NCP699SN25T1G

NCP699 LDO Regulator - CMOS, Low Iq, Enable, TSOP-5 150 mA The NCP699 series of fixed output LDO’s are designed for handheld communication equipment and portable battery powered applications which require low quiescent current. The NCP699 series features a very low ground current of 40 A, independent of load current. Each device contains a voltage reference unit, an error amplifier, a PMOS power transistor, internal resistors for setting output voltage, current limit, and temperature limit protection circuits. The NCP699 has been designed to be used with low cost capacitors. The device is housed in the micro−miniature TSOP−5 surface mount package. Standard voltage versions are 1.3, 1.4, 1.5, 1.8, 2.5, 2.8, 2.9, 3.0, 3.1, 3.3, 3.4, 4.5 and 5.0 V. Other voltages are available in 100 mV steps. Features • • • • • • • • Enable Control (Active High, Supports Sub 1 V Logic) Very Low Ground Current of 40 A Typical Low Dropout Voltage of 340 mV at 150 mA, and 3.0 V Vout Multiple Fixed Output Voltage Option Output Voltage Accuracy of 2.0% Operating Temperature Range of −40°C to 85°C Stable with 1 F Ceramic or Tantalum Capacitors These are Pb−Free Devices Typical Applications • • • • • Cellular Phones Battery Powered Consumer Products Hand−Held Instruments Camcorders and Cameras Printers and Office Equipment Battery or Unregulated Voltage Cin 1 F ON + 1 MARKING DIAGRAM 5 TSOP−5 (SOT23−5, SC59−5) SN SUFFIX CASE 483 5 1 xxx A Y W G xxx AYWG G 1 = Specific Device Code = Assembly Location = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) PIN CONNECTIONS Vin 1 Gnd 2 Enable 3 5 Vout 4 N/C (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. Vout 5 + 2 3 http://onsemi.com Cout 1 F 4 OFF This device contains 86 active transistors Figure 1. Typical Application Diagram © Semiconductor Components Industries, LLC, 2009 September, 2019 − Rev. 8 1 Publication Order Number: NCP699/D NCP699 ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ PIN FUNCTION DESCRIPTION Pin No. Pin Name 1 Vin Positive power supply input voltage. Description 2 Gnd Power supply ground. 3 Enable 4 N/C No internal connection. 5 Vout Regulated output voltage. This input is used to place the device into low−power standby. When this input is pulled low, the device is disabled. If this function is not used, Enable should be connected to Vin. MAXIMUM RATINGS Rating Symbol Value Unit Vin 2.1 to 6.0 V Enable Voltage Enable −0.3 to Vin +0.3 V Output Voltage Vout −0.3 to Vin +0.3 V Power Dissipation PD Internally Limited W Operating Junction Temperature TJ +150 °C Maximum Junction Temperature TJ(max) +150 °C Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −55 to +150 °C Input Voltage Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL−STD−883, Method 3015 Machine Model Method 200 V 2. Latch−up capability (85°C) "200 mA DC with trigger voltage. THERMAL CHARACTERISTICS Rating Symbol Test Conditions Typical Value Unit Junction−to−Ambient RJA 1 oz Copper Thickness, 100 mm2 250 °C/W PSIJ−Lead 2 JL2 1 oz Copper Thickness, 100 mm2 68 °C/W NOTE: Single component mounted on an 80 x 80 x 1.5 mm FR4 PCB with stated copper head spreading area. Using the following boundary conditions as stated in EIA/JESD 51−1, 2, 3, 7, 12. http://onsemi.com 2 NCP699 ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Venable = Vin, Cin = 1.0 F, Cout = 1.0 F, TA = 25°C, unless otherwise noted.) Characteristic Symbol Output Voltage (Iout = 10 mA, TA = −40°C to 85°C) 1.3 V 1.4 V 1.5 V 1.8 V 2.5 V 2.8 V 2.9 V 3.0 V 3.1 V 3.3 V 3.4 V 4.5 V 5.0 V Line Regulation (Iout = 10 mA) 1.3 V−4.4 V (Vin = Vout(nom.) + 1.0 V to 6.0 V) 4.5 V−5.0 V (Vin = 5.5 V to 6.0 V) Vout Regline Load Regulation (Iout = 1.0 mA to 150 mA) Output Current Limit 1.3 V−3.9 V (Vin = Vout(nom.) + 2.0 V) 4.0 V−5.0 V (Vin = 6.0 V) Regload Io(nom.) Dropout Voltage (Iout = 150 mA, Measured at Vout = Vout(nom) −3.0%) 1.3 V 1.4 V 1.5 V 1.8 V 2.5 V 2.8 V 2.9 V 3.0 V 3.1 V 3.3 V 3.4 V 4.5 V − 5.0 V Disable Current (TA = −40°C to 85°C) (Enable Input = 0 V) Vin−Vout Min Typ Max 