NCP167
LDO Regulator - Ultra-Low
Noise, High PSRR, RF and
Analog Circuits
700 mA
The NCP167 is a linear regulator capable of supplying 700 mA
output current. Designed to meet the requirements of RF and analog
circuits, the NCP167 device provides low noise, high PSRR, low
quiescent current, and very good load/line transients. The device is
designed to work with a 1 mF input and a 1 mF output ceramic capacitor.
It is available in two thickness ultra−small 0.35P, 0.65 mm x 0.65 mm
Chip Scale Package (CSP) and XDFN4 0.65P, 1 mm x 1 mm.
Features
•
•
•
•
•
•
•
•
•
•
•
Operating Input Voltage Range: 1.9 V to 5.5 V
Available in Fixed Voltage Option: 1.8 V to 5.2 V
±2% Accuracy Over Load/Temperature
Ultra Low Quiescent Current Typ. 12 mA
Standby Current: Typ. 0.1 mA
Very Low Dropout: 210 mV at 700 mA
Ultra High PSRR: Typ. 85 dB at 20 mA, f = 1 kHz
Ultra Low Noise: 8.5 mVRMS
Stable with a 1 mF Small Case Size Ceramic Capacitors
Available in −WLCSP4 0.65 mm x 0.65 mm x 0.33 mm
−XDFN4 1 mm x 1 mm x 0.4 mm
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
•
•
•
•
Battery−powered Equipment
Wireless LAN Devices
Smartphones, Tablets
Cameras, DVRs, STB and Camcorders
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MARKING
DIAGRAMS
WLCSP4
CASE 567JZ
A1
1
XDFN4
CASE 711AJ
XM
XX M
1
X or XX = Specific Device Code
M
= Date Code
PIN CONNECTIONS
IN
OUT
A1
A2
B1
B2
EN
GND
(Top View)
VOUT
VIN
IN
OUT
NCP167
CIN
1 mF
Ceramic
EN
COUT
1 mF
Ceramic
ON
OFF
GND
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information on page 10 of
this data sheet.
Figure 1. Typical Application Schematics
© Semiconductor Components Industries, LLC, 2016
September, 2019 − Rev. 3
1
Publication Order Number:
NCP167/D
NCP167
IN
EN
ENABLE
THERMAL
LOGIC
SHUTDOWN
BANDGAP
MOSFET
REFERENCE
INTEGRATED
DRIVER WITH
SOFT−START
CURRENT LIMIT
OUT
* ACTIVE DISCHARGE
Version A only
EN
GND
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
CSP4
Pin No.
XDFN4
Pin
Name
A1
4
IN
A2
1
OUT
B1
3
EN
B2
2
GND
Common ground connection
−
EPAD
EPAD
Expose pad should be tied to ground plane for better power dissipation
Description
Input voltage supply pin
Regulated output voltage. The output should be bypassed with small 1 mF ceramic capacitor.
Chip enable: Applying VEN < 0.4 V disables the regulator, Pulling VEN > 1.2 V enables the LDO.
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VIN
−0.3 V to 6
V
Output Voltage
VOUT
−0.3 to VIN + 0.3, max. 6 V
V
Chip Enable Input
VCE
−0.3 to VIN + 0.3, max. 6 V
V
Output Short Circuit Duration
tSC
unlimited
s
Maximum Junction Temperature
TJ
150
°C
TSTG
−55 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Input Voltage (Note 1)
Storage Temperature
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114
ESD Machine Model tested per EIA/JESD22−A115
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS
Rating
Symbol
Thermal Characteristics, WLCSP4 (Note 3)
Thermal Resistance, Junction−to−Air
Value
Unit
108
RqJA
Thermal Characteristics, XDFN4 (Note 3)
Thermal Resistance, Junction−to−Air
°C/W
198
3. Measured according to JEDEC board specification. Detailed description of the board can be found in JESD51−7
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2
NCP167
ELECTRICAL CHARACTERISTICS −40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 1 V; IOUT = 1 mA, CIN = COUT = 1 mF, unless otherwise
noted. VEN = 1.2 V. Typical values are at TJ = +25°C (Note 4).
