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NCP81233MNTXG

NCP81233MNTXG

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    VFQFN52

  • 描述:

    IC REG CNTRL BCK/BST I2C 52QFN

  • 数据手册
  • 价格&库存
NCP81233MNTXG 数据手册
NCP81233 Multi‐Phase Controller with I2C Interface for DrMOS The NCP81233, a multi-phase synchronous buck controller with an I2C interface, provides power management solutions for applications supported by DrMOS. It supports 1-, 2-, 3-, 4-, or 6-phase operation and provides differential voltage and current sense, flexible programming, and comprehensive protections. www.onsemi.com Features • • • • • • • • • • • • • • • • • • • • • • • • • Selectable 1-, 2-, 3-, 4-, or 6-Phase Operation Support up to 12-Phase Operation with Phase Doublers I2C Interface with 8 Programmable Addresses Vin = 4.5 V ~ 20 V with Input Feedforward Integrated 5.35 V LDO and 3.3 V LDO Fsw = 200 k ~ 1.2 MHz Vout = 0.6 V ~ 5.3 V with 0.25 V~1.52 V DAC (5 mV/step) Programmable Vboot Voltage 0.6V ~ 1.23V (10mV/step) with Restore Function DVID Slew Rate Options (0.125 mV/us, 0.25 mV/us, 0.5 mV/us, 1 mV/us, 2 mV/us, 4 mV/us, 8 mV/us, 16 mV/us) Programmable External Reference Input PWM Output Compatible to 3.3 V and 5 V DrMOS Differential Output Voltage Sense Differential Current Sense Compatible for both Inductor DCR Sense and DrMOS Iout Signal Programmable Load Line Report of Vout and Iout Enable with Programmable Input UVLO DrMOS Power Ready Detection (DRVON) Externally Programmable Soft Start Power Saving Interface Power Good Indicator Programmable Over Current Protection Programmable Over/Under Voltage Protection Hiccup Over Temperature Protection Thermal Shutdown Protection This is a Pb-Free Device Typical Applications • • • • January, 2019 − Rev. 1 52 GFN52 6x6, O.4P CASE 485BE PINOUT 52 PIN, QFN 52 51 50 49 48 47 46 45 44 43 42 37 41 40 1 39 2 38 3 37 4 36 35 5 34 6 GND 53 7 8 33 32 9 31 10 30 11 29 12 28 27 13 14 15 16 17 18 19 20 21 22 23 24 24 25 26 For more details see Figure 1. MARKING DIAGRAM* NCP81233 AWLYYWWG A WL YY WW G = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb-Free indicator, “G” or microdot “ G”, may or may not be present. ORDERING INFORMATION Telecom Applications Server and Storage System Graphics Card Applications Multiphase DC-DC Power Management © Semiconductor Components Industries, LLC, 2017 1 Device NCP81233MNTXG Package Shipping† QFN52 (Pb-Free) 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 1 Publication Order Number: NCP81233/D 52 51 50 49 48 47 46 45 44 43 42 41 40 REFIN VSN VSP DIFFOUT FB COMP NC VDRP VDFB CSSUM VREF OTP ILMT NCP81233 1 IMON ISP1 39 2 IMAX ISN1 38 3 VBOOT1 ISN2 37 4 VBOOT2 ISP2 36 5 SS ISP3 35 6 FSET ISN3 34 7 CONFIG ISN4 33 8 MODE1 ISP4 32 9 MODE2 ISP5 31 10 ADDR ISN5 30 11 SDA ISN6 29 12 ALERT# ISP6 28 13 SCL VB_RST#/PSI 27 PGOOD DRVON EN VIN VCC5V VCC3V PVCC PWM6 PWM5 PWM4 PWM3 PWM2 PWM1 GND 53 14 15 16 17 18 19 20 21 22 23 24 25 26 Figure 1. Pin Configuration www.onsemi.com 2 NCP81233 TABLE 1. PIN DESCRIPTION Pin Name Type 1 IMON Analog Output 2 IMAX Analog Input Current Maximum. A resistor from this pin to ground programs IMAX. 3 VBOOT1 Analog Input Boot-Up Voltage 1. A resistor from this pin to ground programs boot voltage 4 VBOOT2 Analog Input Boot-Up Voltage 2. A resistor from this pin to ground programs boot voltage. 5 SS Analog Input Soft-Start Slew Rate. A resistor from this pin to ground programs soft-start slew rate. 6 FSET Analog Input Frequency Selection. A resistor from this pin to ground programs switching frequency per phase. 7 CONFIG Analog Input Configuration. A resistor from this pin to ground programs configuration of power stages. 8 MODE1 Analog Input Mode Programming 1. A resistor from this pin to ground programs configuration of operation functions. 9 MODE2 Analog Input Mode Programming 2. A resistor from this pin to ground programs configuration of operation functions. 10 ADDR Analog Input Address. A resistor from this pin to ground programs address of I2C interface. 11 SDA Logic Bidirectional 12 ALERT# Logic Output 13 SCL Logic Input 14 PGOOD Logic Output Power GOOD. Open-drain output. Provides a logic high valid power good output signal, indicating the regulator’s output is in regulation window. 15 DRVON Analog Input Driver On. High input voltage means power supply of DrMOS’s driver is ready. 16 EN Analog Input Enable. Logic high enables controller while logic low disables controller. Input supply UVLO can be programmed at this pin. 17 VIN Power Input Power Supply Input. Power supply input pin of the device, which is connected to the integrated 5.35 V LDO and 3.3 V LDO. 4.7 mF or more ceramic capacitors must bypass this input to power ground. The capacitors should be placed as close as possible to this pin. 18 VCC5V Analog Power Voltage Supply of Controller. Output of integrated 5.35 V LDO and power input pin of analog circuits. A 4.7 mF ceramic capacitor bypasses this input to GND. This capacitor should be placed as close as possible to this pin. 19 VCC3V Analog Power 3.3 V Voltage Supply. Output of integrated 3.3 V LDO. A 4.7 mF ceramic capacitor bypasses this input to GND. This capacitor should be placed as close as possible to this pin. 20 PVCC Analog Power Voltage Supply of PWM Drivers. Power supply input pin of internal PWM drivers and digital circuits, which is connected to VCC5 V via a 4.7 Ω resistor. A 1 mF or larger ceramic capacitor bypasses this input to ground. This capacitor should be placed as close as possible to this pin. 21 PWM6 Analog Output PWM 6. PWM output of phase 6. 22 PWM5 Analog Output PWM 5. PWM output of phase 5. 23 PWM4 Analog Output PWM 4. PWM output of phase 4. 24 PWM3 Analog Output PWM 3. PWM output of phase 3. 25 PWM2 Analog Output PWM 2. PWM output of phase 2. 26 PWM1 Analog Output PWM 1. PWM output of phase 1. 27 VB_RST# / PSI Logic Input 28 ISP6 Analog Input Description OUT Current Monitor. Provides output signal representing output current by connecting a capacitor from this pin to ground. Serial Data I/O Port. Data port of I2C interface. ALERT. Open-drain output. Provides a logic low valid alert signal. Serial Clock. Clock input of I2C interface. VBOOT Restore. Logic low restores output to boot voltage. Power Saving Interface. Logic high enables Multi-phase CCM operation, and logic low enables 1-phase CCM operation. Pin function is programmed at MODE2 pin. Current Sense Positive Input 6. Non-inverting input of differential current sense amplifier of phase 6. www.onsemi.com 3 NCP81233 TABLE 1. PIN DESCRIPTION (continued) Pin Name Type Description 29 ISN6 Analog Input Current Sense Negative Input 6. Inverting input of differential current sense amplifier of phase 6. 30 ISN5 Analog Input Current Sense Negative Input 5. Inverting input of differential current sense amplifier of phase 5. 31 ISP5 Analog Input Current Sense Positive Input 5. Non-inverting input of differential current sense amplifier of phase 5. 32 ISP4 Analog Input Current Sense Positive Input 4. Non-inverting input of differential current sense amplifier of phase 4. 33 ISN4 Analog Input Current Sense Negative Input 4. Inverting input of differential current sense amplifier of phase 4. 34 ISN3 Analog Input Current Sense Negative Input 3. Inverting input of differential current sense amplifier of phase 3. 35 ISP3 Analog Input Current Sense Positive Input 3. Non-inverting input of differential current sense amplifier of phase 3. 36 ISP2 Analog Input Current Sense Positive Input 2. Non-inverting input of differential current sense amplifier of phase 2. 37 ISN2 Analog Input Current Sense Negative Input 2. Inverting input of differential current sense amplifier of phase 2. 38 ISN1 Analog Input Current Sense Negative Input 1. Inverting input of differential current sense amplifier of phase 1. 39 ISP1 Analog Input Current Sense Positive Input 1. Non-inverting input of differential current sense amplifier of phase 1. 40 ILMT Analog Input Limit of Current. Voltage at this pin sets over-current threshold. 41 OTP Analog Input Over Temperature Protection. Voltage at this pin sets over-temperature threshold. 42 VREF Analog Output Output of Reference. Output of 0.6 V reference. A 10 nF ceramic capacitor bypasses this input to GND. This capacitor should be placed as close as possible to this pin. 43 CSSUM Analog Output Current Sense SUM. Output of current sum amplifier. 44 VDFB Analog Output Droop Amplifier Feedback. Inverting input of droop amplifier 45 VDRP Analog Output Droop Amplifier Output. Output of droop amplifier. 46 NC No Connection 47 COMP Analog Output 48 FB Analog Input 49 DIFFOUT Analog Output Differential Amplifier Output. Output pin of differential voltage sense amplifier. 