NCP51145PDR2G

NCP51145 DDR 1.8 Amp Source / Sink VTT Termination Regulator The NCP51145 is a linear regulator designed to supply a regulated VTT termination voltage for DDR−II, DDR−III, LPDDR−III and DDR−IV memory applications. The regulator is capable of actively sourcing and sinking ±1.8 A peak currents while regulating an output voltage to within ±20 mV. The output termination voltage is regulated to track VDDQ / 2 by two external voltage divider resistors connected to the PVCC, GND, and VREF pins. The NCP51145 incorporates a high−speed differential amplifier to provide ultra−fast response to line and load transients. Other features include source/sink current limiting, soft−start and on−chip thermal shutdown protection. www.onsemi.com MARKING DIAGRAMS 8 SOIC−8 EP D SUFFIX CASE 751BU 8 1 Features • • • • • • • • • • • • 1 For DDR VTT Applications, Source/Sink Currents: Supports DDR−II to ±1.8 A, DDR−III to ±1.5 A Supports LPDDR−III and DDR−IV to ±1.2 A Stable Using Ceramic−Only (Very Low ESR) Capacitors Integrated Power MOSFETs High Accuracy VTT Output at Full−Load Fast Transient Response Built−in Soft−Start Shutdown for Standby or Suspend Mode Integrated Thermal and Current−Limit Protection VTT Remote Sense Available in the DFN8 2x2mm Package These Devices are Pb−Free and are RoHS Compliant XXMG G 1 51145 XX M A Y WW G = Specific Device Code = Specific Device Code = Date Code = Assembly Location = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) PIN CONNECTIONS PVCC DDR−II / DR−III / DDR−IV SDRAM Termination Voltage Motherboard, Notebook, and VGA Card Memory Termination Set Top Box, Digital TV, Printers Low Power DDR−3LP 1 DFN8 MN SUFFIX CASE 506AA 1 Typical Applications • • • • 51145 AYWWG G GND VREF VTT 1 8 PVCC VCC NC NC VTT NC VTTS NC VCC VREF GND NC SOIC−8 EP DFN8 2x2, 0.5P (Top Views) 8 ORDERING INFORMATION Package Shipping† NCP51145PDR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel NCP51145MNTAG DFN−8 (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2015 April, 2017 − Rev. 3 1 Publication Order Number: NCP51145/D NCP51145 NCP51145 SO8−EP Package PVCC = 1.0 to 5.5 V* 1 PVCC VCC C2 C3 R2 100k GND VREF R1 100k 2.2 2 3 Enable 5V R4 6 VTT VTT = 0.6 to 2.5 V* 4 C1 C4 R3 EP C1 = 1 to 100 nF Ceramic C2 = 10 mF Ceramic C3 = 1 mF C4 = 10 mF Ceramic R3 = Optional VTT Discharge Resistor N−Ch MOSFET = Optional Enable / Disable *For DDR2: PVCC = 1.8 V, VTT = 0.9 V DDR3: PVCC = 1.5 V, VTT = 0.75 V DDR4: PVCC = 1.2 V, VTT = 0.60 V Figure 1. Application Diagram PIN FUNCTION DESCRIPTION Pin No. SO8−EP Pin No. DFN8 Pin Name 1 1 PVCC Input voltage which supplies current to the output pin. CIN ^ ½ S COUT 2 4 GND Common Ground 3 5 VREF Buffered reference voltage input equal to ½ of VDDQ and active low shutdown pin. An external resistor divider dividing down the PVCC voltage creates the regulated output voltage. Pulling the pin to ground (0.15 V maximum) turns the device off. 4 2 VTT Regulator output voltage capable of sourcing and sinking current while regulating the output rail. COUT = 10 mF Ceramic, or greater 5, 7, 8 3, 7 NC True No Connect 6 8 VCC The VCC pin is a 5 V input pin that provides internal bias to the controller. PVCC should always be kept lower or equal to VCC. − 6 VTTS VTT Sense EP EP EPAD Pad for thermal connection. The exposed pad must be connected to the ground plane using multiple vias for maximum power dissipation performance. Description www.onsemi.com 2 NCP51145 ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit PVCC, VCC −0.3 to 6 V Output Voltage Range VTT −0.3 to 6 V Reference Input Range VREF −0.3 to 6 V Maximum Junction Temperature TJ(max) 150 °C Storage Temperature Range TSTG −65 to 150 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2 kV ESD Capability, Machine Model (Note 2) ESDMM 200 V TSLD 260 °C Input Supply Voltage Range (Vcc w PVCC) (Note 1) Lead Temperature Soldering Reflow (SMD Styles Only), Pb−Free Versions (Note 3) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) Latchup Current Maximum Rating: ≤150 mA per JEDEC standard: JESD78 3. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D THERMAL CHARACTERISTICS Rating Symbol Value Unit °C/W Thermal Characteristics, SO8−EP (Note 4) Thermal Resistance, Junction−to−Air (Note 5) Thermal Reference, Junction−to−Lead2 (Note 5) 82 TBD RqJA RYJL 4. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area. 5. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate. OPERATING RANGES (Note 6) Rating Input Voltage Bias Supply Voltage Ambient Temperature Symbol Min Max Unit PVCC 1.0 5.5 V VCC 4.75 5.25 V TA −40 85 °C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 6. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. www.onsemi.com 3 NCP51145 ELECTRICAL CHARACTERISTICS PVCC = 1.8 V / 1.5 V; VCC = 5 V; VREF = 0.9 V / 0.75 V; CTT = 10 mF (Ceramic), TA = +25°C, unless otherwise specified. Parameter Test Conditions Symbol Min Typ Max Unit Iout = 0 A VOS −16 − +16 mV Regload −4 − +4 mV Iout = 0 A IBIAS − 1 2.5 mA VREF < 0.2 V (Shutdown), RLOAD = 180W ISTB − 2 90 mA 2 − 3.5 1.5 − 3.5 REGULATOR OUTPUT Output Offset Voltage Iout = ±1.8 A, PVCC = 1.8 V, VREF = 0.9 V Load Regulation Iout = ±1.5 A, PVCC = 1.5 V, VREF = 0.75 V Iout = ±1.2 A, PVCC = 1.35 V, VREF = 0.675 V Iout = ±1.2 A, PVCC = 1.2 V, VREF = 0.6 V INPUT AND STANDBY CURRENTS Bias Supply Current Standby Current CURRENT LIMIT PROTECTION Current Limit PVCC = 1.8 V, VREF = 0.9 V PVCC = 1.5 V, VREF = 0.75 V ILIM A SHUTDOWN THRESHOLDS Enable VIH 0.45 − − Shutdown VIL − − 0.15 Thermal Shutdown Temperature VCC = 5 V TSD − 125 − °C Thermal Shutdown Hysteresis VCC = 5 V TSH − 35 − °C Shutdown Threshold Voltage V THERMAL SHUTDOWN Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 4 NCP51145 PACKAGE DIMENSIONS SOIC8−NB EP CASE 751BU ISSUE E D A 8 NOTE 5 F 2X 0.10 C D 5 NOTE 6 A1 E E1 NOTE 4 L2 L 2X 4 TIPS 0.20 C 4 1 NOTE 5 8X B TOP VIEW b 0.25 M C A-B D 2X D DETAIL A 8X 0.10 C A SEATING PLANE 0.10 C A-B NOTE 4 0.10 C C DETAIL A h B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.10mm IN EXCESS OF MAXIMUM MATERIAL CONDITION. 4. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15mm PER SIDE. DIMENSION E DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25mm PER SIDE. DIMENSIONS D AND E ARE DETERMINED AT DATUM F. 5. DIMENSIONS A AND B ARE TO BE DETERMINED AT DATUM F. 6. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 7. TAB CONTOUR MAY VARY MINIMALLY TO INCLUDE TOOLING FEATURES. DIM A A1 b b1 c c1 D E E1 e F G h L L2 B e C SIDE VIEW END VIEW SEATING PLANE NOTE 7 F ÇÇÇ ÇÇÇ ÉÉÉ ÇÇÇ ÉÉÉ b b1 G c c1 SECTION B−B BOTTOM VIEW MILLIMETERS MIN MAX 1.35 1.75 0.00 0.10 0.31 0.51 0.28 0.48 0.17 0.25 0.17 0.23 4.90 BSC 6.00 BSC 3.90 BSC 1.27 BSC 1.55 2.39 1.55 2.39 0.25 0.50 0.40 1.27 0.25 BSC RECOMMENDED SOLDERING FOOTPRINT* 2.60 2.60 8X 1.52 7.00 1 8X 0.76 1.27 PITCH DIMENSION: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN8 2x2, 0.5P CASE 506AA ISSUE F DATE 04 MAY 2016 1 SCALE 4:1 D PIN ONE REFERENCE 2X 0.10 C 2X 0.10 C A B L1 ÇÇ ÇÇ ÇÇ DETAIL A E OPTIONAL CONSTRUCTIONS ÉÉ ÇÇ ÉÉ ÇÇ EXPOSED Cu TOP VIEW A DETAIL B 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L DIM A A1 A3 b D D2 E E2 e K L L1 ÉÉ ÉÉ ÇÇ A3 MOLD CMPD A1 DETAIL B 0.08 C (A3) NOTE 4 SIDE VIEW DETAIL A ALTERNATE CONSTRUCTIONS A1 C D2 8X 4 1 SEATING PLANE RECOMMENDED SOLDERING FOOTPRINT* L 5 8 e/2 e 8X 0.90 b 0.05 C 8X 0.50 2.30 1 0.10 C A B 8X 0.30 NOTE 3 BOTTOM VIEW 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. GENERIC MARKING DIAGRAM* 1 1.30 PACKAGE OUTLINE E2 K MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.70 0.90 0.50 BSC 0.30 REF 0.25 0.35 −−− 0.10 XXMG G XX = Specific Device Code M = Date Code G = Pb−Free Device *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. DOCUMENT NUMBER: DESCRIPTION: 98AON18658D Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. DFN8, 2.0X2.0, 0.5MM PITCH PAGE 1 OF 1 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2016 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative