NCP170
LDO Regulator, 150 mA,
Ultra‐Low IQ, CMOS
The NCP170 series of CMOS low dropout regulators are designed
specifically for portable battery-powered applications which require
ultra-low quiescent current. The ultra-low consumption of typ. 500 nA
ensures long battery life and dynamic transient boost feature improves
device transient response for wireless communication applications.
The device is available in small 1 × 1 mm XDFN4, SOT-563 and
TSOP-5 packages.
•
Operating Input Voltage Range: 2.2 V to 5.5 V
Output Voltage Range: 1.2 V to 3.6 V (0.1 V Steps)
Ultra-Low Quiescent Current Typ. 0.5 mA
Low Dropout: 170 mV Typ. at 150 mA
High Output Voltage Accuracy ±1%
Stable with Ceramic Capacitors 1 mF
Over-Current Protection
Thermal Shutdown Protection
NCP170A for Active Discharge Option
Available in Small 1 × 1 mm XDFN4, SOT−563 and TSOP-5
Packages
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
IN
1 mF
XDFN4
MX SUFFIX
CASE 711AJ
SOT−563
XV SUFFIX
CASE 463A
5
1
TSOP−5
SN SUFFIX
CASE 483
MARKING DIAGRAMS
XDFN4
XX M
1
XX = Specific Device Code
M = Date Code
SOT−563
XX MG
XX = Specific Device Code
M = Month Code
G
= Pb-Free Package
• Battery Powered Equipments
• Portable Communication Equipments
• Cameras, Image Sensors and Camcorders
VIN
1
1
Typical Applications
CIN
6
1
Features
•
•
•
•
•
•
•
•
•
•
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NCP170
*Pb-Free indicator, “G” or microdot “G”,
may or may not be present.
VOUT
OUT
COUT
EN
TSOP−5
5
XXXAYWG
G
1 mF
GND
1
XXX = Specific Device Code
A
= Assembly Location
Y
= Year
W = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
Figure 1. Typical Application Schematic
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 21 of this data sheet.
© Semiconductor Components Industries, LLC, 2017
May, 2019 − Rev. 18
1
Publication Order Number:
NCP170/D
NCP170
PIN FUNCTION DESCRIPTION
Pin No.
XDFN4
Pin No.
SOT−563
Pin No.
TSOP−5
Pin Name
4
1
1
IN
2
2
2
GND
3
6
3
EN
1
3
5
OUT
Output Pin
EPAD
−
−
EPAD
Internally Connected to GND
−
4
4
NC
−
5
−
GND
Description
Power Supply Input Voltage
Power Supply Ground
Chip Enable Pin (Active “H”)
No Connect
Power Supply Ground
ABSOLUTE MAXIMUM RATINGS
Symbol
VIN
Rating
Input Voltage (Note 1)
VOUT
Output Voltage
VCE
Chip Enable Input
TJ(MAX)
TSTG
Maximum Junction Temperature
Storage Temperature
Value
Unit
6.0
V
−0.3 to VIN + 0.3
V
−0.3 to 6.0
V
150
°C
−55 to 150
°C
ESDHBM
ESD Capability, Human Body Model (Note 2)
2000
V
ESDMM
ESD Capability, Machine Model (Note 2)
200
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC-Q100-002 (EIA/JESD22-A114)
ESD Machine Model tested per AEC-Q100-003 (EIA/JESD22-A115)
Latchup Current Maximum Rating tested per JEDEC standard: JESD78
THERMAL CHARACTERISTICS
Symbol
RqJA
Rating
Value
Thermal Characteristics, Thermal Resistance, Junction-to-Air
XDFN4 1 × 1 mm
SOT−563
TSOP−5
Figure 2. Simplified Block Diagram
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2
250
200
250
Unit
°C/W
NCP170
ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 1.2 V
(−40°C ≤ TJ ≤ 85°C; VIN = 2.5 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 3)
Symbol
VIN
VOUT
Parameter
Test Conditions
Min
Typ
Max
Unit
2.2
−
5.5
V
TA = +25°C
1.188
1.2
1.212
V
−40°C ≤ TJ ≤ 85°C
1.176
1.2
1.224
Operating Input Voltage
Output Voltage
LineReg
Line Regulation
2.5 V < VIN ≤ 5.5 V, IOUT = 1 mA
LoadReg
Load Regulation
0 mA < IOUT ≤ 150 mA, VIN = 2.5 V
−
0.05
0.20
%/V
−20
1
20
mV
VDO
Dropout Voltage
(Note 4)
−
−
−
mV
IOUT
Output Current
(Note 5)
150
−
−
mA
ISC
Short Circuit Current Limit
VOUT = 0 V
−
225
−
mA
IQ
Quiescent Current
IOUT = 0 mA
−
0.5
0.9
mA
ISTB
Standby Current
VEN = 0 V, TJ = 25°C
−
0.1
0.5
mA
VENH
EN Pin Threshold Voltage
EN Input Voltage “H”
1.2
−
−
V
VENL
EN Pin Threshold Voltage
EN Input Voltage “L”
−
−
0.4
V
EN Pin Current
VEN ≤ VIN ≤ 5.5 V (Note 6)
−
10
−
nA
PSRR
Power Supply Rejection Ratio
f = 1 kHz, VIN = 2.2 V + 200 mVpp Modulation
IOUT = 150 mA
IOUT = 10 mA
−
−
57
63
−
−
VNOISE
Output Noise Voltage
VIN = 5.5 V, IOUT = 1 mA,
f = 100 Hz to 1 MHz, COUT = 1 mF
−
85
−
mVrms
Active Output Discharge
Resistance (A option only)
VIN = 5.5 V, VEN = 0 V (Note 6)
−
100
−
W
TSD
Thermal Shutdown Temperature
Temperature Increasing from TJ = +25°C
(Note 6)
−
175
−
°C
TSDH
Thermal Shutdown Hysteresis
Temperature Falling from TSD (Note 6)
