NCP2824FCT2G

NCP2824FCT2G

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    9-WFBGA,FCBGA

  • 描述:

    Amplifier IC 1-Channel (Mono) Class D 9-FlipChip

  • 数据手册
  • 价格&库存
NCP2824FCT2G 数据手册
NCP2824 Non-Clip and Power Limit Mono Class D Amplifier with AGC Description The NCP2824 is a Filterless Class D amplifier capable of delivering up to 2.4 W to a 4 W load with a 5 V supply voltage. With the same battery voltage, it can deliver 1.2 W to an 8 W load with less than 1% THD+N. The non−clipping function automatically adjusts the output voltage in order to control the distortion when an excessive input is applied to the amplifier. This adjustment is done thanks to an Automatic Gain Control circuitry (AGC) built into the chip. A simple Single wire interface allows to the non Clipping function to be enabled and disabled. It also allows the maximum distortion level in the output to be configured. A programmable power limit function is also embedded in order to protect speakers from damage caused by an excessive sound level. http://onsemi.com 1 9 PIN FLIP−CHIP FC SUFFIX CASE 499AL PIN CONFIGURATION Features Non Clipping Function with Automatic Gain Control Circuitry Programmable Power Limit Function Single Wire Interface. No Need for Additional Components Max THD+N Configurable by Swire Interface Only One Capacitor Required Fully Differential Architecture: Better RF Immunity No Need for Input Capacitors in Fully Differential Configuration High Efficiency: up to 90% Low Quiescent Current: 2.2 mA Typ Large Output Power Capability High PSRR: up to −80 dB Fully Differential Capability: RF Immunity Thermal and Auto Recovery Short−Circuit Protection CMRR (−80 dB) Eliminates Two Input Coupling Capacitors Pb−Free and Halide−Free Device Typical Applications Audio Amplifier for: • Cellular Phones • Digital Cameras • Personal Digital Assistant and Portable Media Player • GPS • The NCP2824GEVB/D evaluation board configures the device in typical application. September, 2010 − Rev. 0 A3 B1 B2 B3 C1 C2 C3 (Top View) A1 = INP A2 = VDD A3 = OUTP B1 = AGND B2 = NC B3 = PGND C1 = INM C2 = CNTL C3 = OUTM MARKING DIAGRAM A3 A1 C1 MRA F Y WW G or G = Specific Device Code = Assembly Location = Year = Work Week = Pb−Free Package ORDERING INFORMATION Demo Board Available: © Semiconductor Components Industries, LLC, 2010 A2 MRAG FYWW • • • • • • • • • • • • • • • A1 1 Device Package Shipping† NCP2824FCT2G WCSP−9 (Pb−Free) 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: NCP2824/D NCP2824 C1 4.7 mF/6.3 V VDD Auto Gain control INN PreAmplificator INP CNTL PWM Modulator Single Wire Interface Auto Gain control GND Figure 1. Simplified Block Diagram http://onsemi.com 2 H BRIDGE OUTN OUTP NCP2824 Table 1. PIN FUNCTION DESCRIPTION Pin Pin Name Type A1 INP Input Positive Input Negative Input C1 INN Input A2 PVDD POWER Description Power Supply: This pin is the power supply of the device. A 4.7 mF ceramic capacitor or larger must bypass this input to the ground. This capacitor should be placed as close a possible to this input. B2 NC − A3 OUTP Output Non−connected: reserved for production. Must be kept floating in the final application Positive output: Special care must be observed at layout level. See the Layout consideration section C3 OUTN Output Negative output: Special care must be observed at layout level. See the Layout consideration section C2 CNTL Input B3 PGND POWER Power Ground: This pin is the power ground and carries the high switching current. A high quality ground must be provided to avoid any noise spikes/uncontrolled operation. Care must be observed to avoid high−density current flow in a limited PCB copper track. B1 AGND POWER Analog Ground: This pin is the analog ground of the device and must be connected to GND plane. Control: This pin is dedicated to the control of the chip via the Single wire protocol Table 2. MAXIMUM RATINGS Rating Symbol Value Unit VDD −0.3 to +6.0 V VINP/N −0.3 to +VDD V VDG IDG −0.3 to VDD + 0.3 1 V mA Human Body Model (HBM) ESD Rating are (Note 3) ESD HBM 2000 V Machine Model (MM) ESD Rating are (Note 3) ESD MM 200 V RqJC 90 TA −40 to +85 °C AVDD, PVDD Pins: Power Supply Voltage (Note 2) INP/N Pins: Input (Note 2) Digital Input/Output: EN Pin: Input Voltage Input Current WCSP 1.5 x 1.5 mm package (Notes 6 and 7) Thermal Resistance Junction to Case °C/W Operating Ambient Temperature Range Operating Junction Temperature Range TJ −40 to +125 °C Maximum Junction Temperature (Note 6) TJMAX +150 °C Storage Temperature Range TSTG −65 to +150 °C Moisture Sensitivity (Note 5) MSL Level 1 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = 25°C. 2. According to JEDEC standard JESD22−A108B. 3. This device series contains ESD protection and passes the following tests: Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114 for all pins. Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115 for all pins. 4. Latch up Current Maximum Rating: ±100 mA per JEDEC standard: JESD78 class II. 5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A. 6. The thermal shutdown set to 150°C (typical) avoids irreversible damage on the device due to power dissipation. 7. The RqCA is dependent on the PCB heat dissipation. The maximum power dissipation (PD) is dependent on the min input voltage, the max output current and external components selected. R qCA + 125 * T A * R qJC PD http://onsemi.com 3 NCP2824 Table 3. ELECTRICAL CHARACTERISTICS (Min & Max Limits apply for TA between −40°C to +85°C and for VDD between 2.5 V to 5.5 V (Unless otherwise noted). Typical values are referenced to TA = +25°C and VDD = 3.6 V. (see Note 8)) Symbol Parameter Conditions Min Typ Max Unit 5.5 V 300 350 kHz GENERAL PERFORMANCES VDD Operational Power Supply 2.5 FOSC Oscillator Frequency 250 Idd Isd Supply current Shutdown current VDD = 3.6 V, No Load VDD = 5.5 V, No Load, TA = 85°C 2.2 VDD = 3.6 V, VCNTL = 0 V VDD = 5.5 V, VCNTL = 0 V, TA = 85°C 0.01 mA 4.2 mA 1 TON Turn ON Time Single Wire Activation 7.4 ms TOFF Turn Off Time Single Wire Deactivation 5 ms Class D Output impedance in shutdown mode VENL = 0 V 20 kW 250 mW VDD = 3.6 V, Po = 800 mW, RL = 8 W, F = 1 kHz 86 % VDD = 3.6 V, Po = 1.3 W, RL = 4 W, F = 1 kHz 79 Zsd RDS(ON) h FLP Static drain−source on−state resistance of power Mosfets Efficiency −3 dB Cut off Frequency of the Built in Low Pass Filter kHz 30 TSD Thermal Shut Down Protection 150 °C TSDH Thermal Shut Down Hysteresis 20 °C AGC SECTION Av Voltage gain Single Wire 4 12 dB Av Voltage gain Single Wire 5 18 dB Aa Max AGC attenuation −15 dB Avn AGC Gain step resolution 0.5 dB TA Attack time 0.033 ms/Step TR Release Time 0.013 s/Step TH Hold Time 0.013 s/Step S−WIRE INTERFACE (see Note 9) VIH Rising Voltage Input Logic High VIL Falling Voltage Input Logics Low 1.2 − 5.5 V 0 − 0.4 V VIHYS Input Voltage Hysteresis 100 mV RPLD Pull Down Resistor 20 kW TR Swire Rising time 200 ns TF Swire Falling time 200 ns TSWH Swire High 5 10 45 ms TSWL Swire Low 5 10 75 ms 8. Performances guaranteed over the indicated operating temperature range by design and/or characterization, production tested at TJ = TA = 25°C. 9. Single Wire performances is guaranteed by design and characterized 10. Audio performances are given for Vdd = 3.6 V, TA = 25°C and characterized http://onsemi.com 4 NCP2824 Table 3. ELECTRICAL CHARACTERISTICS (Min & Max Limits apply for TA between −40°C to +85°C and for VDD between 2.5 V to 5.5 V (Unless otherwise noted). Typical values are referenced to TA = +25°C and VDD = 3.6 V. (see Note 8)) Symbol Parameter Conditions Min Typ Max Unit S−WIRE INTERFACE (see Note 9) FSWF Input S−wire Frequency TEHDT Enable High Delay Time TSDD Time to Shunt Down Delay TWAKE−UP TVALID 100 kHz 0 400 ms 300 400 ms 500 ms 400 ms Time to Wake up from shutdown Time to Valid Data 300 AUDIO PERFORMANCES (see Note 10) Output offset Av = 12 dB 0.3 mV PSRRDC Power supply rejection ratio From VDD = 2.5 V to 5.5 V −80 dB PSRRAC Power supply rejection ratio F = 217 Hz, Input ac grounded, Av = 12 dB −70 dB voo F = 1 kHz, Input ac grounded Av = 12 dB −70 Signal to noise ratio Vp = 5 V, Pout = 600 mW (A. Weighted) Av = 12 dB 96 dB Common mode rejection ratio Input shorted together VIC = 1 Vpp, f = 217 Hz −80 dB Vn Output Voltage noise Input ac grounded, Av = 12 dB 20 Hz < f < 20 kHz A. Weighted 34 mV Po Output Power RL = 8 W F = 1 kHz VDD = 5 V 1.2 W VDD = 3.6 V 0.6 VDD = 2.5 V 0.22 VDD = 5 V 1.5 VDD = 3.6 V 0.8 VDD = 2.5 V 0.4 SNR CMRR THD+N
NCP2824FCT2G 价格&库存

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