NCP706
1 A, 1% Precision Very Low
Dropout Voltage Regulator
with Enable
The NCP706 is a Very Low Dropout Regulator which provides up to
1 A of load current and maintains excellent output voltage accuracy of
1% including line, load and temperature variations. The operating
input voltage range from 2.4 V up to 5.5 V makes this device suitable
for Li−ion battery powered products as well as post−regulation
applications. The product is available in 2.1 V, 2.2 V, 2.95 V, 3.0 V and
3.3 V fixed output voltage options. NCP706 is fully protected against
overheating and output short circuit.
Very small 8−pin XDFN8 1.6 x 1.2, 04P package makes the device
especially suitable for space constrained portable applications such as
tablets and smartphones.
Features
• Operating Input Voltage Range: 2.4 V to 5.5 V
• Fixed Output Voltage Options: 2.1 V, 2.2 V, 2.95 V, 3.0 V and 3.3 V
•
•
•
•
•
•
•
•
•
Other Output Voltage Options Available on Request.
Low Quiescent Current of Typ. 200 mA
Very Low Dropout: 155 mV Max. at IOUT = 1 A
±1% Accuracy Over Load/Line/Temperature
High PSRR: 60 dB at 1 kHz
Internal Soft−Start to Limit the Inrush Current
Thermal Shutdown and Current Limit Protections
Stable with a 4.7 mF Ceramic Output Capacitor
Available in XDFN8 1.6 x 1.2, 04P 8−pin Package
These are Pb−Free Devices
SNS
EN
ON
GND
OFF
(Note: Microdot may be in either location)
PIN CONNECTION
OUT 1
8 IN
OUT 2
7 IN
N/C 3
6 EN
5 GND
IN 8
1 OUT
IN 7
2 OUT
EN 6
3 N/C
4 SNS
(Bottom View)
OUT
NCP706
CIN
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
GND 5
VOUT = 2.1 (2.2) V @ 1 A
IN
XXMG
G
XDFN8
CASE 711AS
(Top View)
Tablets, Smartphones,
Wireless Handsets, Portable Media Players
Portable Medical Equipment
Other Battery Powered Applications
VIN = 2.4 (2.5) − 5.5 V
MARKING
DIAGRAM
SNS 4
Typical Applications
•
•
•
•
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ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 15 of this data sheet.
COUT
4.7 mF
Ceramic
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2016
May, 2016 − Rev. 8
1
Publication Order Number:
NCP706/D
NCP706
Figure 2. Simplified Internal Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
XDFN8
Pin Name
1
OUT
2
OUT
3
N/C
Not connected. This pin can be tied to ground to improve thermal dissipation.
4
SNS
Remote sense connection. This pin should be connected to the output voltage rail.
5
GND
Power supply ground.
6
EN
Enable pin. Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator
into shutdown mode.
7
IN
Input pin. A small capacitor is needed from this pin to ground to assure stability.
8
IN
−
Exposed
Pad
Description
Regulated output voltage. A minimum 4.7 mF ceramic capacitor is needed from this pin to ground to
assure stability.
This pad enhances thermal performance and is electrically connected to GND. It is recommended
that the exposed pad is connected to the ground plane on the board or otherwise left open.
