NCP4681DMX33TCG

NCP4681, NCP4684 150 mA, Ultra Low Quiescent Current, Low Dropout Regulator The NCP4681 and NCP4684 are CMOS Linear voltage regulators with 150 mA output current capability and ultra low supply currents (1 mA typ.) The devices are easy to use and include output current protection and a fully integrated soft−start circuit to minimize inrush current and to ensure no output voltage overshoot. The NCP4681 includes an Enable function to reduce supply current by using a Standby mode, while the NCP4684 excludes the Enable pin to avoid any pull down current, thereby offering the lowest possible current consumption for battery powered applications in Active mode. For portable products the devices are available in the exceptionally small 0.8 x 0.8 mm XDFN, along with the SC−70 and SOT23 packages http://onsemi.com MARKING DIAGRAMS SC−70 CASE 419A XXX XMM 1 Features • • • • • • • • • • • Operating Input Voltage Range: 1.40 V to 5.25 V Output Voltage Range: 0.8 V to 3.6 V (available in 0.1 V steps) Output Voltage Accuracy: ±1.0% Supply Current: 1 mA (excluding the CE pull down current) Dropout Voltage: 0.28 V (IOUT = 150 mA, VOUT = 2.8 V) Line Regulation: 0.02%/V Typ. Stable with Ceramic Capacitors: 0.1 mF or more Current Fold Back Protection Build−in Constant Slope Circuit for soft−start function Available in XDFN4 0.8 x 0.8 mm, SC−70, SOT23 Packages These are Pb−Free Devices XXXMM SOT−23−5 CASE 1212 1 XDFN4 CASE 711AB 1 XM M 1 X, XXXX= Specific Device Code MM = Date Code Typical Applications • • • • Battery−powered Equipment Networking and Communication Equipment Cameras, DVRs, STB and Camcorders Home Appliances NCP4681x VIN VIN C1 100n CE ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 15 of this data sheet. VOUT GND NCP4684 VIN VOUT VIN C1 100n C2 100n VOUT VOUT GND C2 100n Figure 1. Typical Application Schematics © Semiconductor Components Industries, LLC, 2013 September, 2013 − Rev. 3 1 Publication Order Number: NCP4681/D NCP4681, NCP4684 VIN VOUT VIN Vref Vref Current Limit CE VOUT CE Current Limit GND GND NCP4681Hxxxx NCP4681Dxxxx VIN VOUT Vref Current Limit NC GND NCP4684xxxx Figure 2. Simplified Schematic Block Diagram PIN FUNCTION DESCRIPTION Pin No. XDFN0808* Pin No. SC−70 Pin No. SOT23 Pin Name 1 4 5 VOUT Output pin 2 3 2 GND Ground 3 1 3 CE/NC 4 5 1 VIN Input pin − 2 4 NC No connection Description Chip enable pin (Active “H”) / No connection (NCP4684) *Tab is GND level. (They are connected to the reverse side of this IC. The tab is better to be connected to the GND, but leaving it open is also acceptable. http://onsemi.com 2 NCP4681, NCP4684 ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit VIN 6.0 V Output Voltage VOUT −0.3 to VIN + 0.3 V Chip Enable Input VCE 6.0 V Output Current IOUT 180 mA PD 286 mW