50 VSP Analog Input Voltage Sense Positive Input. Non-inverting input of differential voltage sense amplifier. 51 VSN Analog Input Voltage Sense Negative Input. Inverting input of differential voltage sense amplifier. 52 REFIN Analog Input Reference Voltage Input. External reference voltage input. 53 THERM/GND Analog Ground Compensation. Output pin of error amplifier. Feedback. Inverting input of internal error amplifier. Thermal Pad and Analog Ground. Ground of internal control circuits. Must be connected to the system ground. www.onsemi.com 4 NCP81233 VIN VIN PVCC PWM1 PWM VCC5V VIN VSWH NCP5339 CGND 3V3 PGND ISP1 VREF ISN1 OTP PWM2 ISP2 ISN2 PWM3 ISP3 ISN3 ILMT DRVON EN PGOOD VB_RST# DRVON PWM4 ISP4 EN NCP81233 ISN4 PGOOD PWM5 VB_RST# / PSI ISP5 ISN5 CONFIG MODE1 PWM6 ISP6 ISN6 MODE2 REFIN VBOOT1 VSN VBOOT2 VSP SS FSET DIFFOUT ADDR SCL SDA ALERT# FB SCL COMP SDA ALERT# GND Figure 2. Typical Application Circuit with Programmed Boot Voltage www.onsemi.com 5 VOUT NCP81233 VIN PVCC VIN PWM1 PWM VSWH NCP5339 CGND PGND VCC5V 3V3 ISP1 VREF ISN1 OTP PWM2 ISP2 ISN2 PWM3 ISP3 ISN3 ILMT DRVON EN PGOOD PSI DRVON PWM4 ISP4 NCP81233 ISN4 PGOOD PWM5 VB_RST# / ISP5 PSI ISN5 CONFIG EN MODE1 PWM6 ISP6 ISN6 MODE2 REF VIN REFIN VBOOT1 VSN VBOOT2 VSP SS FSET ADDR SCL SDA ALERT# DIFFOUT FB SCL COMP SDA ALERT# GND Figure 3. Typical Application Circuit with External Reference Input www.onsemi.com 6 VOUT NCP81233 VIN NCP5339 PWM VIN VOUT VSWH PGND PWMA CSPA VCCD PWM1 CSNA CSNB NCP81162 PWM_IN PWMB CSPB VIN PWM VIN VSWH PGND NCP5339 ISP1 ISN1 NCP81233 PWM2 ISP2 ISN2 PWM3 ISP3 ISN3 PWM4 ISP4 ISN4 PWM5 ISP5 ISN5 PWM6 ISP6 ISN6 Figure 4. Application Circuit with Phase Doublers www.onsemi.com 7 NCP81233 GND VIN 3V3 VCC5V PVCC LDO OC1 VREF VB_RST# /PSI DRVON EN Reference PWM Control OC4 OC5 & PWM4 Protections PWM5 OC6 PWM3 PWM6 OC1 OC2 OC3 OC4 OC5 OC6 IMAX VBOOT1 VBOOT2 MODE1 PWM2 OC3 UVLO & PGOOD PGOOD FSET PWM1 Multi−Phase OC2 VREF Current Limit Programming Detection ILMT OT Over Temperature Protection ILMT ISP1 CS1 ISN1 MODE2 SS ISP2 ADDR CS2 ISN2 REFIN ALERT# SCL OTP ISP3 CS3 VID DAC / REFIN I2C Interface SDA ISN3 ISP4 CS4 VSP ISN4 VSN ISP5 DIFFOUT CS5 COMP ISN5 FB ISP6 CS6 ISN6 Vbias VDFB VDRP CSSUM VDRP −1/3 Vbias Figure 5. Functional Block Diagram www.onsemi.com 8 IMON 10 NCP81233 TABLE 2. MAXIMUM RATINGS Value Rating MIN Symbol MAX Unit 30 V 6.5 V −0.2 0.2 V −0.3 VCC5 V+0.3 V Power Supply Voltage to PGND VVIN Supply Voltage VCC5V to GND VVCC5V −0.3 VVSN VSNx to GND Other Pins to GND Human Body Model (HBM) ESD Rating are (Note 1) ESD HBM 2500 V Charge Device Model (CDM) ESD Rating are (Note 1) ESD CDM 2000 V Latch up Current: (Note 2) ILU −100 100 mA Operating Junction Temperature Range (Note 3) TJ −40 125 °C Operating Ambient Temperature Range TA −40 100 °C Storage Temperature Range TSTG −55 Thermal Resistance Junction to Top Case(Note 4) RΨJC 1.65 _C/W Thermal Resistance Junction to Board (Note 4) RΨJB 3.2 _C/W Thermal Resistance Junction to Ambient (Note 4) RθJA 67.4 _C/W PD 1.48 W MSL 1 − Power Dissipation (Note 5) Moisture Sensitivity Level (Note 6) 150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. This device is ESD sensitive. Handling precautions are needed to avoid damage or performance degradation. 2. Latch up Current per JEDEC standard: JESD78 class II. 3. The thermal shutdown set to 150°C (typical) avoids potential irreversible damage on the device due to power dissipation. 4. JEDEC standard JESD 51−7 (1S2P Direct-Attach Method) with 0 LFM. It is for checking junction temperature using external measurement. 5. The maximum power dissipation (PD) is dependent on input voltage, maximum output current and external components selected. Tambient = 25°C, Tjunc_max = 125°C, PD = (Tjunc_max−T_amb)/Theta JA 6. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J-STD-020A. TABLE 3. ELECTRICAL CHARACTERISTICS (VIN = 12 V, typical values are referenced to TA = TJ = 25°C, Min and Max values are referenced to TA = TJ = −40°C to 100°C. unless other noted.) Characteristics Test Conditions Symbol MIN TYP MAX UNITS VIN 4.5 12 20 V 3.7 SUPPLY VOLTAGE VIN Supply Voltage Range (Note 7) VCC5V Under-Voltage (UVLO) Threshold VCC5V falling VCCUV− VCC5V OK Threshold VCC5V rising VCCOK VCC5V UVLO Hysteresis 4.3 VCCHYS VCC3V Under−Voltage (UVLO) Threshold VCC3V falling VCC3UV− VCC3V OK Threshold VCC3V rising VCC3OK VCC3V UVLO Hysteresis V 270 mV 2.6 V 2.9 VCC3HYS V 135 V mV VCC5V REGULATOR Output Voltage 6V < VIN < 20V, IVCC5V = 15mA (External),EN = Low VCC Load Regulation IVCC5V = 5mA to 25mA (External), EN = Low Dropout Voltage VIN = 5V, IVCC5V = 25mA (External), EN = Low VDO_VCC IVCC3V = 5 mA (External), EN = Low V3V3 5.2 5.35 5.5 V −2.0 0.2 2.0 % 200 mV 3.5 V VCC3V REGULATOR Output Voltage www.onsemi.com 9 3.1 3.3 NCP81233 TABLE 3. ELECTRICAL CHARACTERISTICS (continued) (VIN = 12 V, typical values are referenced to TA = TJ = 25°C, Min and Max values are referenced to TA = TJ = −40°C to 100°C. unless other noted.) Characteristics Test Conditions Symbol MIN TYP MAX UNITS 3.0 % VCC3V REGULATOR Load Regulation IVCC3V = 0.5 mA to 10 mA (External), EN = Low −3.0 SUPPLY CURRENT VIN Quiescent Current EN high, 1−phase only EN high, 6−phase IQVIN − − 11 17 20 28 mA mA VIN Shutdown Current EN low IsdVIN − 5 9 mA VREF Output Voltage IVREF = 500 μA VVREF 594 600 606 mV Load Regulation IVREF = 0 mA to 2 mA 1.0 % 1.53 V −100 100 nA –40°C to 85°C −7 7 mV –40°C to 125°C −10 10 –40°C to 85°C −0.5 0.5 –40°C to 125°C −1.0 1.0 VREF −1.0 REFIN Maximum REFIN Voltage (Note 7) REFIN Bias Current VREFIN = 1.0 V IREFIN SYSTEM VOLTAGE ACCURACY System Voltage Accuracy (V = VDAC or VREFIN) 1.0 V < V v 1.52 V 0.7 V v V v 1.0 V 0.5 V v V < 0.7 V 0.25 V v V < 0.5 V –40°C to 85°C −7 7 –40°C to 125°C −10 10 –40°C to 85°C −8 8 –40°C to 125°C −12 12 −0.2 1.72 % mV mV DIFFERENTIAL VOLTAGE-SENSE AMPLIFIER VSP Input Voltage Range (Note 7) VSN Input Voltage Range (Note 7) DC Gain VSP−VSN = 0 V to 1.52 V −3dB Gain Bandwidth CL = 20 pF to GND, RL = 10 KW to GND (Note 7) Input Bias Current VSP = 1.72, VSN = −0.2 V −0.2 0.2 V V GAIN_DVA 1.0 V/V BW_DVA 10 MHz IVS −400 400 nA VOLTAGE ERROR AMPLIFIER Open-Loop DC Gain (Note 7) GAINEA 80 dB Unity Gain Bandwidth (Note 7) GBWEA 20 MHz Slew Rate (Note 7) SRCOMP 20 V/ms COMP Voltage Swing ICOMP(source) = 2 mA ICOMP(sink) = 2 mA VmaxCOMP TRBST is Enabled VFB = 1.3V 3.4 VminCOMP TRBST is Disabled FB Bias Current 3.2 − IFB − V 0.3 V 400 nA 1.1 −400 DIFFERENTIAL CURRENT-SENSE AMPLIFIER DC Gain −3dB Gain Bandwidth (Note 7) www.onsemi.com 10 GAINCA 6 V/V BWCA 10 MHz NCP81233 TABLE 3. ELECTRICAL CHARACTERISTICS (continued) (VIN = 12 V, typical values are referenced to TA = TJ = 25°C, Min and Max values are referenced to TA = TJ = −40°C to 100°C. unless other noted.) Characteristics Test Conditions Symbol MIN TYP MAX UNITS Vcc+0.1 V 60 mV 100 nA DIFFERENTIAL CURRENT-SENSE AMPLIFIER Input Common Mode Voltage Range (Note 7) Differential Input Voltage Range (Note 7) Input Bias Current ISP, ISN = 1.0 V −0.2 −60 ICS − −100 CURRENT SUMMING AMPLIFIER DC Gain From (ISPn – ISNn) to (CSSUM – Vbias) GAINCSSUM −2 V/V −3dB Gain Bandwidth CL = 10 pF to GND, RL = 10 kW to GND (Note 7) BWCSSUM 5 MHz CSSUM Output Offset All (ISPn – ISNn) = 0 V (Note 7) VosCSSUM Maximum CSSUM Output Voltage ICSSUM(source) = 1 mA (Note 7) 2.02 V Minimum CSSUM Output Voltage ICSSUM(sink) = 1 mA (Note 7) 0.56 V −7 0 7 mV DROOP AMPLIFIER Open-Loop DC Gain (Note 7) GAINDA 80 dB Unity Gain Bandwidth (Note 7) GBWDA 10 MHz Input Offset Voltage (Note 7) VosDA −2.5 2.5 mV Input Bias Current VDFB = 1.3V IDFB −200 200 nA Maximum VDRP Output Voltage IVDRP(source) = 2 mA (Note 7) 3.0 V Minimum VDRP Output Voltage IVDRP(sink) = 2 mA (Note 7) 1.0 V GAINIMON 10 V/V 2 MHz IMON AMPLIFIER DC Gain −3dB Gain Bandwidth (Note 7) BWIMON Input Offset Voltage (Note 7) VosIMON Output Impedance (Note 7) RIMON −2 2 20 mV kW IMAX SourceCurrent VIMAX = 1V 47.5 50 52.5 mA − 1110000 1110001 1110010 1110011 1110100 1110101 1110110 1110111 − − I2C INTERFACE ADDRESS Address Float Short to GND 2.7k 5.1k 8.2k 13k 20k 33k − Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 11 NCP81233 TABLE 3. ELECTRICAL CHARACTERISTICS (continued) (VIN = 12 V, typical values are referenced to TA = TJ = 25°C, Min and Max values are referenced to TA = TJ = −40°C to 100°C. unless other noted.) Characteristics Test Conditions Symbol MIN TYP MAX UNITS VBOOT CODE VBOOT1 Float Short to GND 2.7 k 5.1 k 8.2 k 13 k 20 k 33 k − − 000XXX 001XXX 010XXX 011XXX 100XXX 101XXX 110XXX 111XXX − − VBOOT2 Float Short to GND 2.7 k 5.1 k 8.2 k 13 k 20 k 33 k − − XXX000 