−
25
−
°C
IEN
RLOW
dB
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at
TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
4. Not Characterized at VIN = 2.2 V, VOUT = 1.2 V, IOUT = 150 mA.
5. Respect SOA.
6. Guaranteed by design and characterization.
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NCP170
ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 1.5 V
(−40°C ≤ TJ ≤ 85°C; VIN = 2.5 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 7)
Symbol
VIN
VOUT
Parameter
Test Conditions
Min
Typ
Max
Unit
2.2
−
5.5
V
TA = +25°C
1.485
1.5
1.515
V
−40°C ≤ TJ ≤ 85°C
1.470
1.5
1.530
Operating Input Voltage
Output Voltage
LineReg
Line Regulation
4.3 V < VIN ≤ 5.5 V, IOUT = 1 mA
LoadReg
Load Regulation
0 mA < IOUT ≤ 150 mA, VIN = 4.3 V
−
0.05
0.20
%/V
−20
−
20
mV
VDO
Dropout Voltage
IOUT = 150 mA (Note 8)
−
−
−
mV
IOUT
Output Current
(Note 9)
150
−
−
mA
ISC
Short Circuit Current Limit
VOUT = 0 V
−
225
−
mA
IQ
Quiescent Current
IOUT = 0 mA
−
0.5
0.9
mA
ISTB
Standby Current
VEN = 0 V, TJ = 25°C
−
0.1
0.5
mA
VENH
EN Pin Threshold Voltage
EN Input Voltage “H”
1.2
−
−
V
VENL
EN Pin Threshold Voltage
EN Input Voltage “L”
−
−
0.4
V
EN Pin Current
VEN ≤ VIN ≤ 5.5 V (Note 10)
−
10
−
nA
PSRR
Power Supply Rejection Ratio
f = 1 kHz, VIN = 2.5 V + 200 mVpp Modulation
IOUT = 150 mA
−
57
−
VNOISE
Output Noise Voltage
VIN = 5.5 V, IOUT = 1 mA,
f = 100 Hz to 1 MHz, COUT = 1 mF
−
90
−
mVrms
Active Output Discharge
Resistance (A option only)
VIN = 5.5 V, VEN = 0 V (Note 10)
−
100
−
W
TSD
Thermal Shutdown Temperature
Temperature Increasing from TJ = +25°C
(Note 10)
−
175
−
°C
TSDH
Thermal Shutdown Hysteresis
Temperature Falling from TSD (Note 10)
−
25
−
°C
IEN
RLOW
dB
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
7. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at
TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
8. Not Characterized at VIN = 2.2 V, VOUT = 1.5 V, IOUT = 150 mA.
9. Respect SOA.
10. Guaranteed by design and characterization.
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NCP170
ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 1.8 V
(−40°C ≤ TJ ≤ 85°C; VIN = 2.8 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 11)
Symbol
VIN
Parameter
Test Conditions
Min
Typ
Max
Unit
2.2
−
5.5
V
2.0
−
5.5
TA = +25°C
1.782
1.8
1.818
−40°C ≤ TJ ≤ 85°C
1.764
1.8
1.836
−
0.05
0.20
%/V
−20
1
20
mV
−
350
480
mV
150
−
−
mA
Operating Input Voltage
IOUT < 30 mA
VOUT
Output Voltage
V
LineReg
Line Regulation
2.8 V < VIN ≤ 5.5 V, IOUT = 1 mA
LoadReg
Load Regulation
0 mA < IOUT ≤ 150 mA, VIN = 2.8 V
VDO
Dropout Voltage
IOUT = 150 mA (Note 12)
IOUT
Output Current
(Note 13)
ISC
Short Circuit Current Limit
VOUT = 0 V
−
225
−
mA
IQ
Quiescent Current
IOUT = 0 mA
−
0.5
0.9
mA
ISTB
Standby Current
VEN = 0 V, TJ = 25°C
−
0.1
0.5
mA
VENH
EN Pin Threshold Voltage
EN Input Voltage “H”
1.2
−
−
V
VENL
EN Pin Threshold Voltage
EN Input Voltage “L”
−
−
0.4
V
EN Pull Down Current
VEN ≤ VIN ≤ 5.5 V (Note 14)
−
10
−
nA
PSRR
Power Supply Rejection Ratio
f = 1 kHz, VIN = 2.8 V + 200 mVpp Modulation
IOUT = 150 mA
−
57
−
dB
VNOISE
Output Noise Voltage
VIN = 5.5 V, IOUT = 1 mA
f = 100 Hz to 1 MHz, COUT = 1 mF
−
95
−
mVrms
Active Output Discharge
Resistance (A option only)
VIN = 5.5 V, VEN = 0 V (Note 14)
−
100
−
W
TSD
Thermal Shutdown Temperature
Temperature Increasing from TJ = +25°C
(Note 14)
−
175
−
°C
TSDH
Thermal Shutdown Hysteresis
Temperature Falling from TSD (Note 14)
−
25
−
°C
IEN
RLOW
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
11. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at
TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
12. Characterized when VOUT falls 54 mV below the regulated voltage and only for devices with VOUT = 1.8 V.
13. Respect SOA.
14. Guaranteed by design and characterization.
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NCP170
ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 2.5 V
(−40°C ≤ TJ ≤ 85°C; VIN = 3.5 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 15)
Symbol
VIN
VOUT
Parameter
Test Conditions
Min
Typ
Max
Unit
2.2
−
5.5
V
TA = +25°C
2.475
2.5
2.525
V
−40°C ≤ TJ ≤ 85°C
2.450
2.5
2.550
Operating Input Voltage
Output Voltage
LineReg
Line Regulation
3.5 V < VIN ≤ 5.5 V, IOUT = 1 mA
LoadReg
Load Regulation
0 mA < IOUT ≤ 150 mA, VIN = 3.5 V
−
0.05
0.20
%/V
−20
1
20
mV
VDO
Dropout Voltage
IOUT = 150 mA (Note 16)
−
240
330
mV
IOUT
Output Current
(Note 17)
150
−
−
mA
ISC
Short Circuit Current Limit
VOUT = 0 V
−
225
−
mA
IQ
Quiescent Current
IOUT = 0 mA
−
0.5
0.9
mA
ISTB
Standby Current
VEN = 0 V, TJ = 25°C
−
0.1
0.5
mA
VENH
EN Pin Threshold Voltage
EN Input Voltage “H”
1.2
−
−
V
VENL
EN Pin Threshold Voltage
EN Input Voltage “L”
−
−
0.4
V
EN Pull Down Current
VEN ≤ VIN ≤ 5.5 V (Note 18)
−
10
−
nA
PSRR
Power Supply Rejection Ratio
f = 1 kHz, VIN = 3.5 V + 200 mVpp Modulation
IOUT = 150 mA
−
57
−
dB
VNOISE
Output Noise Voltage
VIN = 5.5 V, IOUT = 1 mA
f = 100 Hz to 1 MHz, COUT = 1 mF
−
125
−
mVrms
Active Output Discharge
Resistance (A option only)
VIN = 5.5 V, VEN = 0 V (Note 18)
−
100
−
W
TSD
Thermal Shutdown Temperature
Temperature Increasing from TJ = +25°C
(Note 18)
−
175
−
°C
TSDH
Thermal Shutdown Hysteresis
Temperature Falling from TSD (Note 18)
