DATA SHEET
www.onsemi.com
Low Dropout Regulator,
Very-Low Quiescent
Current, IQ 25 mA, Low
Noise
MARKING
DIAGRAM
1
XDFN4
MX SUFFIX
CASE 711AJ
200 mA
XX M
1
XX = Specific Device Code
M = Date Code
NCP707
The NCP707 is 200 mA LDO that provides the engineer with a very
stable, accurate voltage with very low noise suitable for space
constrained, noise sensitive applications. In order to optimize
performance for battery operated portable applications, the NCP707
employs the dynamic quiescent current adjustment for very low IQ
consumption at no−load.
PIN CONNECTIONS
IN
EN
4
3
EPAD
Features
• Operating Input Voltage Range: 1.8 V to 5.5 V
• Available in Fixed Voltage Options: 1.5 V to 3.3 V
•
•
•
•
•
•
•
•
•
Contact Factory for Other Voltage Options
Very Low Quiescent Current of Typ. 25 mA
Very Low Noise: 22 mVRMS from 100 Hz to 100 kHz
Very Low Dropout: 100 mV Typical at 200 mA
±2% Accuracy Over Load/Line/Temperature
High Power Supply Ripple Rejection: 70 dB at 1 kHz
Thermal Shutdown and Current Limit Protections
Stable with a 1 mF Ceramic Output Capacitor
Available in XDFN 1.0 x 1.0 mm Package
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
1
2
OUT
GND
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information on page 18 of
this data sheet.
Typical Applicaitons
•
•
•
•
PDAs, Mobile phones, GPS, Smartphones
Wireless Handsets, Wireless LAN, Bluetooth®, Zigbee®
Portable Medical Equipment
Other Battery Powered Applications
VIN
VOUT
IN
CIN
EN
ON
OFF
OUT
NCP707
GND
COUT
1 mF
Ceramic
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2015
September, 2022 − Rev. 10
1
Publication Order Number:
NCP707/D
NCP707
IN
ENABLE
LOGIC
EN
THERMAL
SHUTDOWN
VOLTAGE
REFERENCE
MOSFET
DRIVER WITH
CURRENT LIMIT
OUT
AUTO LOW
POWER MODE
ACTIVE
DISCHARGE*
EN
GND
*Active output discharge function is present only in NCP707AMXyyyTCG and NCP707CMXyyyTCG devices.
yyy denotes the particular VOUT option.
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
Pin Name
Description
1
OUT
Regulated output voltage pin. A small ceramic capacitor with minimum value of 1 mF is needed from this
pin to ground to assure stability.
2
GND
Power supply ground.
3
EN
Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown
mode.
4
IN
Input pin. A small 1 mF capacitor is needed from this pin to ground to assure stability.
−
EPAD
Exposed pad should be connected directly to the GND pin. Soldered to a large ground copper plane allows
for effective heat removal.
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VIN
−0.3 V to 6 V
V
Output Voltage
VOUT
−0.3 V to VIN + 0.3 V
V
Enable Input
VEN
−0.3 V to VIN + 0.3 V
V
Output Short Circuit Duration
tSC
∞
s
TJ(MAX)
150
°C
TSTG
−55 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Input Voltage (Note 1)
Maximum Junction Temperature
Storage Temperature
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114
ESD Machine Model tested per EIA/JESD22−A115
Latchup Current Rating tested per JEDEC standard: JESD78
THERMAL CHARACTERISTICS
Rating
Thermal Characteristics, XDFN4 1x1 mm
Thermal Resistance, Junction−to−Air
3. Single component mounted on 2 oz, FR4 PCB with 100 mm2 Cu area.
www.onsemi.com
2
Symbol
Value
Unit
RqJA
250
°C/W
NCP707
ELECTRICAL CHARACTERISTICS
−40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 0.5 V or 1.9 V, whichever is greater; IOUT = 10 mA, CIN = COUT = 1 mF, unless otherwise noted.
VEN = 0.9 V. Typical values are at TJ = +25°C. Min./Max. are for TJ = −40°C and TJ = +125°C respectively (Note 4).