Parameter
Test Conditions
Operating Input Voltage
Symbol
Min
VIN
Output Voltage Accuracy (Note 5)
VIN = VOUT(NOM) + 1 V to 5.5 V
0 mA ≤ IOUT ≤ 700 mA
VOUT
Line Regulation
VOUT(NOM) + 1 V ≤ VIN ≤ 5.5 V
LineReg
Load Regulation
Dropout Voltage (Note 6)
IOUT = 1 mA to
700 mA
WLCSP4
IOUT = 700 mA
VOUT(NOM) = 1.8 V
XDFN4
VOUT(NOM) = 3.3 V
Typ
Max
Unit
1.9
5.5
V
−2
+2
%
0.02
%/V
0.001
LoadReg
%/mA
0.002
VDO
450
190
290
VOUT = 90% VOUT(NOM)
ICL
Short Circuit Current
VOUT = 0 V
ISC
1050
Quiescent Current
IOUT = 0 mA
IQ
9.7
18
mA
Shutdown Current
VEN ≤ 0.4 V, VIN = 4.8 V
IDIS
0.01
1
mA
EN Input Voltage “H”
VENH
EN Input Voltage “L”
VENL
VEN = 4.8 V
IEN
EN Pull Down Current
Turn−On Time
Power Supply Rejection Ratio
Output Voltage Noise
Thermal Shutdown Threshold
Active output discharge resistance
COUT = 1 mF, From assertion of VEN to
VOUT = 95% VOUT(NOM)
1000
mV
Output Current Limit
EN Pin Threshold Voltage
800
315
mA
1.2
0.4
0.2
0.5
V
mA
120
ms
dB
VOUT(NOM) = 3.3 V,
IOUT = 20 mA
f = 100 Hz
f = 1 kHz
f = 10 kHz
f = 100 kHz
PSRR
83
85
80
63
f = 10 Hz to 100 kHz
IOUT = 20 mA
VN
8.5
mVRMS
Temperature rising
TSDH
160
°C
Temperature falling
TSDL
140
°C
VEN < 0.4 V, Version A only
RDIS
280
W
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at TA = 25°C.
Low duty cycle pulse techniques are used during the testing to maintain the junction temperature as close to ambient as possible.
5. Respect SOA.
6. Dropout voltage is characterized when VOUT falls 100 mV below VOUT(NOM).
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3
NCP167
TYPICAL CHARACTERISTICS
16
2.89
IQ, QUIESCENT CURRENT (mA)
VOUT, OUTPUT VOLTAGE (V)
2.90
2.88
2.87
2.86
IOUT = 10 mA
2.85
2.84
VIN = 3.85 V
VOUT = 2.85 V
CIN = 1 mF
COUT = 1 mF
2.83
2.82
2.81
2.80
−40 −20
0
20
40
60
80
100
TJ = −40°C
8
6
VOUT = 2.85 V
CIN = 1 mF
COUT = 1 mF
4
2
0
0.5 1.0
1.5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VIN, INPUT VOLTAGE (V)
Figure 3. Output Voltage vs. Temperature −
VOUT = 2.85 V
Figure 4. Quiescent Current vs. Input Voltage
1000
VDROP, DROPOUT VOLTAGE (V)
1200
TJ = 125°C
800
TJ = 25°C
600
400
TJ = −40°C
200
0.001 0.01
0.1
1
10
TJ = 25°C
0.35
0.30
0.25
TJ = −40°C
0.20
0.15
0.10
0.05
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
Figure 5. Ground Current vs. Output Current
Figure 6. Dropout Voltage vs. Output Current −
VOUT = 1.8 V
0.30
TJ = 125°C
0.21
0.18
