NCP565_10

NCP565/NCV565 1.5 A Low Dropout Linear Regulator The NCP565/NCV565 low dropout linear regulator will provide 1.5 A at a fixed output voltage or an adjustable voltage down to 0.9 V. The fast loop response and low dropout voltage make this regulator ideal for applications where low voltage and good load transient response are important. Device protection includes current limit, short circuit protection, and thermal shutdown. Features http://onsemi.com MARKING DIAGRAMS 1 2 D2PAK 3 CASE 936 FIXED NC y565D2Txx AWLYWWG • • • • • • • • • • • • • • • Ultra Fast Transient Response (t1.0 ms) Low Ground Current (1.5 mA at Iload = 1.5 A) Low Dropout Voltage (0.9 V at Iload = 1.5 A) Low Noise (28 mVrms) 0.9 V Reference Voltage Adjustable Output Voltage from 7.7 V down to 0.9 V 1.2 V, 1.5 V, 2.8 V, 3.0 V, 3.3 V Fixed Output Versions. Other Fixed Voltages Available on Request Current Limit Protection (3.3 A Typ) Thermal Shutdown Protection (160°C) NCV Prefix for Automotive and Other Applications Requiring Site and Change Controls Pb−Free Packages are Available 3 Tab = Ground Pin 1. Vin 2. Ground 3. Vout 1 5 D2PAK 5 CASE 936A ADJUSTABLE NC y565D2T AWLYWWG Typical Applications Tab = Ground Pin 1. N.C. 2. Vin 3. Ground 4. Vout 5. Adj Servers ASIC Power Supplies Post Regulation for Power Supplies Constant Current Source xx xx y A WL Y WW G = 12 or 33 = P or V = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free P565 MNxx AYWWG G DFN6, 3x3.3 CASE 506AX 1 = Voltage Rating AJ = Adjustable 12 = 1.2 V 30 = 3.0V 15 = 1.5 V 33 = 3.3 V 28 = 2.8 V SOT−223 CASE 318E 1 yy A Y W G = Voltage Rating 12 = 1.2 V = Assembly Location = Year = Work Week = Pb−Free Package AYW 565yy G G Tab = Vout Pin 1. Ground 2. Vout 3. Vin (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 13 of this data sheet. © Semiconductor Components Industries, LLC, 2010 November, 2010 − Rev. 15 1 Publication Order Number: NCP565/D NCP565/NCV565 Vin Vin NCP565 GND Cin Cout Cin R2 Vout Vout Vin Vin NCP565 GND ADJ Vout C1 5.6 pF R1 Cout Vout Figure 1. Typical Application Schematic, Fixed Output Figure 2. Typical Application Schematic, Adjustable Output PIN DESCRIPTION D2PAK 5 Pin No. Adj. Version 1 2 3, Tab 4 5 D2PAK 3 Pin No. Fixed Version − 1 2, Tab 3 − DFN6 Pin No. Adj. Version 1, 2 3 6 4 5 SOT−223 Symbol N.C. Vin Ground Vout Adj − Positive Power Supply Input Voltage Power Supply Ground Regulated Output Voltage This pin is to be connected to the sense resistors on the output. The linear regulator will attempt to maintain 0.9 V between this pin and ground. Refer to the Application Information section for output voltage setting. Description Pin No. Pin No. Fixed Version Fixed Version 1, 2, 5 3 6 4 − − 3 1 2, Tab − Vin Vref = 0.9 V Output Stage Current Limit Sense Vout Vin Vref = 0.9 V Output Stage Current Limit Sense Vout Voltage Reference Block Voltage Reference Block ADJ Thermal Shutdown Block GND Thermal Shutdown Block GND Figure 3. Block Diagram, Fixed Output Figure 4. Block Diagram, Adjustable Output http://onsemi.com 2 NCP565/NCV565 ABSOLUTE MAXIMUM RATINGS Rating Input Voltage (Note 1) Output Pin Voltage Adjust