NCP4588DSQ15T1G

ON Semiconductor Is Now To learn more about onsemi™, please visit our website at www.onsemi.com onsemi and       and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. 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All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. NCP4588 200 mA, Output Capacitor Free, LDO Linear Voltage Regulator The NCP4588 is a CMOS 200mA LDO which is stable without an output capacitor. This results in a reduction in component count, cost and board area, as well as contributing to a more robust solution in hostile environments. With quiescent current < 9.5 mA and PSRR > 60 dB, the device is an excellent trade off between the two features. The family is available in a variety of packages: SC−70, SOT23 and a small, ultra thin 1.2 x 1.2 x 0.4 mm XDFN. Features • • • • • • • • • • • • Operating Input Voltage Range: 1.4 V to 5.25 V Output Voltage Range: 1.0 to 4.2 V (available in 0.1 V steps) Output Voltage Accuracy: 1% Quiescent Current: 9.5 mA Standby Current: 0.1 mA Very Low Dropout: 270 mV (IOUT = 200 mA, VIN = 3.0 V) High PSRR: 70 dB at 1 kHz, VOUT ≤ 1.2 V 65 dB at 1 kHz, 1.2 < VOUT < 2.2 V 60 dB at 1 kHz, VOUT ≥ 2.2 V Line Regulation 0.02%/V Typ. Current Fold Back Protection: 50 mA at short Stable with no Output Capacitor Available in SC−70, XDFN and SOT23 Package These are Pb−Free Devices Typical Applications • Battery Powered Equipments • Portable Communication Equipments • Cameras, VCRs and Camcorders VIN C1 100 n VOUT VOUT GND SC−70 CASE 419A XDFN6 CASE 711AA XXX MG G XX MM XX M SOT−23−5 CASE 1212 XX, XXX= Specific Device Code M, MM = Date Code A = Assembly Location Y = Year W = Work Week G = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 14 of this data sheet. C2 100n* CE MARKING DIAGRAMS (Note: Microdot may be in either location) NCP4588x VIN http://onsemi.com * output capacitor may be omitted Figure 1. Typical Application Schematic © Semiconductor Components Industries, LLC, 2013 February, 2013 − Rev. 1 1 Publication Order Number: NCP4588/D NCP4588 VIN VIN VOUT Vref Vref Current Limit CE VOUT Current Limit CE GND GND NCP4588Dxxxxxxx NCP4588Hxxxxxxx Figure 2. Simplified Schematic Block Diagram PIN FUNCTION DESCRIPTION Pin No. XDFN Pin No. SC−70 Pin No. SOT23 4 5 1 VIN Input pin 2 3 2 GND Ground 3 1 3 CE 6 4 5 VOUT 1, 5 2 4 NC Pin Name Description Chip enable pin (Active “H”) Output pin No connection ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit VIN 6.0 V Output Voltage VOUT −0.3 to VIN + 0.3 V Chip Enable Input VCE −0.3 to 6.0 V Output Current IOUT 400 mA PD 400 mW Input Voltage (Note 1) Power Dissipation XDFN Power Dissipation SC70 380 Power Dissipation SOT23 420 Junction