NCP4328BSNT1G

NCP4328 Secondary Side CV/CC Controller The NCP4328 is a secondary side SMPS controller designed for use in applications which requires constant current and/or constant current regulation. The NCP4328x consists of two OTA amplifiers for voltage and current loop regulation with precise internal voltage references. Outputs of OTAs are open drain type (OTAs sink current only). The NCP4328B includes a LED driver pin implemented with an open drain MOSFET driven by a 1 kHz square wave with a 12.5% duty cycle working when VCC is above UVLO for indication purpose. The NCP4328A is available in TSOP−5 package while the NCP4328B is available in TSOP−6 package. www.onsemi.com MARKING DIAGRAMS 5 5 1 TSOP−5 SN SUFFIX CASE 483 Features • • • • • • XXXAYWG G 1 Operating Input Voltage Range: 2.5 V to 36.0 V Supply current < 100 mA ±0.5% Reference Voltage Accuracy (TJ = 25°C) Constant Voltage and Constant Current (A versions) Control Loop Indication LED PWM Modulated Driver (NCP4328B) These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Typical Applications • Offline Adapters for Notebooks, Game Stations and Printers • LED Lightening • High Power AC−DC Converters for TVs, Set−Top Boxes, Monitors 1 TSOP−6 SN SUFFIX CASE 318G XXXAYWG G 1 XXX = Specific Device Code A = Assembly Location Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) etc. ORDERING INFORMATION See detailed ordering, marking and shipping information on page 8 of this data sheet. © Semiconductor Components Industries, LLC, 2015 July, 2015 − Rev. 2 1 Publication Order Number: NCP4328/D NCP4328 Sink only VCC VCC management GND ISNS OTA VREFC Current Regulation FBC VSNS OTA Sink only V REF Voltage Regulation NCP4328A VCC Sink only VCC management Power RESET ISNS OTA Current Regulation VREFC GND VREF FBC Sink only Power RESET LED SW VSNS OTA Voltage Regulation VREF 1 kHz, 12% D.C. Oscillator NCP4328B Figure 1. Simplified Block Diagrams NCP4328A and NCP4328B www.onsemi.com 2 NCP4328 PIN FUNCTION DESCRIPTION NCP4328A TSOP−5 NCP4328B TSOP−6 Pin Name 1 1 VCC Supply voltage pin 2 2 GND Ground 5 6 VSNS Output voltage sensing pin, connected to output voltage divider 4 4 ISNS Current sensing input for output current regulation, connect it to shunt resistor in ground branch. − 5 LED PWM LED driver output. Connected to LED cathode with current define by external serial resistance 3 3 FBC Output of current sinking OTA amplifiers driving feedback optocoupler’s LED. Connect here compensation networks as well. Description ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit VCC −0.3 to 40.0 V FBC, LED Voltage VFBC, VLED −0.3 to VCC + 0.3 V VSNS, ISNS Voltage VSNS,VISNS −0.3 to 10.0 V LED Current ILED 10 mA Thermal Resistance − Junction−to−Air (Note 1) RqJA 315 °C/W Junction Temperature TJ −40 to 150 °C Storage Temperature TSTG −55 to 150 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V ESD Capability, Machine Model (Note 2) ESDMM 250 V Input Voltage Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. 50 mm2, 1.0 oz. Copper spreader. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per JESD22−A114F ESD Machine Model tested per JESD22−A115C Latchup Current Maximum Rating tested per JEDEC standard: JESD78D. www.onsemi.com 3 NCP4328 ELECTRICAL CHARACTERISTICS −40°C ≤ TJ ≤ 125°C; VCC = 15 V; unless otherwise noted. Typical values are at TJ = +25°C. Parameter Test Conditions Min VCC rising VCCUVLO VCC falling VCC UVLO Hysteresis VCCUVLOHYS Unit 36.0 V 3.5 3.7 2.3 2.5 2.7 0.8 1.0 ICC NCP4328B Max 3.3 NCP4328A Quiescent Current Typ VCC Maximum Operating Input Voltage VCC UVLO Symbol V V 105 130 115 140 mA VOLTAGE CONTROL LOOP OTA Transconductance Sink current only gmV 2.8 V ≤ VCC ≤ 36.0 V, TJ = 25°C Reference Voltage 2.8 V ≤ VCC ≤ 36.0 V, TJ = 0 − 85°C 2.8 V ≤ VCC ≤ 36.0 V, TJ = −40 − 125°C VREF 1 S 1.244 1.250 1.256 1.240 1.250 1.264 1.230 1.250 1.270 Sink Current Capability VFBC > 1.5 V ISINKV 2.5 Inverting Input Bias Current VSNS = VREF IBIASV −100 V mA 100 nA CURRENT CONTROL LOOP OTA Transconductance Sink current only gmC TJ = 25°C Reference Voltage TJ = −20 – 85°C VREFC TJ = −40 – 125°C 3 S 61.2 62.5 63.8 60.5 62.5 64.5 60.0 62.5 65.0 Sink Current Capability VFBC > 1.5 V ISINKC 2.5 Inverting Input Bias Current ISNS = VREFC IBIASC −100 mV mA 100 nA LED DRIVER (NCP4328B Only) fSWLED Switching Frequency Duty Cycle (Note 3) DLED Switch Resistance ILED = 5 mA RSW 1 10.0 12.5 50 kHz 15.0 % W Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Guaranteed by design. www.onsemi.com 4 NCP4328 TYPICAL CHARACTERISTICS 1.28 1.28 1.27 1.27 VREF (V) 1.29 VREF (V) 1.29 1.26 1.26 1.25 1.25 1.24 1.24 1.23 1.23 1.22 −40 −20 0 20 40 60 TJ (°C) 80 100 1.22 0 120 6 Figure 2. VREF at VCC = 15 V 64.5 64.5 64 64 63.5 63.5 VREFC (mV) 65 VREFC (mV) 18 VCC (V) 24 30 36 30 36 Figure 3. VREF at TJ = 255C 65 63 62.5 63 62.5 62 62 61.5 61.5 61 61 60.5 60.5 −20 0 20 40 60 TJ (°C) 80 100 60 0 120 6 Figure 4. VREFC at VCC = 15 V 12 3.6 VCCUVLO_R 3.4 3.2 3.0 2.8 2.6 2.4 −40 VCCUVLO_F −20 18 VCC (V) 24 Figure 5. VREFC at TJ = 255C 3.8 VCC (V) 60 −40 12 0 20 40 60 TJ (°C) Figure 6. VCCUVLO www.onsemi.com 5 80 100 120 NCP4328 130 130 120 120 110 110 ICC (mA) ICC (mA) TYPICAL CHARACTERISTICS 100 100 80 80 80 80 70 −40 −20 0 20 40 60 TJ (°C) 80 100 70 0 120 6 150 150 140 140 130 130 120 110 100 100 0 20 40 60 80 100 90 0 120 6 12 18 24 30 VCC (V) Figure 9. ICC at VCC = 15 V for NCP4328B Figure 10. ICC at TJ = 255C for NCP4328B 3.5 3.5 3.4 3.4 3.3 3.3 3.2 3.2 3.1 3.0 2.9 2.9 2.7 2.7 2.6 2.6 0 20 40 60 80 100 2.5 −40 120 36 3.0 2.8 −20 36 3.1 2.8 2.5 −40 30 TJ (°C) ISINKC (mA) ISINKV (mA) −20 24 120 110 90 −40 18 VCC (V) Figure 8. ICC at TJ = 255C for NCP4328A ICC (mA) ICC (mA) Figure 7. ICC at VCC = 15 V for NCP4328A 12 −20 0 20 40 60 80 100 120 TJ (°C) TJ (°C) Figure 11. Voltage OTA Current Sink Capability Figure 12. Current OTA Current Sink Capability www.onsemi.com 6 NCP4328 1.40 100 1.30 90 80 1.20 RSW2 (W) fSWLED (kHz) TYPICAL CHARACTERISTICS 1.10 70 60 1.00 50 0.90 0.80 −40 40 −20 0 20 40 60 80 100 30 −40 120 −20 0 20 40 60 80 TJ (°C) TJ (°C) Figure 13. LED Switching Frequency at VCC = 15 V Figure 14. RSW at VCC = 15 V 100 120 APPLICATION INFORMATION Typical application circuit for NCP4328A is shown in Figures 15 and 16 shows typical application circuit for NCP4328B that includes internal LED driver for indication purpose. V OUT + V REF R3 ) R4 