−
25
−
°C
IEN
RLOW
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
15. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at
TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
16. Characterized when VOUT falls 75 mV below the regulated voltage and only for devices with VOUT = 2.5 V.
17. Respect SOA.
18. Guaranteed by design and characterization.
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NCP170
ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 2.8 V
(−40°C ≤ TJ ≤ 85°C; VIN = 3.8 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 19)
Symbol
VIN
VOUT
Parameter
Test Conditions
Min
Typ
Max
Unit
2.2
−
5.5
V
TA = +25°C
2.772
2.8
2.828
V
−40°C ≤ TJ ≤ 85°C
2.744
2.8
2.856
Operating Input Voltage
Output Voltage
LineReg
Line Regulation
3.8 V < VIN ≤ 5.5 V, IOUT = 1 mA
LoadReg
Load Regulation
0 mA < IOUT ≤ 150 mA, VIN = 3.8 V
−
0.05
0.20
%/V
−20
1
20
mV
VDO
Dropout Voltage
IOUT = 150 mA (Note 20)
−
210
300
mV
IOUT
Output Current
(Note 21)
150
−
−
mA
ISC
Short Circuit Current Limit
VOUT = 0 V
−
195
−
mA
IQ
Quiescent Current
IOUT = 0 mA
−
0.5
0.9
mA
ISTB
Standby Current
VEN = 0 V, TJ = 25°C
−
0.1
0.5
mA
VENH
EN Pin Threshold Voltage
EN Input Voltage “H”
1.2
−
−
V
VENL
EN Pin Threshold Voltage
EN Input Voltage “L”
−
−
0.4
V
EN Pull Down Current
VEN ≤ VIN ≤ 5.5 V (Note 22)
−
10
−
nA
PSRR
Power Supply Rejection Ratio
f = 1 kHz, VIN = 3.8 V + 200 mVpp Modulation
IOUT = 150 mA
−
40
−
dB
VNOISE
Output Noise Voltage
VIN = 5.5 V, IOUT = 1 mA
f = 100 Hz to 1 MHz, COUT = 1 mF
−
125
−
mVrms
Active Output Discharge
Resistance (A option only)
VIN = 5.5 V, VEN = 0 V (Note 22)
−
100
−
W
TSD
Thermal Shutdown Temperature
Temperature Increasing from TJ = +25°C
(Note 22)
−
175
−
°C
TSDH
Thermal Shutdown Hysteresis
Temperature Falling from TSD (Note 22)
−
25
−
°C
IEN
RLOW
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
19. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at
TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
20. Characterized when VOUT falls 84 mV below the regulated voltage and only for devices with VOUT = 2.8 V.
21. Respect SOA.
22. Guaranteed by design and characterization.
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NCP170
ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 3.0 V
(−40°C ≤ TJ ≤ 85°C; VIN = 4.0 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 23)
Symbol
VIN
VOUT
Parameter
Test Conditions
Min
Typ
Max
Unit
2.2
−
5.5
V
TA = +25°C
2.97
3.0
3.03
V
−40°C ≤ TJ ≤ 85°C
2.94
3.0
3.06
Operating Input Voltage
Output Voltage
LineReg
Line Regulation
4.0 V < VIN ≤ 5.5 V, IOUT = 1 mA
−
0.05
0.20
%/V
LoadReg
Load Regulation
0 mA < IOUT ≤ 150 mA, VIN = 4 V
−20
1
20
mV
VDO
Dropout Voltage
IOUT = 150 mA (Note 24)
−
190
260
mV
IOUT
Output Current
(Note 25)
150
−
−
mA
ISC
Short Circuit Current Limit
VOUT = 0 V
−
195
−
mA
IQ
Quiescent Current
IOUT = 0 mA
−
0.5
0.9
mA
ISTB
Standby Current
VEN = 0 V, TJ = 25°C
−
0.1
0.5
mA
VENH
EN Pin Threshold Voltage
EN Input Voltage “H”
1.2
−
−
V
VENL
EN Pin Threshold Voltage
EN Input Voltage “L”
−
−
0.4
V
EN Pull Down Current
VEN ≤ VIN ≤ 5.5 V (Note 26)
−
10
−
nA
PSRR
Power Supply Rejection Ratio
f = 1 kHz, VIN = 4.0 V + 200 mVpp Modulation
IOUT = 150 mA
−
47
−
dB
VNOISE
Output Noise Voltage
VIN = 5.5 V, IOUT = 1 mA
f = 100 Hz to 1 MHz, COUT = 1 mF
−
120
−
mVrms
Active Output Discharge
Resistance (A option only)
VIN = 5.5 V, VEN = 0 V (Note 26)
−
100
−
W
TSD
Thermal Shutdown Temperature
Temperature Increasing from TJ = +25°C
(Note 26)
−
175
−
°C
TSDH
Thermal Shutdown Hysteresis
Temperature Falling from TSD (Note 26)