Temperature TJ −40 to 150 °C Storage Temperature TSTG −55 to 125 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V ESD Capability, Machine Model (Note 2) ESDMM 200 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) Latchup Current Maximum Rating tested per JEDEC standard: JESD78. http://onsemi.com 2 NCP4588 THERMAL CHARACTERISTICS Symbol Value Unit Thermal Characteristics, XDFN Thermal Resistance, Junction−to−Air Rating RqJA 250 °C/W Thermal Characteristics, SOT23 Thermal Resistance, Junction−to−Air RqJA 238 °C/W Thermal Characteristics, SC−70 Thermal Resistance, Junction−to−Air RqJA 263 °C/W ELECTRICAL CHARACTERISTICS −40°C ≤ TA ≤ 85°C; VIN = VOUT(NOM) + 1 V; IOUT = 1 mA; CIN = COUT = 1 mF; unless otherwise noted. Typical values are at TA = +25°C. Parameter Test Conditions Symbol Min Max Unit VIN 1.4 5.25 V VOUT x0.99 x1.01 V VOUT ≤ 2.0 V −20 20 mV VOUT > 2.0 V x0.980 x1.015 V VOUT ≤ 2.0 V −40 30 mV Operating Input Voltage Output Voltage TA = +25 °C VOUT > 2.0 V −40°C ≤ TA ≤ 85°C Output Voltage Temp. Coefficient Line Regulation Load Regulation Dropout Voltage −40°C ≤ TA ≤ 85°C 100 LineReg IOUT = 1 mA to 200 mA LineReg VDO 1.1 V ≤ VOUT < 1.5 V 0.59 0.84 1.2 V ≤ VOUT < 1.8 V 0.55 0.76 1.5 V ≤ VOUT < 2.3 V 0.44 0.60 2.0 V ≤ VOUT < 3.0 V 0.35 0.49 2.6 V ≤ VOUT < 4.0 V 0.27 0.36 IOUT = 200 mA 1.0 V ≤ VOUT < 1.3 V IOUT VOUT = 0 V Quiescent Current 50 mV 0.92 V 200 mA 9.5 25 mA 0.1 3.0 mA CE Pin Threshold Voltage CE Input Voltage “H” VCEH CE Input Voltage “L” VCEL VIN = VOUT + 1 V or 2.2 V whichever is higher, DVIN = 0.2 Vpk−pk, IOUT = 30 mA, f = 1 kHz PSRR Low Output Nch Tr. On Resistance 25 0.64 IQ ISTB Output Noise Voltage %/V 50 VCE = 0 V, TA = 25°C Power Supply Rejection Ratio 0.2 ISC Standby Current CE Pull Down Current 0.02 ppm/°C VOUT(NOM) + 0.5 V ≤ VIN ≤ 5.0 V Output Current Short Current Limit Typ ICEPD mA V 1.0 0.4 0.1 mA dB VOUT ≤ 1.2 V 70 1.2 V < VOUT ≤ 2.2 V 65 2.2 V ≤ VOUT 60 VOUT = 1 V, IOUT = 30 mA, f = 10 Hz to 100 kHz VN 80 mVrms VIN = 4 V, VCE = 0 V, D version only RLOW 30 W http://onsemi.com 3 NCP4588 TYPICAL CHARACTERISTICS 1.2 1.6 1.4 1.0 1.8 V 2.0 V VIN = 1.4 V 0.6 0.4 3.5 V VIN = 3.0 V 1.2 VOUT (V) VOUT (V) 0.8 3.0 V 4.5 V 1.0 0.8 0.6 0.4 0.2 0.0 0.2 0 100 200 300 IOUT (mA) 400 0.0 500 0 100 Figure 3. Output Voltage vs. Output Current 1.0 V Version (TA = 255C) 500 1.2 2.5 1.0 4.5 V 3.5 V 2.0 0.8 VIN = 3.0 V VDO (V) VOUT (V) 400 Figure 4. Output Voltage vs. Output Current 1.5 V Version (TA = 255C) 3.0 1.5 0.4 0.5 0.2 0 100 200 300 IOUT (mA) 400 0.0 500 25°C 85°C 0.6 1.0 0.0 200 300 IOUT (mA) −40°C 0 Figure 5. Output Voltage vs. Output Current 2.5 V Version (TA = 255C) 50 100 150 IOUT (mA) 200 250 300 Figure 6. Dropout