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2
NCP706
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VIN
−0.3 V to 6 V
V
Output Voltage
VOUT
−0.3 V to VIN + 0.3 V
V
Enable Input
VEN
−0.3 V to VIN + 0.3 V
V
Output Short Circuit Duration
tSC
Indefinite
s
TJ(MAX)
150
°C
Input Voltage (Note 1)
Maximum Junction Temperature
TSTG
−55 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Storage Temperature
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114
Latch−up Current Maximum Rating tested per JEDEC standard: JESD78
THERMAL CHARACTERISTICS
Rating
Thermal Characteristics, XDFN8 1.6x1.2, 04P
Thermal Resistance, Junction−to−Air
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3
Symbol
Value
Unit
RqJA
160
°C/W
NCP706
ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 2.1 V
−40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 0.3 V or 2.4 V, whichever is greater; IOUT = 10 mA, CIN = COUT = 4.7 mF, VEN = 0.9 V, unless
otherwise noted. Typical values are at TJ = +25°C. (Note 3)
Test Conditions
Parameter
Operating Input Voltage
Symbol
Min
VIN
2.4
UVLO
1.2
2.079
Typ
Max
Unit
5.5
V
1.6
1.9
V
2.10
2.121
Undervoltage lock−out
VIN rising
Output Voltage Accuracy
VOUT + 0.3 V ≤ VIN ≤ 4.5 V, IOUT = 0 – 1 A
VOUT
Line Regulation
VOUT + 0.3 V ≤ VIN ≤ 4.5 V, IOUT = 10 mA
RegLINE
2
mV
Load Regulation
IOUT = 0 mA to 1 A
RegLOAD
2
mV
Load Transient
IOUT = 10 mA to 1A or 10 mA to 1 A in 10 ms,
COUT = 10 mF
TranLOAD
±120
mV
Dropout voltage (Note 4)
IOUT = 1 A, VOUT(nom) = 2.1 V
VDO
Output Current Limit
VOUT = 90% VOUT(nom)
ICL
Quiescent current
IOUT = 0 mA
IQ
180
Ground current
IOUT = 1 A
IGND
200
Shutdown current
VEN ≤ 0 V, VIN = 2.0 to 5.5 V
Reverse Leakage Current
in Shutdown
VIN = 5.5 V, VOUT = VOUT(NOM),
VEN < 0.4 V
EN Pin High Threshold
EN Pin Low Threshold
VEN Voltage increasing
VEN Voltage decreasing
EN Pin Input Current
VEN = 5.5 V
IEN
Turn−on Time
COUT = 4.7 mF,
from assertion EN pin to 98% Vout(nom)
tON
VIN = 2.6 V,
VOUT = 2.1 V
IOUT = 0.5 A
f = 100 Hz
f = 1 kHz
f = 10 kHz
Output Noise Voltage
VOUT = 2.1 V, VIN = 2.6 V, IOUT = 0.5 A
f = 100 Hz to 100 kHz
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
1.1
IREV
VEN_HI
VEN_LO
Power Supply Rejection Ratio
300
V
mV
A
230
mA
mA
0.1
1
mA
1.5
5
mA
0.4
V
V
500
nA
0.9
100
ms
200
PSRR
60
60
40
dB
VNOISE
280
mVrms
Temperature increasing from TJ = +25°C
TSD
160
°C
Temperature falling from TSD
TSDH
−
20
−
°C
3. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at
TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
4. Characterized when VOUT falls 100 mV below the regulated voltage at VIN = VOUT(NOM) + 0.3 V.
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NCP706
ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 2.2 V
−40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 0.3 V or 2.5 V, whichever is greater; IOUT = 10 mA, CIN = COUT = 4.7 mF, VEN = 0.9 V, unless