XXX001 XXX010 XXX011 XXX100 XXX101 XXX110 XXX111 − − IVBT 45 50 55 mA FSW 180 270 360 450 540 720 900 1080 200 300 400 500 600 800 1000 1200 220 330 440 550 660 880 1100 1320 kHz IFS 45 50 55 mA Source Current SWITCHING FREQUENCY Switching Frequency 2.7 k 5.1 k Float 8.2 k Short to GND 13 k 20 k 33 k Source Current SYSTEM RESET TIME System Reset Time Measured from EN to start of soft start. TRST 2.0 ms Float SSSR 0.125 mV/us SOFT START Soft−Start Slew Rate 33 k 0.25 20 k 0.5 13 k 1.0 8.2 k 2.0 5.1 k 4.0 2.7 k 8.0 Short to GND 16 Source Current ISS 45 50 55 mA DVID DVID Slew Rate I2C SR 000 0.125 001 0.25 010 0.5 011 1.0 100 2.0 101 4.0 110 8.0 111 16 mV/us INTERFACE Logic High Input Voltage VIH(SDA, SCL) www.onsemi.com 12 1.5 V NCP81233 TABLE 3. ELECTRICAL CHARACTERISTICS (continued) (VIN = 12 V, typical values are referenced to TA = TJ = 25°C, Min and Max values are referenced to TA = TJ = −40°C to 100°C. unless other noted.) Characteristics Test Conditions Symbol MIN TYP MAX UNITS 0.7 V I2C INTERFACE VIL(SDA, SCL) Logic Low Input Voltage Hysteresis SDA Output Low Voltage 350 ISDA = −4 mA VOL Input Current IIH; IIL Input Capacitance (Note 7) CSCL, SDA Clock Frequency (Note 7) fSCL −1.0 mV 0.3 V 1.0 mA 5.0 pF 400 kHz SCL Falling Edge to SDA Valid Time (Note 7) 1.0 ms ALERT# Low Voltage IALERT= −4 mA VLALERT 0.3 V ALERT# Leakage Current ALERT# = 5 V IlkgALERT 1.0 mA PGOOD Startup Delay Measured from end of Soft Start to PGOOD assertion (Note 7) Td_PGOOD PGOOD Shutdown Delay Measured from EN to PGOOD de-assertion PGOOD Low Voltage IPGOOD= −4 mA VlPGOOD 0.3 V PGOOD Leakage Current PGOOD = 5 V IlkgPGOOD 1.0 mA 300 315 mV 120 130 PGOOD 100 ms 250 ns PROTECTIONS Current Limit Threshold Measured from ILIMT to GND Over Current Protection (OCP) Debounce Time (Note 7) Under Voltage Threshold Below DAC VSP falling ISP−ISN = 50 mV VOCTH ISP−ISN = 2 0 mV 285 110 8 Cycles VUVTH Under Voltage Protection (UVP) Hysteresis 250 VUVHYS 300 us 350 25 mV mV Under-voltage Debounce Time (Note 7) 5 ms Shutdown Time in Hiccup Mode UVP (Note 7) OCP (Note 7) OTP (Note 7) 30 ms Absolute Over Voltage Threshold During Soft-Start 40 20 VSP-GND 2.0 Absolute Over Voltage Threshold Hysteresis 2.1 2.2 −25 Over Voltage Threshold Above DAC VSP rising VOVTH Over Voltage Protection Hysteresis VSP falling VOVHYS Over Voltage Debounce Time VSP rising to GH low Offset Voltage of OTP Comparator VILMT = 200 mV 175 200 mV 225 −25 OTP Source Current −2 IOTP 9 140 OTP Debounce Time (Note 7) Thermal Shutdown (TSD) Threshold (Note 7) Tsd Recovery Temperature Threshold (Note 7) Trec Thermal Shutdown (TSD) Debounce Time (Note 7) www.onsemi.com 13 10 mV mV 1.0 VOS_OTP V us 2 mV 11 mA 140 ns 150 °C 125 °C 120 ns NCP81233 TABLE 3. ELECTRICAL CHARACTERISTICS (continued) (VIN = 12 V, typical values are referenced to TA = TJ = 25°C, Min and Max values are referenced to TA = TJ = −40°C to 100°C. unless other noted.) Characteristics Test Conditions Symbol MIN TYP MAX UNITS 3.5 V ENABLE EN Operation Voltage Range 0 EN ON Threshold Hysteresis Source Current VCC5V is OK VEN_TH 0.7 0.8 0.85 V IEN_HYS 25 30 35 mA 2.0 V DRVON DRVON Operation Voltage Range 0 DRVON ON Threshold VDRVON_TH 0.75 0.8 0.85 V IDRVON_HYS 25 30 35 mA High Threshold VhighRST 1.5 − − V Low Threshold VlowRST − − 0.7 V Hysteresis VhysRST Hysteresis Source Current VCC5V is OK VB_RST# and PSI Input Bias Current External 1 K pull−up to 3.3 V IbiasRST 350 − − mV 1.0 mA 50 ns PWM MODULATION Minimum On Time (Note 7) Ton_min Minimum Off Time (Note 7) Toff_min 0% Duty Cycle COMP voltage when the PWM outputs remain Lo (Note 7) 1.3 V 100% Duty Cycle COMP voltage when the PWM outputs remain HI, Vin = 12.0 V (Note 7) 2.5 V Ramp Feed−forward Voltage Range (Note 7) 160 ns 4.5 20 V PWM OUTPUT PWM Output High Voltage Isource = 0.5 mA VPWM_H PWM Output Low Voltage Isink = 0.5 mA VPWM_L Rise and Fall Times CL (PCB) = 50 pF, measured between 10% & 90% of VCC (Note 7) Leakage Current in Hi-Z Stage VCC −0.2 V 0.2 V 10 ILK_PWM −1.0 ns 1.0 mA 7. Guaranteed by design, not tested in production. Table 4. RESISTOR OPTIONS FOR FUNCTION PROGRAMMING Resistance Range (kW) Resistor Options (kW) MIN TYP MAX +5% 2.565 2.7 2.835 2.7 2.61 2.67 2.74 2.80 4.845 5.1 5.355 5.1 4.87 4.99 5.11 5.23 +1% 7.79 8.2 8.61 8.2 7.87 8.06 8.25 8.45 12.35 13 13.65 13 12.4 12.7 13 13.3 19 20 21 20 19.1 19.6 20 20.5 31.35 33 34.65 33 31.6 32.4 33.2 34 www.onsemi.com 14 NCP81233 TABLE 5. VBOOT CODES VBOOT1 VBOOT2 Voltage(V) HEX VBOOT1 VBOOT2 Voltage(V) HEX 0 0 0 0 0 0 0.6 00 1 0 0 0 0 0 0.92 20 0 0 0 0 0 1 0.61 01 1 0 0 0 0 1 0.93 21 0 0 0 0 1 0 0.62 02 1 0 0 0 1 0 0.94 22 0 0 0 0 1 1 0.63 03 1 0 0 0 1 1 0.95 23 0 0 0 1 0 0 0.64 04 1 0 0 1 0 0 0.96 24 0 0 0 1 0 1 0.65 05 1 0 0 1 0 1 0.97 25 0 0 0 1 1 0 0.66 06 1 0 0 1 1 0 0.98 26 0 0 0 1 1 1 0.67 07 1 0 0 1 1 1 0.99 27 0 0 1 0 0 0 0.68 08 1 0 1 0 0 0 1 28 0 0 1 0 0 1 0.69 09 1 0 1 0 0 1 1.01 29 0 0 1 0 1 0 0.7 0A 1 0 1 0 1 0 1.02 2A 0 0 1 0 1 1 0.71 0B 1 0 1 0 1 1 1.03 2B 0 0 1 1 0 0 0.72 0C 1 0 1 1 0 0 1.04 2C 0 0 1 1 0 1 0.73 0D 1 0 1 1 0 1 1.05 2D 0 0 1 1 1 0 0.74 0E 1 0 1 1 1 0 1.06 2E 0 0 1 1 1 1 0.75 0F 1 0 1 1 1 1 1.07 2F 0 1 0 0 0 0 0.76 10 1 1 0 0 0 0 1.08 30 0 1 0 0 0 1 0.77 11 1 1 0 0 0 1 1.09 31 0 1 0 0 1 0 0.78 12 1 1 0 0 1 0 1.1 32 0 1 0 0 1 1 0.79 13 1 1 0 0 1 1 1.11 33 0 1 0 1 0 0 0.8 14 1 1 0 1 0 0 1.12 34 0 1 0 1 0 1 0.81 15 1 1 0 1 0 1 1.13 35 0 1 0 1 1 0 0.82 16 1 1 0 1 1 0 1.14 36 0 1 0 1 1 1 0.83 17 1 1 0 1 1 1 1.15 37 0 1 1 0 0 0 0.84 18 1 1 1 0 0 0 1.16 38 0 1 1 0 0 1 0.85 19 1 1 1 0 0 1 1.17 39 0 1 1 0 1 0 0.86 1A 1 1 1 0 1 0 1.18 3A 0 1 1 0 1 1 0.87 1B 1 1 1 0 1 1 1.19 3B 0 1 1 1 0 0 0.88 1C 1 1 1 1 0 0 1.2 3C 0 1 1 1 0 1 0.89 1D 1 1 1 1 0 1 1.21 3D 0 1 1 1 1 0 0.9 1E 1 1 1 1 1 0 1.22 3E 0 1 1 1 1 1 0.91 1F 1 1 1 1 1 1 1.23 3F www.onsemi.com 15 NCP81233 TABLE 6. VID CODES VID7 VID6 VID5 VID4 VID3 VID2 VID1 VID0 Voltage (V) HEX 0 0 0 0 0 0 0 0 OFF 00 0 0 0 0 0 0 0 1 0.25000 01 0 0 0 0 0 0 1 0 0.25500 02 0 0 0 0 0 0 1 1 0.26000 03 0 0 0 0 0 1 0 0 0.26500 04 0 0 0 0 0 1 0 1 0.27000 05 0 0 0 0 0 1 1 0 0.27500 06 0 0 0 0 0 1 1 1 0.28000 07 0 0 0 0 1 0 0 0 0.28500 08 0 0 0 0 1 0 0 1 0.29000 09 0 0 0 0 1 0 1 0 0.29500 0A 0 0 0 0 1 0 1 1 0.30000 0B 0 0 0 0 1 1 0 0 0.30500 0C 0 0 0 0 1 1 0 1 0.31000 0D 0 0 0 0 1 1 1 0 0.31500 0E 0 0 0 0 1 1 1 1 0.32000 0F 0 0 0 1 0 0 0 0 0.32500 10 0 0 0 1 0 0 0 1 0.33000 11 0 0 0 1 0 0 1 0 0.33500 12 0 0 0 1 0 0 1 1 0.34000 13 0 0 0 1 0 1 0 0 0.34500 14 0 0 0 1 0 1 0 1 0.35000 15 0 0 0 1 0 1 1 0 0.35500 16 0 0 0 1 0 1 1 1 0.36000 17 0 0 0 1 1 0 0 0 0.36500 18 0 0 0 1 1 0 0 1 0.37000 19 0 0 0 1 1 0 1 0 0.37500 1A 0 0 0 1 1 0 1 1 0.38000 1B 0 0 0 1 1 1 0 0 0.38500 1C 0 0 0 1 1 1 0 1 0.39000 1D 0 0 0 1 1 1 1 0 0.39500 1E 0 0 0 1 1 1 1 1 0.40000 1F 0 0 1 0 0 0 0 0 0.40500 20 0 0 1 0 0 0 0 1 0.41000 21 www.onsemi.com 16 NCP81233 TABLE 6. VID CODES (continued) VID7 VID6 VID5 VID4 VID3 VID2 VID1 VID0 Voltage (V) HEX 0 0 1 0 0 0 1 0 0.41500 22 0 0 1 0 0 0 1 1 0.42000 23 0 0 1 0 0 1 0 0 0.42500 24 0 0 1 0 0 1 0 1 0.43000 25 0 0 1 0 0 1 1 0 0.43500 26 0 0 1 0 0 1 1 1 0.44000 27 0 0 1 0 1 0 0 0 0.44500 28 0 0 1 0 1 0 0 1 0.45000 29 0 0 1 0 1 0 1 0 0.45500 2A 0 0 1 0 1 0 1 1 0.46000 2B 0 0 1 0 1 1 0 0 0.46500 2C 0 0 1 0 1 1 0 1 0.47000 2D 0 0 1 0 1 1 1 0 0.47500 2E 0 0 1 0 1 1 1 1 0.48000 2F 0 0 1 1 0 0 0 0 0.48500 30 0 0 1 1 0 0 0 1 0.49000 31 0 0 1 1 0 0 1 0 0.49500 32 0 0 1 1 0 0 1 1 0.50000 33 0 0 1 1 0 1 0 0 0.50500 34 0 0 1 1 0 1 0 1 0.51000 35 0 0 1 1 0 1 1 0 0.51500 36 0 0 1 1 0 1 1 1 0.52000 37 0 0 1 1 1 0 0 0 0.52500 38 0 0 1 1 1 0 0 1 0.53000 39 0 0 1 1 1 0 1 0 0.53500 3A 0 0 1 1 1 0 1 1 0.54000 3B 0 0 1 1 1 1 0 0 0.54500 3C 0 0 1 1 1 1 0 1 0.55000 3D 0 0 1 1 1 1 1 0 0.55500 3E 0 0 1 1 1 1 1 1 0.56000 3F 0 1 0 0 0 0 0 0 0.56500 40 0 1 0 0 0 0 0 1 0.57000 41 0 1 0 0 0 0 1 0 0.57500 42 0 1 0 0 0 0 1 1 0.58000 43 www.onsemi.com 17 NCP81233 TABLE 6. VID CODES (continued) VID7 VID6 VID5 VID4 VID3 VID2 VID1 VID0 Voltage (V) HEX 0 1 0 0 0 1 0 0 0.58500 44 0 1 0 0 0 1 0 1 0.59000 45 0 1 0 0 0 1 1 0 0.59500 46 0 1 0 0 0 1 1 1 0.60000 47 0 1 0 0 1 0 0 0 0.60500 48 0 1 0 0 1 0 0 1 0.61000 49 0 1 0 0 1 0 1 0 0.61500 4A 0 1 0 0 1 0 1 1 0.62000 4B 0 1 0 0 1 1 0 0 0.62500 4C 0 1 0 0 1 1 0 1 0.63000 4D 0 1 0 0 1 1 1 0 0.63500 4E 0 1 0 0 1 1 1 1 0.64000 4F 0 1 0 1 0 0 0 0 0.64500 50 0 1 0 1 0 0 0 1 0.65000 51 0 1 0 1 0 0 1 0 0.65500 52 0 1 0 1 0 0 1 1 0.66000 53 0 1 0 1 0 1 0 0 0.66500 54 0 1 0 1 0 1 0 1 0.67000 55 0 1 0 1 0 1 1 0 0.67500 56 0 1 0 1 0 1 1 1 0.68000 57 0 1 0 1 1 0 0 0 0.68500 58 0 1 0 1 1 0 0 1 0.69000 59 0 1 0 1 1 0 1 0 0.69500 5A 0 1 0 1 1 0 1 1 0.70000 5B 0 1 0 1 1 1 0 0 0.70500 5C 0 1 0 1 1 1 0 1 0.71000 5D 0 1 0 1 1 1 1 0 0.71500 5E 0 1 0 1 1 1 1 1 0.72000 5F 0 1 1 0 0 0 0 0 0.72500 60 0 1 1 0 0 0 0 1 0.73000 61 0 1 1 0 0 0 1 0 0.73500 62 0 1 1 0 0 0 1 1 0.74000 63 0 1 1 0 0 1 0 0 0.74500 64 0 1 1 0 0 1 0 1 0.75000 65 www.onsemi.com 18 NCP81233 TABLE 6. VID CODES (continued) VID7 VID6 VID5 VID4 VID3 VID2 VID1 VID0 Voltage (V) HEX 0 1 1 0 0 1 1 0 0.75500 66 0 1 1 0 0 1 1 1 0.76000 67 0 1 1 0 1 0 0 0 0.76500 68 0 1 1 0 1 0 0 1 0.77000 69 0 1 1 0 1 0 1 0 0.77500 6A 0 1 1 0 1 0 1 1 0.78000 6B 0 1 1 0 1 1 0 0 0.78500 6C 0 1 1 0 1 1 0 1 0.79000 6D 0 1 1 0 1 1 1 0 0.79500 6E 0 1 1 0 1 1 1 1 0.80000 6F 0 1 1 1 0 0 0 0 0.80500 70 0 1 1 1 0 0 0 1 0.81000 71 0 1 1 1 0 0 1 0 0.81500 72 0 1 1 1 0 0 1 1 0.82000 73 0 1 1 1 0 1 0 0 0.82500 74 0 1 1 1 0 1 0 1 0.83000 75 0 1 1 1 0 1 1 0 0.83500 76 0 1 1 1 0 1 1 1 0.84000 77 0 1 1 1 1 0 0 0 0.84500 78 0 1 1 1 1 0 0 1 0.85000 79 0 1 1 1 1 0 1 0 0.85500 7A 0 1 1 1 1 0 1 1 0.86000 7B 0 1 1 1 1 1 0 0 0.86500 7C 0 1 1 1 1 1 0 1 0.87000 7D 0 1 1 1 1 1 1 0 0.87500 7E 0 1 1 1 1 1 1 1 0.88000 7F 1 0 0 0 0 0 0 0 0.88500 80 1 0 0 0 0 0 0 1 0.89000 81 1 0 0 0 0 0 1 0 0.89500 82 1 0 0 0 0 0 1 1 0.90000 83 1 0 0 0 0 1 0 0 0.90500 84 1 0 0 0 0 1 0 1 0.91000 85 1 0 0 0 0 1 1 0 0.91500 86 1 0 0 0 0 1 1 1 0.92000 87 www.onsemi.com 19 NCP81233 TABLE 6. VID CODES (continued) VID7 VID6 VID5 VID4 VID3 VID2 VID1 VID0 Voltage (V) HEX 1 0 0 0 1 0 0 0 0.92500 88 1 0 0 0 1 0 0 1 0.93000 89 1 0 0 0 1 0 1 0 0.93500 8A 1 0 0 0 1 0 1 1 0.94000 8B 1 0 0 0 1 1 0 0 0.94500 8C 1 0 0 0 1 1 0 1 0.95000 8D 1 0 0 0 1 1 1 0 0.95500 8E 1 0 0 0 1 1 1 1 0.96000 8F 1 0 0 1 0 0 0 0 0.96500 90 1 0 0 1 0 0 0 1 0.97000 91 1 0 0 1 0 0 1 0 0.97500 92 1 0 0 1 0 0 1 1 0.98000 93 1 0 0 1 0 1 0 0 0.98500 94 1 0 0 1 0 1 0 1 0.99000 95 1 0 0 1 0 1 1 0 0.99500 96 1 0 0 1 0 1 1 1 1.00000 97 1 0 0 1 1 0 0 0 1.00500 98 1 0 0 1 1 0 0 1 1.01000 99 1 0 0 1 1 0 1 0 1.01500 9A 1 0 0 1 1 0 1 1 1.02000 9B 1 0 0 1 1 1 0 0 1.02500 9C 1 0 0 1 1 1 0 1 1.03000 9D 1 0 0 1 1 1 1 0 1.03500 9E 1 0 0 1 1 1 1 1 1.04000 9F 1 0 1 0 0 0 0 0 1.04500 A0 1 0 1 0 0 0 0 1 1.05000 A1 1 0 1 0 0 0 1 0 1.05500 A2 1 0 1 0 0 0 1 1 1.06000 A3 1 0 1 0 0 1 0 0 1.06500 A4 1 0 1 0 0 1 0 1 1.07000 A5 1 0 1 0 0 1 1 0 1.07500 A6 1 0 1 0 0 1 1 1 1.08000 A7 1 0 1 0 1 0 0 0 1.08500 A8 1 0 1 0 1 0 0 1 1.09000 A9 www.onsemi.com 20 NCP81233 TABLE 6. VID CODES (continued) VID7 VID6 VID5 VID4 VID3 VID2 VID1 VID0 Voltage (V) HEX 1 0 1 0 1 0 1 0 1.09500 AA 1 0 1 0 1 0 1 1 1.10000 AB 1 0 1 0 1 1 0 0 1.10500 AC 1 0 1 0 1 1 0 1 1.11000 AD 1 0 1 0 1 1 1 0 1.11500 AE 1 0 1 0 1 1 1 1 1.12000 AF 1 0 1 1 0 0 0 0 1.12500 B0 1 0 1 1 0 0 0 1 1.13000 B1 1 0 1 1 0 0 1 0 1.13500 B2 1 0 1 1 0 0 1 1 1.14000 B3 1 0 1 1 0 1 0 0 1.14500 B4 1 0 1 1 0 1 0 1 1.15000 B5 1 0 1 1 0 1 1 0 1.15500 B6 1 0 1 1 0 1 1 1 1.16000 B7 1 0 1 1 1 0 0 0 1.16500 B8 1 0 1 1 1 0 0 1 1.17000 B9 1 0 1 1 1 0 1 0 1.17500 BA 1 0 1 1 1 0 1 1 1.18000 BB 1 0 1 1 1 1 0 0 1.18500 BC 1 0 1 1 1 1 0 1 1.19000 BD 1 0 1 1 1 1 1 0 1.19500 BE 1 0 1 1 1 1 1 1 1.20000 BF 1 1 0 0 0 0 0 0 1.20500 C0 1 1 0 0 0 0 0 1 1.21000 C1 1 1 0 0 0 0 1 0 1.21500 C2 1 1 0 0 0 0 1 1 1.22000 C3 1 1 0 0 0 1 0 0 1.22500 C4 1 1 0 0 0 1 0 1 1.23000 C5 1 1 0 0 0 1 1 0 1.23500 C6 1 1 0 0 0 1 1 1 1.24000 C7 1 1 0 0 1 0 0 0 1.24500 C8 1 1 0 0 1 0 0 1 1.25000 C9 1 1 0 0 1 0 1 0 1.25500 CA 1 1 0 0 1 0 1 1 1.26000 CB www.onsemi.com 21 NCP81233 TABLE 6. VID CODES (continued) VID7 VID6 VID5 VID4 VID3 VID2 VID1 VID0 Voltage (V) HEX 1 1 0 0 1 1 0 0 1.26500 CC 1 1 0 0 1 1 0 1 1.27000 CD 1 1 0 0 1 1 1 0 1.27500 CE 1 1 0 0 1 1 1 1 1.28000 CF 1 1 0 1 0 0 0 0 1.28500 D0 1 1 0 1 0 0 0 1 1.29000 D1 1 1 0 1 0 0 1 0 1.29500 D2 1 1 0 1 0 0 1 1 1.30000 D3 1 1 0 1 0 1 0 0 1.30500 D4 1 1 0 1 0 1 0 1 1.31000 D5 1 1 0 1 0 1 1 0 1.31500 D6 1 1 0 1 0 1 1 1 1.32000 D7 1 1 0 1 1 0 0 0 1.32500 D8 1 1 0 1 1 0 0 1 1.33000 D9 1 1 0 1 1 0 1 0 1.33500 DA 1 1 0 1 1 0 1 1 1.34000 DB 1 1 0 1 1 1 0 0 1.34500 DC 1 1 0 1 1 1 0 1 1.35000 DD 1 1 0 1 1 1 1 0 1.35500 DE 1 1 0 1 1 1 1 1 1.36000 DF 1 1 1 0 0 0 0 0 1.36500 E0 1 1 1 0 0 0 0 1 1.37000 E1 1 1 1 0 0 0 1 0 1.37500 E2 1 1 1 0 0 0 1 1 1.38000 E3 1 1 1 0 0 1 0 0 1.38500 E4 1 1 1 0 0 1 0 1 1.39000 E5 1 1 1 0 0 1 1 0 1.39500 E6 1 1 1 0 0 1 1 1 1.40000 E7 1 1 1 0 1 0 0 0 1.40500 E8 1 1 1 0 1 0 0 1 1.41000 E9 1 1 1 0 1 0 1 0 1.41500 EA 1 1 1 0 1 0 1 1 1.42000 EB 1 1 1 0 1 1 0 0 1.42500 EC 1 1 1 0 1 1 0 1 1.43000 ED www.onsemi.com 22 NCP81233 TABLE 6. VID CODES (continued) VID7 VID6 VID5 VID4 VID3 VID2 VID1 VID0 Voltage (V) HEX 1 1 1 0 1 1 1 0 1.43500 EE 1 1 1 0 1 1 1 1 1.44000 EF 1 1 1 1 0 0 0 0 1.44500 F0 1 1 1 1 0 0 0 1 1.45000 F1 1 1 1 1 0 0 1 0 1.45500 F2 1 1 1 1 0 0 1 1 1.46000 F3 1 1 1 1 0 1 0 0 1.46500 F4 1 1 1 1 0 1 0 1 1.47000 F5 1 1 1 1 0 1 1 0 1.47500 F6 1 1 1 1 0 1 1 1 1.48000 F7 1 1 1 1 1 0 0 0 1.48500 F8 1 1 1 1 1 0 0 1 1.49000 F9 1 1 1 1 1 0 1 0 1.49500 FA 1 1 1 1 1 0 1 1 1.50000 FB 1 1 1 1 1 1 0 0 1.50500 FC 1 1 1 1 1 1 0 1 1.51000 FD 1 1 1 1 1 1 1 0 1.51500 FE 1 1 1 1 1 1 1 1 1.52000 FF www.onsemi.com 23 NCP81233 TABLE 7. STANDARD COMMAND CODES (PART 1) Command Code R/W Default Description # Bytes 0x01 R/W 0x80 Operation 1 0x02 R/W 0x17 ON_OFF_Config Comment Operation command turns the device on or off in conjunction with EN signal. 1 Bit Default R/W Comment 7 1 R/W 0: Immediate Off; 1: On (slew rate set by soft-start) Default 6 0 R (Reserved for future use.) 5:2 0000 R Margin Operation. (Reserved for future use.) 1:0 00 R (Reserved for future use.) Configures how the controller is turned on and off. Bit Default R/W Comment 7:5 000 R (Reserved for future use.) 4 1 R Switching starts when commanded by the EN Pin and the Operation Command, as set in Bits 3:0 3 0 R/W 0: Unit ignores OPERATION commands over the I2C Interface 1: Unit responds to OPERATION command, power up may also depend upon EN input, as described in Bit 2 2 1 R 0: Unit ignores EN pin 1: Unit responds EN pin, power up may also depend upon the Operation Register, as described for Bit 3 1 1 R EN Pin polarity 0 = Active Low 1 = Active High 0 1 R 1: When the controller is disabled it will immediately turn off (as set in the Operation Command) 0x03 W NA Clear_Faults 0 Writing any value to this command code will clear all Status Bits immediately. The ALERT# is deasserted on this command. If the fault is still present the fault bit shall immediately be asserted again. This command is write only. There is no data byte for this command. 0x19 R 0xB0 Capability 1 This command allows the host to get some information on the I2C device. Bit Default R/W 7 1 R PEC (Packet Error Checking is supported) 6:5 01 R Supported maximum bus speed is 400 kHz 4 1 R NCP81233 has an ALERT# pin and Alert Response Address (ARA) protocol is supported 3:0 0000 R (Reserved for future use.) www.onsemi.com 24 Comment NCP81233 TABLE 7. STANDARD COMMAND CODES (PART 1) (continued) Command Code R/W Default Description # Bytes 0x20 R 0x20 Vout_Mode 1 The NCP81233 supports VID mode for programming the output voltage. 0x21 R/W 0x0000 Vout_Command 2 Sets the output voltage using VID in low byte. 0x24 R/W 0x00FF Vout_Max 2 Sets maximum output voltage (VID data format). (Reserved for future use.) 0xA4 R/W 0x0000 Vout_Min 2 Sets minimum output voltage (VID data format). (Reserved for future use.) 0x60 R/W 0x0000 TON_DELAY 2 Sets the delay time, in ms, from the end of system reset until the output voltage starts to rise. The lowest 4 bits of the high byte is valid, i.e. 0x0000 = 0ms 0x0100 = 1ms 0x0200 = 2ms … 0x0F00 = 15ms 0x78 R 0x00 STATUS BYTE 1 Comment Bit Name Description 7 BUSY A fault was declared because the NCP81233 was busy and unable to respond 6 OFF 5 VOUT_OV This bit gets set whenever the NCP81233 goes into OVP (Abs OVP and/or Normal OVP) mode. 4 IOUT_OC This bit gets set whenever the NCP81233 turns off due to an over current event. 3 VIN_UV 2 OT This bit gets set whenever the NCP81233 turns off due to an over temperature event. 1 CML This bit gets set whenever a communications or logic fault has occurred. 0 None of the Above www.onsemi.com 25 This bit is set whenever the NCP81233 is not switching Not supported. A fault has occurred which is not one of the above. NCP81233 TABLE 7. STANDARD COMMAND CODES (PART 1) (continued) Command Code R/W Default Description # Bytes 0x79 R 0x0000 STATUS WORD 2 Comment Byte Bit Name Description Low 7 BUSY A fault was declared because the NCP81233 was busy and unable to respond. 6 OFF This bit is set whenever the NCP81233 is not switching. 5 VOUT _OV This bit gets set whenever the NCP81233 goes into OVP mode. 4 IOUT_ OC This bit gets set whenever the NCP81233 turns off due to an over current event. 3 VIN_ UV 2 OT This bit gets set whenever the NCP81233 turns off due to an over temperature event. 