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NCP561SN25T1G

NCP561SN25T1G

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    SOT23-5

  • 描述:

    IC REG LINEAR 2.5V 150MA 5TSOP

  • 数据手册
  • 价格&库存
NCP561SN25T1G 数据手册
NCP561 150 mA CMOS Low Iq Low-Dropout Voltage Regulator The NCP561 series of fixed output low dropout linear regulators are designed for handheld communication equipment and portable battery powered applications which require low quiescent. The NCP561 series features an ultralow quiescent current of 3.0 A. Each device contains a voltage reference unit, an error amplifier, a PMOS power transistor, resistors for setting output voltage, current limit, and temperature limit protection circuits. The NCP561 has been designed to be used with low cost ceramic capacitors and requires a minimum output capacitor of 1.0 F. The device is housed in the micro-miniature TSOP-5 surface mount package. Standard voltage versions are 1.5 V, 1.8 V, 2.5 V, 2.7 V, 2.8 V, 3.0 V, 3.3 V and 5.0 V. http://onsemi.com 5 1 TSOP-5 SN SUFFIX CASE 483 PIN CONNECTIONS AND MARKING DIAGRAM Features VIN 1 GND 2 Enable 3 XXXAYWG G •Low Quiescent Current of 3.0 A Typical •Low Dropout Voltage of 170 mV at 150 mA •Low Output Voltage Option •Output Voltage Accuracy of 2.0% •Industrial Temperature Range of -40°C to 85°C •Pb-Free Packages are Available 5 VOUT 4 N/C (Top View) Typical Applications XXX A Y W G •Battery Powered Instruments •Hand-Held Instruments •Camcorders and Cameras = Specific Device Code = Assembly Location = Year = Work Week = Pb-Free Package (Note: Microdot may be in either location) VIN VOUT 1 5 Thermal Shutdown ORDERING INFORMATION Driver w/ Current Limit See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. Enable ON 3 OFF GND 2 This device contains 28 active transistors Figure 1. Representative Block Diagram © Semiconductor Components Industries, LLC, 2007 August, 2007 - Rev. 5 1 Publication Order Number: NCP561/D NCP561 ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ PIN FUNCTION DESCRIPTION Pin No. Pin Name 1 VIN 2 GND 3 Enable 4 N/C 5 VOUT Description Positive power supply input voltage. Power supply ground. This input is used to place the device into low-power standby. When this input is pulled low, the device is disabled. If this function is not used, Enable should be connected to VIN. No internal connection. Regulated output voltage. MAXIMUM RATINGS Rating Symbol Value Unit VIN 6.0 V Enable Voltage Enable -0.3 to VIN +0.3 V Output Voltage VOUT -0.3 to VIN +0.3 V Power Dissipation and Thermal Characteristics Power Dissipation Thermal Resistance, Junction-to-Ambient PD RJA Internally Limited 250 W °C/W Operating Junction Temperature TJ +150 °C Operating Ambient Temperature TA -40 to +85 °C Storage Temperature Tstg -55 to +150 °C Input Voltage Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL-STD-883, Method 3015 Machine Model Method 200 V 2. Latchup capability (85°C) "100 mA DC with trigger voltage. http://onsemi.com 2 NCP561 ELECTRICAL CHARACTERISTICS (VIN = VOUT(nom) + 1.0 V, Venable = VIN, CIN = 1.0 F, COUT = 1.0 F, TJ = 25°C, unless otherwise noted.) Characteristic Symbol Output Voltage (TA = 25°C, IOUT = 1.0 mA) 1.5 V 1.8 V 2.5 V 2.7 V 2.8 V 3.0 V 3.3 V 5.0 V Min Typ Max 1.455 1.746 2.425 2.646 2.744 2.940 3.234 4.90 1.5 1.8 2.5 2.7 2.8 3.0 3.3 5.0 1.545 1.854 2.575 2.754 2.856 3.060 3.366 5.10 - 10 10 