Input Voltage (Note 1) Power Dissipation XDFN0808 Power Dissipation SC−70 380 Power Dissipation SOT23 420 Junction Temperature TJ −40 to 150 °C Storage Temperature TSTG −55 to 125 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V ESD Capability, Machine Model (Note 2) ESDMM 200 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) Latch−up Current Maximum Rating tested per JEDEC standard: JESD78. THERMAL CHARACTERISTICS Rating Symbol Value Unit Thermal Characteristics, XDFN 0.8 x 0.8 mm Thermal Resistance, Junction−to−Air RqJA 350 °C/W Thermal Characteristics, SOT23 Thermal Resistance, Junction−to−Air RqJA 238 °C/W Thermal Characteristics, SC−70 Thermal Resistance, Junction−to−Air RqJA 263 °C/W http://onsemi.com 3 NCP4681, NCP4684 ELECTRICAL CHARACTERISTICS −40°C ≤ TA ≤ 85°C; VIN = VOUT(NOM) + 1 V or 2.5 V, whichever is greater; IOUT = 1 mA, CIN = COUT = 0.1 mF, unless otherwise noted. Typical values are at TA = +25°C. Parameter Test Conditions Symbol Min Max Unit (Note 3) VIN 1.40 5.25 V VOUT x0.99 x1.01 V VOUT < 2.0 V −20 20 mV VOUT ≥ 2.0 V x0.970 x1.025 V VOUT < 2.0 V −60 60 mV Operating Input Voltage Output Voltage TA = +25°C VOUT ≥ 2.0 V −40°C ≤ TA ≤ 85°C Output Voltage Temp. Coefficient Typ −40°C ≤ TA ≤ 85°C DVOUT/DTA ±100 Line Regulation VOUT(NOM) + 0.5 V ≤ VIN ≤ 5.0 V LineReg 0.02 0.10 %/V Load Regulation IOUT = 1 mA to 150 mA LoadReg 0 20 mV 0.96 1.40 V 0.9 V ≤ VOUT < 1.0 V 0.87 1.25 1.0 V ≤ VOUT < 1.2 V 0.78 1.15 1.2 V ≤ VOUT < 1.4 V 0.64 1.00 1.4 V ≤ VOUT < 1.7 V 0.52 0.80 1.7 V ≤ VOUT < 2.0 V 0.40 0.60 2.0 V ≤ VOUT < 2.5 V 0.32 0.48 2.5 V ≤ VOUT < 3.0 V 0.28 0.40 3.0 V ≤ VOUT < 3.6 V 0.25 0.35 Dropout Voltage IOUT = 150 mA 0.8 V ≤ VOUT < 0.9 V Output Current Short Current Limit CE Pin Threshold Voltage (NCP4681 only) CE Pull Down Current Power Supply Rejection Ratio Output Noise Voltage Low Output Nch Tr. On Resistance 150 mA ISC 50 IQ 1 2 mA VCE = 0 V, TA = 25°C, NCP4681 only ISTB 0.1 1.0 mA CE Input Voltage “H” VCEH CE Input Voltage “L” VCEL NCP4681 only ICEPD 0.3 mA VOUT = 1.5 V, VIN = 2.5 V, DVIN = 0.2 Vpk−pk, IOUT = 30 mA, f = 1 kHz PSRR 25 dB f = 10 Hz to 100 kHz, VOUT = 1.5 V, VIN = 2.5 V, IOUT = 30 mA VN 100 mVrms VIN = 4 V, VCE = 0 V, NCP4681D only RLOW 60 W Quiescent Current Standby Current VDO IOUT VOUT = 0 V −20 ppm/°C mA V 1.0 0.4 3. The maximum Input Voltage of the Electrical Characteristics is 5.25 V. In case of exceeding this specification, the IC must be operated n condition that the Input Voltage is up to 5.50 V and total operation time is within 500 hours. http://onsemi.com 4 NCP4681, NCP4684 TYPICAL CHARACTERISTICS 1.8 3.0 1.6 2.0 VOUT (V) VIN = 1.8 V 1.0 5.25 V 0.8 1.9 V 0.6 0 50 100 150 200 250 300 350 0 400 100 150 200 250 300 350 IOUT (mA) Figure 4. Output Voltage vs. Output Current 2.5 V