Symbol
Min
Max
Unit
VIN
1.8
5.5
V
VOUT + 0.5 V ≤ VIN ≤ 5.5 V, IOUT = 0 − 200 mA
VOUT
−2
+2
%
Line Regulation
VOUT + 0.5 V ≤ VIN ≤ 5.5 V, IOUT = 10 mA
RegLINE
400
mV/V
Load Regulation
IOUT = 0 mA to 200 mA
RegLOAD
10
mV/mA
IOUT = 1 mA to 200 mA or 200 mA to 1 mA in
1 ms, COUT = 1 mF
TranLOAD
75
mV
Parameter
Test Conditions
Operating Input Voltage
Output Voltage Accuracy
Load Transient
Dropout Voltage (Note 5)
VOUT = 1.5 V
415
490
VOUT = 1.8 V
221
380
VOUT = 1.85 V
218
370
VOUT = 2.5 V
135
225
118
175
114
170
VOUT = 3.0 V
111
165
VOUT = 3.1 V
107
160
VOUT = 3.2 V
105
155
100
150
379
500
mA
35
mA
VOUT = 2.8 V
IOUT = 200 mA
VOUT = 2.85 V
VDO
VOUT = 3.3 V
Output Current Limit
Typ
VOUT = 90% VOUT(nom)
ICL
IOUT = 0 mA
IQ
25
IOUT = 2 mA
IGND
105
mA
IOUT = 200 mA
IGND
240
mA
Shutdown Current
VEN ≤ 0.4 V, VIN = 5.5 V
IDIS
0.01
EN Pin Threshold Voltage
High Threshold
Low Threshold
VEN Voltage increasing
VEN Voltage decreasing
VEN_HI
VEN_LO
VEN = 5.5 V
IEN
Turn−on Time
COUT = 1.0 mF, From assertion of VEN to 98%
VOUT(NOM)
tON
Power Supply Rejection Ratio
VIN = 3.6 V, VOUT = 3.1 V
IOUT = 150 mA
Ground Current
EN Pin Input Current
f = 100 Hz
f = 1 kHz
f = 10 kHz
250
mV
1
mA
V
0.9
0.4
180
200
500
nA
ms
PSRR
58
70
55
dB
Output Noise Voltage
VOUT = 3.1 V, VIN = 3.6 V, IOUT = 200 mA
f = 100 Hz to 100 kHz
VN
22
mVrms
Thermal Shutdown Temperature
Temperature increasing from TJ = +25°C
TSD
160
°C
Temperature falling from TSD
TSDH
20
°C
VEN < 0.4 V, Version A only
VEN < 0.4 V, Version C only
RDIS
1.2
120
kW
W
Thermal Shutdown Hysteresis
Active Output Discharge Resistance
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at
TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
5. Characterized when VOUT falls 100 mV below the regulated voltage at VIN = VOUT(NOM) + 0.5 V.
www.onsemi.com
3
1.510
1.860
1.505
1.855
1.500
IOUT = 10 mA
1.495
IOUT
1.490
CIN = COUT = 1 mF
VIN = 2.0 V
VOUT(NOM) = 1.5 V
1.485
1.480
−40
−20
0
20
40
60
80
100
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
NCP707
IOUT = 10 mA
1.850
IOUT = 200 mA
1.845
1.840
CIN = COUT = 1 mF
VIN = 2.35 V
VOUT(NOM) = 1.85 V
1.835
120 140
1.830
−40
−20
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
2.995
2.855
IOUT = 10 mA
2.850
IOUT = 200 mA
2.845
−20
0
20
40
60
80 100
JUNCTION TEMPERATURE (°C)
120 140
100
120 140
IOUT = 200 mA
2.985
2.980
2.975
2.970
−40
CIN = COUT = 1 mF
VIN = 3.5 V
VOUT(NOM) = 3.0 V
−20
0
20
40 60
80 100
JUNCTION TEMPERATURE (°C)
120 140
Figure 6. Output Voltage vs. Temperature
VOUT = 3.0 V
3.110
3.300
CIN = COUT = 1 mF
VIN = 3.6 V
VOUT(NOM) = 3.1 V
3.100
3.295
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
80
IOUT = 10 mA
2.990
Figure 5. Output Voltage vs. Temperature
VOUT = 2.85 V
IOUT = 10 mA
IOUT = 200 mA
3.095
3.090
3.085
3.080
−40
60
3.000
CIN = COUT = 1 mF
VIN = 3.35 V
VOUT(NOM) = 2.85 V
2.860
3.105
40
Figure 4. Output Voltage vs. Temperature
VOUT = 1.85 V
2.870
2.840
−40
20
JUNCTION TEMPERATURE (°C)
JUNCTION TEMPERATURE (°C)
Figure 3. Output Voltage vs. Temperature
VOUT = 1.5 V
2.865
0
−20
0
20
40
60
80 100
JUNCTION TEMPERATURE (°C)
120 140
3.290
IOUT = 10 mA
3.285
IOUT = 200 mA
3.280
CIN = COUT = 1 mF
VIN = 3.8 V
VOUT(NOM) = 3.3 V
3.275
3.270
−40
Figure 7. Output Voltage vs. Temperature
VOUT = 3.1 V
−20
0
20
40 60
80 100
JUNCTION TEMPERATURE (°C)
120 140
Figure 8. Output Voltage vs. Temperature
VOUT = 3.3 V
www.onsemi.com
4
NCP707
35
30
TA = 125°C
25
TA = 25°C
20
TA = −40°C
QUIESCENT CURRENT (mA)
QUIESCENT CURRENT (mA)
35
15
10
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 1.5 V
5
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
25
TA = 25°C
TA = −40°C
20
15
10