otherwise noted. Typical values are at TJ = +25°C. (Note 5)
Test Conditions
Parameter
Operating Input Voltage
Symbol
Min
VIN
2.5
UVLO
1.2
2.178
Typ
Max
Unit
5.5
V
1.6
1.9
V
2.2
2.222
Undervoltage lock−out
VIN rising
Output Voltage Accuracy
VOUT + 0.3 V ≤ VIN ≤ 4.5 V, IOUT = 0 – 1 A
VOUT
Line Regulation
VOUT + 0.3 V ≤ VIN ≤ 4.5 V, IOUT = 10 mA
RegLINE
2
mV
Load Regulation
IOUT = 0 mA to 1 A
RegLOAD
2
mV
Load Transient
IOUT = 10 mA to 1A or 10 mA to 1 A in 10 ms,
COUT = 10 mF
TranLOAD
±120
mV
Dropout voltage (Note 6)
IOUT = 1 A, VOUT(nom) = 2.2 V
VDO
Output Current Limit
VOUT = 90% VOUT(nom)
ICL
Quiescent current
IOUT = 0 mA
IQ
180
Ground current
IOUT = 1 A
IGND
200
Shutdown current
VEN ≤ 0 V, VIN = 2.0 to 5.5 V
EN Pin High Threshold
EN Pin Low Threshold
VEN Voltage increasing
VEN Voltage decreasing
EN Pin Input Current
VEN = 5.5 V
IEN
100
Turn−on Time
COUT = 4.7 mF, from assertion EN pin to 98%
Vout(nom)
tON
200
ms
Power Supply Rejection Ratio
VIN = 3.2 V, VOUT = 2.2 V
IOUT = 0.5 A
f = 100 Hz
f = 1 kHz
f = 10 kHz
PSRR
55
70
60
dB
Output Noise Voltage
VOUT = 2.2 V, VIN = 2.7 V, IOUT = 0.5 A
f = 100 Hz to 100 kHz
VNOISE
300
mVrms
Thermal Shutdown Temperature
Temperature increasing from TJ = +25°C
TSD
160
°C
Thermal Shutdown Hysteresis
Temperature falling from TSD
TSDH
300
1.1
mV
A
0.1
VEN_HI
VEN_LO
V
230
mA
mA
1
0.9
mA
V
0.4
−
20
500
−
nA
°C
5. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA =
25_C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
6. Characterized when VOUT falls 100 mV below the regulated voltage at VIN = VOUT(NOM) + 0.3 V.
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NCP706
ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 2.95 V
−40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 0.3 V or 3.3 V, whichever is greater; IOUT = 10 mA, CIN = COUT = 4.7 mF, VEN = 0.9 V, unless
otherwise noted. Typical values are at TJ = +25°C. (Note 7)
Test Conditions
Parameter
Operating Input Voltage
Symbol
Min
VIN
2.4
UVLO
1.2
2.9205
Typ
Max
Unit
5.5
V
1.6
1.9
V
2.95
2.9795
Undervoltage lock−out
VIN rising, IOUT = 0
Output Voltage Accuracy
VOUT + 0.3 V ≤ VIN ≤ 4.5 V, IOUT = 0 – 1 A
VOUT
Line Regulation
VOUT + 0.3 V ≤ VIN ≤ 4.5 V, IOUT = 10 mA
RegLINE
2
mV
Load Regulation
IOUT = 0 mA to 1 A, VIN = 3.3 V
RegLOAD
2
mV
Load Transient
IOUT = 10 mA to 1 A in 10 ms, VIN = 3.5 V
COUT = 10 mF
TranLOAD
±120
mV
Dropout voltage (Note 8)
IOUT = 1 A, VOUT(nom) = 3.0 V
VDO
155
Output Current Limit
VOUT = 90% VOUT(nom)
ICL
Quiescent current
IOUT = 0 mA
IQ
170
Ground current
IOUT = 1 A
IGND
200
Shutdown current
VEN ≤ 0 V, VIN = 2.4 to 5.5 V
EN Pin High Threshold
EN Pin Low Threshold
VEN Voltage increasing
VEN Voltage decreasing
EN Pin Input Current
VEN = 5.5 V
IEN
100
Turn−on Time
COUT = 4.7 mF, from assertion EN pin to 98%
Vout(nom)