−
25
−
°C
IEN
RLOW
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
23. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at
TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
24. Characterized when VOUT falls 90 mV below the regulated voltage and only for devices with VOUT = 3.0 V.
25. Respect SOA.
26. Guaranteed by design and characterization.
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NCP170
ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 3.3 V
(−40°C ≤ TJ ≤ 85°C; VIN = 4.3 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 27)
Symbol
VIN
VOUT
Parameter
Test Conditions
Min
Typ
Max
Unit
2.2
−
5.5
V
TA = +25°C
3.267
3.3
3.333
V
−40°C ≤ TJ ≤ 85°C
3.234
3.3
3.366
Operating Input Voltage
Output Voltage
LineReg
Line Regulation
4.3 V < VIN ≤ 5.5 V, IOUT = 1 mA
LoadReg
Load Regulation
0 mA < IOUT ≤ 150 mA, VIN = 4.3 V
−
0.05
0.20
%/V
−20
1
20
mV
VDO
Dropout Voltage
IOUT = 150 mA (Note 28)
−
180
250
mV
IOUT
Output Current
(Note 29)
150
−
−
mA
ISC
Short Circuit Current Limit
VOUT = 0 V
−
195
−
mA
IQ
Quiescent Current
IOUT = 0 mA
−
0.5
0.9
mA
ISTB
Standby Current
VEN = 0 V, TJ = 25°C
−
0.1
0.5
mA
VENH
EN Pin Threshold Voltage
EN Input Voltage “H”
1.2
−
−
V
VENL
EN Pin Threshold Voltage
EN Input Voltage “L”
−
−
0.4
V
EN Pull Down Current
VEN ≤ VIN ≤ 5.5 V (Note 30)
−
10
−
nA
PSRR
Power Supply Rejection Ratio
f = 1 kHz, VIN = 4.3 V + 200 mVpp Modulation
IOUT = 150 mA
−
41
−
dB
VNOISE
Output Noise Voltage
VIN = 5.5 V, IOUT = 1 mA
f = 100 Hz to 1 MHz, COUT = 1 mF
−
125
−
mVrms
Active Output Discharge
Resistance (A option only)
VIN = 5.5 V, VEN = 0 V (Note 30)
−
100
−
W
TSD
Thermal Shutdown Temperature
Temperature Increasing from TJ = +25°C
(Note 30)
−
175
−
°C
TSDH
Thermal Shutdown Hysteresis
Temperature Falling from TSD (Note 30)
−
25
−
°C
IEN
RLOW
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
27. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at
TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
28. Characterized when VOUT falls 99 mV below the regulated voltage and only for devices with VOUT = 3.3 V.
29. Respect SOA.
30. Guaranteed by design and characterization.
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9
NCP170
ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 3.6 V
(−40°C ≤ TJ ≤ 85°C; VIN = 4.6 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 31)
Symbol
VIN
VOUT
Parameter
Test Conditions
Min
Typ
Max
Unit
2.2
−
5.5
V
TA = +25°C
3.564
3.6
3.636
V
−40°C ≤ TJ ≤ 85°C
3.528
3.6
3.672
−
0.05
0.20
%/V
−20
1
20
mV
−
170
240
mV
150
−
−
mA
Operating Input Voltage
Output Voltage
LineReg
Line Regulation
4.6 V < VIN ≤ 5.5 V, IOUT = 1 mA
LoadReg
Load Regulation
0 mA < IOUT ≤ 150 mA, VIN = 4.6 V
VDO
Dropout Voltage
IOUT = 150 mA (Note 32)
IOUT
Output Current
(Note 33)
ISC
Short Circuit Current Limit
VOUT = 0 V
−
195
−
mA
IQ
Quiescent Current
IOUT = 0 mA
−
0.5
0.9
mA
ISTB
Standby Current
VEN = 0 V, TJ = 25°C
−
0.1
0.5
mA
VENH
EN Pin Threshold Voltage
EN Input Voltage “H”
1.2
−
−
V
VENL
EN Pin Threshold Voltage
EN Input Voltage “L”
−
−
0.4
V
EN Pull Down Current
VEN ≤ VIN ≤ 5.5 V (Note 34)
−
10
−
nA
PSRR
Power Supply Rejection Ratio
f = 1 kHz, VIN = 4.6 V + 200 mVpp Modulation
IOUT = 150 mA
−
30
−
dB
VNOISE
Output Noise Voltage
VIN = 5.5 V, IOUT = 1 mA
f = 100 Hz to 1 MHz, COUT = 1 mF
−
130
−
mVrms
RLOW
Active Output Discharge Resistance (A option only)
VIN = 5.5 V, VEN = 0 V (Note 34)
−
100
−
TSD
Thermal Shutdown Temperature
Temperature Increasing from TJ = +25°C (Note 34)
−
175
−
°C
TSDH
Thermal Shutdown Hysteresis
Temperature Falling from TSD (Note 34)
−
25
−
°C
IEN
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
31. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA =
25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
32. Characterized when VOUT falls 108 mV below the regulated voltage and only for devices with VOUT = 3.6 V.
33. Respect SOA.
34. Guaranteed by design and characterization.
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10
NCP170
TYPICAL CHARACTERISTICS
1.202
1.802
Vin = 5.5 V
Vin = 3.0 V
1.198
Vin = 2.2 V
1.196
1.798
Vin = 3.5 V
1.794
NCP170xxx120TyG
Cin = Cout = 1 mF
Iout = 1 mA
1.192
1.190
−40
−20
0
20
40
NCP170xxx180TyG
Cin = Cout = 1 mF
Iout = 1 mA
1.792
60
1.790
−40
80
−20
0
20
40
60
80
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 3. Output Voltage vs. Temperature,
Vout = 1.2 V
Figure 4. Output Voltage vs. Temperature,
Vout = 1.8 V
3.008
3.604
Vin = 5.5 V
3.000
Vin = 3.3 − 4.5 V
2.996
Vin = 5.0 V
2.992
NCP170xxx300TyG
Cin = Cout = 1 mF
Iout = 1 mA
2.988
2.984
−40
−20
0
20
40
60
Vin = 5.5 V
3.600
OUTPUT VOLTAGE (V)
3.004
OUTPUT VOLTAGE (V)
Vin = 2.8 V
1.796
1.194
3.596
Vin = 3.8 − 4.5 V
Vin = 5.0 V
3.592
3.588
NCP170xxx360TyG
Cin = Cout = 1 mF
Iout = 1 mA
3.584
3.580
−40
80
−20
0
20
40
60
80
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 5. Output Voltage vs. Temperature,
Vout = 3.0 V
Figure 6. Output Voltage vs. Temperature,
Vout = 3.6 V
1.200
1.802
Vin = 2.5 V
1.198
Vin = 3.0 V