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 1.8 V
5
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Figure 9. Quiescent Current vs. Input Voltage
VOUT = 1.5 V
Figure 10. Quiescent Current vs. Input Voltage
VOUT = 1.8 V
35
30
TA = 125°C
QUIESCENT CURRENT (mA)
QUIESCENT CURRENT (mA)
TA = 125°C
5.5
35
TA = 25°C
TA = −40°C
25
20
15
10
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 2.8 V
5
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
30
TA = 125°C
TA = 25°C
25
TA = −40°C
20
15
10
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 3.0 V
5
0
5.5
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Figure 11. Quiescent Current vs. Input Voltage
VOUT = 2.8 V
Figure 12. Quiescent Current vs. Input Voltage
VOUT = 3.0 V
35
35
30
TA = 125°C
25
QUIESCENT CURRENT (mA)
QUIESCENT CURRENT (mA)
30
TA = 25°C
TA = −40°C
20
15
10
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 3.1 V
5
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 3.3 V
30
25
TA = 125°C
TA = 25°C
TA = −40°C
20
15
10
5
0
5.5
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Figure 13. Quiescent Current vs. Input Voltage
VOUT = 3.1 V
Figure 14. Quiescent Current vs. Input Voltage
VOUT = 3.3 V
www.onsemi.com
5
2.00
2.00
1.75
1.75
1.50
1.50
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
NCP707
1.25
1.00
0.75
TA = 125°C
0.50
TA = 25°C
0.25
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 1.5 V
TA = −40°C
0.00
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
1.00
TA = 125°C
0.75
TA = 25°C
0.50
0.00
5.5
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Figure 15. Output Voltage vs. Input Voltage
VOUT = 1.5 V
Figure 16. Output Voltage vs. Input Voltage
VOUT = 1.8 V
5.5
3.50
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 2.8 V
2.50
2.00
1.50
TA = 125°C
1.00
TA = 25°C
0.50
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 3.0 V
3.00
OUTPUT VOLTAGE (V)
3.00
2.50
2.00
1.50
TA = 125°C
1.00
TA = 25°C
0.50
TA = −40°C
0.00
TA = −40°C
0.00
0
0.5
1
1.5
2 2.5 3 3.5 4
INPUT VOLTAGE (V)
4.5
5
5.5
0
Figure 17. Output Voltage vs. Input Voltage
VOUT = 2.8 V
0.5
1
1.5
2 2.5 3 3.5 4
INPUT VOLTAGE (V)
4.5
5
5.5
Figure 18. Output Voltage vs. Input Voltage
VOUT = 3.0 V
4.00
3.50
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 3.1 V
2.50
2.00
1.50
TA = 125°C
1.00
TA = 25°C
0.50
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 3.3 V
3.50
OUTPUT VOLTAGE (V)
3.00
OUTPUT VOLTAGE (V)
CIN = COUT = 1 mF
IOUT = 0 mA
VOUT(NOM) = 1.8 V
TA = −40°C
0.25
3.50
OUTPUT VOLTAGE (V)
1.25
3.00
2.50
2.00
1.50
TA = 125°C
1.00
TA = 25°C
0.50
TA = −40°C
0.00
TA = −40°C
0.00
0
0.5
1
1.5
2 2.5 3 3.5 4
INPUT VOLTAGE (V)
4.5
5
0
5.5
Figure 19. Output Voltage vs. Input Voltage
VOUT = 3.1 V
0.5
1
1.5
2 2.5 3 3.5 4
INPUT VOLTAGE (V)
4.5
5
Figure 20. Output Voltage vs. Input Voltage
VOUT = 3.3 V
www.onsemi.com
6
5.5
NCP707
0.7
0.5
0.4
TA = 125°C
0.3
0.2
TA = 25°C
TA = −40°C
0.1
0
0
0.04
0.08
0.35
0.30
0.25
0.20
TA = 125°C
0.15
0.10
TA = 25°C
0.05
0.12
0.16
0
0.2
TA = −40°C
0
0.04
0.16
0.2
OUTPUT CURRENT (A)
Figure 22. Dropout Voltage vs. Output Current
VOUT = 1.85 V
0.200
DROPOUT VOLTAGE (V)
0.125
0.100
TA = 125°C
0.075
0.050
TA = 25°C
0
0.04
0.08
0.12
0.150
0.125
0.100
0.075
TA = 125°C
TA = 25°C
0.050
0.025
TA = −40°C
0.000
CIN = COUT = 1 mF
VOUT(NOM) = 3.0 V
0.175
0.150
0.025
TA = −40°C
0.000
0.16
0
0.2
0.04
0.08
0.12
0.16
0.2
OUTPUT CURRENT (A)
OUTPUT CURRENT (A)
Figure 23. Dropout Voltage vs. Output Current
VOUT = 2.8 V
Figure 24. Dropout Voltage vs. Output Current
VOUT = 3.0 V
0.200
0.200
CIN = COUT = 1 mF
VOUT(NOM) = 3.1 V
0.150
0.125
0.100
TA = 125°C
0.075
TA = 25°C
0.050
0.025
0.04