R4 (eq. 1) Current Regulation The output current is sensed by the shunt resistor R5 in series with the load. Voltage drop on R5 is compared with internal precise voltage reference VREFC at ISNS transconductance amplifier input. Voltage difference is amplified by gmC to output current of amplifier, connected to FBC pin. Compensation network is connected between this pin and ISNS input to provide frequency compensation for current regulation path. Resistor R6 separates compensation network from sense resistor. Compensation network works into low impedance without this resistor that significantly decreases compensation network impact. Current regulation point is set to current given by Equation 2. Power Supply The NCP4328 is designed to operate from a single supply up to 36 V. It starts to operate when VCC voltage reaches 3.5 V and stops when VCC voltage drops below 2.5 V. VCC can be supplied by direct connection to the VOUT voltage of the power supply. It is highly recommended to add a RC filter (R1 and C2) in series from VOUT to VCC pin to reduce voltage spikes and drops that are produced at the converter’s output capacitors. Recommended values for this filter are 220 W and 1 mF. Voltage Regulation Path The output voltage is detected on the VSNS pin by the R3 and R4 voltage divider. This voltage is compared with the internal precise voltage reference. The voltage difference is amplified by gmV of the transconductance amplifier. The amplifier output current is connected to the FBC pin. The compensation network is also connected to this pin to provide frequency compensation for the voltage regulation path. This FBC pin drives regulation optocoupler that provides regulation of primary side. The optocoupler is supplied via direct connection to VOUT line through resistor R2. Regulation information is transferred through the optocoupler to the primary side controller where its FB pin is usually pulled down to reduce energy transferred to secondary output. The output voltage can be computed by Equation 1. I OUTLIM + V REFC (eq. 2) R5 LED Driver (NCP4328B only) LED driver is active when VCC is higher than VCCMIN. LED driver consists of an internal power switch controlled by a PWM modulated logic signal and an external current limiting resistor R9. LED current can be computed by Equation 3 I LED + V OUT * V F_LED (eq. 3) R9 PWM modulation is used to increase efficiency of LED. www.onsemi.com 7 NCP4328 D1 VOUT R1 C1 R6 ISNS OTA VCC GND C2 Feedback opto C4 C3 R8 R7 Sink only VCC management Current VREFC Regulation R3 R5 VSNS FBC OTA Sink only R2 Voltage Regulation R4 VREF Figure 15. Typical Application Schematic for NCP4328A D1 C1 VOUT R1 R6 ISNS VCC C2 VCC C4 C3 Power RESET management GND Sink only OTA Current V REFC Regulation R3 Feedback opto R8 FBC Power RESET T R2 Sink only R9 OTA Voltage Regulation LED Indication LED R5 V REF R7 VSNS V REF R4 1 kHz, 12% D.C. Oscillator SW Figure 16. Typical Application Schematic for NCP4328B ORDERING INFORMATION Device Marking LED Driver Package Shipping† NCP4328ASNT1G A32 No TSOP−5 (Pb−Free) 3000 / Tape & Reel NCP4328BSNT1G U32 Yes TSOP−6 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 8 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSOP−6 CASE 318G−02 ISSUE V 1 SCALE 2:1 D H ÉÉ ÉÉ 6 E1 1 NOTE 5 5 2 L2 4 GAUGE PLANE E 3 L b SEATING PLANE C DETAIL Z e DIM A A1 b c D E E1 e L L2 M c A 0.05 M DATE 12 JUN 2012 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D AND E1 ARE DETERMINED AT DATUM H. 5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE. A1 DETAIL Z MIN 0.90 0.01 0.25 0.10 2.90 2.50 1.30 0.85 0.20 0° MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.38 0.50 0.18 0.26 3.00 3.10 2.75 3.00 1.50 1.70 0.95 1.05 0.40 0.60 0.25 BSC 10° − STYLE 1: PIN 1. DRAIN 2. DRAIN 3. GATE 4. SOURCE 5. DRAIN 6. DRAIN STYLE 2: PIN 1. EMITTER 2 2. BASE 1 3. COLLECTOR 1 4. EMITTER 1 5. BASE 2 6. COLLECTOR 2 STYLE 3: PIN 1. ENABLE 2. N/C 3. R BOOST 4. Vz 5. V in 6. V out STYLE 4: PIN 1. N/C 2. V in 3. NOT USED 4. GROUND 5. ENABLE 6. LOAD STYLE 5: PIN 1. EMITTER 2 2. BASE 2 3. COLLECTOR 1 4. EMITTER 1 5. BASE 1 6. COLLECTOR 2 STYLE 6: PIN 1. COLLECTOR 2. COLLECTOR 3. BASE 4. EMITTER 5. COLLECTOR 6. COLLECTOR STYLE 7: PIN 1. COLLECTOR 2. COLLECTOR 3. BASE 4. N/C 5. COLLECTOR 6. EMITTER STYLE 8: PIN 1. Vbus 2. D(in) 3. D(in)+ 4. D(out)+ 5. D(out) 6. GND STYLE 9: PIN 1. LOW VOLTAGE GATE 2. DRAIN 3. SOURCE 4. DRAIN 5. DRAIN 6. HIGH VOLTAGE GATE STYLE 10: PIN 1. D(OUT)+ 2. GND 3. D(OUT)− 4. D(IN)− 5. VBUS 6. D(IN)+ STYLE 11: PIN 1. SOURCE 1 2. DRAIN 2 3. DRAIN 2 4. SOURCE 2 5. GATE 1 6. DRAIN 1/GATE 2 STYLE 12: PIN 1. I/O 2. GROUND 3. I/O 4. I/O 5. VCC 6. I/O STYLE 13: PIN 1. GATE 1 2. SOURCE 2 3. GATE 2 4. DRAIN 2 5. SOURCE 1 6. DRAIN 1 STYLE 14: PIN 1. ANODE 2. SOURCE 3. GATE 4. CATHODE/DRAIN 5. CATHODE/DRAIN 6. CATHODE/DRAIN STYLE 15: PIN 1. ANODE 2. SOURCE 3. GATE 4. DRAIN 5. N/C 6. CATHODE STYLE 16: PIN 1. ANODE/CATHODE 2. BASE 3. EMITTER 4. COLLECTOR 5. ANODE 6. CATHODE STYLE 17: PIN 1. EMITTER 2. BASE 3. ANODE/CATHODE 4. ANODE 5. CATHODE 6. COLLECTOR GENERIC MARKING DIAGRAM* RECOMMENDED SOLDERING FOOTPRINT* 6X 0.60 XXXAYWG G 1 6X 3.20 XXX A Y W G 0.95 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98ASB14888C TSOP−6 1 IC 0.95 XXX MG G = Specific Device Code =Assembly Location = Year = Work Week = Pb−Free Package STANDARD XXX = Specific Device Code M = Date Code G = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSOP−5 CASE 483 ISSUE N 5 1 SCALE 2:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION A. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. D 5X NOTE 5 2X DATE 12 AUG 2020 0.20 C A B 0.10 T M 2X 0.20 T 5 B 1 4 2 B S 3 K DETAIL Z G A A TOP VIEW DIM A B C D G H J K M S DETAIL Z J C 0.05 H C SIDE VIEW SEATING PLANE END VIEW GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT* 0.95 0.037 MILLIMETERS MIN MAX 2.85 3.15 1.35 1.65 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 0_ 10 _ 2.50 3.00 1.9 0.074 5 5 XXXAYWG G 1 1 Analog 2.4 0.094 XXX = Specific Device Code A = Assembly Location Y = Year W = Work Week G = Pb−Free Package 1.0 0.039 XXX MG G Discrete/Logic XXX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) 0.7 0.028 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98ARB18753C TSOP−5 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. 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