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NCP1937C4DR2G

NCP1937C4DR2G

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    SOIC20_150MIL_17引线

  • 描述:

    IC CTLR PFC/FLYBACK

  • 数据手册
  • 价格&库存
NCP1937C4DR2G 数据手册
DATA SHEET www.onsemi.com NCP1937 This combination IC integrates power factor correction (PFC) and quasi−resonant flyback functionality necessary to implement a compact and highly efficient Switched Mode Power Supply for an adapter application. The PFC stage exhibits near−unity power factor while operating in a Critical Conduction Mode (CrM) with a maximum frequency clamp. The circuit incorporates all the features necessary for building a robust and compact PFC stage while minimizing the number of external components. The quasi−resonant current−mode flyback stage features a proprietary valley−lockout circuitry, ensuring stable valley switching. This system works down to the 4th valley and toggles to a frequency foldback mode with a minimum frequency clamp beyond the 4th valley to eliminate audible noise. Skip mode operation allows excellent efficiency in light load conditions while consuming very low standby power consumption. Common General Features • Wide VCC Range from 9 V to 30 V with Built−in Overvoltage • • • • • • • Protection High−Voltage Startup Circuit and Active Input Filter Capacitor Discharge Circuitry for Reduced Standby Power Integrated High−Voltage Brown−Out Detector Integrated High−Voltage Switch Disconnects PFC Feedback Resistor Divider to Reduce Standby Power Fault Input for Severe Fault Conditions, NTC Compatible (Latch and Auto−Recovery Options) 0.5 A / 0.8 A Source / Sink Gate Drivers Internal Temperature Shutdown Power Savings Mode Reduces Supply Current Consumption to 70 mA Enabling Very Low Input Power Applications MARKING DIAGRAM HV/X2 BO/X2 PControl SOIC−20 PONOFF Narrow Body QCT CASE 751BS Fault PSTimer QFB 1 20 NCP1937xxG AWLYWW Combination Power Factor Correction and QuasiResonant Flyback Controllers for Adapters PFBHV PFBLV GND PCS/PZCD PDRV QDRV QCS VCC QZCD NCP1937 = Specific Device Code xx = A1, A2, A3, B1, B2, B3, B51, = C1, C4 or C61 A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information on page 5 of this data sheet. QR Flyback Controller Features • Valley Switching Operation with Valley− • • • • • • Lockout for Noise−Free Operation Frequency Foldback with Minimum Frequency Clamp for Highest Performance in Standby Mode Minimum Frequency Clamp Eliminates Audible Noise Timer−Based Overload Protection (Latched or Auto−Recovery options) Adjustable Overpower Protection Winding and Output Diode Short−Circuit Protection 4 ms Soft−Start Timer PFC Controller Features • Critical Conduction Mode with Constant On Time Control (Voltage • • • • • • Mode) and Maximum Frequency Clamp Accurate Overvoltage Protection Bi−Level Line−Dependent Output Voltage Fast Line / Load Transient Compensation Boost Diode Short−Circuit Protection Feed−Forward for Improved Operation across Line and Load Adjustable PFC Disable Threshold Based on Output Power © Semiconductor Components Industries, LLC, 2015 June, 2022 − Rev. 8 1 Publication Order Number: NCP1937/D N L PCS/PZCD N L PFBHV PFBLV BO/X2 GND PControl PCS/PZCD PONOFF PDRV QCT QDRV Fault QCS PSTimer VCC QZCD QFB NCP1937 HV/X2 PDRV VZCD PCS/PZCD PDRV QCS VCC VPSTimer VCC QCS (Aux) VZCD PSM Control NCP1937 Figure 1. Typical Application Circuit www.onsemi.com 2 NCP1937 Enable PFC PUVP PFC OVP Detection KPOVP(xL) DPOVP(xL) IPControl(boost) KLOW(HYS) KLOW Low/High Line IEA VPREF(xL) ON Time Ramp + − In Regulation 5 PFCDRV Disable PFC PUVP Low Clamp tPisable PSKIP PDRV PFCDRV 15 tPFC(off) Timer PFCDRV Frequency Clamp Minimum Frequency Oscillator 8 IPCS/PZCD + − IPSTimer1/2 PSTIMER 9 In_PSM 11 VQZCD(hys) QSkip VQZCD(th) CT VQFB VCO Setpoint QRDRV IQCT QCT 7 nPILIM2 S S S S S S S Line Removal Brownout VCC(reset) R R R OTP PSM Detection Initial Discharge Valley QSkip VCO tonQR(MAX) TSD QOVLD nQILIM2 nPILIM2 OVP OTP VCCOVP OVP RQFB QSkip PILIM2 Counter VFault(OVP) VFault(OTP_in) QZCD ZCD Detect VCO QRDRV VPILIM1 − + Fault QDRV 14 Soft−start VQZCD IQFB + − VPILIM2 IOTP PONOFF 6 + V − POFF tQ(toutx) Valley PILIM1 + − CCC tP(tout) 16 LEB2 PFCDRV PZCD + V − PZCD PZCD LEB1 VCC 12 QRDRV R Q Dominant Reset S Latch Q tdelay(QSKIP) PILIM2 PFCDRV ZCD Detect PCS/PZCD R Q Dominant Reset Latch Q S POVP PUVP PSKIP PILIM1 PILIM2 HV/X2 1 IPONOFF VPONHYS Disable PFC + DV − PSKIP In Regulation BO/X2 3 VQFB QZCD Soft−Start Level Shift VPCONTROL(MAX) PControl QR_EN Valley Select Logic VQFB + QRDRV QFB In_PSM 10 /KQFB VQZCD Latch Fault Logic QILIM1 LEB1 Auto−recovery QOVLD tQOVLD + VQZCD Temperature TSD In PSM QILIM2 nQILIM2 VCC_OK Figure 2. Functional Block Diagram www.onsemi.com 3 GND 17 Counter VQILIM1 LEB2 IQCS QCS 13 − + PFBLV 18 Latch Auto−recovery VCC(reset) Line Removal Brownout POVP Low/High Line VCC_OK In PSM VPFB(HYS) V − PFB(disable) + Low/High Line High Voltage Brownout Startups, Line Removal Detection, and VCC_OK Logic QR_EN Central In PSM Logic Reset Istart VCCOVP VCC VCC_OK Management VCC(reset) VDD Line Removal ICC(discharge) Soft−start VQILIM1 − + 20 + − PFBHV VQILIM2 NCP1937 Table 1. PIN FUNCTION DESCRIPTION Pin Out Name 1 HV/X2 2 3 Function High voltage startup circuit input. It is also used to discharge the input filter capacitors. Removed for creepage distance. BO/X2 4 Performs brown−out detection for the whole IC and it is also used to discharge the input filter capacitors and detect the line voltage range. Removed for creepage distance. 5 PControl Output of the PFC transconductance error amplifier. A compensation network is connected between this pin and ground to set the loop bandwidth. 6 PONOFF A resistor between this pin and ground sets the PFC turn off threshold. The voltage on this pin is compared to an internal voltage signal proportional to the output power. The PFC disable threshold is determined by the resistor on this pin and the internal pull–up current source, IPONOFF. 7 QCT An external capacitor sets the frequency in VCO mode for the QR flyback controller. 8 Fault The controller enters fault mode if the voltage of this pin is pulled above or below the fault thresholds. A precise pull up current source allows direct interface with an NTC thermistor. Fault detection triggers a latch or auto−recovery depending on device option. 9 PSTimer 10 QFB 11 QZCD 12 VCC Supply input. 13 QCS Input to the cycle−by−cycle current limit comparator for the QR Flyback section. 14 QDRV QR flyback controller switch driver. 15 PDRV PFC controller switch driver. 16 PCS/PZCD 17 GND 18 PFBLV 19 20 Power savings mode (PSM) control and timer adjust. Compatible with an optocoupler for secondary control of PSM. The device enters PSM if the voltage on this pin exceeds the PSM threshold, VPS_in. A capacitor between this pin and GND sets the delay time before the controller enters power savings mode. Once the controller enters power savings mode the IC is disabled and the current consumption is reduced to a maximum of 70 mA. The input filter capacitor discharge function is available while in power savings mode. The controller is enabled once VPSTimer drops below VPS_out. Feedback input for the QR Flyback controller. Allows direct connection to an optocoupler. Input to the demagnetization detection comparator for the QR Flyback controller. Also used to set the overpower compensation. Input to the cycle−by−cycle current limit comparator for the PFC section. Also used to perform the demagnetization detection for the PFC controller. Ground reference. Low voltage PFC feedback input. An external resistor divider is used to sense the PFC bulk voltage. The divider low side resistor connects to this pin. This voltage is compared to an internal reference. The reference voltage is 2.5 V at low line and 4 V at high line. An internal high−voltage switch disconnects the low side resistor from the high side resistor chain when the PFC is disabled in order to reduce input power. Removed for creepage distance. PFBHV High voltage PFC feedback input. An external resistor divider is used to sense the PFC bulk voltage. The divider high side resistor chain from the PFC bulk voltage connects to this pin. An internal high−voltage switch disconnects the high side resistor chain from the low side resistor when the PFC is disabled in order to reduce input power. www.onsemi.com 4 NCP1937 Table 2. NCP1937 DEVICE OPTIONS Fault OTP VBO(start) Typ VBO(stop) Typ PFC Disable Time PFC Frequency Clamp Auto−Recovery Latch 111 V 101 V 0.5 s 250 kHz NCP1937A2DR2G Auto−Recovery Latch 111 V 101 V 0.5 s 131 kHz NCP1937A3DR2G Auto−Recovery Latch 111 V 101 V 4s 131 kHz NCP1937B1DR2G Auto−Recovery Auto−Recovery 111 V 101 V 0.5 s 250 kHz NCP1937B2DR2G Auto−Recovery Auto−Recovery 111 V 101 V 0.5 s 131 kHz NCP1937B3DR2G Auto−Recovery Auto−Recovery 111 V 101 V 4s 131 kHz NCP1937B51DR2G Auto−Recovery Auto−Recovery 97 V 87 V 0.5 s 131 kHz NCP1937C1DR2G Latch Latch 111 V 101 V 0.5 s 250 kHz NCP1937C4DR2G Latch Latch 111 V 101 V 13 s 131 kHz NCP1937C61DR2G Latch Latch 97 V 87 V 4s 131 kHz Device Overload Protection NCP1937A1DR2G Package Shipping† SOIC−20 (Pb−Free) 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Table 3. MAXIMUM RATINGS (Notes 1 − 6) Rating Pin Symbol Value Unit High Voltage Startup Circuit Input Voltage 1 VHV/X2 −0.3 to 700 V High Voltage Startup Circuit Input Current 1 IHV/X2 20 mA High Voltage Brownout Detector Input Voltage 3 VBO/X2 −0.3 to 700 V High Voltage Brownout Detector Input Current 3 IBO/X2 20 mA PFC High Voltage Feedback Input Voltage 20 VPFBHV −0.3 to 700 V PFC High Voltage Feedback Input Current 20 IPFBHV 0.5 mA PFC Low Voltage Feedback Input Voltage 18 VPFBLV −0.3 to 9 V PFC Low Voltage Feedback Input Current 18 IPFBLV 0.5 mA PFC Zero Current Detection and Current Sense Input Voltage (Note 1) 16 VPCS/PZCD −0.3 to VPCS/PZCD(MAX) V PFC Zero Current Detection and Current Sense Input Current 16 IPCS/PZCD −2/+5 mA PFC Control Input Voltage 5 VPControl −0.3 to 5 V PFC Control Input Current 5 IPControl 10 mA Supply Input Voltage 12 VCC(MAX) −0.3 to 30 V Supply Input Current 12 ICC(MAX) 30 mA Supply Input Voltage Slew Rate 12 dVCC/dt 1 V/ms Fault Input Voltage 8 VFault −0.3 to (VCC + 1.25) V Fault Input Current 8 IFault 10 mA QR Flyback Zero Current Detection Input Voltage 11 VQZCD −0.9 to (VCC + 1.25) V QR Flyback Zero Current Detection Input Current 11 IQZCD −2/+5 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. VPCS/PZCD(MAX) is the maximum voltage of the pin shown in the electrical table. When the voltage on this pin exceeds 5 V, the pin sinks a current equal to (VPCS/PZCD − 5 V) / (2 kW). A VPSC/PZCD of 7 V generates a sink current of approximately 1 mA. 2. Maximum driver voltage is limited by the driver clamp voltage, VXDRV(high), when VCC exceeds the driver clamp voltage. Otherwise, the maximum driver voltage is VCC. 3. Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum–rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 4. This device contains Latch−Up protection and exceeds ± 100 mA per JEDEC Standard JESD78. 