Pin Voltage Symbol Vin Vout Vadj Value 18 −0.3 to Vin + 0.3 −0.3 to Vin + 0.3 Unit V V V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. NOTE: This device series contains ESD protection and exceeds the following tests: Human Body Model JESD 22−A114−B Machine Model JESD 22−A115−A THERMAL CHARACTERISTICS Rating Thermal Characteristics SOT−223 (Notes 1, 2) Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Pin Thermal Characteristics DFN6 (Notes 1, 2) Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Pin Thermal Characteristics D2PAK (5ld) (Notes 1, 2) Thermal Resistance, Junction−to−Case Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Pin Symbol RqJA RqJP RqJA RqJP RqJC RqJA RqJP Value 107 12 176 37 3 105 4 Unit °C/W °C/W °C/W OPERATING RANGES Rating Operating Input Voltage (Note 1) Operating Junction Temperature Range Operating Ambient Temperature Range Storage Temperature Range 1. Refer to Electrical Characteristics and Application Information for Safe Operating Area. 2. As measured using a copper heat spreading area of 50 mm2, 1 oz copper thickness. 3. Minimum Vin = (Vout + VDO) or 2.5 V, whichever is higher. Symbol Vin TJ TA Tstg Value Vout + VDO, 2.5 (Note 3) to 9 −40 to 150 −40 to 125 −55 to 150 Unit V °C °C °C http://onsemi.com 3 NCP565/NCV565 ELECTRICAL CHARACTERISTICS (Vin = Vout + 1.6 V, Vout = 0.9 V, TA= 25°C, Cin = Cout = 150 mF, unless otherwise noted, Note 4.) Characteristic ADJUSTABLE OUTPUT VERSION Reference Voltage (10 mA < Iout < 1.5 A; Vout + 1.6 V < Vin < 9.0 V; TA = −10 to 105°C) Reference Voltage (10 mA < Iout < 1.5 A; Vout + 1.6 V < Vin < 9.0 V; TA = −40 to 125°C) ADJ Pin Current (Note 5) Line Regulation (Iout = 10 mA) (Note 5) Load Regulation (10 mA < Iout < 1.5 A) (Note 5) Dropout Voltage (Iout = 1.5 A, Vout = 2.5 V) (Note 6) Current Limit Ripple Rejection (120 Hz; Iout = 1.5 A) (Note 5) Ripple Rejection (1 kHz; Iout = 1.5 A) (Note 5) Ground Current (Iout = 1.5 A) Output Noise Voltage (f = 100 Hz to 100 kHz, Iout = 1.5 A) (Note 5) Thermal Shutdown Protection (Note 5) Vref Vref IAdj Regline Regload Vdo Ilim RR RR IGND Vn TSHD Vout Vout Vout Vout Vout Vout Vout Vout Vout Vout Regline Regload Vdo Ilim RR RR IGND Vn TSHD 0.882 (−2%) 0.873 (−3%) − − − − 1.6 − − − − − 0.9 0.9 30 0.03 0.03 0.9 3.3 85 75 1.5 28 160 0.918 (+2%) 0.927 (+3%) − − − 1.3 − − − 3.0 − − V V nA % % V A dB dB mA mVrms _C V V V V V V V V V V % % V A dB dB mA mVrms _C Symbol Min Typ Max Unit FIXED OUTPUT VOLTAGE (Vin = Vout + 1.6 V, TA = 25°C, Cin = Cout = 150 mF, unless otherwise noted, Note 4.) Output Voltage (10 mA < Iout < 1.5 A; 2.8 V < Vin < 9.0 V; TA = −10 to 105°C) 1.2 V version Output Voltage (10 mA < Iout < 1.5 A; 2.8 V < Vin < 9.0 V; TA = −40 to 125°C) 1.2 V version Output Voltage (10 mA < Iout < 1.5 A; 3.1 V < Vin < 9.0 V; TA = −10 to 105°C) 1.5 V version Output Voltage (10 mA < Iout < 1.5 A; 3.1 V < Vin < 9.0 V; TA = −40 to 125°C) 1.5 V version Output Voltage (10 mA < Iout < 1.5 A; 4.4 V < Vin < 9.0 V; TA = −10 to 105°C) 2.8 V version Output Voltage (10 mA < Iout < 1.5 A; 4.4 V < Vin < 9.0 V; TA = −40 to 125°C) 2.8 V version Output Voltage (10 mA < Iout < 