0.08
0.12
0.150
0.125
0.100
TA = 125°C
0.075
0.050
TA = 25°C
0.025
TA = −40°C
0
CIN = COUT = 1 mF
VOUT(NOM) = 3.3 V
0.175
DROPOUT VOLTAGE (V)
0.175
DROPOUT VOLTAGE (V)
0.12
OUTPUT CURRENT (A)
CIN = COUT = 1 mF
VOUT(NOM) = 2.8 V
0.175
0.000
0.08
Figure 21. Dropout Voltage vs. Output Current
VOUT = 1.5 V
0.200
DROPOUT VOLTAGE (V)
CIN = COUT = 1 mF
VOUT(NOM) = 1.85 V
0.40
DROPOUT VOLTAGE (V)
0.6
DROPOUT VOLTAGE (V)
0.45
CIN = COUT = 1 mF
VOUT(NOM) = 1.5 V
TA = −40°C
0.000
0.16
0.2
0
OUTPUT CURRENT (A)
0.04
0.08
0.12
0.16
0.2
OUTPUT CURRENT (A)
Figure 25. Dropout Voltage vs. Output Current
VOUT = 3.1 V
Figure 26. Dropout Voltage vs. Output Current
VOUT = 3.3 V
www.onsemi.com
7
NCP707
CIN = COUT = 1 mF
VIN = 2.0 V
VOUT(NOM) = 1.5 V
OUTPUT CURRENT (mA)
420
400
Short−Circuit Current:
IOUT for VOUT = 0 V
380
360
Current Limit: IOUT for
VOUT = VOUT(NOM) − 0.1 V
340
320
300
−40
−20
0
20
40
60
80
100
440
420
OUTPUT CURRENT (mA)
440
Short−Circuit Current:
IOUT for VOUT = 0 V
400
380
Current Limit: IOUT for
VOUT = VOUT(NOM) − 0.1 V
360
340
CIN = COUT = 1 mF
VIN = 2.35 V
VOUT(NOM) = 1.85 V
320
300
−40
120 140
−20
JUNCTION TEMPERATURE (°C)
40
60
80
100
120 140
Figure 28. Short−Circuit Limit vs. Temperature
VOUT = 1.85 V
440
440
420
Short−Circuit Current:
IOUT for VOUT = 0 V
400
380
Current Limit: IOUT for
VOUT = VOUT(NOM) − 0.1 V
360
340
CIN = COUT = 1 mF
VIN = 3.35 V
VOUT(NOM) = 2.85 V
320
300
−40
−20
0
20
40
60
80
100
OUTPUT CURRENT (mA)
420
OUTPUT CURRENT (mA)
20
JUNCTION TEMPERATURE (°C)
Figure 27. Short−Circuit Limit vs. Temperature
VOUT = 1.5 V
Short−Circuit Current:
IOUT for VOUT = 0 V
400
380
Current Limit: IOUT for
VOUT = VOUT(NOM) − 0.1 V
360
340
CIN = COUT = 1 mF
VIN = 3.5 V
VOUT(NOM) = 3.0 V
320
300
−40
120 140
−20
JUNCTION TEMPERATURE (°C)
440
440
Short−Circuit Current:
IOUT for VOUT = 0 V
400
Current Limit: IOUT for
VOUT = VOUT(NOM) − 0.1 V
360
CIN = COUT = 1 mF
VIN = 3.6 V
VOUT(NOM) = 3.1 V
340
320
−40
−20
0
20
40
60
80
100
OUTPUT CURRENT (mA)
460
380
20
40
60
80
100
120 140
Figure 30. Short−Circuit Limit vs. Temperature
VOUT = 3.0 V
460
420
0
JUNCTION TEMPERATURE (°C)
Figure 29. Short−Circuit Limit vs. Temperature
VOUT = 2.85 V
OUTPUT CURRENT (mA)
0
CIN = COUT = 1 mF
VIN = 3.8 V
VOUT(NOM) = 3.3 V
420
Short−Circuit Current:
IOUT for VOUT = 0 V
400
380
Current Limit: IOUT for
VOUT = VOUT(NOM) − 0.1 V
360
340
320
−40
120 140
−20
JUNCTION TEMPERATURE (°C)
0
20
40
60
80
100
120 140
JUNCTION TEMPERATURE (°C)
Figure 32. Short−Circuit Limit vs. Temperature
VOUT = 3.3 V
Figure 31. Short−Circuit Limit vs. Temperature
VOUT = 3.1 V
www.onsemi.com
8
NCP707
LINE REGULATION (mV)
4.5
4.0
3.5
5.0
CIN = COUT = 1 mF
VIN = 2.0 V to 5.5 V
VOUT(NOM) = 1.5 V
IOUT = 10 mA
4.5
LINE REGULATION (mV)
5.0
3.0
2.5
2.0
1.5
Line Regulation from VIN = 2 V to 5.5 V
1.0
0.5
0.0
−40
4.0
3.5
CIN = COUT = 1 mF
VIN = 2.35 V to 5.5 V
VOUT(NOM) = 1.85 V
IOUT = 10 mA
3.0
2.5
2.0
1.5
Line Regulation from VIN = 2.35 V to 5.5 V
1.0
0.5
−20
0
20
40
60
80
100
0.0
−40
120 140
−20
JUNCTION TEMPERATURE (°C)
Figure 33. Line Regulation vs. Temperature
VOUT = 1.5 V
3.5
5.0
CIN = COUT = 1 mF
VIN = 3.35 V to 5.5 V
VOUT(NOM) = 2.85 V
IOUT = 10 mA
4.5
LINE REGULATION (mV)
LINE REGULATION (mV)
4.0
3.0
2.5
2.0
1.5
Line Regulation from VIN = 3.35 V to 5.5 V
1.0
0.5
0.0
−40
−20
0
20
40
60
80
100
3.5
80
100
120 140
3.5
CIN = COUT = 1 mF
VIN = 3.5 V to 5.5 V
VOUT(NOM) = 3.0 V
IOUT = 10 mA
3.0
2.5
2.0
1.5
Line Regulation from VIN = 3.5 V to 5.5 V
1.0
−20
0
20
40
60
80
100
120 140
JUNCTION TEMPERATURE (°C)
Figure 35. Line Regulation vs. Temperature
VOUT = 2.85 V
Figure 36. Line Regulation vs. Temperature
VOUT = 3.0 V
5.0
CIN = COUT = 1 mF
VIN = 3.6 V to 5.5 V
VOUT(NOM) = 3.1 V
IOUT = 10 mA
4.5
2.5
2.0
Line Regulation from VIN = 3.6 V to 5.5 V
1.0
0.5
0.0
−40
60
JUNCTION TEMPERATURE (°C)
3.0
1.5
4.0
0.0
−40
120 140
LINE REGULATION (mV)
LINE REGULATION (mV)
4.0
40
0.5
5.0
4.5
20
Figure 34. Line Regulation vs. Temperature
VOUT = 1.85 V
5.0
4.5
0
JUNCTION TEMPERATURE (°C)
4.0
3.5
CIN = COUT = 1 mF
VIN = 3.8 V to 5.5 V
VOUT(NOM) = 3.3 V
IOUT = 10 mA
3.0
2.5
2.0
1.5
Line Regulation from VIN = 3.8 V to 5.5 V
1.0
0.5
−20
0
20
40
60
80
100
0.0
−40
120 140
−20
0
20
40
60
80
100
120 140
JUNCTION TEMPERATURE (°C)
JUNCTION TEMPERATURE (°C)
Figure 37. Line Regulation vs. Temperature
VOUT = 3.1 V
Figure 38. Line Regulation vs. Temperature
VOUT = 3.3 V
www.onsemi.com
9
NCP707
10
7
6
VOUT(NOM) = 1.5 V
5
4
3
VOUT(NOM) = 1.8 V
2
1
0
−40
300
GROUND CURRENT (mA)
GROUND CURRENT (mA)
8
280
0
20
40
60
100
100
60
40
0
1
2
3
4
5
7
6
8
9
10
Figure 40. Ground Current vs. Output Current
100
CIN = COUT = 1 mF
VIN = VOUT(NOM) + 0.5 V
IOUT = 200 mA
VOUT = 1.5 V
VOUT = 3.3 V
VOUT(NOM) = 1.5 V
VOUT(NOM) = 1.85 V
10
UNSTABLE OPERATION
1
STABLE OPERATION
0.1
VOUT(NOM) = 3.3 V
VOUT(NOM) = 2.85 V
−20
0
20
40
60
80
100
0.01
120 140
100
0
200
300
JUNCTION TEMPERATURE (°C)
OUTPUT CURRENT (mA)
Figure 41. Ground Current vs. Temperature
Figure 42. Stability vs. Output Capacitor ESR
100
80
90
70
80
IOUT = 1 mA
60
PSRR (dB)
40
30
100
1k
10k
100k
1M
40
10
0
10
10M
IOUT = 10 mA
50
20
IOUT = 150 mA
IOUT = 1 mA
60
30
COUT = 1 mF
CIN = none,
VIN = 2.0 V ± 50 mVAC
VOUT(NOM) = 1.5 V
IOUT = 150 mA
70
IOUT = 10 mA
50
0
10
TA = −40°C
Figure 39. Load Regulation vs. Temperature
220
10
TA = 25°C
80
0
120 140
90
PSRR (dB)
120
OUTPUT CURRENT (mA)
240
20
TA = 125°C
140
JUNCTION TEMPERATURE (°C)
260
200
−40
80
160
20
VOUT(NOM) = 3.3 V
−20
CIN = COUT = 1 mF
VIN = VOUT(NOM) + 0.5 V
180
CAPACITOR ESR (W)
LOAD REGULATION (mV)
9
200
CIN = COUT = 1 mF
VIN = VOUT(NOM) + 0.5 V
IOUT = 0 mA to 200 mA
COUT = 1 mF
CIN = none,
VIN = 2.35 V ± 50 mVAC
VOUT(NOM) = 1.85 V
100
1k
10k
100k
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 43. PSRR vs. Frequency
VOUT = 1.5 V
Figure 44. PSRR vs. Frequency
VOUT = 1.85 V
www.onsemi.com
10
10M
NCP707
100
90
90
80
80
70
IOUT = 150 mA
PSRR (dB)
60
50
40
30
20
10
0
10
OUTPUT VOLTAGE NOISE (mV/rtHz)
IOUT = 1 mA
COUT = 1 mF
CIN = none,
VIN = 3.5 V ± 50 mVAC
VOUT(NOM) = 3.0 V
100
1k
10k
100k
1M
0
10
10M
COUT = 1 mF
CIN = none,
VIN = 3.6 V ± 50 mVAC
VOUT(NOM) = 3.1 V
100
1k
IOUT = 10 mA
10k
100k
1M
FREQUENCY (Hz)
Figure 46. PSRR vs. Frequency
VOUT = 3.1 V
IOUT = 10 mA
IOUT = 200 mA
0.010
IOUT = 1 mA
100
1k
10k
100k
1M
10M
CIN = COUT = 1 mF
VIN = 3.6 V
VOUT = 3.1 V
MLCC, X7R
1206 size
1.000
IOUT = 10 mA
0.100
IOUT = 200 mA
0.010
IOUT = 1 mA
0.001
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 47. Output Noise Density vs. Frequency
VOUT = 1.5 V
Figure 48. Output Noise Density vs. Frequency
VOUT = 3.1 V
0.35
0.9
TA = 125°C
ENABLE CURRENT (mA)
0.25
0.2
TA = 25°C
0.15
TA = −40°C
0.1
CIN = COUT = 1 mF
VIN = 2 V
VOUT(NOM) = 1.5 V
0.05
0.5
1
1.5
2
2.5
3
VIN = 2 V
CIN = COUT = 1 mF
VOUT(NOM) = 1.5 V
0.85
0.3
ENABLE CURRENT (mA)
30
FREQUENCY (Hz)
0.100
0
40
Figure 45. PSRR vs. Frequency
VOUT = 3.0 V
1.000
0
50
10
IOUT = 10 mA
CIN = COUT = 1 mF
VIN = 2.0 V
VOUT = 1.5 V
MLCC, X7R
1206 size
0.001
10
IOUT = 1 mA
60
20
OUTPUT VOLTAGE NOISE (mV/rtHz)
PSRR (dB)
70
IOUT = 150 mA
3.5
4
4.5
5
0.8
VEN = Low to High
0.75
0.7
VEN = High to Low
0.65
0.6
0.55
0.5
−40
5.5
−20
0
20
40
60
80
100
120 140
ENABLE VOLTAGE (V)
JUNCTION TEMPERATURE (°C)
Figure 49. Enable Input Current vs. Enable
Voltage
Figure 50. Enable Threshold Voltage vs.
Temperature
www.onsemi.com
11
NCP707
300
CIN = COUT = 1 mF
VIN = VOUT(NOM) + 0.5 V
VEN = 0 V
0.16
280
VOUT TURN−ON TIME (ms)
SHUTDOWN CURRENT (mA)
0.2
0.12
0.08
0.04
260
240
200
−20
0
20
40
60
80
100
VOUT = 1.5 V
180
160
140
120
0
−40
VOUT = 3.3 V
220
CIN = COUT = 1 mF
VIN = VOUT(NOM) + 0.5 V
VEN = Step from 0 V to 1 V / 1 ms
100
−40
120 140
−20
0
20
40
60
80
100
JUNCTION TEMPERATURE (°C)
JUNCTION TEMPERATURE (°C)
Figure 51. Shutdown Current vs. Temperature
Figure 52. VOUT Turn−on Time vs.
Temperature
www.onsemi.com
12
120 140
NCP707
50 mV/div
IOUT
VOUT
IOUT
VOUT
20 ms / div
20 ms / div
Figure 53. Load Transient Response
IOUT = 1 mA to 200 mA, COUT = 1 mF
Figure 54. Load Transient Response
IOUT = 1 mA to 200 mA, COUT = 4.7 mF
IOUT
200 mA
VIN = 3.6 V
VOUT(nom) = 3.1 V
CIN = COUT = 4.7 mF
10 mA
30 mV/div
100 mA / div
10 mA
100 mA / div
VIN = 3.6 V
VOUT(nom) = 3.1 V
CIN = COUT = 1 mF
200 mA
50 mV/div
VOUT
IOUT
VOUT
10 ms / div
20 ms / div
Figure 55. Load Transient Response
IOUT = 10 mA to 200 mA, COUT = 1 mF
Figure 56. Load Transient Response
IOUT = 10 mA to 200 mA, COUT = 4.7 mF
VIN = 2.3 V
VOUT(nom) = 1.8 V
CIN = COUT = 1 mF
VOUT = 1.8 V
1 V/div
1 V/div
100 mA/div
1 mA
30 mV/div
100 mA / div
1 mA
VIN = 3.6 V
VOUT(nom) = 3.1 V
CIN = COUT = 4.7 mF
200 mA
100 mA / div
VIN = 3.6 V
VOUT(nom) = 3.1 V
CIN = COUT = 1 mF
200 mA
VOUT = 0 V
VOUT = 1.8 V
RL = 1.8 kW
RL = 180 kW
VOUT = 0 V
IIN = 1 mA
IIN
VEN = 1 V
VIN = 2.3 V
VOUT(nom) = 1.8 V
CIN = COUT = 1 mF
VEN = 1 V
VEN = 0 V
VEN = 0 V
500 ms / div
500 ms / div
Figure 57. Enable Turn−On Response
VOUT = 1.8 V, COUT = 1 mF
Figure 58. Enable Turn−Off Response
VOUT = 1.8 V, COUT = 1 mF (A Version)
www.onsemi.com
13
100 mA/div
VIN = 3.8 V
VOUT(nom) = 3.3 V
CIN = COUT = 1 mF
VOUT = 1.8 V
1 V/div
1 V/div
NCP707
VOUT = 1.8 V RL = 1.8 kW
RL = 180 kW
VOUT = 0 V
VOUT = 0 V
IIN
IIN = 1 mA
VEN = 1 V
VEN = 1 V
VEN = 0 V
VEN = 0 V
50 ms / div
500 ms / div
VIN = 3.8 V
VOUT(nom) = 3.3 V
CIN = COUT = 1 mF
Figure 60. Enable Turn−Off Response
VOUT = 3.3 V, COUT = 1 mF (A Version)
500 mV/div
Figure 59. Enable Turn−On Response
VOUT = 3.3 V, COUT = 1 mF
VIN = 2.3 V
500 mV/div
VOUT = 1.8 V
VOUT = 1.8 V
VIN = 0 V
VOUT = 0 V
VIN = 0 V
VOUT = 0 V
IIN = 1 mA
2 ms / div
Figure 61. Enable Turn−On Response
VOUT = 1.8 V, COUT = 1 mF
Figure 62. Enable Turn−Off Response
VOUT = 1.8 V, COUT = 1 mF (A Version)
VIN = 3.8 V
VOUT(nom) = 3.3 V
CIN = COUT = 1 mF
VIN = 3.8 V
VIN = 0 V
VOUT = 0 V
1 V/div
VOUT = 3.3 V
1 V/div
VIN = 3.8 V
VOUT(nom) = 3.3 V
CIN = COUT = 1 mF
VIN = 2.3 V
500 ms / div
100 mA/div
VIN = 3.8 V
VOUT(nom) = 3.3 V
CIN = COUT = 1 mF
VIN = 3.8 V
VOUT(nom) = 3.3 V
CIN = COUT = 1 mF
VIN = 3.8 V
VOUT = 3.3 V
VIN = 0 V
VOUT = 0 V
IIN = 1 mA
Figure 63. Enable Turn−On Response
VOUT = 3.3 V, COUT = 1 mF
Figure 64. Enable Turn−Off Response
VOUT = 3.3 V, COUT = 1 mF (A Version)
www.onsemi.com
14
NCP707
2 V/div
VOUT = 3.3 V
Output Short−Circuit
VOUT = 0 V
VOUT = 0 V
VIN = 5.5 V
VOUT(nom) = 3.3 V
CIN = COUT = 1 mF
VIN = 5.5 V
VOUT(nom) = 1.5 V
CIN = COUT = 1 mF
200 mA/div
IOUT = 402 mA
IOUT = 398 mA
200 mA/div
1 V/div
Output Short−Circuit
VOUT = 1.5 V
IOUT = 1 mA
200 ms / div
Figure 65. Short−Circuit Response
VOUT = 1.5 V, COUT = 1 mF
Figure 66. Short−Circuit Response
VOUT = 1.5 V, COUT = 1 mF
1 V/div
200 ms / div
VIN = 2.0 V
VOUT(nom) = 1.5 V
CIN = COUT = 1 mF
VOUT = 1.5 V
VOUT = 0 V
Thermal Shutdown
200 mA/div
IOUT = 398 mA
IOUT = 1 mA
5 ms / div
Figure 67. Short−Circuit Response
VOUT = 1.5 V, COUT = 1 mF
www.onsemi.com
15
NCP707
APPLICATIONS INFORMATION
to GND through a 1.2 kW resistor for A options or 120 W
resistor for C options. In the disable state the device
consumes as low as typ. 10 nA from the VIN. If the EN pin
voltage > 0.9 V the device is guaranteed to be enabled. The
NCP707 regulates the output voltage and the active
discharge transistor is turned*off. The EN pin has an
internal pull−down current source with typ. value of 180 nA
which assures that the device is turned−off when the EN pin
is not connected. A build in 56 mV of hysteresis and deglitch