5. Low Conductivity Board. As mounted on 80 x 100 x 1.5 mm FR4 substrate with a single layer of 50 mm2 of 2 oz copper traces and heat spreading area. As specified for a JEDEC51−1 conductivity test PCB. Test conditions were under natural convection of zero air flow. 6. Pins 1, 3, and 20 are rated to the maximum voltage of the part, or 700 V. www.onsemi.com 5 NCP1937 Table 3. MAXIMUM RATINGS (Notes 1 − 6) Rating Pin Symbol Value Unit QR Feedback Input Voltage 7 VQCT −0.3 to 10 V QR Feedback Input Current 7 IQCT 10 mA QR Flyback Current Sense Input Voltage 13 VQCS −0.3 to 10 V QR Flyback Current Sense Input Current 13 IQCS 10 mA QR Flyback Feedback Input Voltage 10 VQFB −0.3 to 10 V QR Flyback Feedback Input Current 10 IQFB 10 mA PSTimer Input Voltage 9 VPSTimer −0.3 to 10 V PSTimer Input Current 9 IPSTimer 10 mA PFC Driver Maximum Voltage (Note 2) 15 VPDRV −0.3 to VPDRV(high) V PFC Driver Maximum Current 15 IPDRV(SRC) IPDRV(SNK) 500 800 mA Flyback Driver Maximum Voltage (Note 2) 14 VQDRV −0.3 to VQDRV(high) V Flyback Driver Maximum Current 14 IQDRV(SRC) IQDRV(SNK) 500 800 mA PFC ON/OFF Threshold Adjust Input Voltage 6 VPONOFF −0.3 to 10 V PFC ON/OFF Threshold Adjust Input Current 6 IPONOFF 10 mA Operating Junction Temperature Range N/A TJ −40 to 125 _C Maximum Junction Temperature N/A TJ(MAX) 150 _C Storage Temperature Range N/A TSTG –60 to 150 _C Power Dissipation (TA = 75_C, 1 Oz Cu, 0.155 Sq Inch Printed Circuit Copper Clad) Plastic Package SOIC−20NB PD W 0.62 Thermal Resistance, Junction−to−Ambient (1 oz. Cu Printed Circuit Copper Clad) Plastic Package SOIC−20NB RθJA Thermal Resistance, Junction−to−Case RθJC 77 ESD Capability (Note 6) Human Body Model per JEDEC Standard JESD22−A114F. Machine Model per JEDEC Standard JESD22−A115−A. Charge Device Model per JEDEC Standard JESD22−C101E. HBM MM CDM 3000 200 750 _C/W 121 _C/W V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. VPCS/PZCD(MAX) is the maximum voltage of the pin shown in the electrical table. When the voltage on this pin exceeds 5 V, the pin sinks a current equal to (VPCS/PZCD − 5 V) / (2 kW). A VPSC/PZCD of 7 V generates a sink current of approximately 1 mA. 2. Maximum driver voltage is limited by the driver clamp voltage, VXDRV(high), when VCC exceeds the driver clamp voltage. Otherwise, the maximum driver voltage is VCC. 3. Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum–rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 4. This device contains Latch−Up protection and exceeds ± 100 mA per JEDEC Standard JESD78. 5. Low Conductivity Board. As mounted on 80 x 100 x 1.5 mm FR4 substrate with a single layer of 50 mm2 of 2 oz copper traces and heat spreading area. As specified for a JEDEC51−1 conductivity test PCB. Test conditions were under natural convection of zero air flow. 6. Pins 1, 3, and 20 are rated to the maximum voltage of the part, or 700 V. www.onsemi.com 6 NCP1937 Table 4. ELECTRICAL CHARACTERISTICS: (VCC = 12 V, VBO/X2 = 120 V, VHV/X2 = 120 V, VFault = open, VRPFBHV = 20 V, VPFBLV = 2.4 V, VPControl = 4 V, VPCS/PZCD = 0 V, VQFB = 3 V, VPONOFF = 4 V, VQCS = 0 V, VQZCD = 0 V, VPSTimer = 0 V, RPFBHV = 200 kW, CVCC = 100 nF , CQCT = 220 pF, CPDRV = 1 nF, CQDRV = 1 nF, for typical values TJ = 25_C, for min/max values, TJ is – 40_C to 125_C, unless otherwise noted) Characteristics Conditions Pin Symbol Min Typ Max VCC increasing VQFB = 0, VPSTimer = 3 V VCC decreasing VCC(on) − VCC(off) VCC(PS_on) − VCC(off) VCC decreasing VCC increasing, IHV/X2 = 650 mA 12 VCC(on) VCC(PS_on) VCC(off) VCC(HYS) VCC(DPS_off) VCC(reset) VCC(inhibit) 16 – 8.2 7.7 1.65 4.5 0.3 17 11 8.8 – 2.20 5.5 0.7 18 – 9.4 – 2.75 7.5 0.95 VCC = 0 V, VBO/X2 = 0 V VCC = 0 V, VHV/X2 = 0 V 12 12 Istart1A Istart1B 0.20 0.20 0.50 0.50 0.65 0.65 12 Istart2A 2.5 5 Istart2B 2.5 5 Istart2A_PSM 9 15 20 Istart2B_PSM 9 15 20 Unit STARTUP AND SUPPLY CIRCUITS V Supply Voltage Startup Threshold Regulation Level in PSM Minimum Operating Voltage Operating Hysteresis Delta Between PSM and VCC(off) Levels Internal Latch / Logic Reset Level Transition from Istart1 to Istart2 Startup Current in Inhibit Mode Startup Current Operating Mode PSM Mode Startup Circuit Off−State Leakage Current Minimum Startup Voltage Minimum Startup Voltage in PSM VCC = VCC(on) – 0.5 V VHV/X2 = 100 V, VBO/X2 = VCC VBO/X2 = 100 V, VHV/X2 = VCC VHV/X2 = 100 V, VBO/X2 = 0 V VBO/X2 = 100 V, VHV/X2 = 0 V mA 12 V HV/X2 = 500 V 1 IHV/X2 (off) – – 3 mA Istart2A = 1 mA, VCC = VCC(on) – 0.5 V Istart2B = 1 mA, VCC = VCC(on) – 0.5 V 1 VHV/X2(MIN) – – 40 V 3 VBO/X2(MIN) – – 40 Istart = 9 mA, VCC = VCC(PS_on) – 0.5 V Istart = 9 mA, VCC = VCC(PS_on) – 0.5 V 1 VHV/X2(MIN) – – 60 3 VBO/X2(MIN) – – 60 27 28 29 VCC Overvoltage Protection Threshold 12 VCC(OVP) VCC Overvoltage Protection Delay 12 tdelay(VCC_OVP) Supply Current 12 In Power Savings Mode Before Startup, Fault or Latch Flyback in Skip, PFC Disabled Flyback in Skip, PFC in Skip Flyback Enabled, QDRV Low, PFC Disabled Flyback Enabled, QDRV Low, PFC in Skip PFC and Flyback switching at 70 kHz PFC and Flyback switching at 70 kHz mA V ms mA ICC1a ICC2 ICC3a ICC3b VCC = VCC(on) – 0.5 V VQFB = 0.35 V VQFB = 0.35 V, VPControl < VPSKIP VQZCD = 1 V, VQZCD = 1 V, VPControl < VPSKIP CQDRV = CPDRV = open 30.0 V – – 0.15 0.3 0.5 0.07 0.25 0.4 1.0 ICC4 ICC5 0.85 1.1 1.35 1.8 ICC6 ICC7 1.5 2.8 4.0 5.2 INPUT FILTER DISCHARGE VCC = VCC(off) + 200 mV 12 ICC(discharge) 8.0 11.5 15.0 mA Line Voltage Removal Detection Threshold VBO/X2 decreasing 3 Vlineremoval 20 30 40 V Line Voltage Removal Detection Delay VBO/X2 stays above Vlineremoval 3 tlineremoval 130 200 270 ms Current Consumption in Discharge Mode www.onsemi.com 7 NCP1937 Table 4. ELECTRICAL CHARACTERISTICS: (VCC = 12 V, VBO/X2 = 120 V, VHV/X2 = 120 V, VFault = open, VRPFBHV = 20 V, VPFBLV = 2.4 V, VPControl = 4 V, VPCS/PZCD = 0 V, VQFB = 3 V, VPONOFF = 4 V, VQCS = 0 V, VQZCD = 0 V, VPSTimer = 0 V, RPFBHV = 200 kW, CVCC = 100 nF , CQCT = 220 pF, CPDRV = 1 nF, CQDRV = 1 nF, for typical values TJ = 25_C, for min/max values, TJ is – 40_C to 125_C, unless otherwise noted) Characteristics Conditions Pin Symbol Min Typ Max Unit System Brown−out Thresholds (See Table 2 for device options) VBO/X2 increasing VBO/X2 decreasing 3 VBO(start) VBO(stop) 102 86 111 101 120 116 V System Brown−out Thresholds (See Table 2 for device options) (B51, C61) VBO/X2 increasing VBO/X2 decreasing 3 VBO(start) VBO(stop) 83 79 97 87 111 95 V Brown−out Hysteresis VBO/X2 increasing 3 VBO(hys) 4 16 V Brown−out Detection Blanking Time VBO/X2 decreasing, duration below VBO(stop) for a Brown−out fault 3 tBO(stop) 43 54 65 ms Brown−out Drive Disable Threshold VBO/X2 decreasing, threshold to disable switching 3 VBO(DRV_disable) 20 30 40 V Line Level Detection Threshold Line Level Detection Threshold (B51, C61) VBO/X2 increasing 3 VBO(lineselect) 216 199 240 221 264 243 V High to Low Line Mode Selector Timer VBO/X2 decreasing 3 thigh to low line 43 54 65 ms Low to High Line Mode Selector Timer VBO/X2 increasing 3 tlow to high line 200 350 450 ms V BO/X2 = 500 V 3 IBO/X2(off) – – 42 mA 15 tPFC(off1) tPFC(off2) 100 700 200 1000 300 1300 ms Cycle by Cycle Current Sense Threshold 16 VPILIM1 0.45 0.50 0.55 V Cycle by Cycle Leading Edge Blanking Duration 16 tPCS(LEB1) 250 325 400 ns Cycle by Cycle Current Sense Propagation Delay 16 tPCS(delay1) 100 200 ns Abnormal Overcurrent Fault Threshold 16 VPILIM2 1.12 1.25 1.38 V Abnormal Overcurrent Fault Leading Edge Blanking Duration 16 tPCS(LEB2) 100 175 250 ns Abnormal Overcurrent Fault Propagation Delay 16 tPCS(delay2) 100 200 ns Number of Consecutive Abnormal Overcurrent Faults to Enter Latch Mode 15 nPILIM2 – 4 – VPCS/PZCD = 1.5 V 16 IPCS/PZCD 0.7 1.0 1.3 mA VBO/X2 > VBO(lineselect) VBO/X2 < VBO(lineselect) 18 VPREF(HL) VPREF(LL) 3.92 2.45 4.00 2.50 4.08 2.55 V 5 IEA(SRCHL) IEA(SNKHL) IEA(SRCLL) IEA(SNKLL) 16 16 10 10 32 32 20 20 48 48 30 30 VPFBLV = VPREF(LL) ± 4% VPFBLV = VPREF(HL) ± 4% 5 gm gm_HL 100 100 200 200 300 300 mS VPFBLV * KLOW(PFCxL), CPControl = 10 nF 5 VPControl(MAX) – 4.5 – V VPFBLV * KPOVP(xL), CPControl = 10 nF 5 VPControl(MIN) – 0.5 – V BROWN−OUT DETECTION Brownout Pin Off State Leakage Current PFC MAXIMUM OFF TIME TIMER Maximum Off Time VPCS/PZCD > VPILIM2 PFC CURRENT SENSE Pull−up Current Source PFC REGULATION BLOCK Reference Voltage Error Amplifier Current Source Sink Source Sink Open Loop Error Amplifier Transconductance Maximum Control Voltage Minimum Control Voltage (PWM Offset) PFC Enabled VPFBLV = 0.96 x VPREF(HL) VPFBLV = 1.04 x VPREF(HL) VPFBLV = 0.96 x VPREF(LL) VPFBLV = 1.04 x VPREF(LL) www.onsemi.com 8 mA NCP1937 Table 4. ELECTRICAL CHARACTERISTICS: (VCC = 12 V, VBO/X2 = 120 V, VHV/X2 = 120 V, VFault = open, VRPFBHV = 20 V, VPFBLV = 2.4 V, VPControl = 4 V, VPCS/PZCD = 0 V, VQFB = 3 V, VPONOFF = 4 V, VQCS = 0 V, VQZCD = 0 V, VPSTimer = 0 V, RPFBHV = 200 kW, CVCC = 100 nF , CQCT = 220 pF, CPDRV = 1 nF, CQDRV = 1 nF, for typical values TJ = 25_C, for min/max values, TJ is – 40_C to 125_C, unless otherwise noted) Characteristics Conditions Pin Symbol Min Typ Max Unit EA Output Control Voltage Range VPControl(MAX) VPControl(MIN) 5 DVPControl 3.8 4.0 4.2 V Delta Between Minimum Control Voltage and Lower Clamp PControl Voltages VPControl(MIN) − VPClamp(lower) 5 DVPClamp(lower) −125 −100 −75 mV Ratio between the Vout Low Detect Threshold and the Regulation Level VPFBLV decreasing, VBOOST / VPREF(HL) VPFBLV decreasing, VBOOST / VPREF(LL) 18 KLOW(PFCHL) 0.940 0.945 0.950 KLOW(PFCLL) 0.940 0.945 0.950 VPFBLV increasing 18 KLOW(HYSHL) KLOW(HYSLL) 0.950 0.950 0.960 0.960 0.965 0.965 5 IPControl(boost) 190 240 290 mA VPControl increasing 5 IIn_Regulation −6.5 – 0 mA IPControl = 5 mA 5 RPControl 4 25 50 W VPControl decreasing, measured from VPClamp(lower) 5 DVPSKIP 5 25 50 mV PFC Skip Hysteresis VPControl increasing 5 VPSKIP(HYS) 25 50 75 mV Delay Exiting Skip Mode Apply 1 V step from VPClamp(lower) 5 tdelay(PSKIP) – 50 60 ms 18 KPOVP(LL) 1.06 1.08 1.10 KPOVP(HL) 1.05 1.06 1.08 PFC REGULATION BLOCK Ratio between the Vout Low Exit Threshold and the Regulation Level Source Current During Vout Low Detect PFC In Regulation Threshold Resistance of Internal Pull Down Switch PFC SKIP MODE Delta Between Skip Level and Lower Clamp PControl Voltages PFC FAULT PROTECTION Ratio between the Hard Overvoltage Protection Threshold and Regulation Level Soft Overvoltage Protection Threshold VPFBLV increasing KPOVP(LL) = VPFBLV/VPREF(LL) KPOVP(HL) = VPFBLV/VPREF(HL) VPSOVP(LL) = soft overvoltage level DPOVP(LL) = KPOVP * VPREF(LL) − VPSOVP(LL) DPOVP(HL) = KPOVP * VPREF(HL) − VPSOVP(HL) mV 18 DPOVP(LL) 20 – 55 DPOVP(HL) 20 – 55 PFC Feedback Pin Disable Threshold VPFBLV decreasing 18 VPFB(disable) 0.225 0.30 0.35 V PFC Feedback Pin Enable Threshold VPFBLV increasing 18 VPFB(enable) 0.275 0.35 0.40 V PFC Feedback Pin Hysteresis VPFBLV increasing 18 VPFB(HYS) 25 50 mV 18 tdelay(PFB) 30 ms PFC Feedback Disable Delay PFC ON TIME CONTROL PFC Maximum On Time VPControl = VPControl(MAX), VBO/X2 = 163 V VBO/X2 = 325 V 15 Minimum On−Time VPControl = VPControl(MIN) PFC Frequency Clamp (See Table 2 for