Voltage vs. Output Current 1.0 V Version 0.6 0.8 0.7 0.5 0.4 25°C 0.5 0.4 VDO (V) VDO (V) 0.6 85°C 0.3 −40°C 25°C 0.3 85°C 0.2 −40°C 0.2 0.1 0.1 0.0 0 50 100 150 200 250 0.0 0 300 50 100 150 200 250 IOUT (mA) IOUT (mA) Figure 7. Dropout Voltage vs. Output Current 1.5 V Version Figure 8. Dropout Voltage vs. Output Current 2.5 V Version http://onsemi.com 4 300 NCP4588 TYPICAL CHARACTERISTICS 1.55 VIN = 2.0 V 1.03 1.53 1.01 1.51 VOUT (V) VOUT (V) 1.05 0.99 0.97 VIN = 2.5 V 1.49 1.47 0.95 −40 −20 0 20 40 60 TJ, JUNCTION TEMPERATURE (°C) 1.45 −40 80 Figure 9. Output Voltage vs. Temperature, 1.0 V Version 2.55 12 10 2.53 2.52 8 2.51 IGND (mA) VOUT (V) 80 Figure 10. Output Voltage vs. Temperature, 1.5 V Version VIN = 3.5 V 2.54 −20 0 20 40 60 TJ, JUNCTION TEMPERATURE (°C) 2.5 2.49 6 4 2.48 2.47 2 2.46 2.45 −40 −20 0 20 40 60 TJ, JUNCTION TEMPERATURE (°C) 0 80 0 1 2 3 VIN (V) 4 5 6 Figure 12. Supply Current vs. Input Voltage, 1.0 V Version Figure 11. Output Voltage vs. Temperature, 2.5 V Version 16 12 14 10 12 IGND (mA) IGND (mA) 8 6 4 10 8 6 4 2 0 2 0 1 2 3 VIN (V) 4 5 0 6 0 Figure 13. Supply Current vs. Input Voltage, 1.5 V Version 1 2 3 VIN (V) 4 5 Figure 14. Supply Current vs. Input Voltage, 2.5 V Version http://onsemi.com 5 6 NCP4588 12 12 10 10 8 8 IGND (mA) IGND (mA) TYPICAL CHARACTERISTICS 6 4 4 2 2 0 −40 −20 0 20 40 60 0 −40 80 −20 0 20 40 60 80 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 15. Supply Current vs. Temperature, 1.0 V Version Figure 16. Supply Current vs. Temperature, 1.5 V Version 12 100 90 10 80 70 PSRR (dB) 8 IGND (mA) 6 6 4 30 mA 60 10 mA 50 IOUT = 1 mA 40 30 20 2 10 0 −40 −20 0 20 40 60 0 0.01 80 1 10 100 1000 TJ, JUNCTION TEMPERATURE (°C) FREQUENCY (kHz) Figure 17. Supply Current vs. Temperature, 2.5 V Version Figure 18. PSRR, 1.0 V Version, COUT = 100 nF 100 100 90 90 80 80 70 70 30 mA 60 50 10 mA 40 IOUT = 1 mA PSRR (dB) PSRR (dB) 0.1 60 50 30 mA 40 10 mA 30 30 IOUT = 1 mA 20 20 10 10 0 0.01 0.1 1 10 FREQUENCY (kHz) 100 0 1000 0.01 Figure 19. PSRR, 1.5 V Version, COUT = 100 nF 0.1 1 10 FREQUENCY (kHz) 100 1000 Figure 20. PSRR, 2.5 V Version, COUT = 100 nF http://onsemi.com 6 NCP4588 TYPICAL CHARACTERISTICS 100 100 90 90 80 80 70 10 mA IOUT = 1 mA 60 PSRR (dB) PSRR (dB) 70 30 mA 50 40 40 30 20 20 10 10 0.1 1 10 100 IOUT = 1 mA 50 30 0 0.01 30 mA 60 10 mA 0 0.01 1000 0.1 1 10 100 1000 FREQUENCY (kHz) FREQUENCY (kHz) Figure 21. PSRR, 1.0 V Version, COUT = 0 mF Figure 22. PSRR, 1.5 V Version, COUT = 0 mF 100 IOUT = 1 mA 90 80 PSRR (dB) 70 30 mA 60 50 10 mA 40 30 20 10 0 0.01 0.1 1 10 100 1000 FREQUENCY (kHz) Figure 23. PSRR, 2.5 V Version, COUT = 0 mF 4.0 12 3.5 10 VN (mVrms/√Hz) VN (mVrms/√Hz) 3.0 2.5 2.0 1.5 8 6 4 1.0 