Version (TJ = 255C) 400 0.6 0.5 3.6 V 2.5 5.25 V 2.0 VIN = 4.5 V 25°C 3.5 V 0.4 VDO (V) VOUT (V) 50 IOUT (mA) 3.0 1.5 0.3 TJ = 85°C 0.20 1.0 −40°C 0.1 0.5 0 50 100 150 200 250 300 350 0 400 0 25 50 75 100 125 IOUT (mA) IOUT (mA) Figure 5. Output Voltage vs. Output Current 3.3 V Version (TJ = 255C) Figure 6. Dropout Voltage vs. Output Current 1.5 V Version 0.35 150 0.30 0.30 0.25 25°C 0.25 25°C 0.20 0.20 VDO (V) VDO (V) 0 Figure 3. Output Voltage vs. Output Current 1.5 V Version (TJ = 255C) 3.5 TJ = 85°C 0.15 0.15 TJ = 85°C 0.10 −40°C 0.10 −40°C 0.05 0.05 0 2.9 V 1.5 0.5 0.2 0 2.8 V VIN = 4.5 V 1.0 0.4 0 5.25 V 3.5 V 1.2 VOUT (V) 2.5 2.5 V 1.4 0 25 50 75 IOUT (mA) 100 125 0 150 Figure 7. Dropout Voltage vs. Output Current 2.5 V Version 0 25 50 75 IOUT (mA) 100 125 Figure 8. Dropout Voltage vs. Output Current 3.3 V Version http://onsemi.com 5 150 NCP4681, NCP4684 TYPICAL CHARACTERISTICS 1.55 2.52 1.51 2.51 VOUT (V) VOUT (V) 2.53 1.52 1.50 1.49 2.50 2.49 1.48 2.48 1.47 2.47 1.46 2.46 −20 0 20 40 60 2.45 −40 80 −20 40 60 80 Figure 9. Output Voltage vs. Temperature, 1.5 V Version Figure 10. Output Voltage vs. Temperature, 2.5 V Version 2.0 VIN = 4.3 V 1.8 1.6 3.32 1.4 3.31 1.2 IGND (mA) 3.33 3.30 3.29 3.3 V 0.8 0.6 3.27 0.4 3.26 0.2 0.0 80 2.5 V 1.0 3.28 −20 0 20 40 60 TJ, JUNCTION TEMPERATURE (°C) VOUT = 1.5 V 0 Figure 11. Output Voltage vs. Temperature, 3.3 V Version 3.0 1 5 1.6 VIN = VOUT + 1 1.4 1.2 VOUT (V) 2.0 1.5 VOUT = 1.5 V, 2.5 V, 3.3 V 1.0 2 3 4 VIN, INPUT VOLTAGE (V) Figure 12. Supply Current vs. Input Voltage 2.5 IGND (mA) 20 TJ, JUNCTION TEMPERATURE (°C) 3.34 30 mA 1 mA 1.0 IOUT = 50 mA 0.8 0.6 0.4 0.5 0.0 −40 0 TJ, JUNCTION TEMPERATURE (°C) 3.35 3.25 −40 VIN = 3.5 V 2.54 1.53 1.45 −40 VOUT (V) 2.55 VIN = 2.5 V 1.54 0.2 −20 0 20 40 60 0.0 80 0 1 2 3 4 5 TJ, JUNCTION TEMPERATURE (°C) VIN, INPUT VOLTAGE (V) Figure 13. Supply Current vs. Temperature Figure 14. Output Voltage vs. Input Voltage, 1.5 V Version http://onsemi.com 6 NCP4681, NCP4684 TYPICAL CHARACTERISTICS 3.0 3.5 2.5 3.0 2.5 VOUT (V) VOUT (V) 2.0 1.5 30 mA 1 mA 1.0 1.5 1 mA 1.0 IOUT = 50 mA 0.5 0 2.0 0 1 30 mA IOUT = 50 mA 0.5 2 3 4 VIN, INPUT VOLTAGE (V) 0 5 0 1 60 60 50 50 40 40 IOUT = 1 mA 30 30 mA 20 IOUT = 1 mA 30 30 mA 20 150 mA 150 mA 10 10 0 0.1 5 Figure 16. Output Voltage vs. Input Voltage, 3.3 V Version PSRR (dB) PSRR (dB) Figure 15. Output Voltage vs. Input Voltage, 2.5 V Version 2 3 4 VIN, INPUT VOLTAGE (V) 1 10 FREQUENCY (kHz) 100 0 1000 0.1 Figure 17. PSRR, 1.5 V Version, VIN = 2.5 V 1 10 100 FREQUENCY (kHz) 1000 1 10 FREQUENCY (kHz) 1000 Figure 18. PSRR, 2.5 V Version, VIN = 3.5 V 4.0 60 3.5 50 40 VN (mVrms/√Hz) PSRR (dB) 3.0 IOUT = 1 mA 30 20 30 mA 150 mA 2.0 1.5 1.0 10 0 0.1 2.5 0.5 1 10 100 0 0.01 1000 FREQUENCY (kHz) Figure 19. PSRR, 3.3 V Version, VIN = 4.3 V 0.1 100 Figure 20. Output Voltage Noise, 1.5 V Version, VIN = 2.5 V, IOUT = 30 mA http://onsemi.com 7 NCP4681, NCP4684 TYPICAL CHARACTERISTICS 8.0 10 7.0 9.0 8.0 VN (mVrms/√Hz) 5.0 4.0 3.0 2.