time in the EN block prevents from periodic on/off
oscillations that can occur due to noise on EN line. In the
case that the EN function isn’t required the EN pin should be
tied directly to IN.
The NCP707 is a high performance, small package size,
200 mA LDO voltage regulator. This device delivers very
good noise and dynamic performance. Thanks to its adaptive
ground current feature the device consumes only 25 mA of
quiescent current at no−load condition. The regulator
features very*low noise of 22 mVRMS, PSRR of typ. 70dB
at 1kHz and very good load/line transient response. The
device is an ideal choice for space constrained portable
applications.
A logic EN input provides ON/OFF control of the output
voltage. When the EN is low the device consumes as low as
typ. 10 nA from the IN pin.
The device is fully protected in case of output overload,
output short circuit condition and overheating, assuring a
very robust design.
Reverse Current
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case that VOUT > VIN.
Due to this fact in cases where the extended reverse current
condition is anticipated the device may require additional
external protection.
Input Capacitor Selection (CIN)
It is recommended to connect a minimum of 1 μF Ceramic
X5R or X7R capacitor close to the IN pin of the device.
Larger input capacitors may be necessary if fast and large
load transients are encountered in the application. There is
no requirement for the min./max. ESR of the input capacitor
but it is recommended to use ceramic capacitors for their low
ESR and ESL.
Output Current Limit
Output Current is internally limited within the IC to a
typical 379 mA. The NCP707 will source this amount of
current measured with the output voltage 100 mV lower
than the nominal VOUT. If the Output Voltage is directly
shorted to ground (VOUT = 0 V), the short circuit protection
will limit the output current to 390 mA (typ). The current
limit and short circuit protection will work properly up to
VIN =5.5 V at TA = 25°C. There is no limitation for the short
circuit duration.
Output Capacitor Selection (COUT)
The NCP707 is designed to be stable with small 1.0 mF and
larger ceramic capacitors on the output. The minimum
effective output capacitance for which the LDO remains
stable is 100 nF. The safety margin is provided to account for
capacitance variations due to DC bias voltage, temperature,
initial tolerance. There is no requirement for the minimum
value of Equivalent Series Resistance (ESR) for the COUT
but the maximum value of ESR should be less than 700 mΩ.
Larger output capacitors could be used to improve the load
transient response or high frequency PSRR characteristics.
It is not recommended to use tantalum capacitors on the
output due to their large ESR. The equivalent series
resistance of tantalum capacitors is also strongly dependent
on the temperature, increasing at low temperature. The
tantalum capacitors are generally more costly than ceramic
capacitors.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
threshold (TSD * 160°C typical), Thermal Shutdown event
is detected and the device is disabled. The IC will remain in
this state until the die temperature decreases below the
Thermal Shutdown Reset threshold (TSDU − 140°C
typical). Once the IC temperature falls below the 140°C the
LDO is enabled again. The thermal shutdown feature
provides protection from a catastrophic device failure due to
accidental overheating. This protection is not intended to be
used as a substitute for proper heat sinking.
No−load Operation
Power Dissipation
The regulator remains stable and regulates the output
voltage properly within the ±2% tolerance limits even with
no external load applied to the output.
As power dissipated in the NCP707 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part. The maximum power dissipation the
NCP707 can handle is given by:
Enable Operation
The NCP707 uses the EN pin to enable/disable its output
and to control the active discharge function. If the EN pin
voltage is < 0.4 V the device is guaranteed to be disabled.