1.197
Vin = 4.0 V
1.196
NCP170xxx120TyG
Cin = Cout = 1 mF
TA = 25°C
1.195
0
20
40
60
Vin = 5.5 V
80
100
120
OUTPUT VOLTAGE (V)
1.800
OUTPUT VOLTAGE (V)
1.199
1.194
Vin = 5.5 V
1.800
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
1.200
Vin = 2.8 V
1.798
Vin = 4.0 V
1.796
Vin = 4.5 V
1.794
NCP170xxx180TyG
Cin = Cout = 1 mF
TA = 25°C
1.792
1.790
140
0
20
40
60
Vin = 5.5 V
80
100
120
140
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
Figure 7. Output Voltage vs. Output Current,
Vout = 1.2 V
Figure 8. Output Voltage vs. Output Current,
Vout = 1.8 V
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11
NCP170
TYPICAL CHARACTERISTICS
3.002
3.599
3.000
Vin = 4.5 V
2.999
Vin = 5.0 V
2.998
NCP170xxx300TyG
Cin = Cout = 1 mF
TA = 25°C
2.997
2.996
0
450
40
60
3.597
3.596
Vin = 4.6 V
3.595
Vin = 5.5 V
80
100
120
3.593
140
40
60
80
100
120
140
Figure 10. Output Voltage vs. Output Current,
Vout = 3.6 V
300
TA = 85°C
250
TA = −40°C
200
150
100
50
20
40
60
80
100
120
NCP170xxx250TyG
Cin = Cout = 1 mF
250
TA = 85°C
TA = 25°C
200
150
TA = −40°C
100
50
0
140
0
20
40
60
80
100
120
140
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
Figure 11. Dropout Voltage vs. Output Current,
Vout = 1.8 V
Figure 12. Dropout Voltage vs. Output Current,
Vout = 2.5 V
200
250
NCP170xxx300TyG
Cin = Cout = 1 mF
200
TA = 85°C
TA = 25°C
150
TA = −40°C
100
50
0
20
40
60
80
100
120
DROPOUT VOLTAGE (mV)
DROPOUT VOLTAGE (mV)
20
Figure 9. Output Voltage vs. Output Current,
Vout = 3.0 V
300
0
0
Vin = 5.5 V
OUTPUT CURRENT (mA)
TA = 25°C
0
Vin = 5.0 V
NCP170xxx360TyG
Cin = Cout = 1 mF
TA = 25°C
OUTPUT CURRENT (mA)
350
0
Vin = 4.3 V
3.594
NCP170xxx180TyG
Cin = Cout = 1 mF
400
DROPOUT VOLTAGE (mV)
20
3.598
OUTPUT VOLTAGE (V)
Vin = 4.0 V
DROPOUT VOLTAGE (mV)
OUTPUT VOLTAGE (V)
3.001
TA = 25°C
150
125
100
TA = −40°C
75
50
25
0
140
TA = 85°C
NCP170xxx360TyG
Cin = Cout = 1 mF
175
0
20
40
60
80
100
120
140
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
Figure 13. Dropout Voltage vs. Output Current,
Vout = 3.0 V
Figure 14. Dropout Voltage vs. Output Current,
Vout = 3.6 V
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NCP170
TYPICAL CHARACTERISTICS
0.55
Vin = 5.5 V
0.50
Vin = 2.5 − 4.0 V
0.45
0.40
Vin = 5.0 V
−20
0
20
40
60
QUIESCENT CURRENT (mA)
0.60
0.35
−40
Vin = 5.0 V
0.40
−20
0
20
40
60
70
NCP170xxx360TyG
Cin = Cout = 1 mF
Iout = 0
Vout = 3.6 V
Vin = 5.5 V
Vin = 4.0 V
0.45
Vin = 5.0 V
0.40
0.35
−40
−20
0
20
40
60
80
Vin = 2.5 V
NCP170xxx120TyG
Cin = Cout = 1 mF
TA = 25°C
Vout = 1.2 V
60
50
Vin = 3.5 V
40
30
20
Vin = 5.5 V
10
0
80
0.01
0.1
1
10
100
TEMPERATURE (°C)
OUTPUT CURRENT (mA)
Figure 17. Quiescent Current vs. Temperature,
Vout = 3.6 V
Figure 18. Ground Current vs. Output Current,
Vout = 1.2 V
80
80
NCP170xxx250TyG
Cin = Cout = 1 mF
TA = 25°C
Vout = 2.5 V
Vin = 3.5 V
Vin = 4.5 V
50
40
30
20
Vin = 5.5 V
NCP170xxx360TyG
Cin = Cout = 1 mF
TA = 25°C
Vout = 3.6 V
70
GROUND CURRENT (mA)
GROUND CURRENT (mA)
Vin = 3.5 − 4.0 V
0.45
Figure 16. Quiescent Current vs. Temperature,
Vout = 2.5 V
0.50
60
Vin = 4.6 V
Vin = 5.0 V
50
40
30
Vin = 5.5 V
20
10
10
0
0.50
0.35
−40
80
Vin = 5.5 V
Figure 15. Quiescent Current vs. Temperature,
Vout = 1.2 V
0.55
60
0.55
TEMPERATURE (°C)
0.60
70
NCP170xxx250TyG
Cin = Cout = 1 mF
Iout = 0
Vout = 2.5 V
0.60
TEMPERATURE (°C)
0.65
QUIESCENT CURRENT (mA)
0.65
NCP170xxx120TyG
Cin = Cout = 1 mF
Iout = 0
Vout = 1.2 V
GROUND CURRENT (mA)
QUIESCENT CURRENT (mA)
0.65
0.01
0.1
1
10
0
100
0.01
0.1
1
10
100
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
Figure 19. Ground Current vs. Output Current,
Vout = 2.5 V
Figure 20. Ground Current vs. Output Current,
Vout = 3.6 V
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NCP170
TYPICAL CHARACTERISTICS
80
80
70
70
Iout = 1 mA
10 mA
100 mA
PSRR (dB)
PSRR (dB)
50
40
30
NCP170xxx120TyG
20 Cout = 1 mF
Vin = 2.2 V+ 200 mVpp modulation
10 TA = 25°C
Vout = 1.2 V
0
100
1k
10k
100k
1M
40
30
150 mA
100k
1M
FREQUENCY (Hz)
Figure 21. PSRR vs. Frequency, Vout = 1.2 V
Figure 22. PSRR vs. Frequency, Vout = 1.8 V
70
Iout = 1 mA
Iout = 1 mA
60
10 mA
50
PSRR (dB)
100 mA
50
40
30
NCP170xxx300TyG
Cout = 1 mF
Vin = 4.0 V+ 200 mVpp modulation
TA = 25°C
Vout = 3.0 V
20
10
100
1k
150 mA
10k
100k
1M
40
30
NCP170xxx360TyG
20 Cout = 1 mF
Vin = 4.6 V+ 200 mVpp modulation
10 TA = 25°C
Vout = 3.6 V
0
100
1k
10k
150 mA
100k
FREQUENCY (Hz)
Figure 23. PSRR vs. Frequency, Vout = 3.0 V
Figure 24. PSRR vs. Frequency, Vout = 3.6 V
1.4
2.0
NCP170xxx120TyG
Cin = Cout = 1 mF
Vin = 5.5 V
Vout = 1.2 V
Iout = 1 mA
TA = 25°C
1.2
1.0
0.8
0.6
0.4
0.2
0
10 mA
100 mA
FREQUENCY (Hz)
OUTPUT VOLTAGE NOISE
SPECTRAL DENSITY (mV/√Hz)
PSRR (dB)
10 mA
100 mA
FREQUENCY (Hz)
60
OUTPUT VOLTAGE NOISE
SPECTRAL DENSITY (mV/√Hz)
50
NCP170xxx180TyG
20 Cout = 1 mF
Vin = 2.8 V+ 200 mVpp modulation
10 TA = 25°C
Vout = 1.8 V
0
100
1k
10k
150 mA
70
0
Iout = 1 mA
60
60
10
100
1k
10k
100k
1M
NCP170xxx180TyG
Cin = Cout = 1 mF
Vin = 5.5 V
Vout = 1.8 V
Iout = 1 mA
TA = 25°C