20 20 - 30 60 150 150 - - VOUT Line Regulation 1.5 V-4.4 V (VIN = Vo(nom) + 1.0 V to 6.0 V) 4.5 V-5.0 V (VIN = 5.5 V to 6.0 V) Regline Load Regulation (IOUT = 10 mA to 150 mA) Regload Output Current (VOUT = (VOUT at Iout = 150 mA) -3.0%) 1.5 V to 3.9 V (VIN = Vo(nom) + 2.0 V) 4.0 V to 5.0 V (VIN = 6.0 V) Io(nom) Dropout Voltage (TA = -40°C to 85°C, IOUT = 150 mA, Measured at VOUT - 3.0%) 1.5 V - 1.7 V 1.8 V - 2.4 V 2.5 V - 2.7 V 2.8 V - 3.2 V 3.3 V - 4.9 V 5.0 V V mV mV - 330 240 150 140 130 120 500 360 250 230 200 190 - 0.1 4.0 1.0 8.0 160 160 400 400 800 800 - 60 - 1.3 - - 0.2 - "100 - A IQ Output Short Circuit Current 1.5 V to 3.9 V (VIN = Vo(nom) + 2.0 V) 4.0 V to 5.0 V (VIN = 6.0 V) IOUT(max) Output Voltage Noise (f = 20 Hz to 100 kHz, VOUT = 3.0, V IOUT = 1.0 V) Vn Enable Input Threshold Voltage (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Vth(en) Output Voltage Temperature Coefficient TC mA T *TA PD + J(max) RJA 4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 3 Vrms V 3. Maximum package power dissipation limits must be observed. http://onsemi.com mV mA VIN-VOUT Quiescent Current (Enable Input = 0 V) (Enable Input = VIN, IOUT = 1.0 mA to Io(nom)) Unit ppm/°C NCP561 180 160 3.015 VOUT = 3.0 V VOUT, OUTPUT VOLTAGE (V) VIN - VOUT, DROPOUT VOLTAGE (mV) TYPICAL CHARACTERISTICS 140 150 mA Load 120 100 100 mA Load 80 60 40 50 mA Load 20 0 -50 -25 0 25 50 75 100 IOUT = 10 mA 3.010 3.005 VIN = 6.0 V 3.000 VIN = 4.0 V 2.995 2.990 2.985 2.980 2.975 -50 125 0 Figure 2. Dropout Voltage vs. Temperature 4.5 4.50 Iq, QUIESCENT CURRENT (A) Iq, QUIESCENT CURRENT (A) IOUT = 10 mA VIN = 4.0 V 4.25 4.00 3.75 3.50 3.25 3.00 -50 0 3.5 3.0 2.5 2.0 1.5 100 50 VOUT = 3.0 V IOUT = 0 mA TA = 25°C 4.0 1 0 2 TEMPERATURE (C°) 3 4 6 5 TEMPERATURE (C°) Figure 4. Quiescent Current vs. Temperature Figure 5. Quiescent Current vs. Input Voltage 4.0 OUTPUT NOISE VOLTAGE (V/ǰHz) 5.0 IGND, GROUND PIN CURRENT (A) 100 Figure 3. Output Voltages vs. Temperature 4.75 VOUT = 3.0 V IOUT = 50 mA TA = 25°C 4.5 4.0 3.5 3.0 2.5 2.0 1.5 50 TEMPERATURE (C°) TEMPERATURE (C°) 0 1 2 3 4 3.0 2.5 2.0 1.0 mA 1.5 1.0 150 mA 0.5 0 10 6 5 3.5 VIN, INPUT VOLTAGE (V) 100 1k 10 k 100 k NOISE CHARACTERIZATION Figure 7. Output Noise Voltage Figure 6. Ground Current vs. Input Voltage http://onsemi.com 4 1000 k NCP561 CHANGE IN OUTPUT VOLTAGE (mV) 60 50 40 IOUT = 10 mA COUT = 1.0 F 400 0 -200 -400 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 TIME (s) 1.6 0 VIN = 4.0 V VOUT = 3.0 V CIN = 1.0 F COUT = 10 F Al. Elec. Surface Mount -50 -100 -150 -200 -250 200 IOUT, OUTPUT CURRENT (mA) CHANGE IN OUTPUT VOLTAGE (mV) VIN, INPUT VOLTAGE (mV) TYPICAL CHARACTERISTICS 1.8 2.0 150 100 50 0 0 ENABLE VOLTAGE (V) 0 -50 VIN = 4.0 V VOUT = 3.0 V CIN = 1.0 F COUT = 10 F Tantalum -100 -150 -200 -250 150 100 50 0 600 TIME (s) 800 1000 1200 4 2 0 3 CIN = 1.0 F COUT = 1.0 F IOUT = 10 mA 2 1 0 0 200 400 600 TIME (s) 800 1000 1200 0 200 Figure 10. Load Transient Response 400 3.0 2.5 CIN = 1.0 F COUT = 1.0 F TA = 25°C VENABLE = VIN 2.0 1.5 1.0 0.5 0 0 1 600 800 1000 1200 1400 1600 TIME (s) Figure 11. Turn-On Response 3.5 VOUT, OUTPUT VOLTAGE (V) IOUT, OUTPUT CURRENT (mA) 400 Figure 9. Load Transient Response VOUT, OUTPUT VOLTAGE (V) CHANGE IN OUTPUT VOLTAGE (mV) Figure 8. Line Transient Response 200 4 2 3 VIN, INPUT VOLTAGE (V) 5 Figure 12. Output Voltage vs. Input Voltage http://onsemi.com 5 6 