1.5 A; 4.6 V < Vin < 9.0 V; TA = −10 to 105°C) 3.0 V version Output Voltage (10 mA < Iout < 1.5 A; 4.6 V < Vin < 9.0 V; TA = −40 to 125°C) 3.0 V version Output Voltage (10 mA < Iout < 1.5 A; 4.9 V < Vin < 9.0 V; TA = −10 to 105°C) 3.3 V version Output Voltage (10 mA < Iout < 1.5 A; 4.9 V < Vin < 9.0 V; TA = −40 to 125°C) 3.3 V version Line Regulation (Iout = 10 mA) (Note 5) Load Regulation (10 mA < Iout < 1.5 A) (Note 5) Dropout Voltage (Iout = 1.5 A, Vout = 2.5 V) (Note 6) Current Limit Ripple Rejection (120 Hz; Iout = 1.5 A) (Note 5) Ripple Rejection (1 kHz; Iout = 1.5 A) (Note 5) Ground Current (Iout = 1.5 A) Output Noise Voltage (f = 100 Hz to 100 kHz, Vout = 1.2 V, Iout = 1.5 A) (Note 5) Thermal Shutdown Protection (Note 5) 1.176 (−2%) 1.164 (−3%) 1.470 (−2%) 1.455 (−3%) 2.744 (−2%) 2.716 (−3%) 2.940 (−2%) 2.910 (−3%) 3.234 (−2%) 3.201 (−3%) − − − 1.6 − − − − − 1.2 1.2 1.5 1.5 2.8 2.8 3.0 3.0 3.3 3.3 0.03 0.03 0.9 3.3 85 75 1.5 38 160 1.224 (+2%) 1.236 (+3%) 1.530 (+2%) 1.545 (+3%) 2.856 (+2%) 2.884 (+3%) 3.060 (+2%) 3.090 (+3%) 3.366 (+2%) 3.399 (+3%) − − 1.3 − − − 3.0 − − 4. Performance guaranteed over specified operating conditions by design, guard banded test limits, and/or characterization, production tested at TJ = TA = 25_C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 5. Typical values are based on design and/or characterization. 6. Dropout voltage is a measurement of the minimum input/output differential at full load. http://onsemi.com 4 NCP565/NCV565 TYPICAL CHARACTERISTICS 0.9005 Vref, REFERENCE VOLTAGE (V) Vref, REFERENCE VOLTAGE (V) 0.9000 0.8995 0.8990 0.8985 0.8980 0.8975 0.8970 −50 Vin = 2.5 V Vout(nom) = 0.9 V 3.302 3.300 3.298 3.296 3.294 3.292 3.290 3.288 −50 Vin = 4.9 V Vout(nom) = 3.3 V −25 0 25 50 75 100 125 150 −25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 5. Output Voltage vs. Temperature ISC, SHORT CIRCUIT CURRENT LIMIT (A) 3.80 3.70 3.60 3.50 3.40 3.30 3.20 3.10 3.00 −50 −25 0 25 50 75 100 125 150 Vin − Vout, DROPOUT VOLTAGE (V) 1.2 1.0 0.8 0.6 0.4 0.2 0 −50 Figure 6. Output Voltage vs. Temperature Iout = 1.5 A Iout = 50 mA −25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 7. Short Circuit Current Limit vs. Temperature 1.60 IGND, GROUND CURRENT (mA) 1.55 1.50 1.45 1.40 1.35 1.30 −50 Iout = 1.5 A IGND, GROUND CURRENT (mA) 1.80 1.70 1.65 1.60 1.55 1.50 1.45 1.40 1.35 0 Figure 8. Dropout Voltage vs. Temperature −25 25 75 125 0 50 100 TJ, JUNCTION TEMPERATURE (°C) 150 300 600 900 1200 1500 Iout, OUTPUT CURRENT (mA) Figure 9. Ground Current vs. Temperature Figure 10. Ground Current vs. Output Current http://onsemi.com 5 NCP565/NCV565 TYPICAL CHARACTERISTICS 100 90 RIPPLE REJECTION (dB) 80 70 50 40 30 20 10 0 10 100 1000 10000 100000 1000000 1 0 250 Iout = 1.5 A ESR (W) 60 100 Unstable 1000 10 Stable 500 750 1000 Vout = 3.3 V Cout = 10 mF 1250 1500 F, FREQUENCY (Hz) OUTPUT CURRENT (mA) Figure 11. Ripple Rejection vs. Frequency Figure 12. Output Capacitor ESR Stability vs. Output Current 10 0 −10 −20 −30 −40 Vin = 4.59 V Vout = 0.9 V OUTPUT VOLTAGE DEVIATION (mV) 0 −10 −20 −30 −40 Vin = 4.59 V Vout = 0.9 V Iout, OUTPUT CURRENT (A) 1.50 1.00 0.50 0 0 50 100 150 200 250 300 350 400 Iout, OUTPUT CURRENT (A) OUTPUT VOLTAGE DEVIATION (mV) 10 1.50 1.00 0.50 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 TIME (nS) TIME (ms) Figure 13. Load Transient from 10 mA to 1.5 A Figure 14. Load Transient from 10 mA to 1.5 A OUTPUT VOLTAGE DEVIATION (mV) 40 30 20 10 0 1.50 1.00 0.50 0 −50 0 50 100 150 200 250 300 350 400 Vin = 4.59 V Vout = 0.9 V OUTPUT VOLTAGE DEVIATION (mV) 50 50 40 30 20 10 0 Vin = 4.59 V Vout = 0.9 V Iout, OUTPUT CURRENT (A) Iout, OUTPUT CURRENT (A) 1.50 1.00 0.50 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 TIME (nS) TIME (ms) Figure 15. Load Transient from 1.5 A to 10 mA Figure 16. Load Transient from 1.5 A to 10 mA http://onsemi.com 6 NCP565/NCV565 TYPICAL CHARACTERISTICS 100 90 NOISE DENSITY (nVrms/ Hz) 80 70 60 50 40 30 20 10 0 Start 1.0 kHz Stop 100 kHz Vin = 3.0 V Vout = 0.9 V Iout = 10 mA NOISE DENSITY (nVrms/ Hz) 100 90 80 70 60 50 40 30 20 10 0 Start 1.0 kHz Stop 100 kHz Vin = 3.0 V Vout = 0.9 V Iout = 1.5 A FREQUENCY (kHz) FREQUENCY (kHz) Figure 17. Noise Density vs. Frequency Figure 18. Noise Density vs. Frequency NOTE: Typical characteristics were measured with the same conditions as electrical characteristics. http://onsemi.com 7 NCP565/NCV565 APPLICATION INFORMATION The NCP565 low dropout linear regulator provides adjustable voltages at currents up to 1.5 A. It features ultra fast transient response and low dropout voltage. These devices contain output current limiting, short circuit protection and thermal shutdown protection. Input, Output Capacitor and Stability Adjustable Operation An input bypass capacitor is recommended to improve transient response or if the regulator is located more than a few inches from the power source. This will reduce the circuit’s sensitivity to the input line impedance at high frequencies and significantly enhance the output transient response. Different types and different sizes of input capacitors can be chosen dependent on the quality of power supply. A 150 mF OSCON 16SA150M type from Sanyo should be adequate for most applications. The bypass capacitor should be mounted with shortest possible lead or track length directly across the regulator’s input terminals. The output capacitor is required for stability. The NCP565 remains stable with ceramic, tantalum, and aluminum− electrolytic capacitors with a minimum value of 1.0 mF with ESR between 50 mW and 2.5 W. The NCP565 is optimized for use with a 150 mF OSCON 16SA150M type in parallel with a 10 mF OSCON 10SL10M type from Sanyo. The 10 mF capacitor is used for best AC stability while 150 mF capacitor is used for achieving excellent output transient response. The output capacitors should be placed as close as possible to the output pin of the device. If not, the excellent load transient response of NCP565 will be degraded. GEN The typical application circuit for the adjustable output regulators is shown in Figure 2. The adjustable device develops and maintains the nominal 0.9 V reference voltage between Adj and ground pins. A resistor divider network R1 and R2 causes a fixed