tON
150
ms
Power Supply Rejection Ratio
VIN = 3.5 V + 200 mVpp
modulation, VOUT = 2.95 V
IOUT = 0.5 A, COUT = 4.7 mF
PSRR
65
58
52
dB
Output Noise Voltage
VOUT = 2.95 V, VIN = 4.0 V, IOUT = 0.5 A
f = 100 Hz to 100 kHz
VNOISE
300
mVrms
Thermal Shutdown Temperature
Temperature increasing from TJ = +25°C
TSD
160
°C
Thermal Shutdown Hysteresis
Temperature falling from TSD
TSDH
1.1
f = 100 Hz
f = 1 kHz
f = 10 kHz
mV
A
0.1
VEN_HI
VEN_LO
230
V
230
mA
mA
1
0.9
mA
V
0.4
−
20
500
−
nA
°C
7. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA =
25_C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
8. Characterized when VOUT falls 90 mV below the regulated voltage at VIN = 3.3 V, IOUT = 10 mA.
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NCP706
ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 3.0 V
−40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 0.3 V or 3.3 V, whichever is greater; IOUT = 10 mA, CIN = COUT = 4.7 mF, VEN = 0.9 V, unless
otherwise noted. Typical values are at TJ = +25°C. (Note 9)
Test Conditions
Parameter
Operating Input Voltage
Symbol
Min
VIN
2.4
UVLO
1.2
2.97
Typ
Max
Unit
5.5
V
1.6
1.9
V
3.0
3.03
Undervoltage lock−out
VIN rising, IOUT = 0
Output Voltage Accuracy
VOUT + 0.3 V ≤ VIN ≤ 4.5 V, IOUT = 0 – 1 A
VOUT
Line Regulation
VOUT + 0.3 V ≤ VIN ≤ 4.5 V, IOUT = 10 mA
RegLINE
2
mV
Load Regulation
IOUT = 0 mA to 1 A, VIN = 3.3 V
RegLOAD
2
mV
Load Transient
IOUT = 10 mA to 1 A in 10 ms, VIN = 3.5 V
COUT = 10 mF
TranLOAD
±120
mV
Dropout voltage (Note 10)
IOUT = 1 A, VOUT(nom) = 3.0 V
VDO
155
Output Current Limit
VOUT = 90% VOUT(nom)
ICL
Quiescent current
IOUT = 0 mA
IQ
170
Ground current
IOUT = 1 A
IGND
200
Shutdown current
VEN ≤ 0 V, VIN = 2.0 to 5.5 V
EN Pin High Threshold
EN Pin Low Threshold
VEN Voltage increasing
VEN Voltage decreasing
EN Pin Input Current
VEN = 5.5 V
IEN
100
Turn−on Time
COUT = 4.7 mF, from assertion EN pin to 98%
Vout(nom)