2 0.5 0 0.01 0.1 1 10 FREQUENCY (kHz) 100 0 0.01 1000 Figure 24. Output Voltage Noise, 1.0 V Version 0.1 1 10 FREQUENCY (kHz) 100 1000 Figure 25. Output Voltage Noise, 1.5 V Version http://onsemi.com 7 NCP4588 TYPICAL CHARACTERISTICS 4 9 3 8 2 7 VOUT (V) 5 4 1.03 1.02 1.01 3 1.00 2 0.99 1 0.98 0 0.01 0.1 1 10 100 1000 0 0.97 0 20 40 60 80 100 120 140 160 180 200 FREQUENCY (kHz) t (ms) Figure 26. Output Voltage Noise, 2.5 V Version Figure 27. Line Transients, 1.0 V Version, tR = tF = 5 ms, IOUT = 30 mA, COUT = 0 nF 4 3 1.04 1 1.03 0 1.02 1.01 VIN (V) VOUT (V) 2 1.00 0.99 0.98 0.97 0 20 40 60 80 100 120 140 160 180 200 t (ms) Figure 28. Line Transients, 1.0 V Version, tR = tF = 5 ms, IOUT = 30 mA, COUT = 100 nF 5 4 3 1 1.52 0 1.51 1.50 1.49 1.48 1.47 0 20 40 60 80 100 120 140 160 180 200 t (ms) Figure 29. Line Transients, 1.5 V Version, tR = tF = 5 ms, IOUT = 30 mA, COUT = 0 nF http://onsemi.com 8 VIN (V) 2 1.53 VIN (V) 1 6 VOUT (V) VN (mVrms/√Hz) 10 NCP4588 TYPICAL CHARACTERISTICS 5 4 3 1 1.52 0 VOUT (V) 1.53 1.51 VIN (V) 2 1.50 1.49 1.48 1.47 0 20 40 60 80 100 120 140 160 180 200 t (ms) Figure 30. Line Transients, 2.5 V Version, tR = tF = 5 ms, IOUT = 30 mA, COUT = 100 nF 6 5 4 2 2.53 1 VOUT (V) 2.54 2.52 VIN (V) 3 2.51 2.50 2.49 2.48 0 20 40 60 80 100 120 140 160 180 200 t (ms) Figure 31. Line Transients, 2.5 V Version, tR = tF = 5 ms, IOUT = 30 mA, COUT = 0 nF 6 5 4 2 2.53 1 VOUT (V) 2.54 2.52 2.51 2.50 2.49 2.48 0 20 40 60 80 100 120 140 160 180 200 t (ms) Figure 32. Line Transients, 2.5 V Version, tR = tF = 5 ms, IOUT = 30 mA, COUT = 100 nF http://onsemi.com 9 VIN (V) 3 NCP4588 TYPICAL CHARACTERISTICS 200 150 100 0 1.10 1.05 IOUT (mA) VOUT (V) 50 1.00 0.95 0.90 0.85 0 20 40 60 80 100 120 140 160 180 200 t (ms) Figure 33. Load Transients, 1.0 V Version, tR = tF = 0.5 ms, VIN = 2.0 V 200 150 100 0 1.60 1.55 IOUT (mA) VOUT (V) 50 1.50 1.45 1.40 1.35 0 20 40 60 80 100 120 140 160 180 200 t (ms) Figure 34 - Load Transients, 1.5 V Version, tR = tF = 0.5 ms, VIN = 1.5 V 200 150 100 0 2.60 2.55 2.50 2.45 2.40 2.35 0 20 40 60 80 100 120 140 160 180 200 t (ms) Figure 35. Load Transients, 2.5 V Version, tR = tF = 0.5 ms, VIN = 3.5 V http://onsemi.com 10 IOUT (mA) VOUT (V) 50 NCP4588 TYPICAL CHARACTERISTICS 200 150 100 0 1.90 1.60 IOUT (mA) VOUT (V) 50 1.30 1.00 0.70 0.40 0 50 100 150 200 250 300 350 400 450 500 t (ms) Figure 36. Load Transients, 1.0 V Version, tR = tF = 0.5 ms, VIN = 2.0 V 200 150 100 0 2.40 2.10 IOUT (mA) VOUT (V) 50 1.80 1.50 1.20 0.90 0 50 100 150 200 250 300 350 400 450 500 t (ms) Figure 37. Load Transients, 1.5 V Version, tR = tF = 0.5 ms, VIN = 2.5 V 200 150 100 0 3.40 3.10 2.80 2.50 2.20 1.90 0 50 100 150 200 250 300 350 400 450 