TJ = 25°C
0.15
TJ = −40°C
0.12
0.09
0.06
0
0.40
TJ = 125°C
IOUT, OUTPUT CURRENT (A)
VOUT = 2.85 V
CIN = 1 mF
COUT = 1 mF
0.24
1000
VOUT = 1.8 V
CIN = 1 mF
COUT = 1 mF
0.45
IOUT, OUTPUT CURRENT (mA)
0.30
0.27
100
VDROP, DROPOUT VOLTAGE (V)
IGND, GROUND CURRENT (mA)
10
0.50
1400
VDROP, DROPOUT VOLTAGE (V)
TJ = 125°C
TJ, JUNCTION TEMPERATURE (°C)
VIN = 3.85 V
VOUT = 2.85 V
CIN = 1 mF
COUT = 1 mF
1600
0.03
0
TJ = 25°C
12
0
120
1800
0
14
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
TJ = 125°C
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
0.27
0.24
0.21
0.18
TJ = 25°C
0.15
TJ = −40°C
0.12
0.09
0.06
0.03
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
IOUT, OUTPUT CURRENT (A)
IOUT, OUTPUT CURRENT (A)
Figure 7. Dropout Voltage vs. Output Current −
VOUT = 2.85 V
Figure 8. Dropout Voltage vs. Output Current −
VOUT = 3.3 V
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4
NCP167
TYPICAL CHARACTERISTICS
1050
ISC, SHORT CIRCUIT CURRENT (mA)
1050
1000
950
900
850
800
750
700
650
600
550
−40 −20
0
20
40
60
80
120
100
750
VIN = 3.85 V
VOUT = 2.85 V
CIN = 1 mF
COUT = 1 mF
700
650
600
550
−40 −20
0
20
40
60
80
100
Figure 10. Short Circuit Current vs.
Temperature
TJ = −40°C
800
TJ = 25°C
700
600
500
400
300
200
CIN = 1 mF
COUT = 1 mF
0.5 1.0 1.5 2.0
120
0.50
2.5 3.0 3.5 4.0 4.5 5.0 5.5
0.45
0.40
CIN = 1 mF
COUT = 1 mF
0.35
0.30
0.25
VIN = 5.5 V
0.20
0.15
VIN = 3.85 V
0.10
0.05
0
−40
−20
0
20
40
60
80
100
120
VIN, INPUT VOLTAGE (V)
TJ, JUNCTION TEMPERATURE (°C)
Figure 11. Short Circuit Current vs. Input
Voltage
Figure 12. Disable Current vs. Temperature
800
VEN, VOLTAGE ON ENABLE PIN (V)
400
IEN, ENABLE CURRENT (nA)
800
Figure 9. Current Limit vs. Temperature
TJ = 125°C
0
850
TJ, JUNCTION TEMPERATURE (°C)
900
100
0
950
900
TJ, JUNCTION TEMPERATURE (°C)
1000
ISC, SHORT CIRCUIT CURRENT (mA)
VIN = 3.85 V
VOUT = 2.85 V
CIN = 1 mF
COUT = 1 mF
IDIS, DISABLE CURRENT (mA)
ICL, CURRENT LIMIT (mA)
1000
360
320
280
240
VEN = 5.5 V
200
160
VIN = 5.5 V
VOUT = 2.85 V
IOUT = 1 mA
CIN = 1 mF
COUT = 1 mF
120
80
40
0
−40 −20
0
20
40
60
80
120
100
VIN = 5.5 V
VOUT = 2.85 V
IOUT = 10 mA
CIN = 1 mF
COUT = 1 mF
750
700
OFF −> ON
650
600
ON −> OFF
550
500
450
400
350
300
−40
−20
0
20
40
60
80
100
120
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 13. Current to Enable Pin vs.
Temperature
Figure 14. Enable Voltage Threshold vs.