1 CML This bit gets set whenever a communications or logic fault has occurred. 0 None of the Above A fault has occurred which is not one of the above. 7 VOUT This bit gets set whenever the measured output voltage goes outside its power good limits or an OVP/UVP event has taken place. i.e. any bit in Status VOUT is set. 6 Iout/ Pout This bit gets set whenever the measured output current or power exceeds its warning limit or goes into OCP. i.e. any bit in Status IOUT is set. High 5 (Reserved for future use.) 4 (Reserved for future use.) 3 2 www.onsemi.com 26 Not supported. POWER GOOD # The VDD_PWRGD signal is deasserted. Same as PowerGood in General Status. (Reserved for future use.) NCP81233 Table 8. STANDARD COMMAND CODES (PART 2) Command Code R/W Default Description # Bytes 0x7A R 0x00 STATUS VOUT 1 0x7B R 0x00 STATUS IOUT 1 Comment Bit Name Description 7 VOUT_OVER VOLTAGE FAULT This bit gets set whenever an OVP event takes place. 6 VOUT_OVER VOLTAGE WARNING This bit gets set whenever the measured output voltage goes above its power-good limit. (Reserved for future use.) 5 VOUT_ UNDER VOLTAGE WARNING This bit gets set whenever the measured output voltage goes below its power*good limit. (Reserved for future use.) 4 VOUT_UNDE RVOLTAGE FAULT This bit gets set whenever an UVP event takes place. 3 (Reserved for future use.) 2 (Reserved for future use.) 1 (Reserved for future use.) 0 (Reserved for future use.) Bit Name Description 7 IOUT_OVER CURRENT FAULT This bit gets set if the NCP81233 turns off due to an OCP Event IOUT_OVER CURRENT WARNING This bit gets set if IOUT exceeds its programmed high warning limit. (Reserved for future use.) 6 5 0x7E R 0x00 STATUS CML 1 (Reserved for future use.) 4 (Reserved for future use.) 3 (Reserved for future use.) 2 (Reserved for future use.) 1 (Reserved for future use.) 0 (Reserved for future use.) Bit Name 7 INVALID COMMAND 6 INVALID DATA 5 PEC_FAULT Description Invalid or unsupported command is received. (Reserved for future use.) Invalid or unsupported data is received. (Reserved for future use.) PEC failed. (Reserved for future use.) 4 (Reserved for future use.) 3 (Reserved for future use.) 2 (Reserved for future use.) 1 OTHERS 0 www.onsemi.com 27 A communication fault other than the ones listed has occurred. (Reserved for future use.) (Reserved for future use.) NCP81233 Table 8. STANDARD COMMAND CODES (PART 2)(continued) Command Code R/W Default Description # Bytes 0x80 R 0x00 STATUS_ ALERT 1 Comment Bit Name Description 7 (Reserved for future use.) 6 (Reserved for future use.) 5 (Reserved for future use.) 4 (Reserved for future use.) 3 (Reserved for future use.) 2 VMON WARN Gets asserted when VMON exceeds it programmed WARN limits. (Reserved for future use.) 1 VMON FAULT Gets asserted when VMON exceeds it programmed FAULT limits. (Reserved for future use.) 0 (Reserved for future use.) 0x8B R 0x0000 Read_VOUT 2 Readback output voltage. Voltage is read back in VID Mode. 0x8C R 0x0000 Read_IOUT 2 Readback output current. Current is read back in Linear Mode with unit of Amp. 0x99 R 0x1A MFR_ID 1 0x9A R 0x1233 MFR_ MODEL 2 0x9B R 0x00 MFR_ REVISION 1 Table 9. MANUFACTURER SPECIFIC COMMAND CODES Command Code R/W Default Description # Bytes 0xD0 R/W 0x00 Lock/Reset 1 Comment Bit Name 1 Reset Resets all registers to their POR Value. Has no effect if Lock bit is set. 0 Lock Logic 1 locks all limit values to their current settings. Once this bit is set, all lockable registers become read*only and cannot be modified until the NCP81233 is powered down and powered up again. This prevents rogue programs such as viruses from modifying critical system limit settings. (Lockable). www.onsemi.com 28 Description NCP81233 Table 9. MANUFACTURER SPECIFIC COMMAND CODES (continued) Command Code R/W Default Description # Bytes 0xD6 R/W 0x00 Vout Slew Rate 1 0xDD R 0x0000 Read_IMAX 2 0xF9 R/W 0x00 Mask ALERT 1 Comment Bit Name Description 7:5 DVID Slew Rate DVID Slew Rate is automatically set to the same value as soft-start slew rate after each startup, which is programmed by SS pin. After that, it can be adjusted by I2C interface. 000 = 0.125mV/us 001 = 0.25mV/us 010 = 0.5mV/us 011 = 1mV/us 100 = 2mV/us 101 = 4mV/us 110 = 8mV/us 111= 16mV/us 4:2 (Reserved for future use.) 1 (Reserved for future use.) 0 (Reserved for future use.) Maximum load current value, which is set at IMAX pin. The unit is Amp. Bit Name 7 Mask VOUT Masks any ALERT caused by bits in Status VOUT Register. 6 Mask IOUT Masks any ALERT caused by bits in Status IOUT Register. 5 Mask OV FAULT Masks any ALERT caused by OVP (Abs OVP and Normal OVP). 4 Mask UV FAULT Masks any ALERT caused by UVP. 3 Mask OC FAULT Masks any ALERT caused by OCP. 2 Mask OT FAULT Masks any ALERT caused by OTP. 1 Mask CML Masks any ALERT caused by bits in Status CML Register. 0 VMON Masks any ALERT caused by VMON exceeding its high or low limit. (Reserved for future use.) www.onsemi.com 29 Description NCP81233 DETAILED DESCRIPTION General Operation Modes The NCP81233, a multi-phase synchronous buck controller with an I2C interface, provides power management solutions for applications supported by DrMOS. It supports 1-, 2-, 3-, 4-, or 6-phase operation and provides differential voltage and current sense, flexible programming, and comprehensive protections. The number of operational phases is programmed at CONFIG pin as shown in Table 10. All used phases are paralleled together in output of power stage with a common voltage-sense feedback. All input pins of current senses in unused phases can be left float. TABLE 10. CONFIG CONFIGURATION CONFIG RCONFIG Phase Number Phase Number Float PWM1+PWM2+PWM3+PWM4+PWM5+PWM6 6 Short to GND PWM1+PWM2+PWM3+PWM4 4 33k PWM1+PWM2+PWM3 3 13k PWM1+PWM2 2 5.1k PWM1 1 Other control functions can be programmed at MODE1 pin and MODE2 pin as shown in Table 11 and Table 12. TABLE 11. MODE 1 CONFIGURATION TABLE 12. MODE 2 CONFIGURATION MODE1 MODE2 RMODE1 OVP & UVP OVP Option OCP, UVP, OTP Float Enabled Recoverable Hiccup Float Latch Off 33 k 33 k Latch Off 20 k 13 k 8.2 k Disabled Disabled Regulation Reference PIN 27 Function OTP Option VBOOT/VID VB_RST# OTP1 Hiccup 20 k Latch Off 13 k Latch Off 8.2 k 5.1 k 2.7 k RMODE2 OTP2 PSI OTP1 OTP2 REFIN PSI OTP2 5.1 k Hiccup 2.7 k Short to GND OTP1 Short to GND In applications with an external analog reference input, the device needs to be programmed at MODE2 pin to select REFIN as the regulation reference. Once REFIN is selected as the regulation reference, the command Vout_Command through I2C interface won’t be proceeded and the readback result of the command Read_VOUT is FFh. www.onsemi.com 30 NCP81233 Power Sequence and Soft Start enabled and VCC is ok. The system reset time is about 2 ms. The value of TON_DLY can be programmed by TON_DELAY command and the default value is zero. When the device is disabled or UVLO happens, the device shuts down immediately and all the PWM turn to Tri-State. The NCP81233 has a soft start function and the soft start slew rate is externally programmed at SS pins. The output starts to ramp up following a system reset period TRST and a programmable delay time TON_DLY after the device is VCC5V VCC5V VCCOK DRVON DRVON V DRVON_OK EN EN T RST TON_DLT TSS TRST TON_DLT Td_PGOOD Vout Vout PGOOD PGOOD PWM Tri−State TSS Td_PGOOD Tri−State PWM (1) VCC5V and DRVON Ready before EN (2) VCC5V and DRVON Ready after EN Figure 6. Timing Diagrams of Power Up Sequence VCC5V VCC5V DRVON DRVON EN VDRVON_F VDRVON_OK EN TRST TON_DLT Vout TSS Td_PGOOD Vout PGOOD PGOOD PWM PWM Figure 7. Timing Diagram of Power Down Sequence Tri−State Figure 8. Timing Diagram of DRVON UVLO www.onsemi.com 31 NCP81233 VCC5V OK VCC5V UVLO VCC5V VCC3V OK VCC3V UVLO VCC3V VDRVON_TH DRVON EN_Int IDRVON_HYS 0x02 0x01 VEN_TH EN IEN_HYS Figure 9. Enable, DRVON and UVLO The device is able to start up smoothly under an output pre-biased condition without discharging the output before ramping up. In applications with external analog REFIN, soft start completes when the internal DAC reaches REFIN. www.onsemi.com 32 NCP81233 Enable and Input UVLO connected to EN pin as shown in Figure 10. The high threshold VEN_H in ENABLE signal is The NCP81233 is enabled when the voltage at EN pin is higher than an internal threshold VEN_TH = 0.8 V. A hysteresis can be programmed by an external resistor REN V EN_H + V EN_TH (eq. 1) VEN_TH EN_Int VEN_H VEN_L ENABLE REN IEN_HYS Figure 10. Enable and Hysteresis Programming The low threshold VEN_L in ENABLE signal is: V EN_L + V EN_TH * V EN_HYS V IN_H + (eq. 2) EN1 EN2 Ǔ )1 V EN_TH (eq. 4) The low threshold VIN_L in VIN signal is: The hysteresis VEN_HYS is: V EN_HYS + I