1.261 1.358 1.455 1.746 2.425 2.716 2.813 2.910 3.007 3.201 3.298 4.365 4.850 1.3 1.4 1.5 1.8 2.5 2.8 2.9 3.0 3.1 3.3 3.4 4.5 5.0 1.339 1.442 1.545 1.854 2.575 2.884 2.987 3.090 3.193 3.399 3.502 4.635 5.150 − − 1.0 1.0 3.0 3.0 − 0.3 0.8 150 150 240 240 − − V mV/V IGND Output Short Circuit Current (Vout = 0 V) 1.3 V−3.9 V (Vin = Vout(nom.) + 2.0 V) 4.0 V−5.0 V (Vin = 6.0 V) Iout(max) Output Voltage Noise (f = 100 Hz to 100 kHz) Iout = 30 mA, Cout = 1 F Vn Ripple Rejection (f = 120 Hz, 15 mA) (f = 1.0 kHz, 15 mA) RR Enable Input Threshold Voltage (TA = −40°C to 85°C) (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Vth(en) Output Voltage Temperature Coefficient TC − − − − − − − − − − − − 800 750 690 570 400 360 350 340 330 320 300 240 900 850 750 620 450 420 420 400 400 360 360 300 − 0.03 1.0 − 40 90 150 150 300 300 600 600 − 100 − − − 55 50 − − 0.95 − − − − 0.3 − "100 − A Vrms dB V T *TA PD + J(max) RJA 4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 3 A mA 3. Maximum package power dissipation limits must be observed. http://onsemi.com mV/mA mA mV DIS Ground Current (TA = −40°C to 85°C) (Enable Input = Vin, Iout = 1.0 mA to Io(nom.)) Unit ppm/°C NCP699 TYPICAL CHARACTERISTICS 3.015 400 Vout, OUTPUT VOLTAGE (V) VDD, DROPOUT VOLTAGE (mV) 450 350 300 250 200 150 100 Vin = 4.0 V Vout = 3.0 V Iout = 150 mA 50 0 −60 −40 −20 0 20 40 60 80 Vin = 6.0 V 3.010 Vin = 4.0 V 3.005 3.000 2.995 Vout = 3.0 V Iout = 1.0 mA 2.990 −60 100 −40 TA, AMBIENT TEMPERATURE (°C) 40 60 80 100 60 42 Iq, QUIESCENT CURRENT (A) Iq, QUIESCENT CURRENT (A) 20 Figure 3. Output Voltage vs. Temperature 43 41 40 39 38 37 Vin = 4.0 V Vout = 3.0 V Iout = 0 mA 36 35 −60 −40 −20 0 20 40 60 80 50 40 30 Vout = 3.0 V Iout = 0 mA TA = 25°C Cin = 1.0 F Cout = 1.0 F 20 10 0 0 100 1.0 70 50 60 RIPPLE REJECTION (dB) 60 40 30 Vout = 3.0 V Iout = 30 mA TA = 25°C Cin = 1.0 F Cout = 1.0 F 10 1.0 2.0 3.0 4.0 5.0 3.0 4.0 5.0 6.0 7.0 Figure 5. Quiescent Current vs. Input Voltage Figure 4. Quiescent Current vs. Temperature 20 2.0 Vin, INPUT VOLTAGE (V) TA, AMBIENT TEMPERATURE (°C) Ignd, GROUND CURRENT (A) 0 TA, AMBIENT TEMPERATURE (°C) Figure 2. Dropout Voltage vs. Temperature 0 0 −20 6.0 50 40 30 20 10 0 100 7.0 Vin = 4.0 V Cout = 1.0 F Iout = 30 mA 1.0k 10k 100k Vin, INPUT VOLTAGE (V) f, FREQUENCY (Hz) Figure 6. Ground Pin Current vs. Input Voltage Figure 7. Ripple Rejection vs. Frequency http://onsemi.com 4 1.0M NCP699 TYPICAL CHARACTERISTICS Vin = 4.0 V Cout = 1.0 F Iout = 30 mA 6 5 4 3 2 1 0 10 100 1.0k 10k 100k 1.0M f, FREQUENCY (Hz) Figure 9. Line Transient Response Figure 8. Output Noise Density Figure 10. Load Transient Response Figure 11. Turn−on Response 3.5 Vout, OUTPUT VOLTAGE (V) OUTPUT VOLTAGE NOISE (V/ǰHz) 7 3.0 2.5 2.0 Iout = 1.0 mA 150 mA 1.5 1.0 0.5 0 0 TA = 25°C 1.0 2.0 3.0 4.0 5.0 Vin, INPUT VOLTAGE (V) Figure 12. Output Voltage vs. Input Voltage http://onsemi.com 5 6.0 NCP699 DEFINITIONS Load Regulation Line Regulation The change in output voltage for a change in output current at a constant temperature. The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected. Dropout Voltage The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 3.0% below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Line Transient Response Typical over and undershoot response when input voltage is excited with a given slope. Thermal Protection Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 160°C, the regulator turns off. This feature is provided to prevent failures from accidental overheating. Maximum Power Dissipation The maximum total dissipation for which the regulator will operate within its specifications. Quiescent and Ground Current The quiescent current is the current which flows through the ground when the LDO operates without a load on its output: internal IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current. It is actually the difference between the input current (measured through the LDO input pin) and the output current. Maximum Package Power Dissipation The maximum power package dissipation