current to flow to ground. This current creates a voltage across R1 that adds to the 0.9 V across R2 and sets the overall output voltage. The output voltage is set according to the formula: Vout + Vref R1 ) R2 * I Adj R2 R2 The adjust pin current, IAdj, is typically 30 nA and normally much lower than the current flowing through R1 and R2, thus it generates a small output voltage error that can usually be ignored. Load Transient Measurement Large load current changes are always presented in microprocessor applications. Therefore good load transient performance is required for the power stage. NCP565 has the feature of ultra fast transient response. Its load transient responses in Figures 13 through 16 are tested on evaluation board shown in Figure 19. On the evaluation board, it consists of NCP565 regulator circuit with decoupling and filter capacitors and the pulse controlled current sink to obtain load current transitions. The load current transitions are measured by current probe. Because the signal from current probe has some time delay, it causes un−synchronization between the load current transition and output voltage response, which is shown in Figures 13 through 16. Vout V RL GND −VCC Vin + NCP565 Evaluation Board Pulse + GND Scope Voltage Probe Figure 19. Schematic for Transient Response Measurement http://onsemi.com 8 NCP565/NCV565 PCB Layout Considerations Good PCB layout plays an important role in achieving good load transient performance. Because it is very sensitive to its PCB layout, particular care has to be taken when tackling Printed Circuit Board (PCB) layout. The figures below give an example of a layout where parasitic elements are minimized. For microprocessor applications it is customary to use an output capacitor network consisting of Vin C1 150 m C2 150 m 2 Vin NC GND 3 GND several capacitors in parallel. This reduces the overall ESR and reduces the instantaneous output voltage drop under transient load conditions. The output capacitor network should be as close as possible to the load for the best results. The schematic of NCP565 typical application circuit, which this PCB layout is base on, is shown in Figure 20. The output voltage is set to 3.3 V for this demonstration board according to the feedback resistors in the Table 1. Vout Adj 4 Vout 1 NCP565 5 C4 10 m C3 150 m C3 150 m GND R2 15.8 k R1 42.2 k C6 5.6 p Figure 20. Schematic of NCP565 Typical Application Circuit Figure 21. Top Layer http://onsemi.com 9 NCP565/NCV565 Figure 22. Bottom Layer NCP565 ON Semiconductor www.onsemi.com D1 VIN C2 R2 C3 C4 R1C6 VOUT C1 GND C5 GND July, 2003 Figure 23. Silkscreen Layer http://onsemi.com 10 NCP565/NCV565 Table 1. Bill of Materials for NCP565 Adj Demonstration Board Item 1 2 3 4 5 6 Used # 4 1 1 1 1 1 Component Radial Lead Aluminum Capacitor 150 mF/16 V Radial Lead Aluminum Capacitor 10 mF/10 V SMT Chip Resistor (0805) 15.8 K 1% SMT Chip Resistor (0805) 42.2 K 1% SMT Ceramic Capacitor (0603) 5.6 pF 10% NCP565 Low Dropout Linear Regulator Designators C1, C2, C3, C5 C4 R2 R1 C6 U1 Suppliers Sanyo Oscon Sanyo Oscon Vishay Vishay Vishay ON Semiconductor