EN_HYS ǒRR V IN_L + V IN_H * V IN_HYS (eq. 3) R EN (eq. 5) The hysteresis VIN_HYS is: A UVLO function for input power supply can be implemented at EN pin. As shown in Figure 11, the UVLO threshold can be programmed by two external resistors. The high threshold VIN_H in VIN signal is: V IN_HYS + I EN_HYS R EN1 (eq. 6) VIN_H VEN_TH EN_Int V IN_L VIN REN1 I REN2 EN_HYS Figure 11. Enable and Input Supply UVLO Circuit To avoid undefined operation, EN pin should not be left float in applications. V DRV_H + DRVON and DrMOS Power Monitor ǒRR DRV1 DRV2 Ǔ )1 V DRVON_TH (eq. 7) The low threshold VDRV_L in the driver supply of DrMOS is: The NCP81233 provides comprehensive power up sequence control including a DrMOS power monitor to ensure proper operation of DrMOS during power up and down. Similar to the UVLO function for input power supply implemented at EN pin, as shown in Figure 12, the UVLO threshold for DrMOS power can be programmed by two external resistors. The high threshold VDRV_H in the driver supply of DrMOS can be programmed as: V DRV_L + V DRV_H * V DRV_HYS (eq. 8) The hysteresis VDRV_HYS is V DRV_HYS + I DRVON_HYS www.onsemi.com 33 R DRV1 (eq. 9) NCP81233 5V VDRV VIN PWM VSWH NCP5339 VDRV_H VDRVON_TH VDRV_L CGND PGND VDRV EN_Int DRVON DRV ON RDRV1 RDRV2 VDRV VIN PWM VSWH NCP5339 CGND IDRVON_HYS VDRV PWM PGND VIN VSWH NCP5339 CGND PGND Figure 12. DRVON and DrMOS Supply UVLO Circuit PWM Output To avoid undefined operation, DRVON pin should not be left float in applications. In an application using phase doublers, DRVON pin may be used to monitor a common power supply shared by both phase doublers and DrMOSs. To be able to operate with diverse DrMOSs and phase doublers, the NCP81233 has 6 tri-level PWM outputs which may be connected to PWM inputs of these receivers. As shown in Figure 13, an internal transistor SH in the NCP81233 pulls a PWM pin up to PVCC when outputs a high level and another internal transistor SL pulls the PWM pin down to GND when outputs a low level. When there is a need to have a mid-level at the PWM input of a DrMOS or a phase doubler during power sequence or fault modes, both SH and SL are turned off and therefore the PWM output of the NCP81233 is left float. To well adapt the mid-level window of the receiver’s PWM input, an external resistor divider composed of RH and RL is required in the connection between the NCP81233 and the receiver if no internal resistor divider in the receiver. Moreover, reduced input impedance by an external resistor also speeds up entering mid-level from either high level or low level for a receiver having an internal resistor divider. VBOOT Restore On condition that VBOOT Restore (VB_RST#) function is selected for pin 27 by function programming at MODE2 pin, the NCP81233 has a capability to restore to boot voltage once pin 27 is pulled low for more than 4ms after PGOOD is asserted. The output voltage slew rate has the same value as soft start. Power Saving Interface (PSI) On condition that PSI function is selected for pin 27 by function programming at MODE2 pin, the NCP81233 has 2 power operation modes responding to PSI levels as shown in Table 13. The operation modes can be changed on the fly after PGOOD is asserted. In PS0 mode, the operating phases are determined by the configuration programming at CONFIG pin. In PS1 mode, only PWM1 is active while high impedance in other PWM outputs. TABLE 13. POWER SAVING INTERFACE (PSI) CONFIGURATIONS PSI Level Power Mode Phase Configuration High PS0 Multi-Phase, FCCM Low PS1 1-Phase, FCCM www.onsemi.com 34 NCP81233 NCP5339 VCIN 3.4V NCP81233 PVCC SH PWM SL RS 0 RH 10k NCP81233 PVCC SH 145k PWM RL 10k NCP81162 VCC 129k 15k PWM_IN 0 SL ( a ) Connected to DrMOS RH RS PWM RL 10k ( b ) Connected to Phase Doubler Figure 13. PWM Connections to DrMOS and Phase Doubler The NCP81233 works with most of DrMOSs having either 5 V or 3.3 V PWM input logic. However, for some 3.3 V-logic DrMOSs having a low maximum voltage rating of PWM pins which is less than the PVCC level of the NCP81233, an additional resistor RS may be inserted into the interconnection, as shown in Figure 13, to reduce the high voltage level. Note the insertion of RS also raises the low voltage level at the PWM input of the receiver, so the resistance of RS needs to be properly designed to meet the receiver’s specification on both high level and low level. Output Voltage Sensing and Regulation VBias VDAC Or VREFIN COMP FB DIFFOUT VSN VSP RVS2 RFB1 RVS1 Vout RVS3 Figure 14. Output Voltage Sensing and Regulation The NCP81233 has a differential voltage-sense amplifier. As shown in Figure 14, the remote voltage sensing points are connected to input pins VSP and VSN of the differential voltage-sense amplifier via a resistor network composed by RVS1, RVS2, and RVS3. For applications with VOUT ≤ 1.52 V, RVS1 = RVS3 = 0 Ω or 100 Ω and RVS2 is left open. In steady-state, VOUT = VDAC. For applications with VOUT > 1.52 V, the output voltage needs to be divided down by the resistor network to have VSP-VSN be within DAC range. Usually RVS3 is set to 0 Ω or 100 Ω. Given a preset value of RVS2, then the value of RVS1 can be obtained by R VS1 + ǒV OUT * V DACǓ V DAC R VS2 * R VS3 (eq. 10) A small offset voltage can also be added in output if needed. As shown in Figure 15, a resistor divider composed by R1 and R2 is connected from VREF to the negative remote sense point and feeds an offset voltage into VSN pin. By doing this way, the output voltage is: V OUT + V DAC ) V REF www.onsemi.com 35 R1 R1 ) R2 (eq. 11) NCP81233 Vout + Vout − VSP R1 VSN NCP81233 R2 VREF Figure 15. Adding Offset Voltage in Output IMAX The I2C interface conveys the platform IMAX value to the master by command Read_IMAX. A resistor RIMAX from the IMAX pin to ground programs this register at the time the part is enabled. A 50 μA current is sourced out this pin to generate a voltage across the programming resistor. The maximum voltage at IMAX pin is 2 V and the maximum value in the IMAX register 0xDDh is 00FFh which is 255 in decimal. For applications with a maximum load IOUT_MAX equal to or less than 255 A, the value IMAXDDh of the register is 1 A per LSB and directly represents IOUT_MAX. For applications with a maximum load IOUT_MAX greater than 255 A, the resistor should be equal or higher than 39.8 k, which results in 00FFh in the IMAX register. I OUT_MAX IMAX DDh + 255 if I OUT_MAX u 255 A I OUT_MAX 6.4x10 *3 R IMAX + if I OUT_MAX ≤ 255 A (eq. 12) (eq. 13) 39.8 k or higher, if I OUT_MAX u 255 A FB IMAX COMP RDRP R IMAX Vbias VDRP IMON RX2 C IMON 10 Rntc I OUT_MAX ≤ 255 A DIFFOUT R FB1 RX if RX1 RX3 Vbias VDFB RDFB CSSUM ISP1−ISN1 −2 ISPn−ISNn Figure 16. IMAX, IMON, and Load Line IMON RX The voltage of the IMON pin is monitored by the internal A/D converter and should be scaled with external resistors, RX and RDFB, surround the droop amplifier such that the maximum load current IOUT_MAX in an application generates a 2 V signal at IMON pin. Therefore, the gain-up ratio RX/RDFB can be designed as below. R DFB + 1 10 1 Σ Nn+1 ǒV ISPn * V ISNnǓ (eq. 14) RX can be replaced by a resistor network with a NTC resistor to compensate temperature effect on the DCR of inductor. The filtered voltage at IMON pin is www.onsemi.com 36 NCP81233 RX R DFB V IMON + 20 Σ Nn+1 ǒV ISPn * V ISNnǓ DC load line LL in output is: (eq. 15) LL + 2 The I2C interface conveys the IOUT value to the master by command Read_IOUT. The maximum value in the IOUT register 0x8Ch is 00FFh which is 255 in decimal. For applications with a maximum load equal to or less than 255A, the value IOUT8Ch in the register is 1 A per LSB which directly represents the output load current value in Amperes. For applications with a maximum load greater than 255 A, the real output current value can be obtained from the reading IOUT8Ch in the register with a coefficient of IOUT_MAX/255. I OUT + IOUT 8Ch 255 IOUT 8Ch if I OUT_MAX ≤ 255 A I OUT_MAX if I OUT_MAX u 255 A R VS1 ) R VS2 ) R VS3 R VS2 DCR (eq. 18) By means of the configuration at MODE1 pin as shown in Table 11, the users can choose either recoverable OVP or latch-off OVP. Recoverable OVP During normal operation the output voltage is monitored at the differential inputs VSP and VSN. If VSP-VSN voltage exceeds the DAC+VOVTH (or REFIN+VOVTH) for more than 1us, over voltage protection OVP is triggered and PGOOD is pulled low. In the meanwhile, all the high-side MOSFETs are turned off and all the low-side MOSFETs are turned on. The over voltage protection can be cleared once VSP-VSN voltage drops 25mV lower than DAC+VOVTH (or REFIN+VOVTH), and then the system comes back to normal operation. During