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 1.0 0 0.01 0.1 1 10 FREQUENCY (kHz) 100 1000 0 0.01 Figure 21. Output Voltage Noise, 2.5 V Version, VIN = 3.5 V, IOUT = 30 mA 0.1 1 10 FREQUENCY (kHz) 3.5 3.0 VIN (V) VOUT (V) 2.5 1.8 1.7 1.6 1.5 1.4 1.3 1.2 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 t (ms) Figure 23. Line Transients, 1.5 V Version, tR = tF = 5 ms, IOUT = 30 mA 5.0 4.5 4.0 3.5 VIN (V) 2.8 2.7 2.6 2.5 2.4 2.3 2.2 0 0.1 0.2 0.3 0.4 100 1000 Figure 22. Output Voltage Noise, 3.3 V Version, VIN = 4.3 V, IOUT = 30 mA 4.0 VOUT (V) VN (mVrms/√Hz) 6.0 0.5 0.6 0.7 0.8 0.9 t (ms) Figure 24. Line Transients, 2.5 V Version, tR = tF = 5 ms, IOUT = 30 mA http://onsemi.com 8 1.0 NCP4681, NCP4684 TYPICAL CHARACTERISTICS 5.8 5.3 4.8 VIN (V) VOUT (V) 4.3 3.6 3.5 3.4 3.3 3.2 3.1 3.0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 t (ms) Figure 25. Line Transients, 3.3 V Version, tR = tF = 5 ms, IOUT = 30 mA 150 100 50 2.1 IOUT (mA) VOUT (V) 0 1.9 1.7 1.5 1.3 1.1 0.9 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 t (ms) Figure 26. Load Transients, 1.5 V Version, IOUT = 50 – 100 mA, tR = tF = 0.5 ms, VIN = 2.5 V 150 100 50 3.1 IOUT (mA) VOUT (V) 0 2.9 2.7 2.5 2.3 2.1 1.9 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 t (ms) Figure 27. Load Transients, 2.5 V Version, IOUT = 50 – 100 mA, tR = tF = 0.5 ms, VIN = 3.5 V http://onsemi.com 9 NCP4681, NCP4684 TYPICAL CHARACTERISTICS 150 100 50 3.7 IOUT (mA) VOUT (V) 0 3.5 3.3 3.1 2.9 2.7 2.5 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 t (ms) Figure 28. Load Transients, 3.3 V Version, IOUT = 50 – 100 mA, tR = tF = 0.5 ms, VIN = 4.3 V 150 100 50 3.0 IOUT (mA) VOUT (V) 0 2.5 2.0 1.5 1.0 0.5 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 t (ms) Figure 29. Load Transients, 1.5 V Version, IOUT = 1 – 100 mA, tR = tF = 0.5 ms, VIN = 2.5 V 150 100 50 4.0 IOUT (mA) VOUT (V) 0 3.5 3.0 2.5 2.0 1.5 1.0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 t (ms) Figure 30. Load Transients, 2.5 V Version, IOUT = 1 – 100 mA, tR = tF = 0.5 ms, VIN = 3.5 V http://onsemi.com 10 1.0 NCP4681, NCP4684 TYPICAL CHARACTERISTICS 150 100 50 4.3 IOUT (mA) VOUT (V) 0 3.8 3.3 2.8 2.3 1.8 1.3 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 t (ms) Figure 31. Load Transients, 3.3 V Version, IOUT = 1 – 100 mA, tR = tF = 0.5 ms, VIN = 4.3 V 45 30 15 2.1 IOUT (mA) VOUT (V) 0 1.9 1.7 1.5 1.3 1.1 0.9 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 t (ms) Figure 32. Load Transients, 1.5 V Version, IOUT = 1 – 30 mA, tR = tF = 0.5 ms, VIN = 2.5 V 45 30 15 IOUT (mA) VOUT (V) 0 