tON
150
ms
Power Supply Rejection Ratio
VIN = 3.5 V + 200 mVpp
modulation, VOUT = 3.0 V
IOUT = 0.5 A, COUT = 4.7 mF
PSRR
65
58
52
dB
Output Noise Voltage
VOUT = 3.0 V, VIN = 4.0 V, IOUT = 0.5 A
f = 100 Hz to 100 kHz
VNOISE
300
mVrms
Thermal Shutdown Temperature
Temperature increasing from TJ = +25°C
TSD
160
°C
Thermal Shutdown Hysteresis
Temperature falling from TSD
TSDH
1.1
f = 100 Hz
f = 1 kHz
f = 10 kHz
mV
A
0.1
VEN_HI
VEN_LO
230
V
230
mA
mA
1
0.9
mA
V
0.4
−
20
500
−
nA
°C
9. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA =
25_C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
10. Characterized when VOUT falls 90 mV below the regulated voltage at VIN = 3.3 V, IOUT = 10 mA.
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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NCP706
TYPICAL CHARACTERISTICS
2.102
2.098
2.096
2.094
2.200
2.196
2.192
2.188
2.092
2.090
−40
VIN = 2.5 V
IOUT = 10 mA
COUT = 4.7 mF
VOUT(NOM) = 2.2 V
2.204
OUTPUT VOLTAGE (V)
2.100
OUTPUT VOLTAGE (V)
2.208
VIN = 2.4 V
IOUT = 10 mA
COUT = 4.7 mF
VOUT(NOM) = 2.1 V
−20
0
20
40
60
80
100
2.184
−40
120
−20
0
TEMPERATURE (°C)
3.004
2.4
3.002
2.0
3.000
2.998
2.996
2.992
−40 −20
VIN = 3.3 V
IOUT = 10 mA
COUT = 1 mF
VOUT(NOM) = 3.0 V
0
20
40
1.2
0.8
80
100
0.0
1.0
1.6
VIN = VEN
TA = 25°C
COUT = 4.7 mF
VOUT(NOM) = 2.2 V
IOUT = 10 mA
IOUT = 50 mA
IOUT = 250 mA
IOUT = 500 mA
3.0
4.0
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
3.0
2.0
3.0
4.0
5.0
Figure 6. Output Voltage vs. Input Voltage
2.0
1.0
2.0
INPUT VOLTAGE (V)
3.5
0.0
120
IOUT = 10 mA
IOUT = 50 mA
IOUT = 250 mA
IOUT = 500 mA
0.0
120
2.4
0.4
100
VIN = VEN
TA = 25°C
COUT = 4.7 mF
VOUT(NOM) = 2.1 V
Figure 5. Output Voltage vs. Temperature
0.0
80
1.6
TEMPERATURE (°C)
0.8
60
0.4
60
1.2
40
Figure 4. Output Voltage vs. Temperature
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
Figure 3. Output Voltage vs. Temperature
2.994
20
TEMPERATURE (°C)
2.5
VIN = VEN
TA = 25°C
COUT = 1 mF
VOUT(NOM) = 3.0 V
2.0
1.5
1.0
IOUT = 10 mA
IOUT = 50 mA
IOUT = 250 mA
IOUT = 500 mA
0.5
0.0
0.0
5.0
1.0
2.0
3.0
4.0
5.0
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Figure 7. Output Voltage vs. Input Voltage
Figure 8. Output Voltage vs. Input Voltage
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NCP706
TYPICAL CHARACTERISTICS
240
IOUT = 0
COUT = 4.7 mF
VOUT(NOM) = 2.1 V
240
QUIESCENT CURRENT (mA)
QUIESCENT CURRENT (mA)
260
TA = 125°C
220
TA = 25°C
200
TA = −40°C
180
160
140
2.0
2.5
3.0
3.5
4.0
4.5
5.0
TA = 25°C
160
TA = −40°C
140
2.0
3.0
3.5
4.0
4.5
5.0
5.5
INPUT VOLTAGE (V)
Figure 10. Quiescent Current vs. Input Voltage
260
IOUT = 0
COUT = 1 mF
VOUT(NOM) = 3.0 V
220
200
TA = 125°C
180
TA = 25°C
160
TA = −40°C
140
3.0
3.5
4.0
4.5
INPUT VOLTAGE (V)
5.0
VIN = 2.4 V
VIN = 4.0 V
VIN = 5.5 V
240
200
180
COUT = 4.7 mF
TA = 25°C
VOUT(NOM) = 2.1 V
160
140
0.0
5.5
VIN = 3.0 V
VIN = 5.0 V
220
Figure 11. Quiescent Current vs. Input Voltage
0.1
0.2
0.3 0.4 0.5 0.6 0.7
OUTPUT CURRENT (A)
