NCP4640H120T1G

NCP4640 50 mA, Wide Input Range, Voltage Regulator The NCP4640 is a CMOS 50 mA linear voltage regulator with high input voltage and ultra−low supply current. It incorporates multiple protection features such as peak current limit, short circuit current limit and thermal shutdown to ensure a very robust device. A high maximum input voltage tolerance of 50 V and a wide temperature range make the NCP4640 suitable for a variety of demanding applications. http://onsemi.com MARKING DIAGRAMS Features • • • • • • • • • • Operating Input Voltage Range: 4 V to 36 V Output Voltage Range: 2.0 to 12.0 V (0.1 steps) ±2% Output Voltage Accuracy Output Current: min 50 mA (VIN = 8 V, VOUT = 5 V) Line Regulation: 0.05%/V Peak Current Limit Circuit Short Current Limit Circuit Thermal Shutdown Circuit Available in SOT−89−5 and SOIC6−TL Package These are Pb−Free Devices SOIC6−TL CASE 751BR XXX XMM SOT−89 5 CASE 528AB • Power source for home appliances • Power source for car audio equipment, navigation system • Power source for notebooks, digital TVs, cordless phones and private LAN systems • Power source for office equipment machines such as copiers, printers, facsimiles, scanners, projectors, etc. NCP4640x VIN C1 100n CE VOUT GND 1 1 Typical Applications VIN XXX XMM XXXX MM = Specific Device Code = Date Code (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 15 of this data sheet. VOUT C2 100n Figure 1. Typical Application Schematic © Semiconductor Components Industries, LLC, 2011 February, 2011 − Rev. 1 1 Publication Order Number: NCP4640/D NCP4640 VIN VOUT Internal VR Vref Current Limit Short Protection Thermal Shutdown CE GND Figure 2. Simplified Schematic Block Diagram PIN FUNCTION DESCRIPTION Pin No. SOT89 Pin No. SOIC6−TL Pin Name 5 6 VIN Input pin 2 2 GND Ground pin, all ground pins must be connected together when it is mounted on board 4 4 GND Ground pin, all ground pins must be connected together when it is mounted on board − 5 GND Ground pin, all ground pins must be connected together when it is mounted on board 3 3 CE 1 1 VOUT Description Chip enable pin (“H” active) Output pin http://onsemi.com 2 NCP4640 ABSOLUTE MAXIMUM RATINGS Symbol Value Unit Input Voltage Rating VIN −0.3 to 50 V Peak Input Voltage (Note 1) VIN 60 V Output Voltage VOUT −0.3 to VIN + 0.3 ≤ 50 V Chip Enable Input VCE −0.3 to VIN + 0.3 ≤ 50 V Output Current IOUT 150 mA 900 mW PD Power Dissipation SOT−89 Power Dissipation SOIC6−TL 1700 Junction Temperature TJ −40 to 150 °C Storage Temperature TSTG −55 to 125 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V ESD Capability, Machine Model (Note 2) ESDMM 200 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Duration time = 200 ms 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) Latchup Current Maximum Rating tested per JEDEC standard: JESD78. THERMAL CHARACTERISTICS Rating Symbol Value Unit Thermal Characteristics, SOT−89 Thermal Resistance, Junction−to−Air RqJA 111 °C/W Thermal Characteristics, SOIC6−TL Thermal Resistance, Junction−to−Air RqJA 59 °C/W http://onsemi.com 3 NCP4640 ELECTRICAL CHARACTERISTICS TA = 25°C Parameter Test Conditions