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
10
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 25. Output Voltage Noise Spectral
Density, Vout = 1.2 V
Figure 26. Output Voltage Noise Spectral
Density, Vout = 1.8 V
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1M
1M
NCP170
TYPICAL CHARACTERISTICS
4.0
NCP170xxx300TyG
Cin = Cout = 1 mF
Vin = 5.5 V
Vout = 3.0 V
Iout = 1 mA
TA = 25°C
3.0
2.5
2.0
OUTPUT VOLTAGE NOISE
SPECTRAL DENSITY (mV/√Hz)
OUTPUT VOLTAGE NOISE
SPECTRAL DENSITY (mV/√Hz)
3.5
1.5
1.0
0.5
0
10
100
1k
10k
100k
1M
NCP170xxx360TyG
Cin = Cout = 1 mF
Vin = 5.5 V
Vout = 3.6 V
Iout = 1 mA
TA = 25°C
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
10
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 27. Output Voltage Noise Spectral
Density, Vout = 3.0 V
Figure 28. Output Voltage Noise Spectral
Density, Vout = 3.6 V
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1M
NCP170
TYPICAL CHARACTERISTICS
Figure 29. Load Transient Response at Load
Step from 1 mA to 50 mA, Vout = 1.2 V
Figure 30. Load Transient Response at Load
Step from 0.1 mA to 50 mA, Vout = 1.2 V
Figure 31. Load Transient Response at Load
Step from 0.1 mA to 10 mA, Vout = 1.2 V
Figure 32. Load Transient Response at Load
Step from 1 mA to 50 mA, Vout = 2.5 V
Output Voltage
Output Current
Figure 33. Load Transient Response at Load
Step from 0.1 mA to 50 mA, Vout = 2.5 V
Figure 34. Load Transient Response at Load
Step from 0.1 mA to 10 mA, Vout = 2.5 V
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NCP170
TYPICAL CHARACTERISTICS
Figure 35. Load Transient Response at Load
Step from 1mA to 50 mA, Vout= 3.0 V
Figure 36. Load Transient Response at Load
Step from 0.1 mA to 50 mA, Vout = 3.0 V
Figure 37. Load Transient Response at Load
Step from 0.1 mA to 10 mA, Vout = 3.0 V
Figure 38. Load Transient Response at Load
Step from 1 mA to 50 mA, Vout = 3.6 V
Figure 39. Load Transient Response at Load
Step from 0.1 mA to 50 mA, Vout = 3.6 V
Figure 40. Load Transient Response at Load
Step from 0.1 mA to 10 mA, Vout = 3.6 V
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NCP170
TYPICAL CHARACTERISTICS
Figure 41. Output Voltage with and without
Active Discharge Feature, Vout = 1.2 V
Figure 42. Output Voltage with and without
Active Discharge Feature, Vout = 2.5 V
Figure 43. Output Voltage with and without
Active Discharge Feature, Vout = 3.0 V
Figure 44. Output Voltage with and without
Active Discharge Feature, Vout = 3.6 V
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NCP170
TYPICAL CHARACTERISTICS
Figure 45. Enable Turn−on Response at Vout =
1.2 V
Figure 46. Enable Turn−on Response at Vout =
1.8 V
Figure 47. Enable Turn−on Response at Vout =
2.5 V
Figure 48. Enable Turn−on Response at Vout =
3.6 V
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NCP170
APPLICATIONS INFORMATION
General
available at output pin. In case the Enable function is not
required the EN pin should be connected directly to input
pin.
The NCP170 is a high performance 150 mA Linear
Regulator with Ultra Low IQ. This device delivers low
Noise and high Power Supply Rejection Ratio with excellent
dynamic performance due to employing the Dynamic
Quiescent Current adjustment which assure ultra low IQ
consumption at no – load state. These parameters make this
device very suitable for various battery powered
applications.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
point (TSD = 175°C typical) the device goes to disabled state
and the output voltage is not delivered until the die
temperature decreases to 150°C. The Thermal Shutdown
feature provides a protection from a catastrophic device
failure at accidental overheating. This protection is not
intended to be used as a substitute for proper heat sinking.
Input Decoupling (CIN)
It is recommended to connect at least a 1 mF Ceramic X5R
or X7R capacitor between IN and GND pins of the device.
This capacitor will provide a low impedance path for any
unwanted AC signals or Noise superimposed onto constant
Input Voltage. The good input capacitor will limit the
influence of input trace inductances and source resistance
during sudden load current changes.
Higher capacitance and lower ESR Capacitors will
improve the overall line transient response.
Power Dissipation and Heat sinking
The maximum power dissipation supported by the device
is dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part. For reliable operation, junction temperature
should be limited to +125°C. The maximum power
dissipation the NCP170 device can handle is given by:
Output Decoupling (COUT)
The NCP170 does not require a minimum Equivalent
Series Resistance (ESR) for the output capacitor. The device
is designed to be stable with standard ceramics capacitors
with values of 1.0 mF or greater up to 10 mF. The X5R and
X7R types have the lowest capacitance variations over
temperature thus they are recommended. There is
recommended connect the output capacitor as close as
possible to the output pin of the regulator.
