pb−Free)
3000 / Tape & Reel
NCP164CSNADJT1G
ADJ
E4
N/A
TSOP5
(Pb−Free)
3000 / Tape & Reel
NCP164CMT180TAG
1.8 V
FJ
Non−Wettable
WDFN6 2 x 2
(WF, Pb−Free)
3000 / Tape & Reel
NCP164CMT280TAG
2.8 V
FK
Non−Wettable
WDFN6 2 x 2
(WF, Pb−Free)
3000 / Tape & Reel
NCP164CMT300TAG
3.0 V
FQ
Non−Wettable
WDFN6 2 x 2
(WF, Pb−Free)
3000 / Tape & Reel
NCP164CMT330TAG
3.3 V
FL
Non−Wettable
WDFN6 2 x 2
(WF, Pb−Free)
3000 / Tape & Reel
NCP164CMTADJTAG
ADJ
F2
Non−Wettable
WDFN6 2 x 2
(WF, Pb−Free)
3000 / Tape & Reel
NCP164CMLADJTCG
ADJ
G2
Wettable
DFNW8 3 x 3
(WF, Pb−Free)
3000 / Tape & Reel
Shipping †
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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8
NCP164C
PACKAGE DIMENSIONS
TSOP−5
CASE 483
ISSUE M
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
D 5X
NOTE 5
0.20 C A B
0.10 T
M
2X
0.20 T
B
5
1
4
2
B
S
3
K
DETAIL Z
G
A
A
TOP VIEW
DIM
A
B
C
D
G
H
J
K
M
S
DETAIL Z
J
C
0.05
H
SIDE VIEW
C
SEATING
PLANE
END VIEW
MILLIMETERS
MIN
MAX
2.85
3.15
1.35
1.65
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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9
NCP164C
PACKAGE DIMENSIONS
WDFN6 2x2, 0.65P
CASE 511BR
ISSUE B
D
A1
PIN ONE
REFERENCE
0.10 C
ÍÍÍ
ÍÍÍ
ÍÍÍ
0.10 C
A3
ÉÉ
ÇÇ
ÇÇ
EXPOSED Cu
ALTERNATE B−1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND
IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM
THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS
WELL AS THE TERMINALS.
5. FOR DEVICES CONTAINING WETTABLE FLANK
OPTION, DETAIL A ALTERNATE CONSTRUCTION
A-2 AND DETAIL B ALTERNATE CONSTRUCTION
B-2 ARE NOT APPLICABLE.
MOLD CMPD
ALTERNATE B−2
DETAIL B
ALTERNATE
CONSTRUCTIONS
E
L
L
DIM
A
A1
A3
b
D
D2
E
E2
e
L
L1
L1
TOP VIEW
ALTERNATE A−1
ALTERNATE A−2
DETAIL A
A3
DETAIL B
0.05 C
ÇÇ
ÉÉ
A
B
ALTERNATE
CONSTRUCTIONS
A
6X
0.05 C
A1
NOTE 4
C
SIDE VIEW
RECOMMENDED
MOUNTING FOOTPRINT
D2
DETAIL A
1
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.25
0.35
2.00 BSC
1.50
1.70
2.00 BSC
0.90
1.10
0.65 BSC
0.40
0.20
--0.15
3
L
1.72
6X
0.45
E2
1.12
6
4
e
BOTTOM VIEW
6X
2.30
b
0.10
M
C A
0.05
M
C
B
PACKAGE
OUTLINE
NOTE 3
6X
0.40
1
0.65
PITCH
DIMENSIONS: MILLIMETERS
www.onsemi.com
10
NCP164C
PACKAGE DIMENSIONS
DFNW8 3x3, 0.65P
CASE 507AD
ISSUE A
A
B
D
L3
L
ÉÉÉ
ÉÉÉ
ÉÉÉ
L
EXPOSED
COPPER
TOP VIEW
DETAIL B
A1
A4
A
PLATING
ALTERNATE
CONSTRUCTION
C
C
NOTE 4
A4
C
SIDE VIEW
SEATING
PLANE
D2
DETAIL A
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. THIS DEVICE CONTAINS WETTABLE FLANK
DESIGN FEATURE TO AID IN FILLET FORMATION ON THE LEADS DURING MOUNTING.