500 t (ms) Figure 38. Load Transients, 2.5 V Version, tR = tF = 0.5 ms, VIN = 3.5 V http://onsemi.com 11 IOUT (mA) VOUT (V) 50 NCP4588 TYPICAL CHARACTERISTICS 4 Chip Enable 3 2 0 2.0 1.5 1.0 IOUT = 1 mA 0.5 IOUT = 200 mA 0.0 −0.5 VCE (V) VOUT (V) 1 0 20 40 60 80 100 120 140 160 180 200 t (ms) Figure 39. Start−up, 1.0 V Version, VIN = 2.0 V 5 4 Chip Enable 3 1 2.0 0 1.0 1.0 IOUT = 1 mA 0.5 VCE (V) VOUT (V) 2 IOUT = 200 mA 0.0 −0.5 0 20 40 60 80 100 120 140 160 180 200 t (ms) Figure 40. Start−up, 1.5 V Version, VIN = 2.5 V 5 Chip Enable 4 3 1 4 0 3 2 IOUT = 1 mA 1 IOUT = 200 mA 0 −1 0 20 40 60 80 100 120 140 160 180 200 t (ms) Figure 41. Start−up, 2.5 V Version, VIN = 3.5 V http://onsemi.com 12 VCE (V) VOUT (V) 2 NCP4588 TYPICAL CHARACTERISTICS 4 3 2 VOUT (V) 0 2.0 IOUT = 200 mA 1.5 1.0 IOUT = 30 mA 0.5 IOUT = 1 mA VCE (V) 1 Chip Enable 0.0 −0.5 0 5 10 15 20 25 30 t (ms) 35 40 45 50 Figure 42. Shutdown, 1.0 V Version D, VIN = 2.0 V 5 4 3 1 Chip Enable 2.0 IOUT = 200 mA 1.5 VCE (V) VOUT (V) 2 IOUT = 30 mA 1.0 IOUT = 1 mA 0.5 0.0 −0.5 0 5 10 15 20 25 30 t (ms) 35 40 45 50 Figure 43. Shutdown, 1.5 V Version D, VIN = 2.5 V 5 4 3 1 Chip Enable 4 IOUT = 200 mA IOUT = 30 mA 3 2 1 IOUT = 1 mA 0 −1 0 5 10 15 20 25 30 35 40 45 t (ms) Figure 44. Shutdown, 2.5 V Version D, VIN = 3.5 V http://onsemi.com 13 50 VCE (V) VOUT (V) 2 NCP4588 APPLICATION INFORMATION A typical application circuit for NCP4588 series is shown in Figure 45. NCP4588x VIN VIN C1 100 n voltage is above logic high level. The enable pin has internal pull down current source. If enable function is not needed connect CE pin to VIN. VOUT Output Discharger VOUT The D version includes a transistor between VOUT and GND that is used for faster discharging of the output capacitor. This function is activated when the IC goes into disable mode. C2 100n* CE GND * output capacitor may be omitted Thermal A 100 nF ceramic input decoupling capacitor should be connected as close as possible to the input and ground pin of the NCP4588. Higher values and lower ESR improves line transient response. As power across the IC increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and also the ambient temperature affect the rate of temperature rise for the part. That is to say, when the device has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. Output Decoupling Capacitor (C2) PCB layout Figure 45. Typical Application Schematic Input Decoupling Capacitor (C1) The output capacitor may be not used even if the load current is varied, but if load variation is very large it is better to use an output capacitor in the range of 0.1 mF to 10 mF. It is recommended to use ceramic capacitor; tantalum capacitor with higher