3.1 2.9 2.7 2.5 2.3 2.1 1.9 0 0.1 0.2 0.3 0.4 0.5 0.6 t (ms) 0.7 0.8 0.9 Figure 33. Load Transients, 2.5 V Version, IOUT = 1 – 30 mA, tR = tF = 0.5 ms, VIN = 2.5 V http://onsemi.com 11 1.0 NCP4681, NCP4684 TYPICAL CHARACTERISTICS 45 30 15 3.7 IOUT (mA) VOUT (V) 0 3.5 3.3 3.1 2.9 2.7 2.5 0 0.1 0.2 0.3 0.4 0.5 0.6 t (ms) 0.7 0.8 0.9 1.0 Figure 34. Load Transients, 3.3 V Version, IOUT = 1 – 30 mA, tR = tF = 0.5 ms, VIN = 4.3 V 3 Chip Enable 2 1 2.0 IOUT = 150 mA 1.5 1.0 IOUT = 30 mA 0.5 IOUT = 1 mA 0 −0.5 VCE (V) VOUT (V) 0 0 40 80 120 160 200 240 280 320 360 400 t (ms) Figure 35. Start−up, 1.5 V Version NCP4681x, VIN = 2.5 V 4.5 Chip Enable 3.0 1.5 2.5 VCE (V) VOUT (V) 0 2.0 1.5 IOUT = 150 mA 1.0 IOUT = 30 mA 0.5 IOUT = 1 mA 0 −0.5 0 40 80 120 160 200 240 280 320 360 400 t (ms) Figure 36. Start−up, 2.5 V Version NCP4681x, VIN = 3.5 V http://onsemi.com 12 NCP4681, NCP4684 TYPICAL CHARACTERISTICS 6 Chip Enable 4 2 VCE (V) VOUT (V) 0 4.0 3.0 IOUT = 150 mA 2.0 IOUT = 30 mA 1.0 0 IOUT = 1 mA −1.0 0 40 80 120 160 200 240 280 320 360 400 t (ms) Figure 37. Start−up, 3.3 V Version NCP4681x, VIN = 4.3 V 3 2 1 0 VCE (V) VOUT (V) Chip Enable 2.0 1.5 IOUT = 1 mA 1.0 IOUT = 30 mA 0.5 0 −0.5 IOUT = 150 mA 0 10 20 30 40 50 60 70 80 90 100 t (ms) Figure 38. Shutdown, 1.5 V Version NCP4681D, VIN = 2.5 V 4.5 3.0 1.5 0 2.5 2.0 VCE (V) VOUT (V) Chip Enable IOUT = 1 mA 1.5 IOUT = 30 mA 1.0 0.5 0 −0.5 IOUT = 150 mA 0 10 20 30 40 50 60 70 80 90 100 t (ms) Figure 39. Shutdown, 2.5 V version NCP4681D, VIN = 3.5 V http://onsemi.com 13 NCP4681, NCP4684 TYPICAL CHARACTERISTICS 6 4 2 0 VCE (V) VOUT (V) Chip Enable 4.0 3.0 IOUT = 1 mA IOUT = 30 mA 2.0 1.0 0 IOUT = 150 mA −1.0 0 10 20 30 40 50 60 t (ms) 70 80 90 100 Figure 40. Shutdown, 3.3 V Version NCP4681D, VIN = 4.3 V APPLICATION INFORMATION output and ground pins. Larger capacitor values and lower ESR improves dynamic parameters. A typical application circuits for NCP4681 and NCP4684 series are shown in Figure 41. VIN NCP4681x VIN C1 100n CE Enable Operation (NCP4681 Only) VOUT The enable pin CE may be used for turning the regulator on and off. The IC is switched on when a high level voltage is applied to the CE pin. The enable pin has an internal pull down current source. If the enable function is not needed connect CE pin to VIN. VOUT GND C2 100n Constant Slope Circuit NCP4684 VIN VIN C1 100n The constant slope circuit is used as a soft start circuit that allows the output voltage to start up slowly with a defined slope. This circuit minimizes inrush current at start up and also prevents against overshoot of the output voltage. The Constant slope circuit is fully built in and no external components are needed. Start up time and the output voltage slope is defined internally and there is no way for the user to