Temperature
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NCP167
TYPICAL CHARACTERISTICS
100
90
1 mA
RR, RIPPLE REJECTION (dB)
RR, RIPPLE REJECTION (dB)
100
80
70
60
50
20 mA
40
VIN = 3.8 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
MLCC, X7R, 0805
30
20
10
0
100
1K
100 mA
10K
100K
1M
10M
VOUT = 3.3 V
IOUT = 100 mA
CIN = 1 mF
COUT = 1 mF
MLCC, X7R, 0805
100
1K
10K
100K
30
20
10
0
20 mA
VIN = 3.6 V
VOUT = 3.3 V
CIN = 1 mF
COUT = 1 mF
MLCC, X7R, 0805
100
1K
100 mA
10K
100K
1M
10M
1M
3.6 V
70
3.8 V
60
50
40
VOUT = 3.3 V
IOUT = 20 mA
CIN = 1 mF
COUT = 1 mF
MLCC, X7R, 0805
30
20
10
100
1K
10K
100K
1M
10M
FREQUENCY (kHz)
Figure 17. Power Supply Rejection Ratio vs.
Input Voltage, IOUT = 100 mA, COUT = 1 mF
Figure 18. Power Supply Rejection Ratio vs.
Input Voltage, IOUT = 20 mA, COUT = 1 mF
100K
VIN = 3.6 V
VOUT = 3.3 V
IOUT = 20 mA
CIN = 1 mF
COUT = 1 mF
MLCC, X7R, 0805
10K
1K
100
10
80
0
10M
4.3 V
90
FREQUENCY (kHz)
100K
OUTPUT VOLTAGE NOISE (nV/√Hz)
RR, RIPPLE REJECTION (dB)
3.8 V
OUTPUT VOLTAGE NOISE (nV/√Hz)
RR, RIPPLE REJECTION (dB)
3.6 V
50
10
40
100
4.3 V
60
0
50
Figure 16. Power Supply Rejection Ratio vs.
Current, VDROP = 0.3 V, COUT = 1 mF
70
10
60
Figure 15. Power Supply Rejection Ratio vs.
Current, VDROP = 0.5 V, COUT = 1 mF
80
20
70
FREQUENCY (kHz)
90
30
1 mA
80
FREQUENCY (kHz)
100
40
90
100
1K
10K
100K
1M
VIN = 3.8 V
VOUT = 3.3 V
IOUT = 250 mA
CIN = 1 mF
COUT = 1 mF
MLCC, X7R, 0805
10K
1K
100
10
10
100
1K
10K
100K
1M
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 19. Output Voltage Noise Spectral Density
for VOUT = 3.3 V, IOUT = 20 mA, COUT = 1 mF
Figure 20. Output Voltage Noise Spectral Density
for VOUT = 3.3 V, IOUT = 250 mA, COUT = 1 mF
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NCP167
APPLICATIONS INFORMATION
General
maximum value of ESR should be less than 1.7 W. Larger
output capacitors and lower ESR could improve the load
transient response or high frequency PSRR. It is not
recommended to use tantalum capacitors on the output due
to their large ESR. The equivalent series resistance of
tantalum capacitors is also strongly dependent on the
temperature, increasing at low temperature.
The NCP167 is an ultra−low noise 700 mA low dropout
regulator designed to meet the requirements of RF
applications and high performance analog circuits. The
NCP167 device provides very high PSRR and excellent
dynamic response. In connection with low quiescent current
this device is well suitable for battery powered application
such as cell phones, tablets and other. The NCP167 is fully
protected in case of current overload, output short circuit and
overheating.
Enable Operation
Input capacitor connected as close as possible is necessary
for ensure device stability. The X7R or X5R capacitor
should be used for reliable performance over temperature
range. The value of the input capacitor should be 1 mF or
greater to ensure the best dynamic performance. This
capacitor will provide a low impedance path for unwanted
AC signals or noise modulated onto constant input voltage.