ESR may cause unstable output. Make VIN and GND line sufficient. If their impedance is high, noise pickup or unstable operation may result. Connect capacitors C1 and C2 (if it is used) as close as possible to the IC, and make wiring as short as possible. Enable Operation The enable pin CE may be used for turning the regulator on and off. The regulator is switched on when the CE pin ORDERING INFORMATION Nominal Output Voltage Description Marking Package Shipping† NCP4588DSQ10T1G 1.0 V Auto discharge P010 SC−70 (Pb−Free) 3000 / Tape & Reel NCP4588DSQ15T1G 1.5 V Auto discharge P015 SC−70 (Pb−Free) 3000 / Tape & Reel NCP4588DSQ25T1G 2.5 V Auto discharge P025 SC−70 (Pb−Free) 3000 / Tape & Reel NCP4588DMX10TCG 1.0 V Auto discharge LA XDFN (Pb−Free) 5000 / Tape & Reel NCP4588DMX15TCG 1.5 V Auto discharge LF XDFN (Pb−Free) 5000 / Tape & Reel NCP4588DMX25TCG 2.5 V Auto discharge LR XDFN (Pb−Free) 5000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. NOTE: To order other package and voltage variants, please contact your ON Semiconductor sales representative. http://onsemi.com 14 NCP4588 PACKAGE DIMENSIONS SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE L A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) B M M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 J C K H SOLDER FOOTPRINT 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 http://onsemi.com 15 SCALE 20:1 mm Ǔ ǒinches MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NCP4588 PACKAGE DIMENSIONS XDFN6 1.2x1.2, 0.4P CASE 711AA ISSUE O PIN ONE REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25mm FROM TERMINAL TIPS. 4. COPLANARITY APPLIES TO ALL OF THE TERMINALS. A B D ÍÍÍ ÍÍÍ ÍÍÍ E DIM A A1 b C D E e L 0.05 C 2X 2X 0.05 C TOP VIEW A 0.05 C 0.05 C A1 SIDE VIEW NOTE 4 C MILLIMETERS MIN MAX --0.40 0.00 0.05 0.13 0.23 0.20 0.30 1.20 BSC 1.20 BSC 0.40 BSC 0.37 0.48 RECOMMENDED MOUNTING FOOTPRINT* SEATING PLANE 6X 6X 0.22 0.66 PACKAGE OUTLINE e 1 3 1.50 C 6X L 0.40 PITCH 6 4 DIMENSIONS: MILLIMETERS 6X 0.05 BOTTOM VIEW *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. b M C A B NOTE 3 http://onsemi.com 16 NCP4588 PACKAGE DIMENSIONS SOT−23 5−LEAD CASE 1212 ISSUE A A 5 E 1 L1 A1 4 2 DIM A A1 A2 b c D E E1 e L L1 L 3 5X e A2 0.05 S B D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSIONS: MILLIMETERS. 3. DATUM C IS THE SEATING PLANE. A E1 b 0.10 C M C B S A S C MILLIMETERS MIN MAX --1.45 0.00 0.10 1.00 1.30 0.30 0.50 0.10 0.25 2.70 3.10 2.50 3.10 1.50 1.80 0.95 BSC 0.20 --0.45 0.75 RECOMMENDED SOLDERING FOOTPRINT* 3.30 5X 0.85 5X 0.95 PITCH 0.56 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 17 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NCP4588/D