device options) www.onsemi.com 9 ms ton1a ton1b 12.5 4.25 15 5.00 17.5 5.75 15 tP(on−time) – – 200 ns 15 fclamp(PFC) 112 215 131 250 150 285 kHz NCP1937 Table 4. ELECTRICAL CHARACTERISTICS: (VCC = 12 V, VBO/X2 = 120 V, VHV/X2 = 120 V, VFault = open, VRPFBHV = 20 V, VPFBLV = 2.4 V, VPControl = 4 V, VPCS/PZCD = 0 V, VQFB = 3 V, VPONOFF = 4 V, VQCS = 0 V, VQZCD = 0 V, VPSTimer = 0 V, RPFBHV = 200 kW, CVCC = 100 nF , CQCT = 220 pF, CPDRV = 1 nF, CQDRV = 1 nF, for typical values TJ = 25_C, for min/max values, TJ is – 40_C to 125_C, unless otherwise noted) Characteristics Conditions Pin Symbol Min Typ Max Unit Voltage to Current Conversion Ratio VQFB = 3 V, Low Line VQFB = 3 V, High Line 6 Iratio1(QFB/PON) Iratio2(QFB/PON) 14 14 15 15 16 16 mA PFC Disable Threshold VPONOFF decreasing 6 VPOFF 1.9 2.0 2.1 V PFC Enable Hysteresis VPONOFF = increasing 6 VPONHYS 0.135 0.160 0.185 V PFC DISABLE PONOFF Operating Mode Voltage tdemag/T = 70%, RPONOFF = 191 kW, CPONOFF = 1 nF VQFB = 1.8 V (decreasing) VQFB = 3 V (decreasing) V 6 VPONOFF1 VPONOFF2 1.08 1.8 1.20 2.0 1.32 2.2 6 tPdisable 0.45 3.6 11.7 0.50 4 13 0.55 4.4 14.3 s 6 tPenable(filter) 50 100 150 ms PONOFF Increasing 6 tPenable 200 – 500 ms PFC Off−State Leakage Current VPONOFF = 1 V, VPFBHV = 500 V 20 IPFBHV(off) – 0.1 3 mA PFC Feedback Switch On Resistance VPFBHV = 4.25 V, IPFBHV = 100 mA 20 RPFBswitch(on) – – 10 kW Rise Time (10−90%) VPDRV from 10 to 90% of VCC 15 tPDRV(rise) – 40 80 ns Fall Time (90−10%) 90 to 10% of VPDRV 15 tPDRV(fall) – 20 40 ns 15 RPDRV(SRC) RPDRV(SNK) VPDRV = 2 V VPDRV = 10 V 15 IPDRV(SRC) IPDRV(SNK) – – 500 800 – – mA VCC = VCC(off) + 0.2 V, RPDRV = 10 kW VCC = 26 V, RPDRV = 10 kW 15 VPDRV(high) 8 – – V 10 12 14 VFault = 4 V 15 VPDRV(low) – – 0.25 V Zero Current Detection Threshold VPCS/PZCD rising VPCS/PZCD falling 16 VPZCD(rising) VPZCD(falling) 675 200 750 250 825 300 mV Hysteresis on Voltage Threshold VPZCD(rising) – VPZCD(falling) 16 VPZCD(HYS) 375 500 625 mV 16 tPZCD 50 100 170 ns 16 VPCS/PZCD(MAX) VPCS/PZCD(MIN) 6.5 −0.9 7 −0.7 7.5 0 V 16 tSYNC – 70 200 ns 16 tP(tout) 8 10 12 ms PFC Disable Timer (See Table 2 for device options) Disable Timer PFC Enable Filter Delay PFC Enable Timer PFC GATE DRIVE Driver Resistance Source Sink Current Capability Source Sink High State Voltage Low Stage Voltage 13 7 W PFC ZERO CURRENT DETECTION Propagation Delay Input Voltage Excursion Upper Clamp Negative Clamp IPCS/PZCD = 1 mA IPCS/PZCD = −2 mA Minimum detectable ZCD Pulse Width Missing Valley Timeout Timer Measured after last ZCD transition www.onsemi.com 10 NCP1937 Table 4. ELECTRICAL CHARACTERISTICS: (VCC = 12 V, VBO/X2 = 120 V, VHV/X2 = 120 V, VFault = open, VRPFBHV = 20 V, VPFBLV = 2.4 V, VPControl = 4 V, VPCS/PZCD = 0 V, VQFB = 3 V, VPONOFF = 4 V, VQCS = 0 V, VQZCD = 0 V, VPSTimer = 0 V, RPFBHV = 200 kW, CVCC = 100 nF , CQCT = 220 pF, CPDRV = 1 nF, CQDRV = 1 nF, for typical values TJ = 25_C, for min/max values, TJ is – 40_C to 125_C, unless otherwise noted) Characteristics Conditions Pin Symbol Min Typ Max Unit VQDRV from 10 to 90% 14 tQDRV(rise) – 40 80 ns 90 to 10% of VQDRV 14 tQDRV(fall) – 20 40 ns 14 RQDRV(SRC) RQDRV(SNK) VQDRV = 2 V VQDRV = 10 V 14 IQDRV(SRC) IQDRV(SNK) – – 500 800 – – mA VCC = VCC(off) + 0.2 V, RQDRV = 10 kW VCC = 26 V, RQDRV = 10 kW 14 VQDRV(high) 8 – – V 10 12 14 VFault = 4 V 14 VQDRV(low) – – 0.25 V Internal Pull−Up Current Source 10 IQFB 48 50 52 mA Feedback Input Open Voltage 10 VQFB(open) 4.8 5.0 5.2 V VQFB to Internal Current Setpoint Division Ratio 10 KQFB 3.95 4.0 4.15 – 10 RQFB 365 400 435 kW VH2D VH3D VH4D VHVCOD VHVCOI VH4I VH3I VH2I 1.316 1.128 0.846 0.752 1.316 1.504 1.692 1.880 1.400 1.200 0.900 0.800 1.400 1.600 1.800 2.000 1.484 1.272 0.954 0.848 1.484 1.696 1.908 2.120 QR FLYBACK GATE DRIVE Rise Time (10−90%) Fall Time (90−10%) Driver Resistance Source Sink Current Capability Source Sink High State Voltage Low Stage Voltage 13 7 W QR FLYBACK FEEDBACK QFB Pull Up Resistor VPSTimer = 3 V; VQFB = 0.4 V Valley Thresholds Transition from 1st to 2nd valley Transition from 2nd to 3rd valley Transition from 3rd to 4th valley Transition from 4th valley to VCO Transition from VCO to 4th valley Transition from 4th to 3rd valley Transition from 3rd to 2nd valley Transition from 2nd to 1st valley VQFB decreasing VQFB decreasing VQFB decreasing VQFB decreasing VQFB increasing VQFB increasing VQFB increasing VQFB increasing Skip Threshold VQFB decreasing 10 VQSKIP 0.35 0.40 0.45 V VQFB increasing 10 VQSKIP(HYS) 25 50 75 mV Apply 1 V step from VQSKIP 10 tdelay(QSKIP) – – 10 ms 14 tonQR(MAX) 26 32 38 ms VQFB = 0.5 V 7 VQCT(peak) 3.815 4.000 4.185 V VQCT = 0 V 7 IQCT 18 20 22 mA 7 VQCT(min) – – 90 mV 7 fVCO(MIN) 23.5 27 30.5 kHz Skip Hysteresis Delay Exiting Skip Mode to 1st QDRV Pulse 10 Maximum On Time V QR FLYBACK TIMING CAPACITOR QCT Operating Voltage Range On Time Control Source Current Minimum voltage on QCT Input Minimum Operating Frequency in VCO Mode VQCT = VQCT(peak) + 100 mV www.onsemi.com 11 NCP1937 Table 4. ELECTRICAL CHARACTERISTICS: (VCC = 12 V, VBO/X2 = 120 V, VHV/X2 = 120 V, VFault = open, VRPFBHV = 20 V, VPFBLV = 2.4 V, VPControl = 4 V, VPCS/PZCD = 0 V, VQFB = 3 V, VPONOFF = 4 V, VQCS = 0 V, VQZCD = 0 V, VPSTimer = 0 V, RPFBHV = 200 kW, CVCC = 100 nF , CQCT = 220 pF, CPDRV = 1 nF, CQDRV = 1 nF, for typical values TJ = 25_C, for min/max values, TJ is – 40_C to 125_C, unless otherwise noted) Characteristics Conditions Pin Symbol Min Typ Max Unit QZCD threshold voltage VQZCD decreasing 11 VQZCD(th) 35 55 90 mV QZCD hysteresis VQZCD increasing 11 VQZCD(HYS) 15 35 55 mV Demagnetization Propagation Delay VQZCD step from 4.0 V to −0.3 V 11 tDEM – 150 250 ns Input Voltage Excursion IQZCD = 5.0 mA IQZCD = −2.0 mA 11 VQZCD(MAX) VQZCD(MIN) 12.4 −0.9 12.7 −0.7 13.25 0 V 11 tZCD(blank) 2 3 4 ms During soft−start After soft−start 14 tQ(tout1) tQ(tout2) 80 5.1 100 6 120 6.9 ms VQCS increasing VQCS increasing, VQZCD = 1 V 13 VQILIM1a VQILIM1b 0.760 0.760 0.800 0.800 0.840 0.840 V Cycle by Cycle Leading Edge Blanking Duration 13 tQCS(LEB1) 220 275 350 ns Cycle by Cycle Current Sense Propagation Delay 13 tQCS(delay1) – 125 175 ns 13 VQILIM2 1.125 1.200 1.275 V Abnormal Overcurrent Fault Leading Edge Blanking Duration 13 tQCS(LEB2) 90 120 150 ns Abnormal Overcurrent Fault Propagation Delay 13 tQCS(delay2) – 125 175 ns Number of Consecutive Abnormal Overcurrent Faults to Enter Latch Mode 13 nQILIM2 – 4 – QR FLYBACK DEMAGNETIZATION INPUT Upper Clamp Negative Clamp Blanking Delay After Turn−Off Timeout After Last Demagnetization Detection QR FLYBACK CURRENT SENSE Current Sense Voltage Threshold Immediate Fault Protection Threshold VQCS increasing, VQFB = 4 V Minimum Peak Current Level in VCO Mode VQFB = 0.4 V, VQCS increasing 13 Ipeak(VCO) 11 12.5 14 % Set point decrease for VQZCD = − 250 mV VQCS Increasing, VQFB = 4 V 13 VOPP(MAX) 28 31.25 33 % 11 tQOPP(delay) – 125 175 ns 13 IQCS 0.7 1.0 1.3 mA 13 tSSTART 2.8 4.0 5.0 ms 13 tQOVLD 60 80 100 ms Overpower Protection Delay Pull−up Current Source VQCS = 1.5 V QR FLYBACK FAULT PROTECTION Soft−Start Period Flyback Overload Fault Timer VQCS = VQILIM1 www.onsemi.com 12 NCP1937 Table 4. ELECTRICAL CHARACTERISTICS: (VCC = 12 V, VBO/X2 = 120 V, VHV/X2 = 120 V, VFault = open, VRPFBHV = 20 V, VPFBLV = 2.4 V, VPControl = 4 V, VPCS/PZCD = 0 V, VQFB = 3 V, VPONOFF = 4 V, VQCS = 0 V, VQZCD = 0 V, VPSTimer = 0 V, RPFBHV = 200 kW, CVCC = 100 nF , CQCT = 220 pF, CPDRV = 1 nF, CQDRV = 1 nF, for typical values TJ = 25_C, for min/max values, TJ is – 40_C to 125_C, unless otherwise noted) Characteristics Conditions Pin Symbol Min Typ Max Unit Overvoltage Protection (OVP) Threshold VFault increasing 8 VFault(OVP) 2.79 3.00 3.21 V Delay Before Fault Confirmation Used for OVP Detection Used for OTP Detection VFault increasing VFault decreasing tdelay(Fault_OVP) tdelay(Fault_OTP) 22.5 22.5 30.0 30.0 37.5 37.5 COMMON FAULT PROTECTION 8 ms Overtemperature Protection (OTP) Threshold (Note 7) VFault decreasing 8 VFault(OTP_in) 0.38 0.40 0.42 V Overtemperature Protection (OTP) Exiting Threshold (Note 7) VFault increasing, Options B and D 8 VFault(OTP_out) 0.874 0.920 0.966 V VFault = VFault(OTP_in) + 0.2 V TJ = 110_C 8 IFault(OTP) IFault(OTP_110) 42.5 – 45.5 45.5 48.5 – VFault = open 8 VFault(clamp) 1.5 1.75 2.0 V RFault(clamp) 1.32 1.55 1.82 kW OTP Pull−up Current Source (Note 7) Fault Input Clamp Voltage Fault Input Clamp Series Resistor mA POWER SAVINGS MODE PSM Enable Threshold VPSTimer increasing 9 VPS_in 3.325 3.500 3.675 V PSM Disable Threshold VPSTimer decreasing 9 VPS_out 0.45 0.50 0.55 V VPSTimer = 0.9 V VPSTimer = 3.4 V 9 IPSTimer1 IPSTimer2 9 800 10 1000 11 1200 mA IPSTimer2 Enable Threshold 9 VPSTimer2 0.95 1.0 1.05 V Filter Delay Before Entering PSM 9 tdelay(PS_in) VHV_X2 increasing VBO_X2 increasing 1 3 VHV_X2(PS) VBO_X2(PS) 20 20 30 30 40 40 V VPSTimer = VPSTimer(off) + 10 mV 9 IPSTimer(DIS) 200 – – mA VPSTimer decreasing 9 VPSTimer(off) 50 100 150 mV Thermal Shutdown Temperature increasing N/A TSHDN 150 _C Thermal Shutdown Hysteresis Temperature decreasing N/A TSHDN(HYS) 40 _C PSTimer Pull Up Current Sources Startup Circuits Turn−on Thresholds in PSM PSTimer Discharge Current PSTimer Discharge Turn Off Threshold 40 ms THERMAL PROTECTION 7. NTC with R110 = 8.8 kW (TTC03−474) www.onsemi.com 13 NCP1937 DETAILED OPERATING DESCRIPTION Introduction A dedicated comparator monitors VCC when the QR stage is enabled and latches off the controller if VCC exceeds VCC(OVP), typically 28 V. The controller is disabled once a fault is detected. The controller will restart the next time VCC reaches VCC(on) and all non−latching faults have been removed. The supply capacitor provides power to the controller during power up. The capacitor must be sized such that a VCC voltage greater than VCC(off) is maintained while the auxiliary supply voltage is building up. Otherwise, VCC will collapse and the controller will turn off. The operating IC bias current, ICC4, and gate charge load at the drive outputs must be considered to correctly size CCC. The increase in current consumption due to external gate charge is calculated using Equation 1. The NCP1937 is a combination critical mode (CrM) power factor correction (PFC) and quasi−resonant (QR) flyback controller optimized for off−line adapter applications. This device includes all the features needed to implement a highly efficient adapter with extremely low input power in no−load conditions. This device reduces standby input power by integrating an active input filter capacitor discharge circuit and disconnecting the PFC feedback resistor divider when the PFC is disabled. High Voltage Startup Circuit The NCP1937 integrates two high voltage startup circuits accessible by the HV_X2 and BO_X2 pins. The startup circuits are also used for input filter capacitor discharge. The BO_X2 input is also used for monitoring the ac line voltage and detecting brown−out faults. The startup circuits are rated at a maximum voltage of 700 V. A startup regulator consists of a constant current source that supplies current from the ac input terminals (Vin) to the supply capacitor on the VCC pin (CCC). The startup circuit currents (Istart2A/B) are typically 3.75 mA. Istart2A/B are disabled if the VCC pin is below VCC(inhibit). In this condition the startup current is reduced to Istart1A/B, typically 0.5 mA. The internal high voltage startup circuits eliminate the need for external startup components. In addition, these regulators reduce no load power and increase the system efficiency as they use negligible power in the normal operation mode. Once CCC is charged to the startup threshold, VCC(on), typically 17 V, the startup regulators are disabled and the controller is enabled. The startup regulators remain disabled until VCC falls below the minimum operating voltage threshold, VCC(off), typically 8.8 V. Once reached, the PFC and flyback controllers are disabled reducing the bias current consumption of the IC. Both startup circuits are then enabled allowing VCC to charge back up. In power savings mode VCC is regulated by enabling the startup circuits once the supply voltage decays below VCC(PS_on), typically 11 V. The startup circuit is disabled once VCC exceeds VCC(PS_on). This provides enough headroom from VCC(off) to maintain a supply voltage and allow the controller to detect the line voltage removal in order to discharge the input filter capacitor(s). In this mode, the supply capacitor is charged by the startup circuit on the HV_X2 and BO_X2 pins once the voltage on these pin exceeds 30 V, typically. This reduces the average voltage during which the startup circuit is enabled reducing power consumption. Both startup circuits are enabled once the controller exits power savings mode in order to quickly charge VCC. A new startup sequence commences once VCC reaches VCC(on). I CC(gate charge) + f @ Q G (eq. 1) where f is the operating frequency and QG is the gate charge of the external MOSFETs. Line Voltage Sense The BO/X2 pin provides access to the brown−out and line voltage detectors. It also provides access to the input filter capacitor discharge circuit. The brown−out detector detects mains interruptions and the line voltage detector determines the presence of either 110 V or 220 V ac mains. Depending on the detected input voltage range device parameters are internally adjusted to optimize the system performance. This pin connects to either line or neutral to achieve half−wave rectification as shown in Figure 3. A diode is used to prevent the pin from going below ground. A resistor in series with the BO/X2 pin can be used for protection, but a low value (< 3 kW) resistor should be used to reduce the voltage offset while sensing the line voltage. Figure 3. Brown−out and Line Voltage Detectors Configuration The flyback stage is enabled once VBO_X2 is above the brown−out threshold, VBO(start), and VCC reaches VCC(on). The high voltage startups are immediately enabled when the voltage on VBO_X2 crosses over the brown−out start threshold, VBO(start), to ensure that device is enabled quickly upon exiting a brown−out state. Figure 4 shows typical power up waveforms. www.onsemi.com 14 NCP1937 VBO_X2 VBO(start) Startup turns on when device exits a brown−out VBO/X2(MIN) time V CC VCC(on) VCC(off) Startup current = Istart2 Startup current = Istart1 VCC(inhibit) time QDRV Figure 4. Startup Timing Diagram time Figure 5 shows typical operation for the line voltage detector. The default power−up mode of the controller is low line. The controller switches to “high line” mode if VBO_X2 exceeds the line select threshold for longer than the low to high line timer, t(low to high line), typically 300 ms, as long as it was not previously in high line mode. If the controller has switched from “high line” to “low line” mode, the low to high line timer, t(low to high line), is inhibited until VBO/X2 falls below VBO(stop). This prevents the controller from toggling back to “high line” until at least one VBO(stop) transition has occurred. The timer and logic is included to prevent unwanted noise from toggling the operating line level. In “high line” mode the high to low line timer, t(high to low line), (typically 54 ms) is enabled once VBO_X2 falls below VBO(lineselect). It is reset once VBO_X2 exceeds VBO(lineselect). The controller switches back to “low line” mode if the high to low line timer expires. A timer is enabled once VBO_X2 drops below its stop threshold, VBO(stop). If the timer, tBO, expires the device will begin monitoring the voltage on VBO_X2 and disable the PFC and flyback stages when that voltage is below the Brown−out Drive Disable threshold, VBO(DRV_disable), typically 30 V. This ensures that device switching is stopped in a low energy state which minimizes inductive voltage kick from the EMI components and ac mains. The timer, tBO, typically 54 ms, is set long enough to ignore a single cycle drop−out. Line Voltage Detector The input voltage range is detected based on the peak voltage measured at the BO_X2 pin. Discrete values are selected for the PFC stage gain (feedforward) depending on the input voltage range. The controller compares VBO_X2 to an internal line select threshold, VBO(lineselect). Once VBO_X2 exceeds VBO(lineselect), the PFC stage operates in “high line” (Europe/Asia) or “220 Vac” mode. In high line mode the maximum on time is reduced by a factor of 3, resulting in a maximum output power independent of input voltage. www.onsemi.com 15 NCP1937 HL transition blanked by t low to high line VBO/X2 HL transition blanked by VBO(stop) counter VBO(lineselect) VBO(stop) High Line Entered Line Timer Starts Line Timer Reset Line Timer Starts t(low to high line) Low Line Select Timer Line Timer Expires Low Line Entered t (high to low line) time Operating Mode Transition to High Line Allowed? Low Line High Line Low Line time Yes No Yes time Figure 5. Line Detector Waveforms Input Filter Capacitor Discharge both startup circuits are enabled. The startup circuits will then source current from the BO_X2 and HV_X2 inputs to the VCC pin and discharge the input filter capacitors by transferring its charge to the VCC capacitor(s). The input filter capacitor(s) are typically discharged once the startup circuit turns on the 1st time because the energy stored in the input filter capacitor(s) is significantly lower than the energy needed to charge the VCC capacitor from VCC(off) to VCC(on). After the initial discharge the controller enters a low current mode (ICC2) once VCC drops to VCC(off). In the event that the input filter capacitor is not fully discharged, a larger VCC capacitor should be used. But, this is not a concern for most applications because the supply capacitor value will be large enough to maintain VCC during skip operation. Figure 6 shows typical behavior of the filter capacitor discharge when the ac line is removed. Safety agency standards require the input filter capacitors to be discharged once the ac line voltage is removed. A resistor network is the most common method to meet this requirement. Unfortunately, the resistor network consumes power across all operating modes and is a major contributor to the total input power dissipation during light−load and no−load conditions. The NCP1937 eliminates the need for external discharge resistors by integrating active input filter capacitor discharge circuitry. A novel approach is used to reconfigure the high voltage startup circuits to discharge the input filter capacitors upon removal of the ac line voltage. Once the controller detects the absence of the ac line voltage, the controller is disabled and VCC is discharged by a current source, ICC(discharge), typically 11.5 mA. This will cause VCC to fall down to VCC(off). Upon reaching VCC(off), www.onsemi.com 16 NCP1937 AC Mains Unplugged HV Startups Turn On VAC Input Filter Cap Discharged 0V tlineremoval VCC ICC(discharge) Begins VCC(off) QDRV Figure 6. Input Filter Capacitor Discharge Waveforms The diode connecting the AC line to the BO_X2 pin should be placed after the system fuse. A resistor in series with the BO_X2 pin is recommended to limit the current during transient events. A low value resistor (< 3 kW) should be used to reduce the voltage drop when the startup circuit is enabled. once VPSTimer falls below its minimum operating level, VPSTimer(MIN) (maximum of 50 mV). The time to enter PSM mode is calculated using Equations 2 through 4. The time to exit PSM mode is calculated using Equation 5. t PSM(in) + t PSM(in1) ) t PSM(in2) ǒ ǒ Power Savings Mode t PSM(in1) + −R PSMC PSM @ In 1− The NCP1937 has a low current consumption mode known as power savings mode (PSM). The supply current consumption in this mode is below 70 mA. PSM operation is controlled by an external control signal. This signal is typically generated on the secondary side of the power supply and fed via an optocoupler. The NCP1937 is configured as active on logic, that is it enters PSM in the absence of the control signal. The control signal is applied to the PSTimer pin. The block diagram for NCP1937 PSTimer pin is shown in Figure 7. Power savings mode operating waveforms for the NCP1937 are shown in Figure 8. The NCP1937 controller starts once VCC reaches VCC(on) and no faults are present. At this time the current source on the PSTimer pin, IPSTimer1, is enabled. IPSTimer1 is typically 10 mA. The current source charges the capacitor connected from this pin to ground. Once VPSTimer reaches VPSTimer2 a 2nd current source, IPSTimer2, is enabled to speed up the charge of CPSM. VPSTimer2 and IPSTimer2 are typically 1 V and 1 mA, respectively. The controller enters PSM if the voltage on VPSTimer exceeds VPS_in, typically 3.5 V. An external optocoupler or switch needs to pull down on this pin before its voltage reaches VPS_in to prevent entering PSM. Once the controller enters PSM, IPSTimer1/2 is disabled. A resistor between this pin and ground discharges the PSTimer capacitor. The controller exits PSM once VPSTimer drops below VPS_out, typically 0.5 V. Once the QR stage is enabled, the capacitor on the PSTimer pin is discharged with an internal pull down transistor. The transistor is disabled t PSM(in2) [ −R PSMC PSM @ In 1− ǒ t PSM(out) + −R PSMC PSM @ In Ǔ Ǔ V PSTimer2 I PSTimer1 @ R PSM V PS_in−V PSTimer2 I PSTimer2 @ R PSM Ǔ V PS_out V PS_in (eq. 2) (eq. 3) (eq. 4) (eq. 5) In PSM the startup circuits on the HV_X2 and BO_X2 pins work to maintain VCC above VCC(off). The input filter capacitor discharge circuitry continues operation in PSM. The supply voltage is maintained in PSM by enabling one of the startup circuits once VCC falls below VCC(PS_on) (typically 11 V) and either VHV_X2 exceeds VHV_X2(PS) or VBO_X2 exceeds VBO_X2(PS) (typically 30 V). The startup circuit is disabled once VCC exceeds VCC(PS_on). A voltage offset is observed on VCC while the startup circuit is enabled due to the capacitor ESR. This will cause the startup circuit to turn off because VCC exceeds VCC(PS_on). Internal circuitry prevents the startup circuit from turning on multiple times during the same ac line half−cycle. The complementary startup circuit will then turn on