There is no requirement for the ESR of the input capacitor
but it is recommended to use ceramic capacitors for their low
ESR and ESL. A good input capacitor will limit the
influence of input trace inductance and source resistance
during sudden load current changes.
The NCP167 uses the EN pin to enable/disable its device
and to deactivate/activate the active discharge function. If
the EN pin voltage is 1.2 V the device is
guaranteed to be enabled. The NCP167 regulates the output
voltage and the active discharge transistor is turned−off. The
EN pin has internal pull−down current source with typ. value
of 200 nA which assures that the device is turned−off when
the EN pin is not connected. In the case where the EN
function isn’t required the EN should be tied directly to IN.
Output Decoupling (COUT)
Output Current Limit
Input Capacitor Selection (CIN)
The NCP167 requires an output capacitor connected as
close as possible to the output pin of the regulator. The
recommended capacitor value is 1 mF and X7R or X5R
dielectric due to its low capacitance variations over the
specified temperature range. The NCP167 is designed to
remain stable with minimum effective capacitance of 0.7 mF
to account for changes with temperature, DC bias and
package size. Especially for small package size capacitors
such as 0201 the effective capacitance drops rapidly with the
applied DC bias. Please refer Figure 21.
Output Current is internally limited within the IC to a
typical 1000 mA. The NCP167 will source this amount of
current measured with a voltage drops on the 90% of the
nominal VOUT. If the Output Voltage is directly shorted to
ground (VOUT = 0 V), the short circuit protection will limit
the output current to 1050 mA (typ.). The current limit and
short circuit protection will work properly over whole
temperature range and also input voltage range. There is no
limitation for the short circuit duration.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
threshold (TSD = 160°C typical), Thermal Shutdown event
is detected and the device is disabled. The IC will remain in
this state until the die temperature decreases below the
Thermal Shutdown Reset threshold (TSDU = 140°C typical).
Once the IC temperature falls below the 140°C the LDO is
enabled again. The thermal shutdown feature provides the
protection from a catastrophic device failure due to
accidental overheating. This protection is not intended to be
used as a substitute for proper heat sinking.
Reverse Current
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case that VOUT > VIN.
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
Figure 21. Capacity vs DC Bias Voltage
There is no requirement for the minimum value of
Equivalent Series Resistance (ESR) for the COUT but the
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7
NCP167
Power Supply Rejection Ratio
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part. The maximum power dissipation the
NCP167 can handle is given by:
The NCP167 features very high Power Supply Rejection
ratio. If desired the PSRR at higher frequencies in the range
100 kHz – 10 MHz can be tuned by the selection of COUT
capacitor and proper PCB layout.
Turn−On Time
The turn−on time is defined as the time period from EN
assertion to the point in which VOUT will reach 98% of its
nominal value. This time is dependent on various
application conditions such as VOUT(NOM), COUT, TA.