P D(MAX) +
ƪTJ(MAX) * TAƫ
R qJA
(eq. 1)
The power dissipated by the NCP170 device for given
application conditions can be calculated from the following
equations:
P D [ V INǒI GND(I OUT)Ǔ ) I OUTǒV IN * V OUTǓ
(eq. 2)
or
Enable Operation
The NCP170 uses the EN pin to enable /disable its device
and to activate /deactivate the active discharge function at
devices with this feature. If the EN pin voltage is pulled
below 0.4 V the device is guaranteed to be disable. The
active discharge transistor at the devices with Active
Discharge Feature is activated and the output voltage VOUT
is pulled to GND through an internal circuitry with effective
resistance about 100 ohms.
If the EN pin voltage is higher than 1.2 V the device is
guaranteed to be enabled. The internal active discharge
circuitry is switched off and the desired output voltage is
V IN(MAX) [
P D(MAX) ) ǒV OUT
I OUT ) I GND
I OUTǓ
(eq. 3)
Hints
VIN and GND printed circuit board traces should be as
wide as possible. When the impedance of these traces is
high, there is a chance to pick up noise or cause the regulator
to malfunction. Place external components, especially the
output capacitor, as close as possible to the NCP170, and
make traces as short as possible.
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20
NCP170
ORDERING INFORMATION
Device
Nominal
Output Voltage
Marking
NCP170AMX120TCG
1.2
AC
NCP170AMX135TCG
1.35
AP
NCP170AMX150TCG
1.5
AJ
NCP170AMX170TCG
1.7
AT
NCP170AMX180TAG
1.8
AD
NCP170AMX180TCG
1.8
AD
NCP170AMX190TCG
1.9
AL
NCP170AMX250TCG
2.5
AE
NCP170AMX280TAG
2.8
AF
NCP170AMX280TCG
2.8
AF
NCP170AMX285TCG
2.85
AK
NCP170AMX300TAG
3.0
AA
NCP170AMX300TCG
3.0
AA
NCP170AMX310TCG
3.1
AN
NCP170AMX320TCG
3.2
AQ
NCP170AMX330TAG
3.3
AG
NCP170AMX330TCG
3.3
AG
NCP170AMX360TCG
3.6
AM
NCP170BMX120TCG
1.2
2C
NCP170BMX135TCG
1.35
2P
NCP170BMX150TCG
1.5
2J
NCP170BMX170TCG
1.7
2T
NCP170BMX180TCG
1.8
2D
NCP170BMX190TCG
1.9
2L
NCP170BMX250TCG
2.5
2E
NCP170BMX280TCG
2.8
2F
NCP170BMX285TCG
2.85
2K
NCP170BMX300TCG
3.0
2A
NCP170BMX310TCG
3.1
2N
NCP170BMX320TCG
3.2
2Q
NCP170BMX330TCG
3.3
2G
NCP170BMX360TCG
3.6
2M
Active
Discharge
Package
Shipping†
XDFN4 1.0 × 1.0
(Pb-Free)
3000 / Tape & Reel
Yes
No
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21
NCP170
ORDERING INFORMATION
Device
Nominal
Output Voltage
Marking
NCP170AXV120T2G
1.2
AC
NCP170AXV135T2G
1.35
AL
NCP170AXV150T2G
1.5
AJ
NCP170AXV180T2G
1.8
AD
NCP170AXV190T2G
1.9
AM
NCP170AXV210T2G
2.1
AK
NCP170AXV250T2G
2.5
AE
NCP170AXV280T2G
2.8
AF
NCP170AXV300T2G
3.0
AA
NCP170AXV310T2G
3.1
AN
NCP170AXV330T2G
3.3
AH
NCP170AXV360T2G
3.6
AG
NCP170BXV120T2G
1.2
2C
NCP170BXV135T2G
1.35
2L
NCP170BXV150T2G
1.5
2J
NCP170BXV180T2G
1.8
2D
NCP170BXV190T2G
1.9
2M
NCP170BXV250T2G
2.5
2E
NCP170BXV280T2G
2.8
2F
NCP170BXV300T2G
3.0
2A
NCP170BXV310T2G
3.1
2N
NCP170BXV330T2G
3.3
2H
NCP170ASN120T2G
1.2
GCG
NCP170ASN150T2G
1.5
GCH
NCP170ASN180T2G
1.8
GCF
NCP170ASN250T2G
2.5
GCE
NCP170ASN280T2G
2.8
GCA
NCP170ASN300T2G
3.0
GCC
NCP170ASN330T2G
3.3
GCD
Active
Discharge
Package
Shipping†
SOT−563
(Pb-Free)
4000 / Tape & Reel
(Available Soon)
TSOP−5
(Pb-Free)
3000 / Tape & Reel
(Available Soon)
Yes
No
Yes
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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22
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−563, 6 LEAD
CASE 463A
ISSUE G
6
1
DATE 23 SEP 2015
SCALE 4:1
D
−X−
5
6
1
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
A
L
4
E
−Y−
3
b
e
DIM
A
b
C
D
E
e
L
HE
HE
C
5 PL
6
0.08 (0.003)
M
X Y
STYLE 1:
PIN 1. EMITTER 1
2. BASE 1
3. COLLECTOR 2
4. EMITTER 2
5. BASE 2
6. COLLECTOR 1
STYLE 2:
PIN 1. EMITTER 1
2. EMITTER2
3. BASE 2
4. COLLECTOR 2
5. BASE 1
6. COLLECTOR 1
STYLE 3:
PIN 1. CATHODE 1
2. CATHODE 1
3. ANODE/ANODE 2
4. CATHODE 2
5. CATHODE 2
6. ANODE/ANODE 1
STYLE 4:
PIN 1. COLLECTOR
2. COLLECTOR
3. BASE
4. EMITTER
5. COLLECTOR
6. COLLECTOR
STYLE 5:
PIN 1. CATHODE
2. CATHODE
3. ANODE
4. ANODE
5. CATHODE
6. CATHODE
STYLE 6:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
STYLE 7:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. ANODE
6. CATHODE
STYLE 8:
PIN 1. DRAIN
2. DRAIN
3. GATE
4. SOURCE
5. DRAIN
6. DRAIN
STYLE 9:
PIN 1. SOURCE 1
2. GATE 1
3. DRAIN 2
4. SOURCE 2
5. GATE 2
6. DRAIN 1
STYLE 10:
PIN 1. CATHODE 1
2. N/C
3. CATHODE 2
4. ANODE 2
5. N/C
6. ANODE 1
MILLIMETERS
MIN
NOM MAX
0.50
0.55
0.60
0.17
0.22
0.27
0.08
0.12
0.18
1.50
1.60
1.70
1.10
1.20
1.30
0.5 BSC
0.10
0.20
0.30
1.50
1.60
1.70
INCHES
NOM MAX
0.021 0.023
0.009 0.011
0.005 0.007
0.062 0.066
0.047 0.051
0.02 BSC
0.004 0.008 0.012
0.059 0.062 0.066
MIN
0.020
0.007
0.003
0.059
0.043
GENERIC
MARKING DIAGRAM*
XX MG
1
XX = Specific Device Code
M = Month Code
G
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON11126D
ON SEMICONDUCTOR STANDARD
1
© Semiconductor Components Industries, LLC, 2002
January, 2002 − Rev. 01O
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
SOT−563, 6 LEAD
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled exceptCase
when
stamped
Outline
Number:
483A
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON11126D
PAGE 2 OF 2
ISSUE
REVISION
DATE
A
ADDED STYLE 5. REQ. BY D. BARLOW.