during the next half−cycle. Eventually, VCC will be regulated several millivolts below VCC(PS_on). The offset is dependent on the capacitor ESR. This architecture enables the startup circuit for the exact amount of time needed to regulate VCC. This results in a significant reduction in power dissipation because the average input voltage is greatly reduced. www.onsemi.com 17 NCP1937 Figure 7. NCP1937 Power Savings Mode Control Block Diagram Figure 8. NCP1937 Power Savings Mode Operating Waveforms www.onsemi.com 18 NCP1937 Fault Input the upper threshold, the external pull−up current has to be higher than the pull−down capability of the clamp (set by RFault(clamp) at VFault(clamp)). The upper fault threshold is intended to be used for an overvoltage fault using a Zener diode and a resistor in series from the auxiliary winding voltage, VAUX. The controller is latched once VFault exceeds VFault(OVP). The Fault input signal is filtered to prevent noise from triggering the fault detectors. Upper and lower fault detector blanking delays, tdelay(Fault_OVP) and tdelay(Fault_OTP) are both typically 30 ms. A fault is detected if the fault condition is asserted for a period longer than the blanking delay. A bypass capacitor is usually connected between the Fault and GND pins and it will take some time for VFault to reach its steady state value once IFault(OTP) is enabled. Therefore, a lower fault (i.e. overtemperature) is ignored during soft−start. In Options B and D, IFault(OTP) remains enabled while the lower fault is present independent of VCC in order to provide temperature hysteresis. The controller can detect an upper OVP fault once VCC exceeds VCC(reset). The OVP fault detection remains active provided the device is not in PSM. Once the controller is latched, it is reset if a brown−out condition is detected or if VCC is cycled down to its reset level, VCC(reset). In the typical application these conditions occur only if the ac voltage is removed from the system. Prior to reaching VCC(reset), Vfault(clamp) is set at 0 V. The NCP1937 includes a dedicated fault input accessible via the Fault pin. The controller can be latched by pulling the pin above the upper fault threshold, VFault(OVP), typically 3.0 V. The controller is disabled if the Fault pin voltage, VFault, is pulled below the lower fault threshold, VFault(OTP_in), typically 0.4 V. The lower threshold is normally used for detecting an overtemperature fault. The controller operates normally while the Fault pin voltage is maintained within the upper and lower fault thresholds. Figure 9 shows the architecture of the Fault input. The lower fault threshold is intended to be used to detect an overtemperature fault using an NTC thermistor. A pull up current source IFault(OTP), (typically 45.5 mA) generates a voltage drop across the thermistor. The resistance of the NTC thermistor decreases at higher temperatures resulting in a lower voltage across the thermistor. The controller detects a fault once the thermistor voltage drops below VFault(OTP_in). Options A and C latch−off the controller after an overtemperature fault is detected. In Options B and D the controller is re−enabled once the fault is removed such that VFault increases above VFault(OTP_out) and VCC reaches VCC(on). Figure 10 shows typical waveforms related to the latch option whereas Figure 11 shows waveforms of the auto−recovery option. An active clamp prevents the Fault pin voltage from reaching the upper latch threshold if the pin is open. To reach VAUX blanking tdelay(Fault_OVP) + − VDD S Q Latch VFault(OVP) R IFault(OTP) Fault − + blanking NTC Thermistor RFault(clamp) VFault(clamp) Soft−start end Hysteresis Control Option Figure 9. Fault Detection Schematic www.onsemi.com 19 BO_OK Line Removal Reset tdelay(Fault_OTP) VFault(OTP) Auto−restart Control Auto−restart NCP1937 VCC VCC(on) VCC(off) VFault VFault(clamp) VFault(OTP) tdelay(Fault_OTP) OTP Fault Flag OTP Fault Detected QDRV Figure 10. Latch−off Function Timing Diagram time VCC VCC(on) VCC(off) VFault VFault(clamp) VFault(OTP_OUT) VFault(OTP_IN) VFault(OTP) OTP Fault Flag tdelay(Fault_OTP) OTP Fault Detected OTP Fault is Cleared tSSTART (OTP Fault Ignored) QDRV Figure 11. OTP Auto−recovery Timing Diagram www.onsemi.com 20 time NCP1937 QR Flyback Valley Lockout patent pending valley lockout circuitry to eliminate valley jumping. Once a valley is selected, the controller stays locked in this valley until the output power changes significantly. Like a traditional QR flyback controller, the frequency increases when the load decreases. Once a higher valley is selected the frequency decreases very rapidly. It will continue to increase if the load is further reduced. This technique extends QR operation over a wider output power range while maintaining good efficiency and limiting the maximum operating frequency. Figure 12 shows a qualitative frequency vs output power relationship. Figure 13 shows the internal arrangement of the valley lockout circuitry. The decimal counter increases each time a valley is detected. The operating valley (1st, 2nd, 3rd or 4th) is determined by the QFB voltage. As VQFB decreases or increases, the valley comparators toggle one after another to select the proper valley. The activation of an “n” valley comparator blanks the “n−1” or “n+1” valley comparator output depending if VQFB decreases or increases, respectively. A valley is detected once VQZCD falls below the QR flyback demagnetization threshold, VQZCD(th), typically 55 mV. The controller will switch once the valley is detected or increment the valley counter depending on QFB voltage. The NCP1937 integrates a quasi−resonant (QR) flyback controller. The power switch turn−off of a QR converter is determined by the peak current set by the feedback loop. The switch turn−on is determined by the transformer demagnetization. The demagnetization is detected by monitoring the transformer auxiliary winding voltage. Turning on the power switch once the transformer is demagnetized or reset reduces switching losses. Once the transformer is demagnetized, the drain voltage starts ringing at a frequency determined by the transformer magnetizing inductance and the drain lump capacitance eventually settling at the input voltage. A QR controller takes advantage of the drain voltage ringing and turns on the power switch at the drain voltage minimum or “valley” to reduce switching losses and electromagnetic interference (EMI). The operating frequency of a traditional QR flyback controller is inversely proportional to the system load. That is, a load reduction increases the operating frequency. This tradionally requires a maximum frequency clamp to limit the operating frequency. This causes the controller to become unstable and jump (or hesitate) between two valleys generating audible noise. The NCP1937 incorporates a Figure 12. Valley Lockout Frequency vs. Output Power Relationship www.onsemi.com 21 NCP1937 Figure 13. Valley Lockout Detection Circuitry Internal Schematic VQFB falls below VHVCOD. In VCO mode the peak current is set as shown in Figure 15. The operating frequency in VCO mode is adjusted to deliver the required output power. A hysteresis between valleys provides noise immunity and helps stabilize the valley selection in case of small perturbations on VQFB. Figure 14 shows the operating valley versus VQFB. Once a valley is asserted by the valley selection circuitry, the controller is locked in this valley until VQFB decreases or increases such that VQFB reaches the next valley threshold. A decrease in output power causes the controller to switch from “n” to “n+1” valley until reaching the 4th valley. A further reduction of output power causes the controller to enter the voltage control oscillator (VCO) mode once Valley VCO 4th 3rd 2nd 1st V HVCOD VH4D V H3D V H2D V HVCOI V QFB V H4I VH3I V H2I Figure 14. Selected Operating Valley vs. VQFB www.onsemi.com 22 V QILIM1*KQFB NCP1937 Peak current Setpoint Skip VCO Mode QR Mode VQILIM1 ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ 1st Valley 2nd 3rd Fault 4th Ipeak(VCO)*VQILIM1 VQFB(TH) VQSKIP VHVCOD VH4D VH3D VH2D VQILIM1*KQFB VQFB Figure 15. Operating Valley vs. VQFB Figure 16 through Figure 19 show drain voltage, VQFB and VQCT simulation waveforms for a reduction in output power. The transitions between 2nd to 3rd, 3rd to 4th and 4th   valley to VCO mode are observed without any instabilities or valley jumping. Plot1 vdrain in volts 700 500 300 1 100 Plot2 feedback in volts −100 2.00 1.60 1.20 800m 400m 2 Plot3 vct in volts 7.00 3 5.00 3.00 1.00 −1.00 3.64m 4.91m 6.18m time in seconds 7.45m 8.72m Figure 16. Operating Mode Transitions between 2nd to 3rd, 3rd to 4th and 4th Valley to VCO Mode www.onsemi.com 23 NCP1937   1 vdrain 2 feedback 3 vct Plot1 vdrain in volts 700 500 1 300 100 Plot2 feedback in volts −100 2.15 2.05 2 1.95 1.85 1.75 Plot3 vct in volts 6.00 4.00 2.00 3 0 −2.00 3.70m 3.78m 3.86m time in seconds 3.94m 4.02m Figure 17. Zoom 1: 2nd to 3rd Valley Transition 1 vdrain 2 feedback 3 vct Plot1 vdrain in volts 700 500 300 1 100 −100 Plot2 feedback in volts 1.38 2 1.34 1.30 1.26 1.22 4.00 vct i n volts 3.00 2.00 1.00 3 0 5.90m 5.95m 6.00m time in seconds 6.05m 6.11m Figure 18. Zoom 2: 3rd to 4th Valley Transition   1 vdrain 2 feedback 3 vct Plot1 vdrain in volts 700 500 300 1 100 Plot2 feedback in volts −100 1.12 1.02 2 919m 819m 719m Plot3 vct in volts 8.00 6.00 4.00 3 2.00 0 7.10m 7.21m 7.32m time in seconds 7.43m 7.55m Figure 19. Zoom 3: 4th Valley to VCO Mode Transition www.onsemi.com 24 NCP1937 VCO Mode capacitor is charged with a constant current source, IQCT, typically 20 mA. The capacitor voltage, VQCT, is compared to an internal voltage level, Vf(QFB), inversely proportional to VQFB The relationship between and Vf(QFB) and VQFB is given by Equation 6. The controller enters VCO mode once VQFB falls below VHVCOD and remains in VCO until VQFB exceeds VHVCOI. In VCO mode the peak current is set to VQILIM1*Ipeak(VCO) and the operating frequency is linearly dependent on VQFB. The product of VQILIM1*Ipeak(VCO) is typically 12.5%. A minimum frequency clamp, fVCO(MIN), typically 27 kHz, prevents operation in the audible range. Further reduction in output power causes the controller to enter skip operation. The minimum frequency clamp is only enabled when operating in VCO mode. The VCO mode operating frequency is set by the timing capacitor connected between the QCT and GND pins. This V f (QFB) + 5 * 2 @ V QFB A drive pulse is generated once VQCT exceeds Vf(QFB) followed by the immediate discharge of the timing capacitor. The timing capacitor is also discharged once the minimum frequency clamp is reached. Figure 20 shows simulation waveforms of Vf(QFB), VQDRV and output current while operating in VCO mode. 800m 600m IOUT 400m 200m 1 0 7.00 2 5.00 3 3.00 VQCT Vf(QFB) 1.00 −1.00 30.0 VQDRV 20.0 10.0 0 5 −10.0 7.57m 7.78m (eq. 6) 7.99m time in seconds 8.20m Figure 20. VCO Mode Operating Waveforms www.onsemi.com 25 8.40m NCP1937 Flyback Timeout During startup, the voltage offset added by