change it. Start up into bigger output capacitor doesn’t make any problem due to cooperation of constant slope circuit and current limit circuit. VOUT VOUT GND C2 100n Figure 41. Typical Application Schematics Current Limit This regulator includes a fold−back current limiting circuit. This type of protection doesn’t limit output current up to specified current capability in normal operation, but when an over current situation occurs, the output voltage and current decrease until the over current condition ends. Typical characteristics of this protection scheme are shown in the Output voltage versus Output current graphs in the characterization section of this datasheet. Input Decoupling Capacitor (C1) A 0.1 mF ceramic input decoupling capacitor should be connected as close as possible to the input and ground pin of the NCP4681/4. Higher values and lower ESR improves line transient response. Output Decoupling Capacitor (C2) A 0.1 mF ceramic output decoupling capacitor is enough to achieve stable operation of the IC. If a tantalum capacitor is used, and its ESR is high, loop oscillation may result. The capacitors should be connected as close as possible to the http://onsemi.com 14 NCP4681, NCP4684 Output Discharger The NCP4681D version includes a transistor between VOUT and GND that is used for faster discharging of the output capacitor. This function is activated when the IC goes into disable mode. on the PCB, the board material, and also the ambient temperature affect the rate of temperature increase for the part. When the device has good thermal conductivity through the PCB the junction temperature will be relatively low in high power dissipation applications. Thermal PCB layout As power across the IC increase, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration Make the VIN and GND line as large as practical. If their impedance is high, noise pickup or unstable operation may result. Connect capacitors C1 and C2 as close as possible to the IC, and make wiring as short as possible. ORDERING INFORMATION Nominal Output Voltage Description Marking Package Shipping† NCP4681DMX29TCG 2.9 V Auto discharge B (fixed)* XDFN0808 (Pb−Free) 10000 / Tape & Reel NCP4681DMX33TCG 3.3 V Auto discharge B (fixed)* XDFN0808 (Pb−Free) 10000 / Tape & Reel NCP4681DMX35TCG 3.5 V Auto discharge B (fixed)* XDFN0808 (Pb−Free) 10000 / Tape & Reel NCP4681HMX35TCG 3.5 V Enable high B (fixed)* XDFN0808 (Pb−Free) 10000 / Tape & Reel NCP4681DSQ15T1G 1.5 V Auto discharge AQ15 SC−70 (Pb−Free) 3000 / Tape & Reel NCP4681DSQ25T1G 2.5 V Auto discharge AQ25 SC−70 (Pb−Free) 3000 / Tape & Reel NCP4681DSQ28T1G 2.8 V Auto discharge AQ28 SC−70 (Pb−Free) 3000 / Tape & Reel NCP4681DSQ33T1G 3.3 V Auto discharge AQ33 SC−70 (Pb−Free) 3000 / Tape & Reel NCP4684EMX25TCG 2.5 V