soft-start, the OVP threshold is set to 2.1V before PGOOD is asserted, but it changes to DAC+VOVTH (or REFIN+VOVTH) after OVP is triggered. (eq. 16) In applications with a need of programmable load line, the output of the droop amplifier needs to be connected to FB pin by an external resistor RDRP as shown in Figure 16. Droop voltage VDROOP in DIFFOUT output can be obtained by: R FB1 R DRP RX R DFB Over Voltage Protection (OVP) Load Line Programming V DROOP + 2 R FB1 R DRP RX N ǒV Σ * V ISNnǓ R DFB n+1 ISPn (eq. 17) Latch-Off OVP ( a ) Normal Operation Mode ( b ) During Start Up Figure 17. Function of Latch-Off Over Voltage Protection MOSFETs toggle between on and off as the output voltage follows the DAC+VOVTH (or REFIN+VOVTH ) down with a hysteresis of 25 mV. When the DAC gets to zero, all the high-side MOSFETs will be held off and all the low-side MOSFETs will remain on. During soft-start, the OVP threshold is set to 2.1 V, and it changes to DAC+VOVTH (or REFIN+VOVTH) after DAC starts to ramp down. To restart the device after latch-off OVP, the system needs to have either VCC5V or EN toggled state. During normal operation the output voltage is monitored at the differential inputs VSP and VSN. If VSP-VSN voltage exceeds the DAC+VOVTH (or REFIN+VOVTH) for more than 1us, over voltage protection OVP is triggered and PGOOD is pulled low. In the meanwhile, all the high-side MOSFETs are latched off and all the low-side MOSFETs are turned on. After the OVP trips, the DAC ramps slowly down to zero, having a slew rate of −0.5 mV/us to avoid a negative output voltage spike during shutdown. All the low-side www.onsemi.com 37 NCP81233 Over Current Protection (OCP) OVP detection starts from the beginning of soft-start time TSS and ends in shutdown, latch-off, and idle time of hiccup mode caused by other protections. The NCP81233 senses phase current by a differential current-sense amplifier and provides a cycle-by-cycle over current protection for each phase. If OCP happens in all the phases and lasts for more than 8 times of the switching cycle, the NCP81233 turns off both high-side MOSFETs and low-side MOSFETs with all PWM outputs in high impedance and enters into a hiccup mode or ends in latch-off, which is programmable at MODE1 pin as shown in Table 11. A normal power up sequence happens after a hiccup interval. To restart the device after latch-off OCP, the system needs to have either VCC5V or EN toggled state. The part may enter into hiccup mode or latch-off sooner due to the under voltage protection in a case if the output voltage drops down very fast. Under Voltage Protection (UVP) The NCP81233 pulls PGOOD low and turns off both high-side MOSFETs and low-side MOSFETs with high impedance in all PWM outputs once VSP-VSN voltage drops below DAC-VUVTH for more than 5μ s. Under voltage protection operates in either a hiccup mode or ends in latch-off, which is programmable at MODE1 pin as shown in Table 11. A normal power up sequence happens after a hiccup interval. To restart the device after latch-off UVP, the system needs to have either VCC5V or EN toggled state. UVP detection starts when PGOOD delay Td_PGOOD is expired right after a soft start, and ends in shutdown, latch-off, and idle time of hiccup mode. ISP OCP ISN 6 ISP ISP ISP ISN ISN ISN RNTC ILMT 6 ILMT RT2 RT3 RT1 VREF OTP OTP OCP OTP 10uA RILIM2 0.6 V ROTP2 OTP ROTP1 10uA (1) OTP Configuration 1 RILMT1 VREF ROTP2 V ROTP1 (2) OTP Configuration 2 Figure 18. Over−Current Protection and Over−Temperature Protection Over Temperature Protection (OTP) The over-current threshold can be externally programmed at the ILIM pin. As shown in Figure 18 (1), a NTC resistor RNTC can be employed for temperature compensated over current protection. The peak current limit per phase can be calculated by V ISP * V ISN + 1 6 R T3 R R T1 ) R T2 R NTC T2)R NTC ) R T3 The NCP81233 provides over temperature protection. To serve different types of DrMOS, one of two internal configurations of OTP detection can be selected at MODE2 pin as shown in Table 12. With OTP Configuration 1, as shown in Figure 18 (1), the NTC resistor RNTC senses the hot-spot temperature and changes the voltage at ILMT pin. Both over-temperature threshold and hysteresis are externally programmed at OTP pin by a resistor divider. Once the voltage at ILMT pin is higher than the voltage at OTP pin, the NCP81233 turns off both high-side MOSFETs and low-side MOSFETs with all PWM outputs in high impedance and operates in either a hiccup mode or ends in latch-off, which is programmable at MODE1 pin as shown in Table 11. The controller will have a normal start up after a hiccup interval in condition that the temperature drops below the OTP reset threshold. To restart the device after latch-off OTP, the system needs to have V REF (eq. 19) If no temperature compensation is needed, as shown in Figure 18 (2), the peak current limit per phase can be simply set by V ISP * V ISN + 1 6 R ILIM2 R ILIM1 ) R ILIM2 V REF (eq. 20) OCP detection starts from the beginning of soft-start time TSS, and ends in shutdown and idle time of hiccup mode. www.onsemi.com 38 NCP81233 Thermal Shutdown (TSD) either VCC5V or EN toggled state. The OTP assertion threshold VOTP and reset threshold VOTP_RST can be calculated by: V OTP + V REF ) I OTP_HYS R OTP1 The NCP81233 has an internal thermal shutdown protection to protect the device from overheating in an extreme case that the die temperature exceeds 150°C. TSD detection is activated when VCC5V, EN, and DRVON are valid. Once the thermal protection is triggered, the whole chip shuts down and all PWM signals are in high impedance. If the temperature drops below 125°C, the system automatically recovers and a normal power sequence follows. (eq. 21) R 1 ) ROTP1 OTP2 V OTP_RST + V REF R OTP2 R OTP1 ) R OTP2 (eq. 22) The corresponding OTP temperature TOTP and reset temperature TOTP_RST can be calculated by T OTP + ǒ ln R 1 NTC_OTP ńRTNCǓ B T OTP_RST + * 273.15 ) 1 25)273.15 1 ǒ ln R NTC_OTPRST ńR TNCǓ B I2C Interface Control of the NCP81233 is carried out using the I2C Interface. The NCP81233 is connected to this bus as a slave device, under the control of a master controller. The master controller can start to access the NCP81233 via I2C after VCC5V is ready for more than 2 ms. Data is sent over the serial bus in sequences of nine clock pulses: eight bits of data followed by an acknowledge bit from the slave device. Transitions on the data line must occur during the low period of the clock signal and remain stable during the high period, because a low-to-high transition when the clock is high might be interpreted as a stop signal. The number of data bytes that can be transmitted over the serial bus in a single read or write operation is limited only by what the master and slave devices can handle. When all data bytes have been read or written, stop conditions are established. In write mode, the master pulls the data line high during the tenth clock pulse to assert a stop condition. In read mode, the master device overrides the acknowledge bit by pulling the data line high during the low period before the ninth clock pulse; this is known as No Acknowledge. The master takes the data line low during the low period before the tenth clock pulse, and then high during the tenth clock pulse to assert a stop condition. Any number of bytes of data can be transferred over the serial bus in one operation, but it is not possible to mix read and write in one operation because the type of operation is determined at the beginning and cannot subsequently be changed without starting a new operation. In the NCP81233, write operations contain one, two or three bytes, and read operations contain one or two bytes. The command code or register address determines the number of bytes to be read or written, See the register map for more information. To write data to one of the device data registers or read data from it, the address pointer register must be set so that the correct data register is addressed (i.e. command code), and then data can be written to that register or read from it. The first byte of a read or write operation always contains an address that is stored in the address pointer register. If data is to be written to the device, the write operation contains a (eq. 23) * 273.15 ) 1 25)273.15 (eq. 24) Where: R NTC_OTP + 1 1 R T_OTP *R T1 R NTC_OTPRST + 1 R R T_OTP + ǒVV R T_OTPRST + REF OTP ǒ * R1 T_OTPRST Ǔ *1 (eq. 25) T2 1 *R T1 * R1 T2 R T3 (eq. 26) (eq. 27) Ǔ V REF *1 V OTP_RST R T3 (eq. 28) With OTP Configuration 2, as shown in Figure 18 (2), the NCP81233 receives an external signal VT linearly