NCP561 DEFINITIONS Load Regulation Line Regulation The change in output voltage for a change in output current at a constant temperature. The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected. Dropout Voltage The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 3.0% below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Line Transient Response Typical over and undershoot response when input voltage is excited with a given slope. Thermal Protection Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 160°C, the regulator turns off. This feature is provided to prevent failures from accidental overheating. Maximum Power Dissipation The maximum total dissipation for which the regulator will operate within its specifications. Quiescent Current The quiescent current is the current which flows through the ground when the LDO operates without a load on its output: internal IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current. It is actually the difference between the input current (measured through the LDO input pin) and the output current. Maximum Package Power Dissipation The maximum power package dissipation is the power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 125°C. Depending on the ambient power dissipation and thus the maximum available output current. http://onsemi.com 6 NCP561 APPLICATIONS INFORMATION Thermal A typical application circuit for the NCP561 series is shown in Figure 13. As power across the NCP561 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material and also the ambient temperature effect the rate of temperature rise for the part. This is stating that when the NCP561 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. The maximum dissipation the package can handle is given by: Input Decoupling (C1) A 1.0 F capacitor either ceramic or tantalum is recommended and should be connected close to the NCP561 package. Higher values and lower ESR will improve the overall line transient response. TDK capacitor: C2012X5R1C105K, or C1608X5R1A105K Output Decoupling (C2) The NCP561 is a stable Regulator and does not require any specific Equivalent Series Resistance (ESR) or a minimum output current. Capacitors exhibiting ESRs ranging from a few m up to 3.0  can thus safely be used. The minimum decoupling value is 1.0 F and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices. Larger values improve noise rejection and load regulation transient response. TDK capacitor: C2012X5R1C105K, or C1608X5R1A105K, or C3216X7R1C105K T *TA PD + J(max) RJA If junction temperature is not allowed above the maximum 125°C, then the NCP561 can dissipate up to 400 mW @ 25°C. The power dissipated by the NCP561 can be calculated from the following equation: Ptot + [Vin * Ignd(Iout)] ) [Vin * Vout] * Iout or Enable Operation ) VOUT * IOUT P VINMAX + TOT IGND ) IOUT The enable pin will turn on the regulator when pulled high and turn off the regulator when pulled low. These limits of threshold are covered in the electrical specification section of this data sheet. If the enable is not used then the pin should be connected to VIN. If a 150 mA output current is needed then the ground current from the data sheet is 4.0 A. For an NCP561SN30T1 (3.0 V), the maximum input voltage will then be 5.6 V. Hints Battery or Unregulated Voltage Please be sure the VIN and GND lines are sufficiently wide. When the impedance of