The pass transistor is turned*off so that there is virtually no
current flow between the IN and OUT. In case of the option
equipped with active discharge − the active discharge
transistor is turned−on and the output voltage VOUT is pulled
P D(MAX) +
www.onsemi.com
16
ƪ125 * T Aƫ
q JA
(eq. 1)
NCP707
For reliable operation junction temperature should be
limited to +125°C.
The power dissipated by the NCP707 for given
application conditions can be calculated as follows:
P D(MAX) + V INI GND ) I OUTǒV IN * V OUTǓ
point of load can easily approach 100 mW which will cause
a 20 mV voltage drop at full load current, deteriorating the
excellent load regulation.
Line Regulation
(eq. 2)
The IC features very good line regulation of 0.4 mV/V
measured from VIN = VOUT + 0.5 V to 5.5 V.
Figure 68 shows the typical values of θJA vs. heat
spreading area.
Power Supply Rejection Ratio
At low frequencies the PSRR is mainly determined by the
feedback open−loop gain. At higher frequencies in the range
100 kHz – 10 MHz it can be tuned by the selection of COUT
capacitor and proper PCB layout.
Load Regulation
The NCP707 features very good load regulation of typical
2 mV in the 0 mA to 200 mA range. In order to achieve this
very good load regulation a special attention to PCB design
is necessary. The trace resistance from the OUT pin to the
0,9
500
Theta JA curve with PCB cu thk 1,0 oz
Power curve with PCB cu thk 2,0 oz
400
qJA (oC/W)
0,8
Theta JA curve with PCB cu thk 2,0 oz
0,7
Power curve with PCB cu thk 1,0 oz
350
0,6
300
0,5
250
0,4
200
0,3
150
0,2
100
0,1
50
0
100
200
300
400
500
600
PD(MAX) (W)
450
0
COPPER AREA (mm2)
Figure 68. Thermal Parameters vs. Copper Area
Output Noise
voltage overshoots and assures monotonic ramp−up of the
output voltage.
The IC is designed for very−low output voltage noise. The
typical noise performance of 22 mVRMS makes the device
suitable for noise sensitive applications.
PCB Layout Recommendations
To obtain good transient performance and good regulation
characteristics place CIN and COUT capacitors close to the
device pins and make the PCB traces wide. In order to
minimize the solution size use 0402 capacitors. Larger
copper area connected to the pins will also improve the
device thermal resistance. The actual power dissipation can
be calculated by the formula given in Equation 2.
Internal Soft Start
The Internal Soft*Start circuitry will limit the inrush
current during the LDO turn−on phase. Please refer to
typical characteristics section for typical inrush current
values. The soft*start function prevents from any output
www.onsemi.com
17
NCP707
ORDERING INFORMATION
Voltage
Option
Marking
Marking
Rotation
NCP707AMX150TCG
1.5 V
A
0°
NCP707AMX180TCG
1.8 V
D
0°
NCP707AMX185TCG
1.85 V
E
0°
NCP707AMX250TCG
2.5 V
K
180°
NCP707AMX280TCG
2.8 V
F
0°
NCP707AMX285TCG
2.85 V
J
0°
NCP707AMX300TCG
3.0 V
K
0°
NCP707AMX310TCG
3.1 V
L
0°
NCP707AMX330TCG
3.3 V
P
0°
NCP707BMX150TCG
1.5 V
A
90°
NCP707BMX180TCG
1.8 V
D
90°
NCP707BMX185TCG
1.85 V
E
90°
NCP707BMX250TCG
2.5 V
K
270°
NCP707BMX280TCG
2.8 V
F
90°
NCP707BMX285TCG
2.85 V
J
90°
NCP707BMX300TCG
3.0 V
K
90°
NCP707BMX310TCG
3.1 V
L
90°
NCP707BMX330TCG
3.3 V
P
90°
NCP707CMX150TCG
1.5 V
L
180°
NCP707CMX180TBG
1.8 V
P
180°
NCP707CMX180TCG
1.8 V
P
180°
NCP707CMX185TCG
1.85 V
Q
180°
NCP707CMX250TCG
2.5 V
V
180°
NCP707CMX280TCG
2.8 V
Y
180°
NCP707CMX285TCG
2.85 V
2
180°
NCP707CMX300TBG (Note 6)
3.0 V
3
180°
NCP707CMX300TCG (Note 6)
3.0 V
3
180°
NCP707CMX310TCG
3.1 V
4
180°
NCP707CMX320TCG
3.2 V
5
180°
NCP707CMX330TBG
3.3 V
6
180°
NCP707CMX330TCG
3.3 V
6
180°
Device
Option
Package
Shipping†
XDFN4
(Pb-Free)
3000 or 5000 /
Tape & Reel
(Note 6)
With active output
discharge function
(RDIS = 1.2 kW)
Without active output
discharge function
With active output
discharge function
(RDIS = 120 W)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
6. Products processed after October 1, 2022 are shipped with quantity 5000 units / tape & reel.
Bluetooth is a registered trademark of Bluetooth SIG.
ZigBee is a registered trademark of ZigBee Alliance.
www.onsemi.com
18
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN4 1.0x1.0, 0.65P
CASE 711AJ
ISSUE C
GENERIC
MARKING DIAGRAM*
XX M
1
DOCUMENT NUMBER:
DESCRIPTION:
XX = Specific Device Code
M = Date Code
98AON67179E
XDFN4, 1.0X1.0, 0.65P
DATE 08 MAR 2022
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
onsemi Website: www.onsemi.com
◊
TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative
工商网监
湘ICP备2023018690号
