NCP562SQ25T1G

NCP562, NCV562, NCP563, NCV563 Voltage Regulator - CMOS Low Iq, Low-Dropout 80 mA www.onsemi.com This series of fixed output low−dropout linear regulators are designed for handheld communication equipment and portable battery powered applications which require low quiescent. This series features an ultra−low quiescent current of 2.5 A. Each device contains a voltage reference unit, an error amplifier, a PMOS power transistor, resistors for setting output voltage, current limit, and temperature limit protection circuits. The NCP562 series provides an enable pin for ON/OFF control. The NCP562/NCP563 has been designed to be used with low cost ceramic capacitors and requires a minimum output capacitor of 0.1 F. The device is housed in the micro−miniature SC82−AB surface mount package. Standard voltage versions are 1.5, 1.8, 2.1, 2.5, 2.7, 2.8, 3.0, 3.3, 3.5 and 5.0 V. Other voltages are available in 100 mV steps. 4 1 SC82−AB (SC70−4) SQ SUFFIX CASE 419C PIN CONNECTIONS & MARKING DIAGRAMS Features GND 1 Vin 2 4 Enable 3 Vout (NCP562 Top View) GND 1 Vin 2 Typical Applications 4 N/C xxxM G G • Low Quiescent Current of 2.5 A Typical Low Output Voltage Option Output Voltage Accuracy of 2.0% Temperature Range of −40°C to 85°C NCP562 Provides an Enable Pin NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant xxxM G G • • • • • • 3 Vout (NCP563 Top View) • Battery Powered Instruments • Hand−Held Instruments • Camcorders and Cameras xxx M G = Specific Device Code = Month Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position and underbar may vary depending upon manufacturing location. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. © Semiconductor Components Industries, LLC, 2015 October, 2019 − Rev. 15 1 Publication Order Number: NCP562/D NCP562, NCV562, NCP563, NCV563 ON GND Enable OFF Input C1 Output Vout Vin + + C2 This device contains 28 active transistors Figure 1. NCP562 Typical Application Diagram Input C1 GND N/C Vin Vout + Output + C2 This device contains 28 active transistors Figure 2. NCP563 Typical Application Diagram ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ PIN FUNCTION DESCRIPTION NCP562 NCP563 Pin Name Description 1 1 GND 2 2 Vin Positive power supply input voltage. 3 3 Vout Regulated output voltage. 4 − Enable − 4 N/C Power supply ground. This input is used to place the device into low−power standby. When this input is pulled low, the device is disabled. If this function is not used, Enable should be connected to Vin. No internal connection. MAXIMUM RATINGS ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Rating Symbol Value Unit Vin 6.0 V Enable −0.3 to Vin +0.3 V Output Voltage Vout −0.3 to Vin +0.3 V Power Dissipation and Thermal Characteristics Power Dissipation Thermal Resistance, Junction−to−Ambient PD RJA Internally Limited 400 W °C/W Operating Junction Temperature TJ +150 °C Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −55 to +150 °C Input Voltage Enable Voltage (NCP562 ONLY) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL−STD−883, Method 3015 Machine Model Method 200 V 2. Latch up capability (85°C) "100 mA DC with trigger voltage. www.onsemi.com 2 NCP562, NCV562, NCP563, NCV563 ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Venable = Vin, Cin = 1.0 F, Cout = 1.0 F, TJ = 25°C, unless otherwise noted.) Characteristic Symbol Output Voltage (TA = 25°C, Iout = 1.0 mA) 1.5 V 1.8 V 2.1 V 2.5 V 2.7 V 2.8 V 3.0 V 3.3 V 3.5 V 5.0 V Min Typ Max 1.455 1.746 2.037 2.425 2.646 2.744 2.940 3.234 3.43 4.9 1.5 1.8 2.1 2.5 2.7 2.8 3.0 3.3 3.5 5.0 1.545 1.854 2.163 2.575 2.754 2.856 3.060 3.366 3.57 5.1 − − 10 10 20 20 − 20 40 80 80 280 280 − − Vout Line Regulation 1.5 V−4.4 V (Vin = Vo(nom.) + 1.0 V to 6.0 V 4.5 V−5.0 V (Vin = 5.5 V to 6.0 V) Regline Load Regulation (Iout = 10 mA to 80 mA) Regload Output Current (Vout = (Vout at Iout = 80 mA) −3.0%) 1.5 V to 3.9 V (Vin = Vout(nom.) + 2.0 V) 4.0 V−5.0 V (Vin = 6.0 V) Io(nom.) Dropout Voltage (TA = −40°C to 85°C, Iout = 80 mA, Measured at Vout −3.0%) 1.5 V−1.7 V 1.8 V−2.4 V 2.5 V−2.6 V 2.7 V−2.9 V 3.0 V−3.2 V 3.3 V−4.9 V 5.0 V Vin−Vout Quiescent Current (Enable Input = 0 V) (Enable Input = Vin, Iout = 1.0 mA to Io(nom.)) IQ Output Short Circuit Current 1.5 V to 3.9 V (Vin = Vnom + 2.0 V) 4.0 V−5.0 V (Vin = 6.0 V) V mV Vn Enable Input Threshold Voltage (NCP562 ONLY) (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) mV − − − − − − − 550 400 250 230 200 190 140 800 550 400 400 350 350 250 − − 0.1 2.5 1.0 6.0 150 150 300 300 600 600 − 100 − 1.3 − − − − 0.3 TC − "100 − T *TA PD + J(max) RJA 4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 3 Vrms V 3. Maximum package power dissipation limits must be observed. www.onsemi.com A mA Vth(en) Output Voltage Temperature Coefficient mV mA Iout(max) Output Voltage Noise (f = 100 Hz to 100 kHz, Vout = 3.0 V) Unit ppm/°C NCP562, NCV562, NCP563, NCV563 3 VIN = 4.0 V VOUT = 3.0 V IOUT = 0 mA 2.7 IQ, QUIESCENT CURRENT (A) IQ, QUIESCENT CURRENT (A) 2.9 2.5 2.3 2.1 1.9 VOUT = 3.0 V 2.5 2 1.5 1 0.5 0 1.7 −60 −40 −20 0 20 40 60 0 100 80 1 T, TEMPERATURE (°C) 3 VIN = 6.0 V 3.010 3.005 3.000 VIN = 4.0 V IOUT = 30 mA 2 1.5 1 0.5 0 −40 0 −20 20 40 60 80 100 0 1 2 3 4 5 T, TEMPERATURE (°C) VIN, INPUT VOLTAGE (V) Figure 5. Output Voltage versus Temperature Figure 6. Output Voltage versus Input Voltage 300 VOUT(nom) = 3.0 V 250 80 mA LOAD 200 150 6 4 2 VIN = 4.0 V CIN = 1.0 F 0 3 40 mA LOAD 100 50 0 6 2.5 ENABLE VOLTAGE (V) VIN − VOUT, DROPOUT VOLTAGE (mV) VOUT, OUTPUT VOLTAGE (V) 3.015 VOUT, OUTPUT VOLTAGE (V) VOUT, OUTPUT VOLTAGE (V) 3.5 2.990 −60 5 4 Figure 4. Quiescent Current versus Input Voltage 3.020 2.995 3 VIN, INPUT VOLTAGE (V) Figure 3. Quiescent Current versus Temperature VOUT(nom) = 3.0 V IOUT = 10 mA 2 10 mA LOAD −50 −25 0 25 50 75 100 1 0 125 COUT = 0.1 F IOUT = 10 mA 2 0 T, TEMPERATURE (°C) 50 100 150 200 250 300 350 400 t, TIME (s) Figure 7. Dropout Voltage versus Temperature Figure 8. Turn−On Response (NCP562 ONLY) www.onsemi.com 4 IOUT, OUTPUT CURRENT (mA) 6 5 4 3 1 OUTPUT VOLTAGE DEVIATION (V) OUTPUT VOLTAGE DEVIATION (V) VIN, INPUT VOLTAGE (V) NCP562, NCV562, NCP563, NCV563 0.5 0 VOUT = 3.0 V COUT = 0.1 F IOUT = 10 mA −0.5 −1 0 100 150 200 250 300 350 400 t, TIME (s) 50 60 IOUT = 1 mA to 30 mA VIN = 4.0 V 30 0 −30 1 VOUT = 3.0 V COUT = 0.1 F 0.5 0 −0.5 450 500 −1 0 60 IOUT = 1 mA to 30 mA VIN = 4.0 V 30 0 −30 400 200 0 COUT = 1.0 F VOUT = 3.0 V −200 −400 0 100 200 100 150 200 250 300 350 400 t, TIME (s) 450 500 Figure 10. Load Transient Response 300 400 500 600 700 800 900 1000 t, TIME (s) Vn, OUTPUT VOLTAGE NOISE (mV/√Hz) OUTPUT VOLTAGE DEVIATION (mV) IOUT, OUTPUT CURRENT (mA) Figure 9. Line Transient Response 50 3.5 VIN = 5.0 V VOUT = 3.0 V IOUT = 50 mA COUT = 0.1 F 3 2.5 2 1.5 1 0.5 0 0.01 Figure 11. Load Transient Response 0.1 1 10 f, FREQUENCY (kHz) 100 1000 Figure 12. Output Voltage Noise DEFINITIONS Load Regulation Line Regulation The change in output voltage for a change in output current at a constant temperature. The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected. Dropout Voltage The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 3.0% below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Line Transient Response Typical over and undershoot response when input voltage is excited with a given slope. Thermal Protection Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 160°C, the regulator turns off. This feature is provided to prevent failures from accidental overheating. Maximum Power Dissipation The maximum total dissipation for which the regulator will operate within its specifications. Quiescent Current The quiescent current is the current which flows through the ground when the LDO operates without a load on its output: internal IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current. It is actually the difference between the input current (measured through the LDO input pin) and the output current. Maximum Package Power Dissipation The maximum power package dissipation is the power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 125°C. Depending on the ambient power dissipation and thus the maximum available output current. www.onsemi.com 5 NCP562, NCV562, NCP563, NCV563 APPLICATIONS INFORMATION Place external components, especially the output capacitor, as close as possible to the circuit, and make leads as short as possible. A typical application circuit for the NCP562 and NCP563 series are shown in Figure 1 and Figure 2. Input Decoupling (C1) A 1.0 F capacitor either ceramic or tantalum is recommended and should be connected close to the NCP562 package. Higher values and lower ESR will improve the overall line transient response. TDK capacitor: C2012X5R1C105K, or C1608X5R1A105K Thermal As power across the NCP562 and NCP563 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material and also the ambient temperature effect the rate of temperature rise for the part. This is stating that when the devices have good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. The maximum dissipation the package can handle is given by: Output Decoupling (C2) The NCP562 and NCP563 are very stable regulators and do not require any specific Equivalent Series Resistance (ESR) or a minimum output current. Capacitors exhibiting ESRs ranging from a few m up to 10  can thus safely be used. The minimum decoupling value is 0.1 F and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices. Larger values improve noise rejection and load regulation transient response. TDK capacitor: C2012X5R1C105K, C1608X5R1A105K, or C3216X7R1C105K T *TA PD + J(max) RJA If junction temperature is not allowed above the maximum 125°C, then the NCP562 and NCP563 can dissipate up to 250 mW @ 25°C. The power dissipated by the NCP562 and NCP563 can be calculated from the following equation: Enable Operation (NCP562 ONLY) The enable pin will turn on the regulator when pulled high and turn off the regulator when pulled low. These limits of threshold are covered in the electrical specification section of this data sheet. If the enable is not used, then the pin should be connected to Vin. Ptot + ƪVin * Ignd (Iout)ƫ ) [Vin * Vout] * Iout or P ) Vout * Iout VinMAX + tot Ignd ) Iout Hints If an 80 mA output current is needed then the ground current from the data sheet is 2.5 A. For an NCP562 or NCP563 (3.0 V), the maximum input voltage will then be 6.0 V. Please be sure the Vin and GND lines are sufficiently wide. When the impedance of these lines is high, there is a chance to pick up noise or cause the regulator to malfunction. www.onsemi.com 6 NCP562, NCV562, NCP563, NCV563 ORDERING INFORMATION Nominal Output Voltage Marking NCP562SQ15T1G 1.5 LDI NCP562SQ18T1G 1.8 LEY NCP562SQ21T1G 2.1 AAA Device NCP562SQ25T1G NCV562SQ25T1G* LEZ NCP562SQ28T1G 2.8 LDL NCP562SQ30T1G 3.0 LDM AAE 3.5 LJU NCP562SQ50T1G 5.0 LDP 1.5 LDQ 1.8 LFA NCP563SQ25T1G 2.5 LDS NCP563SQ27T1G 2.7 LFB NCP563SQ28T1G 2.8 LDT 3.0 LDU 3.3 LDV 5.0 LDX NCV563SQ15T1G* NCP563SQ18T1G NCV563SQ18T1G* NCP563SQ30T1G NCV563SQ30T1G* NCP563SQ33T1G NCV563SQ33T1G* NCP563SQ50T1G 3000 / Tape & Reel LDN 3.3 NCP562SQ35T1G NCP563SQ15T1G SC82−AB AAG 2.7 NCV562SQ33T1G* Shipping† LDK 2.5 NCP562SQ27T1G NCP562SQ33T1G Package †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable www.onsemi.com 7 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SC−82AB CASE 419C−02 ISSUE F DATE 22 JUN 2012 SCALE 4:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. 419C−01 OBSOLETE. NEW STANDARD IS 419C−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A G C D 3 PL N 3 4 K B S 1 2 H J F L 0.05 (0.002) 0.90 0.035 0.70 0.028 INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.008 0.016 0.012 0.020 0.043 0.059 0.000 0.004 0.004 0.010 0.004 −−− 0.002 BSC 0.008 REF 0.07 0.09 XXX M G 0.65 0.026 0.95 0.037 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.20 0.40 0.30 0.50 1.10 1.50 0.00 0.10 0.10 0.26 0.10 −−− 0.05 BSC 0.20 REF 1.80 2.40 GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT* 1.30 0.0512 DIM A B C D F G H J K L N S 1 XXX = Specific Device Code M = Month Code G = Pb−Free Package 1.90 0.075 SCALE 10:1 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98ARB18939C SC−82AB Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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