Operating Input Voltage Output Voltage Output Voltage Temp. Coefficient Line Regulation Load Regulation Dropout Voltage Output Current VIN = VOUT + 3 V, IOUT = 1 mA Symbol Min Max Unit VIN 4 36 V VOUT x0.98 x1.02 V VIN = VOUT + 3 V, IOUT = 1 mA, TA = −40 to 105°C VIN = VOUT + 1.5 V to 36 V, IOUT = 1 mA VIN = VOUT + 3 V, IOUT = 1 mA to 40 mA IOUT = 20 mA 2.0 V ≤ VOUT < 5.0 V ppm/°C ±100 LineReg 0.05 0.20 %/V LoadReg 10 25 mV 20 35 5.0 V ≤ VOUT < 12.0 V 2.0 V ≤ VOUT < 3.7 V Typ VDO (Note 3) 3.7 V ≤ VOUT < 4.0 V 0.35 0.60 4.0 V ≤ VOUT < 5.0 V 0.25 0.40 5.0 V ≤ VOUT < 12.0 V 0.20 0.35 50 V VIN = VOUT + 3 V IOUT mA Short Current Limit VOUT = 0 V ISC 50 Quiescent Current VIN = VOUT + 3 V, IOUT = 0 mA IQ 9 20 mA Standby Current VIN = 36 V, VCE = 0 V ISTB 0.1 1 mA CE Pin Threshold Voltage CE Input Voltage “H” VCEH 1.5 VIN V CE Input Voltage “L” VCEL 0 0.3 mA Thermal Shutdown Temperature TSD 150 °C Thermal Shutdown Release Temperature TSR 125 °C VIN = 5.0 V, VOUT = 2.0 V, ΔVIN PK−PK = 0.2 V, IOUT = 30 mA, f = 1 kHz PSRR 30 dB VOUT = 2.0 V, IOUT = 30 mA, f = 10 Hz to 100 kHz VN 80 mVrms Power Supply Rejection Ratio Output Noise Voltage 3. Dropout voltage for 2.0 V ≤ VOUT < 3.7 V can be computed by this formula: VDO = 4 V − VOUTSET http://onsemi.com 4 NCP4640 TYPICAL CHARACTERISTICS 2.5 3.5 2.0 VIN = 4.0 V 1.5 2.5 1.0 5.5 V VIN = 6.5 V 5.5 V VOUT (V) VOUT (V) 5.0 V 5.0 V 6.0 V 3.0 4.5 V 2.0 1.5 1.0 0.5 0.0 0.5 0 50 100 IOUT (mA) 150 200 0.0 0 50 Figure 3. Output Voltage vs. Output Current 2.0 V Version (TJ = 255C) 5.0 VOUT (V) VOUT (V) 10.0 11.5 V 6.0 10 V 4.0 14.5 V 15 V 12.0 11 V 7.0 3.0 15.5 V 8.0 14 V 6.0 4.0 2.0 2.0 1.0 0 50 100 150 200 0.0 0 50 150 200 IOUT (mA) Figure 5. Output Voltage vs. Output Current 8.0 V Version (TJ = 255C) Figure 6. Output Voltage vs. Output Current 12 V Version (TJ = 255C) 1.50 1.50 1.25 1.25 1.00 1.00 0.75 0.50 TJ = 25°C 0.75 0.50 105°C TJ = 25°C 0.25 0.25 −40°C 0 100 IOUT (mA) VDO (V) VDO (V) 200 14.0 10.5 V 8.0 0.00 150 Figure 4. Output Voltage vs. Output Current 3.3 V Version (TJ = 255C) 9.0 0.0 100 IOUT (mA) 10 20 30 IOUT (mA) 40 0.00 50 Figure 7. Dropout Voltage vs. Output Current 8.0 V Version 105°C −40°C 0 10 20 30 IOUT (mA) 40 Figure 8. Dropout Voltage vs. Output Current 12 V Version http://onsemi.com 5 50 NCP4640 TYPICAL CHARACTERISTICS 3.40 2.10 VIN = 5.0 V 2.06 3.36 2.04 3.34 2.02 3.32 2.00 1.98 3.26 3.24 1.92 3.22 −20 0 20 40 60 80 3.20 −40 100 20 40 60 80 100 TJ, JUNCTION TEMPERATURE (°C) Figure 10. Output Voltage vs. Temperature, 3.3 V Version 12.20 VIN = 11 V 12.05 VOUT (V) 8.05 8.00 7.95 12.00 11.95 7.90 11.90 7.85 11.85 −20 0 20 40 60 80 VIN = 15 V 12.15 12.10 11.80 −40 100 −20 0 20 40 60 80 100 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 11. Output Voltage vs. Temperature, 8.0 V Version Figure 12. Output Voltage vs. Temperature, 12 V Version 14 16 12 V 8.0 V 12 14 8.0 V 12 8 IGND (mA) 10 VOUT = 2.0 V 3.3 V 6 4 12 V 10 8 3.3 V 6 VOUT = 2.0 V 4 2 0 −40 0 TJ, JUNCTION TEMPERATURE (°C) 8.10 7.80 −40 −20 Figure 9. Output Voltage vs. Temperature, 2.0 V Version 8.15 VOUT (V) 3.28 1.94 8.20 IGND (mA) 3.30 1.96 1.90 −40 VIN = 6.3 V 3.38 VOUT (V) VOUT (V) 2.08 2 −20 0 20 40 60 80 0 100 0 5 10 15 20 25 30 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 13. Supply Current vs. Temperature Figure 14. Supply Current vs. Input Voltage http://onsemi.com 6 35 NCP4640 TYPICAL CHARACTERISTICS 2.5 3.5 3.0 2.0 1.5 1 mA VOUT (V) VOUT (V) 2.5 1 mA 20 mA 1.0 2.0 20 mA 1.5 1.0 IOUT = 40 mA 0.5 0.0 0 5 IOUT = 40 mA 0.5 10 15 20 25 VIN, INPUT VOLTAGE (V) 30 0.0 35 0 Figure 15. Output Voltage vs. Input Voltage, 2.0 V Version 35 12.0 7.0 10.0 6.0 1 mA VOUT (V) VOUT (V) 30 14.0 8.0 5.0 4.0 20 mA 3.0 2.0 0 5 1 mA 8.0 6.0 4.0 IOUT = 40 mA 1.0 20 mA 2.0 10 15 20 25 VIN, INPUT VOLTAGE (V) 30 0.0 35 IOUT = 40 mA 0 Figure 17. Output Voltage vs. Input Voltage, 8.0 V Version 100 100 90 90 80 80 70 70 60 50 40 IOUT = 1 mA 30 30 mA 0.1 1 10 FREQUENCY (kHz) 100 30 35 60 50 40 IOUT = 1 mA 10 mA 20 10 0 0.01 10 15 20 25 VIN, INPUT VOLTAGE (V) 30 10 mA 20 5 Figure 18. Output Voltage vs. Input Voltage, 12 V Version PSRR (dB) PSRR (dB) 10 15 20 25 VIN, INPUT VOLTAGE (V) Figure 16. Output Voltage vs. Input Voltage, 3.3 V Version 9.0 0.0 5 10 0 0.01 1000 Figure 19. PSRR, 2.0 V Version, VIN = 5.0 V 30 mA 0.1 1 10 FREQUENCY (kHz) 100 Figure 20. PSRR, 3.3 V Version, VIN = 6.3 V http://onsemi.com 7 1000 NCP4640 TYPICAL CHARACTERISTICS 5 100 90 4 80 VN (mVrms/√Hz) PSRR (dB) 70 60 50 40 IOUT = 1 mA 30 10 mA 20 2 1 10 30 mA 0 0.01 0.1 1 10 100 0 0.01 1000 0.1 1 10 100 1000 FREQUENCY (kHz) FREQUENCY (kHz) Figure 21. PSRR, 3.3 V Version, VIN = 6.3 V Figure 22. Output Voltage Noise, 2.0 V Version, VIN = 5.0 V, IOUT = 30 mA 12 45 40 10 35 VN (mVrms/√Hz) 8 6 4 30 25 20 15 10 2 5 0 0.01 0.1 1 10 FREQUENCY (kHz) 100 1000 0 0.01 Figure 23. Output Voltage Noise, 3.3 V Version, VIN = 6.3 V, IOUT = 30 mA 0.1 1 10 FREQUENCY (kHz) 60 50 40 30 20 10 0 0.01 0.1 100 1000 Figure 24. Output Voltage Noise, 8.0 V Version, VIN = 11.0 V, IOUT = 30 mA 70 VN (mVrms/√Hz) VN (mVrms/√Hz) 3 1 10 100 1000 FREQUENCY (kHz) Figure 25. Output Voltage Noise, 12.0 V Version, VIN = 15.0 V, IOUT = 30 mA http://onsemi.com 8 NCP4640 TYPICAL CHARACTERISTICS 6.5 6.0 5.0 VIN (V) VOUT (V) 5.5 2.10 2.05 2.00 1.95 1.90 0 0.2 0.4 0.6 0.8 1.0 1.2 t (ms) 1.4 1.6 1.8 2.0 Figure 26. Line Transients, 2.0 V Version, tR = tF = 50 ms, IOUT = 1 mA 8.0 7.5 6.5 3.5 6.0 3.4 VIN (V) VOUT (V) 7.0 3.3 3.2 3.1 0 0.2 0.4 0.6 0.8 1.0 1.2 t (ms) 1.4 1.6 1.8 2.0 Figure 27. Line Transients, 3.3 V Version, tR = tF = 50 ms, IOUT = 1 mA 12.5 12.0 11.0 VIN (V) VOUT (V) 11.5 8.4 8.2 8.0 7.8 7.6 0 0.2 0.4 0.6 0.8 1.0 1.2 t (ms) 1.4 1.6 1.8 Figure 28. Line Transients, 8.0 V Version, tR = tF = 50 ms, IOUT = 1 mA http://onsemi.com 9 2.0 NCP4640 TYPICAL CHARACTERISTICS 16.5 16.0 15.0 VIN (V) VOUT (V) 15.5 12.4 12.2 12.0 11.8 11.6 0 0.2 0.4 0.6 0.8 1.0 1.2 t (ms) 1.4 1.6 1.8 2.0 Figure 29. Line Transients, 12.0 V Version, tR = tF = 50 ms, IOUT = 1 mA 30 20 10 IOUT (mA) VOUT (V) 0 2.2 2.1 2.0 1.9 1.8 1.7 0 0.2 0.4 0.6 0.8 1.0 1.2 t (ms) 1.4 1.6 1.8 2.0 Figure 30. Load Transients, 2.0 V Version, IOUT = 1 – 20 mA, tR = tF = 50 ms, VIN = 5.0 V 30 20 10 IOUT (mA) VOUT (V) 0 3.7 3.5 3.3 3.1 2.9 2.7 0 0.2 0.4 0.6 0.8 1.0 1.2 t (ms) 1.4 1.6 1.8 Figure 31. Load Transients, 3.3 V Version, IOUT = 1 – 20 mA, tR = tF = 50 ms, VIN = 6.3 V http://onsemi.com 10 2.0 NCP4640 TYPICAL CHARACTERISTICS 30 20 10 0 8.4 IOUT (mA) VOUT (V) 8.6 8.2 8.0 7.8 7.6 7.4 7.2 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 t (ms) Figure 32. Load Transients, 8.0 V Version, IOUT = 1 – 20 mA, tR = tF = 50 ms, VIN = 11.0 V 30 20 10 IOUT (mA) VOUT (V) 0 12.8 12.4 12.0 11.6 11.2 10.8 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 t (ms) Figure 33. Load Transients, 12.0 V Version, IOUT = 1 – 20 mA, tR = tF = 50 ms, VIN = 15.0 V 60 50 40 20 IOUT (mA) VOUT (V) 30 2.2 2.1 2.0 1.9 1.8 1.7 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 t (ms) 1.6 1.8 Figure 34. Load Transients, 2.0 V Version, IOUT = 20 – 50 mA, tR = tF = 50 ms, VIN = 5.0 V http://onsemi.com 11 2.0 NCP4640 TYPICAL CHARACTERISTICS 60 50 40 IOUT (mA) VOUT (V) 30 3.7 3.5 3.3 3.1 2.9 2.7 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 t (ms) Figure 35. Load Transients, 3.3 V Version, IOUT = 20 – 50 mA, tR = tF = 50 ms, VIN = 6.3 V 60 50 40 20 IOUT (mA) VOUT (V) 30 8.4 8.2 8.0 7.8 7.6 7.4 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 t (ms) Figure 36. Load Transients, 8.0 V Version, IOUT = 20 – 50 mA, tR = tF = 50 ms, VIN = 11.0 V 60 50 40 20 IOUT (mA) VOUT (V) 30 12.8 12.4 12.0 11.6 11.2 10.8 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 t (ms) Figure 37. Load Transients, 12.0 V Version, IOUT = 20 – 50 mA, tR = tF = 50 ms, VIN = 15.0 V http://onsemi.com 12 2.0 NCP4640 TYPICAL CHARACTERISTICS 8 Chip Enable 6 4 0 2.0 IOUT = 1 mA 1.5 1.0 IOUT = 20 mA VCE (V) VOUT (V) 2 IOUT = 50 mA 0.5 0 −0.5 0 50 100 150 200 250 300 350 400 450 500 t (ms) Figure 38. Start−up, 2.0 V Version, VIN = 5.0 V Chip Enable 8 6 4 0 4 3 IOUT = 1 mA 2 VCE (V) VOUT (V) 2 IOUT = 20 mA IOUT = 50 mA 1 0 −1 0 50 100 150 200 250 300 350 400 450 500 t (ms) Figure 39. Start−up, 3.3 V Version, VIN = 6.3 V 16 Chip Enable 12 8 0 8 6 IOUT = 1 mA 4 IOUT = 20 mA IOUT = 50 mA 2 0 −2 0 50 100 150 200 250 300 350 400 450 500 t (ms) Figure 40. Start−up, 8.0 V Version, VIN = 11.0 V http://onsemi.com 13 VCE (V) VOUT (V) 4 NCP4640 TYPICAL CHARACTERISTICS Chip Enable 20 15 10 0 16 IOUT = 20 mA 12 8 IOUT = 1 mA 4 IOUT = 50 mA 0 −4 0 50 100 150 200 250 300 350 400 450 500 t (ms) Figure 41. Start−up, 12.0 V Version, VIN = 15.0 V http://onsemi.com 14 VCE (V) VOUT (V) 5 NCP4640 APPLICATION INFORMATION A typical application circuit for NCP4640 series is shown in Figure 42. NCP4640x VIN VIN connected to CE pin. Do not keep CE pin not connected or between VCEH and VCEL voltage levels. Otherwise output voltage would be unstable or indefinite and unexpected would flow internally. VOUT VOUT Thermal The device is stable without any input capacitance, but if input line is long and has high impedance or if more stable operation is needed, input capacitor C1 should be connected as close as possible to the IC. Recommended range of input capacitor value is 100 nF to 10 mF. As a power across the IC increase, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and also the ambient temperature affect the rate of temperature increase