the overpower compensation diode, DOPP, prevents the QZCD Comparator from accurately detecting the valleys. In this condition, the steady state timeout period will be shorter than the inductor demagnetization period causing continuous current mode (CCM) operation. CCM operation lasts for a few cycles until the voltage on the QZCD pin is high enough to detect the valleys. A longer timeout period, tQ(tout1), (typically 100 ms) is set during soft−start to limit CCM operation. Figure 22 and Figure 23 show the timeout period generator related waveforms. In case of extremely damped oscillations, the QZCD comparator may be unable to detect the valleys. In this condition, drive pulses will stop waiting for the next valley or ZCD event. The NCP1937 ensures continued operation by incorporating a maximum timeout period after the last demagnetization detection. The timeout signal is a substitute for the ZCD signal for the valley counter. Figure 21 shows the timeout period generator circuit schematic. The steady state timeout period, tQ(tout2), is set at 6 ms to limit the frequency step. Figure 21. Timeout Period Generator Circuit Schematic www.onsemi.com 26 NCP1937 3 4 high The 3rd valley is validated VQZCD(th) VQZCD 14 2nd, 3rd low high The 3rd valley is not detected by the QZCD Comparator The 2nd valley is detected by the QZCD Comparator low 12 15 QZCD Comparator Output 16 Timeout 17 Clk high low Timeout adds a pulse to account for the missing 3rd valley high low Figure 22. Timeout Operation with a Missing 3rd Valley 3 4 high The 4th valley is validated VQZCD(th) VQZCD 18 3rd, 4th low 14 high QZCD low 15 Comparator Output high 16 Timeout low high Timeout adds 2 pulses to account for the missing 3rd and 4th valleys low 17 Clk Figure 23. Timeout Operation with Missing 3rd and 4th Valleys www.onsemi.com 27 NCP1937 QR Flyback Current Sense and Overload The Maximum Peak Current Comparator compares the current sense signal to a reference voltage to limit the maximum peak current of the system. The maximum peak current reference voltage, VQILIM1, is typically 0.8 V. The maximum peak current setpoint is reduced by the overpower compensation circuitry. An overload condition causes the output of the Maximum Peak Current Comparator to transition high and enable the overload timer. Figure 24 shows the implementation of the current sensing circuitry. The power switch on time is modulated by comparing a ramp proportional to the switch current to VQFB/KQFB using the PWM Comparator. The switch current is sensed across a current sense resistor, RSENSE, and the resulting voltage is applied to the QCS pin. The current signal is blanked by a leading edge blanking (LEB) circuit. The blanking period eliminates the leading edge spike and high frequency noise during the switch turn−on event. The LEB period, tQCS(LEB1), is typically 275 ns. The drive pulse terminates once the current sense signal exceeds VQFB/KQFB. VDD VQFB RQFB In_PSM IQFB Skip QFB + VQSKIP Ipeak(VCO) = KQCS(VCO) − VQZCD PWM Comparator Overload Timer tQOVLD LEB Peak Current Comparator Count Down Count Up /KQFB + tQCS(LEB1) + VQZCD Fault Over Current Comparator LEB VDD IQCS QCS tQCS(LEB2) Count Reset + − CSStop − Counter + Disable QDRV VQILIM1 QDRV VQILIM2 Figure 24. Current Sensing Circuitry Schematic and the overload timer counts down. The controller can latch (options C and D) or allow for auto−recovery (options A and B) once the overload timer expires. Auto−recovery requires a VCC triple hiccup before the controller restarts. Figure 25 and Figure 26 show operating waveforms for latched and auto−recovery overload conditions. The overload timer integrates the duration of the overload fault. That is, the timer count increases while the fault is present and reduces its count once it is removed. The overload timer duration, tQOVLD, is typically 80 ms. If both the PWM and Maximum Peak Current Comparators toggle at the same time, the PWM Comparator takes precedence www.onsemi.com 28 NCP1937 Figure 25. Latched Overload Operation Figure 26. Auto−recovery Overload Operation www.onsemi.com 29 NCP1937 A severe overload fault like a secondary side winding short−circuit causes the switch current to increase very rapidly during the on−time. The current sense signal significantly exceeds VQILIM1. But, because the current sense signal is blanked by the LEB circuit during the switch turn on, the system current can get extremely high causing system damage. The NCP1937 protects against this fault by adding an additional comparator, Fault Overcurrent Comparator. The current sense signal is blanked with a shorter LEB duration, tQCS(LEB2), typically 120 ns, before applying it to the Fault Overcurrent Comparator. The voltage threshold of the comparator, VQILIM2, typically 1.2 V, is set 50% higher than VQILIM1, to avoid interference with normal operation. Four consecutive faults detected by the Fault Overcurrent Comparator causes the controller to enter latch mode. The count to 4 provides noise immunity during surge testing. The counter is reset each time a QDRV pulse occurs without activating the Fault Overcurrent Comparator. A 1 mA (typically) pull−up current source, IQCS, pulls up the QCS pin to disable the controller if the pin is left open. ramps up from 0 V once the controller powers up. The soft−start duration, tSSTART, is typically 4 ms. During soft−start the timeout duration is extended and the lower latch or OTP Comparator signal (typically for overtemperature) is blanked. Soft−start ends once VSSTART exceeds the peak current sense signal threshold. QR Flyback Overpower Compensation The input voltage of the QR flyback stage varies with the line voltage and operating mode of the PFC converter. At low line the PFC bulk voltage is 250 V and at high line it is 400 V. In addition, the PFC can be disabled at light loads to reduce input power at which point the PFC bulk voltage is set by the rectified peak line voltage. An integrated overpower circuit provides a relative constant output power across PFC bulk voltage, Vbulk. It also reduces the variation on VQFB during the PFC stage enable or disable transitions. Figure 27 shows the circuit schematic for the overpower detector. The auxiliary winding voltage during the power switch on time is a reflection of the input voltage scaled by the primary to auxiliary winding turns ratio, NP,AUX, as shown in Figure 28. QR Flyback Soft−Start Soft−start is achieved by ramping up an internal reference, VSSTART, and comparing it to current sense signal. VSSTART QZCD DOPP RQCZD LAUX ROPPU QZCD Comparator + − ROPPL QFB VQZCD(th) Peak Current Comparator + /4 + V − QILIM1 + Other Faults KQCS(VCO) QCS Disable QDRV + − PWM Comparator LEB tQCS(LEB1) Figure 27. Overpower Compensation Circuit Schematic Figure 28. Auxiliary Winding Voltage Waveform www.onsemi.com 30 NCP1937 Overpower compensation is achieved by scaling down the on−time reflected voltage and applying it to the QZCD pin. The voltage is scaled down using ROPPU and ROPPL. The negative voltage applied to the pin is referred to as VOPP. The internal current setpoint is the sum of VOPP and peak current sense threshold, VQILIM1. VOPP is also subtracted from VQFB to compensate for the PWM Comparator delay and improve the PFC on/off accuracy. The current setpoint is calculated using Equation 7. For example, a VOPP of −0.15 V results in a current setpoint of 0.65 V. Current setpoint + V QILIM1 ) V OPP Substituting values in Equation 8 and solving for ROPPU we obtain, R QZCD ) R OPPU 0.18 @ 370 * (−0.25) +* + 271 (−0.25) R OPPL R OPPU + 271 @ R OPPL * R QZCD R OPPU + 271 @ 1 k * 1 k + 270 k Power Factor Correction The PFC stage operates in critical conduction mode (CrM). In CrM, the PFC inductor current, IL(t) reaches zero at the end of each switch cycle. Figure 29 shows the PFC inductor current while operating in CrM. The average input current, Iin(t), is in phase with the ac line voltage, Vin(t), to achieve power factor correction. (eq. 7) To ensure optimal zero−crossing detection, a diode is needed to bypass ROPPU during the off−time. Equation 8 is used to calculate ROPPU and ROPPL. N P,AUX @ V bulk * V OPP R QZCD ) R OPPU +* (eq. 8) R OPPL V OPP ROPPU is selected once a value is chosen for ROPPL. ROPPL is selected large enough such that enough voltage is available for the zero crossing detection during the off−time. It is recommended to have at least 8 V applied on the QZCD pin for good detection. The maximum voltage is internally clamped to VCC. The off−time voltage on the QZCD is given by Equation 9. V QZCD + R OPPL @ ǒV AUX * V FǓ R QZCD ) R OPPL (eq. 9) Figure 29. Inductor Current in CrM Where VAUX is the voltage across the auxiliary winding and VF is the DOPP forward voltage drop. The ratio between RQZCD and ROPPL is given by Equation 10. It is obtained combining Equations 8 and 9. V AUX * V F * V QZCD R QZCD + R OPPL V QZD High power factor is achieved in CrM by maintaining a constant on time (ton) for a given RMS input voltage (Vac(RMS)) and load condition. Equation 11 shows the relationship between on time and system operating conditions. (eq. 10) t on + A design example is shown below: System Parameters: VAUX = 18 V VF = 0.6 V NP,AUX = 0.18 The ratio between RQZCD and ROPPL is calculated using Equation 10 for a minimum VQZCD of 8 V. 2 @ P out @ L h @ V ac(RMS) 2 (eq. 11) where Pout is the output power, L is the PFC choke inductance and η is the system efficiency. PFC Feedback The PFC feedback circuitry is shown in Figure 30. A transconductance error amplifier regulates the PFC output voltage, Vbulk, by comparing the PFC feedback signal to an internal reference voltage, VPREF. The feedback signal is applied to the inverting input and the reference is connected to the non−inverting input of the error amplifier. A resistor divider consisting of R1 and R2 scales down Vbulk to generate the PFC feedback signal. VPREF is trimmed during manufacturing to achieve an accuracy of ± 2%. The PFC stage is disabled at light loads to reduce input power. The NCP1937 integrates a 700 V switch, PFC FB Switch, between the PFBHV and PFBLV pins. The PFC FB Switch is in series between R1 and R2 to disconnect the resistors and reduce input power when the PFC stage is disabled. R QZCD + 18 * 0.6 * 8 [ 1.2 8 R OPPL RQZCD is arbitrarily set to 1 kW. ROPPL is also set to 1 kW because the ratio between the resistors is close to 1. The NCP1937 maximum overpower compensation or peak current setpoint reduction is 31.25% for a VOPP of −250 mV. We will use this value for the following example: www.onsemi.com 31 NCP1937 Vbulk R1 PFBHV PFC FB Switch PFC UVP Comparator PFBLV PUVP + R2 − VPREF + − Delay tPenable VPFB(disable) Error Amplifier Enable PFC Latchoff PILIM1, PILIM2 Stop Q R Dominant Reset Latch Q S PFC Faults and Disable Signals PFCDRV VDD High Clamp PControl Disable PFC PUVP Low Clamp Figure 30. PFC Regulation Circuit Schematic The maximum on resistance of the PFC FB Switch, RPFBswitch(on), is 10 kW. Because the PFC FB Switch is in series with R1 and R1’s value is several orders of magnitudes