0.8
0.9 1.0
Figure 12. Ground Current vs. Output Current
260
260
VIN = 2.5 V
VIN = 4.0 V
VIN = 5.5 V
240
VIN = 3.0 V
VIN = 5.0 V
GROUND CURRENT (mA)
GROUND CURRENT (mA)
2.5
INPUT VOLTAGE (V)
GROUND CURRENT (mA)
QUIESCENT CURRENT (mA)
TA = 125°C
180
Figure 9. Quiescent Current vs. Input Voltage
240
120
200
120
5.5
IOUT = 0
COUT = 4.7 mF
VOUT(NOM) = 2.2 V
220
220
200
180
COUT = 4.7 mF
TA = 25°C
VOUT(NOM) = 2.2 V
160
140
0.0
0.1
0.2
0.3
0.4
VIN = 3.3 V
VIN = 4.0 V
VIN = 5.0 V
240
220
200
180
COUT = 1 mF
TA = 25°C
VOUT(NOM) = 3.0 V
160
140
0.5
0.6
0.7
0.8
0.0
0.9 1.0
OUTPUT CURRENT (A)
Figure 13. Ground Current vs. Output Current
VIN = 3.5 V
VIN = 4.5 V
VIN = 5.5 V
0.1
0.2
0.3 0.4 0.5 0.6 0.7
OUTPUT CURRENT (A)
0.8
0.9 1.0
Figure 14. Ground Current vs. Output Current
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NCP706
TYPICAL CHARACTERISTICS
1.8
VOUT = 0
VEN = VIN
COUT = 4.7 mF
TA = 25°C
VOUT(NOM) = 2.1 V
1.8
1.6
1.4
SHORT CURRENT LIMIT (A)
SHORT CURRENT LIMIT (A)
2
1.2
1
0.8
0.6
2.0
2.5
3.0
3.5
4.0
4.5
5.0
1.2
1.0
0.8
0.6
5.5
2.0
2.5
3.5
4.0
4.5
5.0
INPUT VOLTAGE (V)
Figure 15. Short Current Limitation vs. Input
Voltage
Figure 16. Short Current Limitation vs. Input
Voltage
5.5
0.35
VOUT = 0
VEN = VIN
COUT = 1 mF
TA = 25°C
VOUT(NOM) = 3.0 V
1.6
DROPOUT VOLTAGE (V)
1.7
VEN = VIN
COUT = 4.7 mF
VOUT(NOM) = 2.1 V
0.30
1.5
1.4
1.3
125°C
0.25
25°C
0.20
0.15
−40°C
0.10
0.05
3.0
3.5
4.0
4.5
5.0
0.00
5.5
0
0.2
INPUT VOLTAGE (V)
0.35
0.6
0.8
1
Figure 18. Dropout Voltage vs. Output Current
200
VEN = VIN
COUT = 4.7 mF
VOUT(NOM) = 2.2 V
VEN = VIN
COUT = 1 mF
VOUT(NOM) = 3.0 V
180
DROPOUT VOLTAGE (mV)
0.30
0.4
OUTPUT CURRENT (A)
Figure 17. Short Current Limitation vs. Input
Voltage
DROPOUT VOLTAGE (V)
3.0
INPUT VOLTAGE (V)
1.8
SHORT CURRENT LIMIT (A)
1.4
0.4
0.4
1.2
VOUT = 0
VEN = VIN
COUT = 4.7 mF
TA = 25°C
VOUT(NOM) = 2.2 V
1.6
125°C
0.25
0.20
25°C
0.15
−40°C
0.10
0.05
160
125°C
140
25°C
120
−40°C
100
80
60
40
20
0.00
0
0
0.2
0.4
0.6
0.8
0
1
0.2
OUTPUT CURRENT (A)
0.4
0.6
0.8
OUTPUT CURRENT (A)
Figure 19. Dropout Voltage vs. Output Current
Figure 20. Dropout Voltage vs. Output Current
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1
NCP706
TYPICAL CHARACTERISTICS
100
VIN = 5.5 V
VEN = 0
CIN = COUT = 4.7 mF
TA = 25°C
3.0
2.5
2.0
60
1.5
40
1.0
VOUT(NOM) = 2.1 V
VOUT(NOM) = 2.2 V
VOUT(NOM) = 3.0 V
0.5
0.0
1.0
3.0
4.0
0
0.1
5.0
FORCED OUTPUT VOLTAGE (V)
10
FREQUENCY (kHz)
Figure 21. Reverse Leakage Current in
Shutdown
Figure 22. PSRR vs. Frequency & Output
Capacitor
100
PSRR (dB)
40
0.1
1
10
100
0
1000
COUT = 1 mF
COUT = 2.2 mF
COUT = 4.7 mF
0.1
1
10
FREQUENCY (kHz)
60
PSRR (dB)
PSRR (dB)
80
VIN = 3.7 V + 200 mVPP Modulation
COUT = 4.7 mF
TA = 25°C
VOUT(NOM) = 2.1 V
70
60
50
40
VIN = 3.2 V + 200 mVPP Modulation
COUT = 4.7 mF
TA = 25°C
VOUT(NOM) = 2.2 V
40
30
20
20
IOUT = 10 mA
IOUT = 100 mA
IOUT = 500 mA
10
0
1000
Figure 24. PSRR vs. Frequency & Output
Capacitor
100
80
100
FREQUENCY (kHz)