these lines is high, there is a chance to pick up noise or cause the regulator to malfunction. Set external components, especially the output capacitor, as close as possible to the circuit, and make leads a short as possible. C1 + 1 + 2 ON 3 4 OFF Figure 13. Typical Application Circuit http://onsemi.com 7 VOUT 5 C2 NCP561 APPLICATION CIRCUITS Input R1 Input Q1 Q1 R2 R Output R3 5 1 1.0 F Q2 1.0 F 2 3 Output 5 1 1.0 F 4 1.0 F 2 3 Figure 14. Current Boost Regulator Figure 15. Current Boost Regulator with Short Circuit Limit The NCP561 series can be current boosted with a PNP transist‐ or. Resistor R in conjunction with VBE of the PNP determines when the pass transistor begins conducting; this circuit is not short circuit proof. Input/Output differential voltage minimum is increased by VBE of the pass resistor. Input 4 Short circuit current limit is essentially set by the VBE of Q2 and R1. ISC = ((VBEQ2 - ib * R2) / R1) + IO(max) Regulator Output 1 5 1.0 F 1.0 F 2 Enable 3 4 Input 1 5 1.0 F R 1.0 F Output Q1 Output 1 1.0 F 5 1.0 F 2 2 3 3 R 4 5.6 V 4 C Figure 16. Delayed Turn-on Figure 17. Input Voltages Greater than 6.0 V If a delayed turn-on is needed during power up of several voltages then the above schematic can be used. Resistor R, and capacitor C, will delay the turn-on of the bottom regulator. A regulated output can be achieved with input voltages that exceed the 6.0 V maximum rating of the NCP561 series with the addition of a simple pre-regulator circuit. Care must be taken to prevent Q1 from overheating when the regulated output (VOUT) is shorted to GND. http://onsemi.com 8 NCP561 ORDERING INFORMATION Nominal Output Voltage Marking Package NCP561SN15T1 1.5 LDA TSOP-5 NCP561SN15T1G 1.5 LDA TSOP-5 (Pb-Free) NCP561SN18T1 1.8 LEV TSOP-5 NCP561SN18T1G 1.8 LEV TSOP-5 (Pb-Free) NCP561SN25T1 2.5 LDC TSOP-5 NCP561SN25T1G 2.5 LDC TSOP-5 (Pb-Free) NCP561SN27T1 2.7 LEX TSOP-5 NCP561SN27T1G 2.7 LEX TSOP-5 (Pb-Free) NCP561SN28T1 2.8 LDD TSOP-5 NCP561SN28T1G 2.8 LDD TSOP-5 (Pb-Free) NCP561SN30T1 3.0 LDE TSOP-5 NCP561SN30T1G 3.0 LDE TSOP-5 (Pb-Free) NCP561SN33T1 3.3 LDF TSOP-5 NCP561SN33T1G 3.3 LDF TSOP-5 (Pb-Free) NCP561SN50T1 5.0 LDH TSOP-5 NCP561SN50T1G 5.0 LDH TSOP-5 (Pb-Free) Device Shipping† 3000 / 7″ Tape & Reel NOTE: Additional voltages are available upon request by contacting your ON Semiconductor representative. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 9 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSOP−5 CASE 483 ISSUE N 5 1 SCALE 2:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION A. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. D 5X NOTE 5 2X DATE 12 AUG 2020 0.20 C A B 0.10 T M 2X 0.20 T 5 B 1 4 2 B S 3 K DETAIL Z G A A TOP VIEW DIM A B C D G H J K M S DETAIL Z J C 0.05 H C SIDE VIEW SEATING PLANE END VIEW GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT* 0.95 0.037 MILLIMETERS MIN MAX 2.85 3.15 1.35 1.65 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 0_ 10 _ 2.50 3.00 1.9 0.074 5 5 XXXAYWG G 1 1 Analog 2.4 0.094 XXX = Specific Device Code A = Assembly Location Y = Year W = Work Week G = Pb−Free Package 1.0 0.039 XXX MG G Discrete/Logic XXX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) 0.7 0.028 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98ARB18753C TSOP−5 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative
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