Without Enable B (fixed)* XDFN0808 (Pb−Free) 10000 / Tape & Reel NCP4684EMX33TCG 3.3 V Without Enable B (fixed)* XDFN0808 (Pb−Free) 10000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *Marking codes for XDFN0808 packages are unified. **To order other package and voltage variants, please contact your ON Semiconductor sales representative. http://onsemi.com 15 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE L SCALE 2:1 A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 −B− S 1 2 DATE 17 JAN 2013 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) B M M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 J GENERIC MARKING DIAGRAM* C K H XXXMG G SOLDER FOOTPRINT 0.50 0.0197 XXX = Specific Device Code M = Date Code G = Pb−Free Package 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. mm Ǔ ǒinches STYLE 1: PIN 1. BASE 2. EMITTER 3. BASE 4. COLLECTOR 5. COLLECTOR STYLE 2: PIN 1. ANODE 2. EMITTER 3. BASE 4. COLLECTOR 5. CATHODE STYLE 3: PIN 1. ANODE 1 2. N/C 3. ANODE 2 4. CATHODE 2 5. CATHODE 1 STYLE 4: PIN 1. SOURCE 1 2. DRAIN 1/2 3. SOURCE 1 4. GATE 1 5. GATE 2 STYLE 6: PIN 1. EMITTER 2 2. BASE 2 3. EMITTER 1 4. COLLECTOR 5. COLLECTOR 2/BASE 1 STYLE 7: PIN 1. BASE 2. EMITTER 3. BASE 4. COLLECTOR 5. COLLECTOR STYLE 8: PIN 1. CATHODE 2. COLLECTOR 3. N/C 4. BASE 5. EMITTER STYLE 9: PIN 1. ANODE 2. CATHODE 3. ANODE 4. ANODE 5. ANODE DOCUMENT NUMBER: DESCRIPTION: 98ASB42984B STYLE 5: PIN 1. CATHODE 2. COMMON ANODE 3. CATHODE 2 4. CATHODE 3 5. CATHODE 4 Note: Please refer to datasheet for style callout. If style type is not called out in the datasheet refer to the device datasheet pinout or pin assignment. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. SC−88A (SC−70−5/SOT−353) PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS XDFN4 0.8x0.8, 0.48P CASE 711AB−01 ISSUE O 1 SCALE 4:1 ÉÉ ÉÉ PIN ONE REFERENCE 2X 4X A B D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINALS. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L3 L2 0.06 E 0.05 C DATE 21 OCT 2010 REF DETAIL A 0.05 C 2X TOP VIEW 0.07 (A3) 0.05 C 4X 0.37 A 0.05 C NOTE 4 A1 SIDE VIEW C SEATING PLANE e e/2 DETAIL A 3X L 1 2 4 3 DETAIL B 0.17 DIM A A1 A3 b D D2 E e L L2 L3 GENERIC MARKING DIAGRAM* D2 45 5 MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.10 REF 0.17 0.27 0.80 BSC 0.20 0.30 0.80 BSC 0.48 BSC 0.23 0.33 0.17 0.27 0.01 0.11 1 XM M X = Specific Device Code MM = Date Code 4X b 0.05 M C A B NOTE 3 BOTTOM VIEW *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. RECOMMENDED MOUNTING FOOTPRINT* 4X 0.27 3X 0.44 0.32 PACKAGE OUTLINE 1.00 DETAIL B 0.48 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON53252E XDFN4, 0.8X0.8, 0.48P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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