Figure 23. PSRR vs. Frequency & Output
Capacitor
90
1000
40
20
COUT = 22 mF
COUT = 10 mF
COUT = 4.7 mF
100
VIN = 3.5 V + 200 mVPP Modulation
IOUT = 500 mA
TA = 25°C
VOUT(NOM) = 3.0 V
60
60
20
1
80
VIN = 2.7 V + 200 mVPP Modulation
IOUT = 500 mA
TA = 25°C
VOUT(NOM) = 2.2 V
80
PSRR (dB)
2.0
COUT = 22 mF
COUT = 10 mF
COUT = 4.7 mF
20
0.0
0
VIN = 2.6 V + 200 mVPP Modulation
IOUT = 500 mA
TA = 25°C
VOUT(NOM) = 2.1 V
80
PSRR (dB)
REVERSE LEAKAGE CURRENT IN
SHUTDOWN (mA)
3.5
0.1
1.0
10
100
0
1000
IOUT = 10 mA
IOUT = 100 mA
IOUT = 500 mA
FREQUENCY (kHz)
0.1
10
FREQUENCY (kHz)
Figure 25. PSRR vs. Frequency & Output
Current
Figure 26. PSRR vs. Frequency & Output
Current
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11
1
100
1000
NCP706
TYPICAL CHARACTERISTICS
80
OUTPUT NOISE DENSITY (mV/√Hz)
60
PSRR (dB)
2.5
VIN = 3.5 V + 200 mVPP Modulation
COUT = 1 mF
TA = 25°C
VOUT(NOM) = 3.0 V
40
20
IOUT = 10 mA
IOUT = 100 mA
IOUT = 500 mA
0
0.1
1
10
FREQUENCY (kHz)
100
2.0
1.5
1.0
0.5
0.0
0.01
1000
Figure 27. PSRR vs. Frequency & Output
Current
1.5
1.0
0.5
0.0
0.01
COUT = 4.7 mF
COUT = 10 mF
0.1
0.1
1
10
FREQUENCY (kHz)
3.5
IOUT = 500 mA
VIN = 2.6 V
TA = 25°C
VOUT(NOM) = 2.2 V
2.0
COUT = 4.7 mF
COUT = 10 mF
100
1000
Figure 28. Output Noise Density vs. Frequency
OUTPUT NOISE DENSITY (mV/√Hz)
OUTPUT NOISE DENSITY (mV/√Hz)
2.5
IOUT = 500 mA
VIN = 2.7 V
TA = 25°C
VOUT(NOM) = 2.1 V
IOUT = 500 mA
VIN = 4.0 V
TA = 25°C
VOUT(NOM) = 3.0 V
3.0
2.5
2.0
1.5
1.0
COUT = 1 mF
COUT = 2.2 mF
0.5
0.0
1
10
100
1000
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 29. Output Noise Density vs. Frequency
Figure 30. Output Noise Density vs. Frequency
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12
NCP706
TYPICAL CHARACTERISTICS
Figure 31. Turn−on by Coupled Input and
Enable Pins
Figure 32. Turn−on by Coupled Input and
Enable Pins
Figure 33. Turn−on by Coupled Input and
Enable Pins
Figure 34. Turn−on by Enable Signal
Figure 35. Turn−on by Enable Signal
Figure 36. Turn−on by Enable Signal
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13
NCP706
TYPICAL CHARACTERISTICS
Figure 37. Line Transient Response
Figure 38. Line Transient Response
Figure 39. Line Transient Response
Figure 40. Load Transient Response
Figure 41. Load Transient Response
Figure 42. Load Transient Response
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14
NCP706
APPLICATIONS INFORMATION
Input Decoupling (Cin)
Thermal
A 4.7 mF capacitor either ceramic or tantalum is
recommended and should be connected as close as possible
to the pins of NCP706 device. Higher values and lower ESR
will improve the overall line transient response.
As power across the NCP706 increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and also the ambient
temperature affect the rate of temperature rise for the part.
This is stating that when the NCP706 has good thermal
conductivity through the PCB, the junction temperature will
be relatively low with high power dissipation.
The power dissipation across the device can be roughly
represented by the equation:
Output Decoupling (Cout)
The minimum decoupling value for NCP706MX21TAG
and NCP706MX22TAG devices is 4.7 mF and can be
augmented to fulfill stringent load transient requirements.
The minimum decoupling value for NCP706MX295TAG
and NCP706MX706300TAG devices is 1 mF. The regulator
accepts ceramic chip capacitors MLCC. If a tantalum
capacitor is used, and its ESR is large, the loop oscillation
may result. Larger values improve noise rejection and
PSRR.
P D + ǒV IN * V OUTǓ * I OUT [W]
(eq. 1)
The maximum power dissipation depends on the thermal
resistance of the case and circuit board, the temperature
differential between the junction and ambient, PCB
orientation and the rate of air flow.
The maximum allowable power dissipation can be
calculated using the following equation:
Enable Operation
The enable pin EN will turn on or off the regulator. These
limits of threshold are covered in the electrical specification
section of this data sheet. If the enable is not used then the
pin should be connected to VIN.
P MAX + ǒT J * T AǓńq JA [W]
(eq. 2)
Where (TJ − TA) is the temperature differential between
the junction and the surrounding environment and qJA is the
thermal resistance from the junction to the ambient.
Connecting the exposed pad and non connected pin 3 to
a large ground pad or plane helps to conduct away heat and
improves thermal relief.
Hints
Please be sure the Vin and GND lines are sufficiently wide.
If their impedance is high, noise pickup or unstable
operation may result.
Set external components, especially the output capacitor,
as close as possible to the circuit.
The sense pin SNS trace is recommended to be kept as far
from noisy power traces as possible and as close to load as
possible.
ORDERING INFORMATION
Nominal Ooutput
Voltage
Marking
Package
Shipping†
NCP706MX21TAG
2.1 V
QM
XDFN8
(Pb−Free)
3000 / Tape & Reel
NCP706MX22TAG
2.2 V
QR
XDFN8
(Pb−Free)
3000 / Tape & Reel
NCP706MX295TAG
2.95 V
A2
XDFN8
(Pb−Free)
3000 / Tape & Reel
NCP706MX300TAG
3.0 V
A3
XDFN8
(Pb−Free)
3000 / Tape & Reel
NCP706MX33TAG
(In Development)
3.3 V
Q3
XDFN8
(Pb−Free)
3000 / Tape & Reel
(Available Soon)
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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15
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN8 1.6x1.2, 0.4P
CASE 711AS
ISSUE D
SCALE 4:1
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
A
B
8X
L1
DETAIL A
ÍÍÍ
ÍÍÍ
ÍÍÍ
OPTIONAL
CONSTRUCTION
E
PIN ONE
IDENTIFIER
DIM
A
A1
b
D
D2
E
E2
e
L
L1
ÉÉ
ÉÉ
ÇÇ
ÇÇ
EXPOSED Cu
TOP VIEW
0.10 C
DATE 08 DEC 2015
MOLD CMPD
DETAIL B
OPTIONAL
CONSTRUCTION
A
DETAIL B
GENERIC
MARKING DIAGRAM*
A1
8X
MILLIMETERS
MIN
NOM
MAX
0.300 0.375 0.450
0.000 0.025 0.050
0.130 0.180 0.230
1.500 1.600 1.700
1.200 1.300 1.400
1.100 1.200 1.300
0.200 0.300 0.400
0.40 BSC
0.150 0.200 0.250
0.000 0.050 0.100
0.08 C
NOTE 3
DETAIL A
8X
8X
C
SIDE VIEW
L
XXMG
G
SEATING
PLANE
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
D2
1
4
E2
L1
8
5
e
e/2
8X
b
0.10 C A
BOTTOM VIEW
RECOMMENDED
MOUNTING FOOTPRINT*
B
0.05 C
1.44
PACKAGE
OUTLINE
8X
0.35
1.40
0.44
8X
0.26
1
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON87768E
XDFN8, 1.6X1.2, 0.4P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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