03 NOV 2003
B
ADDED STYLE 6. REQ. BY M. ATANOVICH.
03 MAR 2004
C
ADDED SYTLE 7. REQ. BY A. TAM.
19 MAR 2004
D
ADDED STYLE 8 AND 9. REQ. K. VAN TYNE.
30 APR 2004
E
ADDED NOM VALUES AND CHANGED DIMS TO INDUSTRY STANDARD. REQ.
BY D. TRUHITTE
31 JAN 2005
F
ADDED STYLE 10. REQ. BY M. DEWITT.
28 APR 2005
G
REMOVED −01 FROM CASE CODE VARIANT. REQ. BY N. CALZADA.
23 SEP 2015
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2015
September, 2015 − Rev. G
Case Outline Number:
463A
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSOP−5
CASE 483
ISSUE M
5
1
SCALE 2:1
DATE 17 MAY 2016
NOTE 5
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
D 5X
0.20 C A B
0.10 T
M
2X
0.20 T
5
B
1
4
2
S
3
K
B
DETAIL Z
G
A
A
TOP VIEW
DIM
A
B
C
D
G
H
J
K
M
S
DETAIL Z
J
C
0.05
H
C
SIDE VIEW
SEATING
PLANE
END VIEW
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
0.95
0.037
MILLIMETERS
MIN
MAX
2.85
3.15
1.35
1.65
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
1.9
0.074
5
5
XXXAYWG
G
1
1
Analog
2.4
0.094
XXX = Specific Device Code
A
= Assembly Location
Y
= Year
W = Work Week
G
= Pb−Free Package
1.0
0.039
XX MG
G
Discrete/Logic
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
0.7
0.028
SCALE 10:1
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98ARB18753C
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
TSOP−5
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98ARB18753C
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
INITIATED NEW MECHANICAL OUTLINE #483. REQ BY WL CHIN/L. RENNICK.
28 OCT 1998
A
UPDATE OUTLINE DRAWING TO CORRECT DIN “C” (SHOULD BE FROM TIP OF
LID TO TOP OF PKG). DIM IN TABLE INCORRECTLY LISTED TO G, F TO H,
H TO J, N TO L & R TO M. REQ BY F. PADILLA
13 NOV 1998
B
CHANGE OF LEGAL ONWERSHIP FROM MOTOROLA TO ON SEMICONDUCTOR. REQ BY A. GARLINGTON
20 APR 2001
C
ADDED NOTE “4”. REQ BY S. RIGGS
27 JUN 2003
D
ADDED FOOTPRINT INFORMATION. UPDATED MARKING. REQ. BY D. JOERSZ
07 APR 2005
E
CHANGED DEVICE MARKING FROM AWW TO AYW. REQ. BY J. MANES.
14 SEP 2005
F
UPDATED DRAWINGS TO LATEST JEDEC STANDARDS. ADDED NOTE 5. REQ.
BY T. GURNETT.
07 JUN 2006
G
ADDED MARKING DIAGRAM FOR IC OPTION. REQ. BY J. MILLER.
21 FEB 2007
H
CORRECTED MARKING DIAGRAM ERROR BY REVERSING ANALOG AND
DISCRETE LABELS. REQ. BY GK SUA.
18 MAY 2007
J
CHANGED NOTE 4. REQ. BY A. GARLINGTON.
13 MAR 2013
K
REMOVED DIMENSION L AND ADDED DATUMS A AND B TO TOP VIEW. REQ.
BY A. GARLINGTON.
19 APR 2013
L
REMOVED −02 FROM CASE CODE VARIANT. REQ. BY N. CALZADA.
23 SEP 2015
M
CHANGED DIMENSIONS A & B FROM BASIC TO MIN AND MAX VALUES. REQ.
BY A. GARLINGTON.
17 MAY 2016
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2016
May, 2016 − Rev. M
Case Outline Number:
483
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN4 1.0x1.0, 0.65P
CASE 711AJ
ISSUE A
1
SCALE 4:1
DATE 13 NOV 2015
PIN ONE
REFERENCE
0.05 C
2X
4X
A
B
D
ÏÏ
ÏÏ
E
4X
DETAIL A
0.05 C
2X
TOP VIEW
(A3)
0.05 C
A
0.05 C
NOTE 4
A1
SIDE VIEW
C
SEATING
PLANE
e/2
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.20 mm FROM THE TERMINAL TIPS.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM
A
A1
A3
b
b2
D
D2
E
e
L
L2
MILLIMETERS
MIN
MAX
0.33
0.43
0.00
0.05
0.10 REF
0.15
0.25
0.02
0.12
1.00 BSC
0.43
0.53
1.00 BSC
0.65 BSC
0.20
0.30
0.07
0.17
GENERIC
MARKING DIAGRAM*
e
1
b2
L2
4X
2
L
XX M
1
D2
45 5
D2
4
XX = Specific Device Code
M = Date Code
3
4X
b
0.05
M
C A B
NOTE 3
BOTTOM VIEW
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
MOUNTING FOOTPRINT*
0.65
PITCH
2X
0.52
PACKAGE
OUTLINE
4X
4X
0.11
4X
0.24
0.39
1.20
4X
0.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON67179E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
XDFN4, 1.0X1.0, 0.65P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON67179E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY I. CAMBALIZA.
02 FEB 2012
A
CORRECTED MARKING DIAGRAM TO TWO CHARACTERS. REQ. BY J. SUPINA.
13 NOV 2015
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.
SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2015
November, 2015 − Rev. A
Case Outline Number:
711AJ
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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