is the power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 125°C. Depending on the ambient power dissipation and thus the maximum available output current. http://onsemi.com 6 NCP699 APPLICATIONS INFORMATION Set external components, especially the output capacitor, as close as possible to the circuit, and make leads as short as possible. A typical application circuit for the NCP699 series is shown in Figure 1, front page. Input Decoupling (Cin) A 1.0 F capacitor either ceramic or tantalum is recommended and should be connected close to the NCP699 package. Higher values and lower ESR will improve the overall line transient response. TDK capacitor: C2012X5R1C105K, or C1608X5R1A105K Thermal As power across the NCP699 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material and also the ambient temperature effect the rate of temperature rise for the part. This is stating that when the NCP699 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. The maximum dissipation the package can handle is given by: Output Decoupling (Cout) The NCP699 is a stable regulator and does not require any specific Equivalent Series Resistance (ESR) or a minimum output current. Capacitors exhibiting ESRs ranging from a few m up to 5.0  can thus safely be used. The minimum decoupling value is 1.0 F and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum capacitors. Larger values improve noise rejection and load regulation transient response. TDK capacitor: C2012X5R1C105K, C1608X5R1A105K, or C3216X7R1C105K T *TA PD + J(max) RJA If junction temperature is not allowed above the maximum 125°C, then the NCP699 can dissipate up to 400 mW @ 25°C. The power dissipated by the NCP699 can be calculated from the following equation: Enable Operation The enable pin will turn on the regulator when pulled high and turn off the regulator when pulled low. These limits of threshold are covered in the electrical specification section of this data sheet. If the enable is not used then the pin should be connected to Vin. Ptot + ƪVin * Ignd (@Iout)ƫ ) [Vin * Vout] * Iout or VinMAX + Ptot ) Vout * Iout Ignd(@Iout) ) Iout If an 150 mA output current is needed then the ground current from the data sheet is 40 A. For an NCP699 (3.0 V), the maximum input voltage will then be 5.65 V. Hints Please be sure the Vin and Gnd lines are sufficiently wide. When the impedance of these lines is high, there is a chance to pick up noise or cause the regulator to malfunction. ORDERING INFORMATION Nominal Output Voltage* Marking NCP699SN13T1G 1.3 LJY NCP699SN14T1G 1.4 AA4 NCP699SN15T1G 1.5 LJP NCP699SN18T1G 1.8 LJS NCP699SN25T1G 2.5 LJT NCP699SN28T1G 2.8 LJU NCP699SN29T1G 2.9 ACP NCP699SN30T1G 3.0 LJV NCP699SN31T1G 3.1 AAE NCP699SN33T1G 3.3 LJW NCP699SN34T1G 3.4 ACF NCP699SN45T1G 4.5 ACQ NCP699SN50T1G 5.0 LJX Device Package Shipping† TSOP−5 (Pb−Free) 3000 Units/ 7″ Tape & Reel *Additional voltages in 100 mV steps are available upon request by contacting your ON Semiconductor representative. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. http://onsemi.com 7 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSOP−5 CASE 483 ISSUE N 5 1 SCALE 2:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION A. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. D 5X NOTE 5 2X DATE 12 AUG 2020 0.20 C A B 0.10 T M 2X 0.20 T 5 B 1 4 2 B S 3 K DETAIL Z G A A TOP VIEW DIM A B C D G H J K M S DETAIL Z J C 0.05 H C SIDE VIEW SEATING PLANE END VIEW GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT* 0.95 0.037 MILLIMETERS MIN MAX 2.85 3.15 1.35 1.65 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 0_ 10 _ 2.50 3.00 1.9 0.074 5 5 XXXAYWG G 1 1 Analog 2.4 0.094 XXX = Specific Device Code A = Assembly Location Y = Year W = Work Week G = Pb−Free Package 1.0 0.039 XXX MG G Discrete/Logic XXX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) 0.7 0.028 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98ARB18753C TSOP−5 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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