Part Number 16SA150M 10SL10M CRCW08051582F CRCW08054222F VJ0603A5R6KXAA NCP565D2TR4 http://onsemi.com 11 NCP565/NCV565 Protection Diodes Thermal Considerations When large external capacitors are used with a linear regulator it is sometimes necessary to add protection diodes. If the input voltage of the regulator gets shorted, the output capacitor will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage and the rate at which Vin drops. In the NCP565 linear regulator, the discharge path is through a large junction and protection diodes are not usually needed. If the regulator is used with large values of output capacitance and the input voltage is instantaneously shorted to ground, damage can occur. In this case, a diode connected as shown in Figure 24 is recommended. 1N4002 (Optional) Vin C1 GND Vout CAdj R1 Adj This series contains an internal thermal limiting circuit that is designed to protect the regulator in the event that the maximum junction temperature is exceeded. This feature provides protection from a catastrophic device failure due to accidental overheating. It is not intended to be used as a substitute for proper heat sinking. The maximum device power dissipation can be calculated by: PD + 200 180 160 DFN 1 oz Cu DFN 2 oz Cu SOT−223 1 oz Cu SOT−223 2 oz Cu D2PAK 1 oz Cu D2PAK 2 oz Cu TJ(max) * TA RqJA Vin Vout qJA (°C/W) C2 140 120 100 80 NCP565 R2 60 40 0 50 100 150 200 250 300 350 400 450 500 Figure 24. Protection Diode for Large Output Capacitors COPPER HEAT−SPREADER AREA (mm sq) Figure 25. Thermal Resistance http://onsemi.com 12 NCP565/NCV565 ORDERING INFORMATION Device NCP565D2T NCP565D2TG NCP565D2TR4 NCP565D2TR4G NCP565MNADJT2G NCP565D2T12 NCP565D2T12G NCP565D2T12R4 NCP565D2T12R4G NCP565MN12T2G NCP565ST12T3G NCP565MN15T2G NCP565MN28T2G NCP565MN30T2G NCP565D2T33G NCP565D2T33R4G NCP565MN33T2G NCV565D2TG* NCV565D2TR4G* NCV565D2T12R4G* NCV565ST12T3G* Fixed (1.2 V) Fixed (1.2 V) Nominal Output Voltage** Package D2PAK D2PAK 5 50 Units / Tube Shipping† 5 (Pb−Free) Adj D2PAK 5 D2PAK 5 (Pb−Free) DFN6 (Pb−Free) D2PAK 3 D2PAK 3 (Pb−Free) D2PAK 3 D2PAK 3 (Pb−Free) DFN6 (Pb−Free) SOT−223 (Pb−Free) Fixed (1.5 V) Fixed (2.8 V) Fixed (3.0 V) DFN6 (Pb−Free) DFN6 (Pb−Free) DFN6 (Pb−Free) D2PAK 3 (Pb−Free) Fixed (3.3 V) D2PAK 3 (Pb−Free) DFN6 (Pb−Free) Adj D2PAK 5 (Pb−Free) D2PAK 3 (Pb−Free) SOT−223 (Pb−Free) 800 / Tape & Reel 3000 / Tape & Reel 50 Units / Tube 800 / Tape & Reel 3000 / Tape & Reel 4000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 50 Units / Tube 800 / Tape & Reel 3000 / Tape & Reel 50 Units / Tube 800 / Tape & Reel 800 / Tape & Reel 4000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV prefix is for automotive and other applications requiring site and change controls. **For other fixed output versions, please contact the factory. The max Vout available for SOT−223 is 1.2 V. http://onsemi.com 13 NCP565/NCV565 PACKAGE DIMENSIONS D2PAK 3 D2T SUFFIX CASE 936−03 ISSUE C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 4. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. DIM A B C D E F G H J K L M N P R S U V INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.051 REF 0.100 BSC 0.539 0.579 0.125 MAX 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 _ REF 0.116 REF 0.200 MIN 0.250 MIN MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.295 REF 2.540 BSC 13.691 14.707 3.175 MAX 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 _ REF 2.946 REF 5.080 MIN 6.350 MIN −T− K A S B F H 1 2 3 OPTIONAL CHAMFER TERMINAL 4 E V U M J D 0.010 (0.254) M T N R L P G C SOLDERING FOOTPRINT* 10.49 8.38 16.155 3.504 1.016 5.080 PITCH DIMENSIONS: MILLIMETERS 2X 2X *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 14 NCP565/NCV565 PACKAGE DIMENSIONS D2PAK 5 CASE 936A−02 ISSUE C −T− A K B 12345 OPTIONAL CHAMFER TERMINAL 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 6. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. DIM A B C D E G H K L M N P R S U V U1 V1 INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.067 BSC 0.539 0.579 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 _ REF 0.116 REF 0.200 MIN 0.250 MIN 0.297 0.305 0.038 0.046 MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.702 BSC 13.691 14.707 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 _ REF 2.946 REF 5.080 MIN 6.350 MIN 7.544 7.747 0.965 1.168 E V U U1 S H M L V1 D G 0.010 (0.254) M T R N P C SOLDERING FOOTPRINT* 8.38 0.33 1.702 0.067 10.66 0.42 1.016 0.04 16.02 0.63 3.05 0.12 SCALE 3:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 15 NCP565/NCV565 PACKAGE DIMENSIONS SOT−223 (TO−261) CASE 318E−04 ISSUE N D b1 NOTES: 6. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 7. CONTROLLING DIMENSION: INCH. DIM A A1 b b1 c D E e e1 L L1 HE MIN 1.50 0.02 0.60 2.90 0.24 6.30 3.30 2.20 0.85 0.20 1.50 6.70 0° MILLIMETERS NOM MAX 1.63 1.75 0.06 0.10 0.75 0.89 3.06 3.20 0.29 0.35 6.50 6.70 3.50 3.70 2.30 2.40 0.94 1.05 −−− −−− 1.75 2.00 7.00 7.30 1 0° − MIN 0.060 0.001 0.024 0.115 0.009 0.249 0.130 0.087 0.033 0.008 0.060 0.264 0° INCHES NOM 0.064 0.002 0.030 0.121 0.012 0.256 0.138 0.091 0.037 −−− 0.069 0.276 − MAX 0.068 0.004 0.035 0.126 0.014 0.263 0.145 0.094 0.041 −−− 0.078 0.287 1 0° 4 HE E 1 2 3 e1 b e A q L L1 C q 0.08 (0003) A1 SOLDERING FOOTPRINT 3.8 0.15 2.0 0.079 2.3 0.091 2.3 0.091 6.3 0.248 2.0 0.079 1.5 0.059 mm inches SCALE 6:1 http://onsemi.com 16 NCP565/NCV565 PACKAGE DIMENSIONS DFN6, 3x3.3, 0.95 PITCH CASE 506AX−01 ISSUE O D A B NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D D2 E E2 e K L L1 MILLIMETERS MIN NOM MAX 0.80 −−− 0.90 0.00 −−− 0.05 0.20 REF 0.30 −−− 0.40 3.00 BSC 1.90 −−− 2.10 3.30 BSC 1.10 −−− 1.30 0.95 BSC 0.20 −−− −−− 0.40 −−− 0.60 0.00 −−− 0.15 PIN 1 REFERENCE E 2X 0.15 C 2X 0.15 C 0.10 C 6X 0.08 C SIDE VIEW D2 6X L 1 3 6X L1 The product described herein (NCP565), may be covered by one or more of the following U.S. patents: 5,920,184; 5,834,926. There may be other patents pending. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative ÇÇÇÇ ÇÇÇÇ ÇÇÇÇ 6 TOP VIEW A (A3) A1 4X C SEATING PLANE SOLDERING FOOTPRINT* 3.60 e K 1 1.35 0.50 6X E2 2.15 4 6X 0.95 PITCH b (NOTE 3) BOTTOM VIEW 0.10 C A B 0.05 C 0.83 6X DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 17 NCP565/D