P D(MAX) +
q JA
P D [ V IN @ I GND ) I OUTǒV IN * V OUTǓ
As power dissipated in the NCP167 increases, it might
become necessary to provide some thermal relief. The
160
PD(MAX), TA = 25°C, 2 oz Cu
PD(MAX), TA = 25°C, 1 oz Cu
140
1.4
1.2
130
1.0
120
0.8
qJA, 1 oz Cu
110
0.6
0.4
100
qJA, 2 oz Cu
90
0
100
200
300
400
500
0.2
600
PCB COPPER AREA (mm2)
Figure 22. qJA and PD (MAX) vs. Copper Area (CSP4)
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8
0
700
PD(MAX), MAXIMUM POWER DISSIPATION (W)
1.6
150
80
(eq. 1)
The power dissipated by the NCP167 for given application
conditions can be calculated from the following equations:
Power Dissipation
qJA, JUNCTION TO AMBIENT THERMAL RESISTANCE (°C/W)
ƪ125oC * T Aƫ
(eq. 2)
1.0
220
PD(MAX), TA = 25°C, 2 oz Cu
210
0.9
200
0.8
PD(MAX), TA = 25°C, 1 oz Cu
190
0.7
qJA, 2 oz Cu
qJA, 1 oz Cu
180
0.6
170
0.5
160
0.4
150
0
100
200
300
400
PCB COPPER AREA (mm2)
500
600
PD(MAX), MAXIMUM POWER DISSIPATION (W)
qJA, JUNCTION TO AMBIENT THERMAL RESISTANCE (°C/W)
NCP167
0.3
700
Figure 23. qJA and PD (MAX) vs. Copper Area (XDFN4)
PCB Layout Recommendations
To obtain good transient performance and good regulation
characteristics place CIN and COUT capacitors close to the
device pins and make the PCB traces wide. In order to
minimize the solution size, use 0402 or 0201 capacitors with
appropriate capacity. Larger copper area connected to the
pins will also improve the device thermal resistance. The
actual power dissipation can be calculated from the equation
above (Equation 2). Expose pad can be tied to the GND pin
for improvement power dissipation and lower device
temperature.
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9
NCP167
ORDERING INFORMATION (XDFN4)
Device
Nominal Output Voltage
Description
Marking
NCP167AMX180TBG
1.8 V
CH
NCP167AMX280TBG
2.8 V
CP
NCP167AMX285TBG
2.85 V
NCP167AMX300TBG
3.0 V
NCP167AMX330TBG
3.3 V
NCP167AMX350TBG
3.5 V
NCP167BMX330TBG
3.3 V
Package
Shipping
XDFN4
(Pb−Free)
3000 / Tape
& Reel
Package
Shipping†
WLCSP4
(Pb-Free)
5000 / Tape
& Reel
CK
700 mA, Active
Discharge
CQ
CR
CL
700 mA, Non-Active
Discharge
AR
ORDERING INFORMATION (WLCSP4)
Device
Nominal
Output
Voltage
Description
Marking*
Rotation
NCP167AFCT180T2G
1.8 V
H
0°
NCP167AFCT285T2G
2.85 V
K
0°
NCP167AFCT295T2G
2.95 V
P
0°
NCP167AFCT330T2G
3.3 V
R
0°
NCP167AFCT350T2G
3.5 V
L
0°
NCP167AFCTC350T2G
3.5 V
700 mA, Active Discharge,
Backside Coating
L
0°
NCP167BFCT330T2G
3.3 V
700 mA, Non−Active
Discharge
R
180°
700 mA, Active Discharge
*Marking letter with overbar.
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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10
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP4, 0.64x0.64
CASE 567JZ
ISSUE A
SCALE 4:1
È
È
A
E
PIN A1
REFERENCE
DATE 03 AUG 2016
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
D
DIM
A
A1
A2
b
D
E
e
TOP VIEW
A2
0.05 C
A
0.05 C
NOTE 3
4X
A1
SIDE VIEW
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
A1
PACKAGE
OUTLINE
e
b
0.03 C A B
C
MILLIMETERS
MIN
NOM
MAX
−−−
−−−
0.33
0.04
0.06
0.08
0.23 REF
0.195
0.210
0.225
0.610
0.640
0.670
0.610
0.640
0.670
0.35 BSC
e
B
A
1
2
BOTTOM VIEW
DOCUMENT NUMBER:
DESCRIPTION:
98AON85781F
WLCSP4, 0.64X0.64
0.35
PITCH
4X
0.20
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN4 1.0x1.0, 0.65P
CASE 711AJ
ISSUE B
1
SCALE 4:1
GENERIC
MARKING DIAGRAM*
XX M
1
DOCUMENT NUMBER:
DESCRIPTION:
XX = Specific Device Code
M = Date Code
98AON67179E
XDFN4, 1.0X1.0, 0.65P
DATE 25 JUN 2021
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
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