larger, the switch introduces minimum error on the regulation level. The off state leakage current of the PFC FB Switch, IPFBSwitch(off), is less than 3 mA. The NCP1937 safely disables the controller if the PFBLV pin is grounded. A short pin detector disables the controller if VPFBLV is below the disable threshold, VPFB(disable), typically 0.3 V. If the PFBLV pin is open, the PFC FB Switch will raise VPFBLV above the overvoltage threshold and disable the controller. Equation 12 shows the relationship between the PFC output voltage, the PFC reference threshold, R1 and R2. V PFC + V PREF(xL) @ R1 ) R2 R2 fp + gm 2pC PControl (eq. 13) where, CPControl is the capacitor on the PControl pin to ground. The output of the error amplifier is held low when the PFC is disabled by means of an internal pull−down transistor. The pull down transistor is disabled once the PFC stage is enabled. An internal voltage clamp is then enabled to quickly raise VPControl to its minimum voltage, VPClamp(lower). PFC On−Time The PFC on time is controlled by VPControl. The PFC On−Time Comparator terminates the drive pulse once the PFC on−time ramp voltage plus offset exceeds VPControl. The ramp is generated by charging an internal timing capacitor, CPCT, with a constant current source, IPCT. The capacitor ramp is level shifted to achieve 0 duty ratio (stop drive pulses) at the minimum VPControl. VPControl is proportional to the output power and it is fixed for a given RMS line voltage and output load, satisfying Equation 11. Lower and upper voltage clamps limit the excursion of VPControl. The maximum on−time, ton(MAX), occurs when VPControl is at its maximum value, VPControl(MAX). The PFC drive pulses are inhibited once VPControl is below its minimum value, VPControl(MIN). The maximum PFC on−time in the NCP1937 is set internally. The maximum on time at low line is typically 15 ms. (eq. 12) PFC Error Amplifier A transconductance amplifier has a voltage−to−current gain, gm. That is, the amplifier’s output current is controlled by the differential input voltage. The NCP1937 amplifier has a typical gm of 200 mS. The PControl pin provides access to the amplifier output for compensation. The compensation network is ground referenced allowing the PFC feedback signal to be used to detect an overvoltage condition. The compensation network on the PControl pin is selected to filter the bulk voltage ripple such that a constant control voltage is maintained across the ac line cycle. A capacitor between the PControl pin and ground sets a pole. A pole at or below 20 Hz is enough to filter the ripple voltage for a 50 and 60 Hz system. The low frequency pole, fp, of the system is calculated using Equation 13. www.onsemi.com 32 NCP1937 PFC Transient Response The boost current source becomes active as soon as the PFC is enabled. Coupled with the lower control clamp, the current provided by the boost current source assists in rapidly bringing VPControl to its set point to allow the bulk voltage to quickly reach regulation. Achieving regulation is detected by monitoring the error amplifier output current. The error amplifier output current drops to zero once the PFC output voltage reaches the target regulation level. The maximum PFC output voltage is limited by the overvoltage protection circuitry. The NCP1937 incorporates both soft and hard overvoltage protection. The hard overvoltage protection function immediately terminates and prevents further PFC drive pulses when VPFBLV exceeds the hard−OVP level, VPREF(xL) * KPOVP(xL). Soft−OVP reduces the on−time proportional to the delta between VPFBLV and the hard−OVP level. Soft−OVP is enabled once the delta, DPOVP(xL), between VPFBLV and the hard−OVP level, is between 20 and 55 mV. Figure 31 shows the circuit schematic of the boost and Soft−OVP circuits. The PFC bandwidth is set low enough to achieve good power factor. A low bandwidth system is slow and fast load transients can result in large output voltage excursions. The NCP1937 incorporates dedicated circuitry to help mantain regulation of the output voltage independent of load transients. An undervoltage detector monitors Vbulk and prevents it from dropping below from its regulation level. Once the ratio between VPFBLV and VPREF(xL) exceeds KLOW(PFCxL), typically 5.5%, a pull−up current source on the PControl pin, IPControl(boost), is enabled to speed up the charge of the compensation capacitor(s). This results in an increased on−time and thus output power. IPControl(boost) is typically 240 mA. The boost current source is disabled once the ratio between VPFBLV and VPREF(xL) drops below KLOW(PFCxL), typically 4%. Figure 31. Boost and Soft−OVP Circuit Schematics PFC Current Sense and Zero Current Detection During power up, VPControl exceeds the regulation level due to the system’s inherently low bandwidth. This causes the bulk voltage to rapidly increase and exceed its regulation. The on time starts to decrease when soft−OVP is activated. Once the bulk voltage decreases to its regulation level the PFC on time is no longer controlled by the soft−OVP circuitry. The NCP1937 uses a novel architecture combining the PFC current sense and zero current detectors (ZCD) in a single input terminal. Figure 32 shows the circuit schematic of the current sense and ZCD detectors. www.onsemi.com 33 NCP1937 tPFC(off) Timer PDRV ZCD Comparator PFC Boost Diode PFC Inductor + − Reset PILIM2 VDD Q ZCD_LAT CLK RPsense R PDRV PCS/PZCD D Q CLK Q PFC Timeout tPFC(out) Reset PFC Switch RPZCD D VZCD PDRV RPCS To PDRV Set Frequency Clamp Timer LEB1 tPCS(LEB1) VPILIM1 Q Current Limit Comparator + PILIM1 PDRV − PDRV LEB2 PILIM2 tPCS(LEB2) Short Circuit Detector VPILIM2 Other Latching Faults PDRVRST Boost Diode Counter Count Reset Q S Dominant Reset Latch Q R Latchoff Figure 32. PFC Current Sense and ZCD Detectors Schematic PFC Current Sense than VPILIM1, to avoid interference with normal operation. Four consecutive faults detected by the Short Circuit Comparator causes the controller to enter latch mode. The count to 4 provides noise immunity during surge testing. The counter is reset each time a PDRV pulse occurs without activating the Short Circuit Comparator. The PFC watchdog timer duration increases to tPFC(off2) (typically 1 ms) when a VPILIM2 fault is detected independent of the PFC ZCD state. The PFC Switch current is sensed across a sense resistor, RPsense, and the resulting voltage ramp is applied to the PCS/PZCD pin. The current signal is blanked by a leading edge blanking (LEB) circuit. The blanking period eliminates the leading edge spike and high frequency noise during the switch turn−on event. The LEB period, tPCS(LEB1), is typically 325 ns. The Current Limit Comparator disables the PFC driver once the current sense signal exceeds the PFC current sense reference, VPILIM1, typically 0.5 V. A severe overload fault like a PFC boost diode short circuit causes the switch current to increase very rapidly during the on−time. The current sense signal significantly exceeds VPILIM1. But, because the current sense signal is blanked by the LEB circuit during the switch turn on, the system current can get extremely high causing system damage. The NCP1937 protects against this fault by adding an additional comparator, PFC Short Circuit Comparator. The current sense signal is blanked with a shorter LEB duration, tPCS(LEB2), typically 175 ns, before applying it to the PFC Short Circuit Comparator. The voltage threshold of the comparator, VPILIM2, typically 1.25 V, is set 250% higher PFC Zero Current Detection The off−time in a CrM PFC topology varies with the instantaneous line voltage and is adjusted every switching cycle to allow the inductor current to reach zero before the next switching cycle begins. The inductor is demagnetized once its current reaches zero. Once the inductor is demagnetized the drain voltage of the PFC switch begins to drop. The inductor demagnetization is detected by sensing the voltage across the inductor using an auxiliary winding. This winding is commonly known as a zero crossing detector (ZCD) winding. This winding provides a scaled version of the inductor voltage. Figure 33 shows the ZCD winding arrangement. www.onsemi.com 34 NCP1937 threshold. The watchdog timer is reset at the beginning of a PFC drive pulse. It is disabled during a PFC hard overvoltage and feedback input short circuit condition. Figure 33. ZCD Winding Implementation The ZCD voltage, VZCD, is positive while the PFC Switch is off and current flows through the PFC inductor. VZCD drops to and rings around zero volts once the inductor is demagnetized. The next switching cycle begins once a negative transition is detected on the PCS/PZCD pin. A positive transition (corresponding to the PFC switch turn off) arms the ZCD detector to prevent false triggering. The arming of the ZCD detector, VPZCD(rising), is typically 0.75 V (VPCS/PZCD increasing). The trigger threshold, VPZCD(falling), is typically 0.25 V (VPCS/PZCD decreasing). The PCS/PZCD pin is internally clamped to 5 V with a Zener diode and a 2 kW resistor. A resistor in series with the PCS/PZCD pin is required to limit the current into pin. The Zener diode also prevents the voltage from going below ground. Figure 34 shows typical ZCD waveforms. During startup there are no ZCD transitions to set the PFC PWM Latch and generate a PDRV pulse. A watchdog timer, tPFC(off1), starts the drive pulses in the absence of ZCD transitions. Its duration is typically 200 ms. The timer is also useful if the line voltage transitions from low line to high line and while operating at light load because the amplitude of the ZCD signal may be too small to cross the ZCD arming Figure 34. ZCD Winding Waveforms The watchdog timer duration increases to tPFC(off2), typically 1 ms, when a VPILIM2 fault is detected. PFC Frequency Clamp The PFC operating frequency naturally increases when the line voltage gets near to zero due to the reduced demagnetization time or when the PFC is operating at light loads. A maximum frequency clamp, fclamp(PFC), limits the PFC frequency to improve efficiency and facilitate compliance with EMI requirements. The NCP1937 has options for PFC frequency clamp values of 131 kHz or 250 kHz. The PDRV pulse is blanked until the frequency clamp timer expires. Once expired, the controller waits for the next ZCD transition to initiate PDRV. This ensures valley switching to reduce switching losses. A timeout timer, tP(tout), starts the next PDRV pulse in the absence of a ZCD transition. The timeout timer duration is typically 10 ms. The timer is reset at every ZCD event. Figure 35 shows the block diagram of the PFC frequency clamp. tPFC(off) Timer PDRV PFC Boost Diode PFC Inductor PFC Switch ZCD Comparator To PDRV Set Frequency Clamp Timer + D V − ZCD PDRV Q CLK Q PFC Timeout tPFC(out) Reset RPsense RPCS RPZCD Reset PILIM2 VDD D Q CLK PCS/PZCD R PDRV Q Figure 35. PFC Frequency Clamp Schematic www.onsemi.com 35 ZCD_LAT NCP1937 PFC Enable & Disable The PONOFF pin voltage, VPONOFF, is compared to an internal reference, VPOFF (typically 2 V) to disable the PFC stage. The PFC disable point is typically set between 25 and 50% or between 50 and 75% of the maximum system load. These setpoints provide the best system efficiency across low line and high line. Once VPONOFF decreases below VPOFF, the PFC disable timer, tPdisable, is enabled. The NCP1937 has options for 500 ms, 4 s, or 13 s PFC disable timer. The PFC stage is disabled once the timer expires. The PFC stage is enabled once VPONOFF exceeds VPOFF by VPONHYS for a period longer than the PFC enable filter, tPenable(filter), typically 100 ms. A shorter delay for the PFC enable threshold is used to reduce the bulk capacitor requirements during a step load response. Figure 36 shows the block diagram of the PFC disable circuit. In some applications it is desired to disable the PFC at lighter loads to increase the overall system efficiency. The NCP1937 integrates a novel architecture that allows the user to program the PFC disable threshold based on the percentage of QR output power. The PFC enable circuitry is inactive until the QR flyback soft start period has ended. A voltage to current (V−I) converter generates a current proportional to VQFB. This current is pulse width modulated by the demagnetization time of the flyback controller to generate a current, IPONOFF, proportional to the output power. An external resistor, RPONOFF, between the PONOFF and GND pins generate a voltage proportional to the output power. This resistor is used to scale the output power signal. A capacitor, CPONOFF, in parallel with RPONOFF is required to average the signal on this pin. A good compromise between voltage ripple and speed is achieved by setting the time constant of CPONOFF and RPONOFF to 160Ăms. QFB V to I Converter Demag Time Calculator PFC Disable Timer Enable QZCD QDRV tPdisable Reset IPONOFF PONOFF VPOFF − RCPONOFF + CPONOFF PONOFF Comparator − + Soft−Start Complete Q S Dominant Reset Latch Q R Filter Delay Release PControl Disable PFC PFC Enable Timer tPenable tPenable(filter) Turn on PFC FB Switch Hysteresis Control Figure 36. PFC On/Off Control Circuitry PFC Skip Auto Recovery The PFC stage incorporates skip cycle operation at light loads to reduce input power. Skip operation disables the PFC stage if the PControl voltage decreases below the skip threshold. The skip threshold voltage is typically 25 mV (DVPSKIP) above the PControl lower voltage clamp, Vclamp(lower). The PFC stage is enabled once VPControl increases above the skip threshold by the skip hysteresis, VPSKIP(HYS). PFC skip is disabled during any initial PFC startup and when the PFC is in a UVP. Skip operation will become active after the PFC has reached regulation. The controller is disabled and enters “triple−hiccup” mode if VCC drops below VCC(off). The controller will also enter “triple−hiccup” mode if an overload fault is detected on the non−latching version. A hiccup consists of VCC falling down to VCC(off) and charging up to VCC(on). The controller needs to complete 3 hiccups before restarting. Temperature Shutdown An internal thermal shutdown circuit monitors the junction temperature of the IC. The controller is disabled if the junction temperature exceeds the thermal shutdown threshold, TSHDN, typically 150_C. A continuous VCC hiccup is initiated after a thermal shutdown fault is detected. The controller restarts at the next VCC(on) once the IC temperature drops below below TSHDN by the thermal shutdown hysteresis, TSHDN(HYS), typically 40_C. The thermal shutdown fault is also cleared if VCC drops below VCC(reset), a brown−out fault is detected or if the line voltage is removed. A new power up sequences commences at the next VCC(on) once all the faults are removed. PFC and Flyback Drivers The NCP1937 maximum supply voltage, VCC(MAX), is 30 V. Typical high voltage MOSFETs have a maximum gate voltage rating of 20 V. Both the PFC and flyback drivers incorporate an active voltage clamp to limit the gate voltage on the external MOSFETs. The PFC and flyback voltage clamps, VPDRV(high) and VQDRV(high), are typically 12 V with a maximum limit of 14 V. www.onsemi.com 36 NCP1937 PCB Layout Recommendations therefore necessary to pay particular attention to the current paths and grounding patterns to avoid interactions between the two converters. Before laying out a PCB for the NCP1937 it is recommended to identify and annotate the various grounds as shown in Figure 37. Table 5 below includes a description of the different grounds. The grounds are divided into power grounds, denoted as PGNDx, and analog or signal grounds, denoted as AGNDx. In any power converter, the PCB layout and routing require consideration to minimize noise generation and ensure stable operation. As a combo device, the NCP1937 controls two variable switching frequency converters that operate independently of each other and can therefore switch asynchronously. A turn−on or turn−off event of one converter can occur at any point in the other converter’s switching cycle possibly disrupting its operation. It is Figure 37. Typical Application with Annotated Grounds For the NCP1937 the following routing requirements are recommended for the primary side power grounds: • The current path from PGND3 to PGND4 and the current path from PGND4 to PGND5 are isolated to the greatest extent possible to provide separate paths for the switching currents of the PFC and flyback converter. This will avoid the switching currents and the gate drive currents from the two converters overlapping • Path between PGND6 and PGND1 is key for improved surge performance. It is necessary to use a separate, isolated trace to connect PGND6 back to PGND1. Make this trace as wide as possible. • The connection between PGND4 and PGND5 should be as short as possible with as wide of a trace as possible. Table 5. DESCRIPTION OF ANNOTATED GROUND NODES IN NCP1937 APPLICATION Label Location PGND1 Diode bridge and input bulk ground PGND2 PFC pi filter ground PGND3 PFC current sense resistor ground PGND4 Negative of PFC bulk cap ground PGND5 current sense resistor ground of flyback PGND6 Primary Y−cap and Aux winding ground AGND1 All programming components of NCP1937 AGND2 Ground of VCC bulk capacitor AGND3 PFC ZCD auxiliary winding AGND GND at the IC www.onsemi.com 37 NCP1937 • PGND4 will be the center point of a star connection for • recommendations are not followed, it is possible that the switching events from one converter can interrupt operation of the other converter. One particular sensitivity that may occur is that the PFC switching and gate drive currents can interfere with QR current sense signal resulting in erratic drive pulses. The QR current sense signal is particularly critical for stable operation of the QR and RC filtering decoupled to the appropriate ground should be employed. When assessing noise on the QR current sense signal, QCS, it is important to determine the noise source and take appropriate measures. • Self−generated noise, i.e., noise spikes generated by a QR switching event, should be maintained to a duration < 100 ns for proper QR operation. • Coupled noise spikes generated by a PFC switching event can generally lead to more disruptive behavior and should be maintained to a duration < 20 ns for proper QR operation. • If the noise spikes on the QCS signal do not meet either of the above requirements, or if improper switching behavior of the QR is still observed, then it is recommended to increase the time constant of the RC filter going to the QCS pin. the analog signal grounds. The trace connection between PGND4 and AGND should be as short and wide as possible. The path between PGND1 and PGND2 and PGND3 can be sequential paths, i.e., it is not necessary to isolate these paths. Routing requirements for the primary side analog grounds: • AGND is the NCP1937 IC ground and will be the • • • center point of the analog star configuration. The three other analog grounds should intersect at this point. The trace between AGND and PGND4 (bulk capacitor ground) should be as short and wide as possible. AGND3 which originates from the PFC choke auxiliary winding should have its own isolated trace back to AGND. To the greatest extent possible AGND1 & AGND3 should not overlap except for their intersection point at the AGND star. AGND2 should its own trace back to the AGND star intersection point and try to avoid overlap with the other analog grounds. Star ground connections are well known in the industry and a good practice for optimal layouts. Figure 38 is an example star grounding configuration for the primary grounds In summary: • Layout is a critical consideration for power converter operation. This is especially true with a combination controller operating two power converters asynchronously • Follow the suggested grounding recommendation outlined above. These recommendations are intended to mitigate noise from one converter coupling onto the sensitive control signals of the other converter • An RC filter with a time constant of ≥ 100 ns should be placed close to the QCS pin of the IC, with the capacitor decoupled to AGND1 as shown above • If any erratic drive operation of the QR is observed, it is recommended to increase the time constant of the RC filter. Time constants up to 250 – 300 ns are reasonable Figure 38. Example Star Ground Configuration for NCP1937 The above recommendations are meant to serve as a general guideline for most applications. If the above www.onsemi.com 38 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC20 NB LESS PINS 2, 4 & 19 CASE 751BS−01 ISSUE O DATE 28 APR 2011 SCALE 1:1 0.10 C A-B NOTE 4 D NOTE 5 20 NOTE 4 E1 0.10 C A-B D A 11 L2 ÇÇÇÇ ÇÇÇÇ 1 NOTE 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.10 TOTAL IN EXCESS OF THE b DIMENSION. DIMENSION b APPLIES TO THE FLAT PORTION OF THE LEAD AND SHALL BE MEASURED BETWEEN 0.13 AND 0.25 FROM THE TIP. 4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS BUT DO INCLUDE MOLD MISMATCH. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15mm PER SIDE. DIMENSIONS D AND E1 ARE DETERMINED AT DATUM H. 5. DATUMS A AND B ARE TO BE DETERMINED AT DATUM H. 6. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEAT­ ING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 7. CHAMFER FEATURE IS OPTIONAL. IF NOT PRESENT, THEN A PIN ONE IDENTIFIER MUST BE LOCATED IN THIS AREA. L E SEATING PLANE C M DETAIL A 10 e 17X B b 0.25 0.20 C C A-B D M NOTE 3 NOTE 7 h 0.10 C h DIM A A1 b c D E E1 e h L L2 M H 0.10 C A A1 C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE c GENERIC MARKING DIAGRAM* 17X 0.85 20 XXXXXXXXXXXXG XXXXXXXXXXXXX AWLYWW 11 20 1 6.30 1 XXXXX A WL YY WW G 10 17X 0.53 1.00 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: DETAIL A 98AON56699E MILLIMETERS MIN MAX --1.70 0.00 0.20 0.31 0.51 0.10 0.25 9.90 BSC 6.00 BSC 3.90 BSC 1.00 BSC 0.25 0.50 0.40 0.85 0.25 BSC 0_ 8_ = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. SOIC20 NB LESS PINS 2, 4 & 19 PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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