A4
A1
DETAIL B
A3
0.05 C
8X
ALTERNATE
CONSTRUCTION
DETAIL A
E
PIN ONE
REFERENCE
0.05 C
L3
L3
PLATED
SURFACES
DIM
A
A1
A3
A4
b
D
D2
E
E2
e
K
L
L3
MILLIMETERS
MIN
NOM
MAX
0.80
0.90
1.00
−−−
−−−
0.05
0.20 REF
0.10
−−−
−−−
0.25
0.30
0.35
2.90
3.00
3.10
2.30
2.40
2.50
2.90
3.00
3.10
1.55
1.65
1.75
0.65 BSC
0.28 REF
0.30
0.40
0.50
0.05 REF
SECTION C−C
4
RECOMMENDED
SOLDERING FOOTPRINT*
L
2.50
2.35
E2
K
e/2
8
5
e
BOTTOM VIEW
8X
b
0.58
8
5
1
4
3.30 1.75
0.10 C A B
0.05 C
8X
NOTE 3
0.65
PITCH
PACKAGE
OUTLINE
8X
0.40
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
◊
TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
www.onsemi.com
11
Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSOP−5
CASE 483
ISSUE M
5
1
SCALE 2:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
D 5X
NOTE 5
2X
DATE 17 MAY 2016
0.20 C A B
0.10 T
M
2X
0.20 T
5
B
1
4
2
B
S
3
K
DETAIL Z
G
A
A
TOP VIEW
DIM
A
B
C
D
G
H
J
K
M
S
DETAIL Z
J
C
0.05
H
C
SIDE VIEW
SEATING
PLANE
END VIEW
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
0.95
0.037
MILLIMETERS
MIN
MAX
2.85
3.15
1.35
1.65
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
1.9
0.074
5
5
XXXAYWG
G
1
1
Analog
2.4
0.094
XXX = Specific Device Code
A
= Assembly Location
Y
= Year
W = Work Week
G
= Pb−Free Package
1.0
0.039
XX MG
G
Discrete/Logic
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98ARB18753C
TSOP−5
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFNW8 3x3, 0.65P
CASE 507AD
ISSUE A
1
SCALE 2:1
DATE 15 JUN 2018
A
B
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
L3
L
L
ALTERNATE
CONSTRUCTION
DETAIL A
E
PIN ONE
REFERENCE
EXPOSED
COPPER
DETAIL B
PLATING
A1
A4
A
ALTERNATE
CONSTRUCTION
DETAIL B
A3
C
C
0.05 C
NOTE 4
A4
C
SIDE VIEW
SEATING
PLANE
PLATED
SURFACES
D2
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. THIS DEVICE CONTAINS WETTABLE FLANK
DESIGN FEATURE TO AID IN FILLET FORMATION ON THE LEADS DURING MOUNTING.
A4
A1
TOP VIEW
0.05 C
L3
1
L3
SECTION C−C
4
DIM
A
A1
A3
A4
b
D
D2
E
E2
e
K
L
L3
GENERIC
MARKING DIAGRAM*
1
8X
L
E2
K
8
5
e/2
8X
0.05 C
NOTE 3
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
2.50
2.35
8X
0.58
8
5
1
4
XXXXXX
XXXXXX
ALYWG
G
XXXXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
b
0.10 C A B
e
MILLIMETERS
MIN
NOM
MAX
1.00
0.80
0.90
−−−
−−−
0.05
0.20 REF
0.10
−−−
−−−
0.25
0.30
0.35
2.90
3.00
3.10
2.30
2.40
2.50
2.90
3.00
3.10
1.55
1.65
1.75
0.65 BSC
0.28 REF
0.30
0.40
0.50
0.05 REF
3.30 1.75
PACKAGE
OUTLINE
8X
0.65
PITCH
0.40
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON17792G
DFNW8 3x3, 0.65P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WDFN6 2x2, 0.65P
CASE 511BR
ISSUE B
ÉÉ
ÉÉ
ÇÇ
SCALE 4:1
D
A
B
A1
0.10 C
0.10 C
ALTERNATE B−1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND
IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM
THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS
WELL AS THE TERMINALS.
5. FOR DEVICES CONTAINING WETTABLE FLANK
OPTION, DETAIL A ALTERNATE CONSTRUCTION
A-2 AND DETAIL B ALTERNATE CONSTRUCTION
B-2 ARE NOT APPLICABLE.
MOLD CMPD
ALTERNATE B−2
ALTERNATE
CONSTRUCTIONS
E
L
L
DIM
A
A1
A3
b
D
D2
E
E2
e
L
L1
L1
TOP VIEW
ALTERNATE A−1
ALTERNATE A−2
DETAIL A
A3
DETAIL B
0.05 C
ÉÉ
ÉÉ
ÇÇ
EXPOSED Cu
DETAIL B
ÍÍÍ
ÍÍÍ
ÍÍÍ
PIN ONE
REFERENCE
A3
DATE 19 JAN 2016
ALTERNATE
CONSTRUCTIONS
A
6X
0.05 C
A1
NOTE 4
C
SIDE VIEW
D2
DETAIL A
1
3
SEATING
PLANE
GENERIC
MARKING DIAGRAM*
1
L
XX M
XX = Specific Device Code
M = Date Code
E2
6
4
6X
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
b
e
BOTTOM VIEW
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.25
0.35
2.00 BSC
1.50
1.70
2.00 BSC
0.90
1.10
0.65 BSC
0.20
0.40
--0.15
0.10
M
C A
0.05
M
C
B
RECOMMENDED
MOUNTING FOOTPRINT
NOTE 3
1.72
6X
0.45
1.12
PACKAGE
OUTLINE
6X
0.40
2.30
1
0.65
PITCH
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
DESCRIPTION:
98AON55829E
WDFN6 2X2, 0.65P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
◊
TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
www.onsemi.com
1
Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative
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