for the part. When the device has good thermal conductivity through the PCB the junction temperature will be relatively low in high power dissipation applications. The IC includes internal thermal shutdown circuit that stops operation of regulator, if junction temperature is higher than 150°C. After that, when junction temperature decreases below 125°C, the operation of voltage regulator would restart. While high power dissipation condition is, the regulator starts and stops repeatedly and protects itself against overheating. Output Decoupling Capacitor (C2) PCB layout C1 100 n C2 100n CE GND Figure 42. Typical Application Schematic Input Decoupling Capacitor (C1) The NCP4641 can work stable without output capacitor, but if faster response and higher stability reserve is needed, output capacitor should be connected as close as possible to the device. Recommended range of output capacitance is 100 nF to 10 mF. Larger values of output capacitance and lower ESR improves dynamic parameters. Pins number 2 and 4 of SOT89−5 package and pins number 2, 4 and 5 of SOIC6−TL must be wired to the GND plane while it is mounted on board. Make VIN and GND lines sufficient. If their impedance is high, noise pickup or unstable operation may result. Connect capacitors C1 and C2 as close as possible to the IC, and make wiring as short as possible. Enable Operation The enable pin CE may be used for turning the regulator on and off. The device is activated when high level is ORDERING INFORMATION Nominal Output Voltage Description Marking Package Shipping† NCP4640H020T1G 2.0 V Enable High N020 SOT89−5 (Pb−Free) 1000 / Tape & Reel NCP4640H030T1G 3.0 V Enable High N030 SOT89−5 (Pb−Free) 1000 / Tape & Reel NCP4640H033T1G 3.3 V Enable High N033 SOT89−5 (Pb−Free) 1000 / Tape & Reel NCP4640H080T1G 8.0 V Enable High N080 SOT89−5 (Pb−Free) 1000 / Tape & Reel NCP4640H120T1G 12.0 V Enable High N120 SOT89−5 (Pb−Free) 1000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *To order other package and voltage variants, please contact your ON Semiconductor sales representative. http://onsemi.com 15 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−89, 5 LEAD CASE 528AB−01 ISSUE O DATE 23 NOV 2009 SCALE 2:1 D E NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS INCLUDES LEAD FINISH. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 5. DIMENSIONS L, L2, L3, L4, L5, AND H ARE MEASURED AT DATUM PLANE C. H DIM A b b1 c D D2 E e H L L2 L3 L4 L5 1 TOP VIEW c A 0.10 C C SIDE VIEW e b1 L GENERIC MARKING DIAGRAM* e b MILLIMETERS MIN MAX 1.40 1.60 0.32 0.52 0.37 0.57 0.30 0.50 4.40 4.60 1.40 1.80 2.40 2.60 1.40 1.60 4.25 4.45 1.10 1.50 0.80 1.20 0.95 1.35 0.65 1.05 0.20 0.60 L2 1 1 2 3 XXX XMM L5 5 L3 4 D2 L4 RECOMMENDED MOUNTING FOOTPRINT* BOTTOM VIEW 4X 0.57 1.75 2.79 XXXX MM G = Specific Device Code = Lot Number = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G”, may or not be present. 1.50 0.45 4.65 1.30 1 1.65 2X 2X 1.50 0.62 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON47037E SOT−89, 5 LEAD Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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