representing temperature and compares to an internal 0.6 V reference voltage. If the voltage is over the threshold OTP happens. The OTP assertion threshold VOTP and reset threshold VOTP_RST in this configuration can be obtained by V T_OTP + ǒ1 ) RR Ǔ V T_OTP_RST + OTP1 0.6 (eq. 29) OTP2 ǒR0.6 OTP2 * I OTP_HYS Ǔ R OTP1 ) 0.6 (eq. 30) OTP detection starts from the beginning of soft-start time TSS, and ends in shutdown, latch-off, and idle time of hiccup mode. www.onsemi.com 39 NCP81233 second data byte that is written to the register selected by the address pointer register. This write byte operation is shown in Figure 20. The device address is sent over the bus, and then R/ W is set to 0. This is followed by two data bytes. The first data byte is the address of the internal data register to be written to, which is stored in the address pointer register. The second data byte is the data to be written to the internal data register. • The read byte operation is shown in Figure 21. First the command code needs to be written to the NCP81233 so that the required data is sent back. This is done by performing a write to the NCP81233 as before, but only the data byte containing the register address is sent, because no data is written to the register. A repeated start is then issued and a read operation is then performed consisting of the serial bus address; R/ W bit set to 1, followed by the data byte read from the data register. It is not possible to read or write a data byte from a data register without first writing to the address pointer register, even if the address pointer register is already at the correct value. In addition to supporting the send byte, the NCP81233 also supports the read byte, write byte, read word and write word protocols. • • 1 9 1 9 SCL SDA 1 0 1 0 0 A1 R/W A0 START BY MASTER D6 D7 D5 D4 D3 D2 D1 ACK. BY NCP81233 D0 ACK. BY STOP BY NCP81233 MASTER FRAME 1 SERIAL BUS ADDRESS BYTE FRAME 2 COMMAND CODE Figure 19. Send Byte 1 9 1 9 … SCL … SDA 1 1 0 0 0 A1 A0 R/W START BY MASTER D6 D7 D5 D4 D3 D2 D1 D0 ACK. BY NCP81233 ACK. BY NCP81233 FRAME 1 SERIAL BUS ADDRESS BYTE FRAME 2 COMMAND CODE 1 9 SCL (CONTINUED) … … SDA (CONTINUED) … … D7 D6 D5 D4 D3 D2 D1 D0 ACK. BY STOP BY NCP81233 MASTER FRAME 3 DATA BYTE Figure 20. Write Byte www.onsemi.com 40 NCP81233 1 9 1 9 SCL SDA 1 1 0 0 0 A1 A0 START BY MASTER R/W D7 D6 D5 D4 D3 D2 D1 ACK. BY NCP81233 D0 ACK. BY NCP81233 FRAME 1 SERIAL BUS ADDRESS BYTE FRAME 2 COMMAND CODE 1 9 1 9 SCL SDA 1 1 0 0 0 A1 A0 REPEATED START BY MASTER R/W D7 D6 D5 D4 D3 D2 D1 ACK. BY NCP81233 D0 NO ACK. BY STOP BY MASTER MASTER FRAME 1 SERIAL BUS ADDRESS BYTE FRAME 2 COMMAND CODE Figure 21. Read Byte 1 Write Operations The I2C specification defines several protocols for different types of read and writes operations. The ones used in the NCP81233 are discussed in this section. The following abbreviations are used in the diagrams: S—START P—STOP R—READ W—WRITE A—ACKNOWLEDGE A—NO ACKNOWLEDGE 2 3 4 56 COMMAND SLAVE S ADDR ESS W A AP CODE Figure 22. Send Byte Command If the master is required to read data from the register immediately after setting up the address, it can assert a repeat start condition immediately after the final ACK and carry out a single byte read without asserting an intermediate stop condition. The NCP81233 uses the following I2C write protocols. Write Byte In this operation, the master device sends a command byte and one data byte to the slave device as follows: 1. The master device asserts a start condition on SDA. 2. The master sends the 7-bit slave address followed by the write bit (low). 3. The addressed slave device asserts ACK on SDA. 4. The master sends a command code. 5. The slave asserts ACK on SDA. 6. The master sends a data byte. 7. The slave asserts ACK on SDA. 8. The master asserts a stop condition on SDA and the transaction ends. Send Byte In this operation, the master device sends a single command byte to a slave device as follows: 1. The master device asserts a start condition on SDA. 2. The master sends the 7-bit slave address followed by the write bit (low). 3. The addressed slave device asserts ACK on SDA. 4. The master sends a command code. 5. The slave asserts ACK on SDA. 6. The master asserts a stop condition on SDA and the transaction ends. For the NCP81233, the send byte protocol is used to clear faults. This operation is shown in Figure 22. The byte write operation is shown in Figure 23. www.onsemi.com 41 NCP81233 1 2 3 SLAVE S ADDRESS W A 4 5 COMMAND A CODE 6 DATA 2 3 4 1 AP SLAVE W A COMMAND A BYTE COUNT A DATA A S ADDRESS CODE BYTE 1 =N Figure 23. Single Byte Write to a Register 10 In this operation, the master device sends a command byte and two data bytes to the slave device as follows: 1. The master device asserts a start condition on SDA. 2. The master sends the 7-bit slave address followed by the write bit (low). 3. The addressed slave device asserts ACK on SDA. 4. The master sends a command code. 5. The slave asserts ACK on SDA. 6. The master sends the first data byte. 7. The slave asserts ACK on SDA. 8. The master sends the second data byte. 9. The slave asserts ACK on SDA. 10. The master asserts a stop condition on SDA and the transaction ends. 7 11 3 SLAVE S ADDRESS W A 4 5 COMMAND A CODE 6 7 12 DATA (LSB) A 13 14 DATA BYTE N A P Read Operations The NCP81233 uses the following I2C read protocols. Read Byte In this operation, the master device receives a single byte from a slave device as follows: 1. The master device asserts a start condition on SDA. 2. The master sends the 7-bit slave address followed by the write bit (low). 3. The addressed slave device asserts ACK on SDA. 4. The master sends a command code. 5. The slave asserted ACK on SDA. 6. The master sends a repeated start condition on SDA. 7. The master sends the 7 bit slave address followed by the read bit (high). 8. The slave asserts ACK on SDA. 9. The slave sends the Data Byte. 10. The master asserts NO ACK on SDA. 11. The master asserts a stop condition on SDA and the transaction ends. 9 10 8 8 Figure 25. Block Write to a Register The word write operation is shown in Figure 24. 2 6 DATA BYTE 2 A Write Word 1 5 9 78 DATA A P (MSB) Figure 24. Single Word Write to a Register Block Write In this operation, the master device sends a command byte and a byte count followed by the stated number of data bytes to the slave device as follows: 1. The master device asserts a START condition on SDA. 2. The master sends the 7-bit slave address followed by the write bit (low). 3. The addressed slave device asserts ACK on SDA. 4. The master sends a command code. 5. The slave asserts ACK on SDA. 6. The master sends the byte count N. 7. The slave asserts ACK on SDA. 8. The master sends the first data byte. 9. The slave asserts ACK on SDA. 10. The master sends the second data byte. 11. The slave asserts ACK on SDA. 12. The master sends the remainder of the data byes. 13. The slave asserts an ACK on SDA after each data byte. 14. After the last data byte the master asserts a STOP condition on SDA. 1 2 3 4 5 6 7 8 9 10 11 SLAVE W A COMMAND A S SLAVE R A DATA A P S ADDRESS CODE ADDRESS Figure 26. Single Byte Read to a Register Read Word In this operation, the master device receives two data bytes from a slave device as follows: 1. The master device asserts a start condition on SDA. 2. The master sends the 7-bit slave address followed by the write bit (low). 3. The addressed slave device asserts ACK on SDA. 4. he master sends a command code. 5. The slave asserted ACK on SDA. 6. The master sends a repeated start condition on SDA. www.onsemi.com 42 NCP81233 ALERT# Signal 7. The master sends the 7 bit slave address followed by the read bit (high). 8. The slave asserts ACK on SDA. 9. The slave sends the first Data Byte (low Data Byte). 10. The master asserts ACK on SDA. 11. The slave sends the second Data Byte (high Data Byte). 12. The master asserts a No ACK on SDA. 13. The master asserts a stop condition on SDA and the transaction ends. 1 2 3 4 5 6 7 8 9 The NCP81233 has an ALERT# output to notify the host of fault or warning conditions and also supports the Alert Response Address (ARA) protocol. ALERT# pin is an open-drain output. It is pulled low whenever at least one bit in the status registers is asserted with the following exception, on condition that the corresponding alert is not masked in the Mask Alert register. Bit 6 in Status Byte and Bit 3 in the high byte of Status Word have no impact on ALERT#. A broadcast address used by the system host as part of the Alert Response Protocol initiated when a device asserts the ALERT# signal. The Alert Response Address (0001 100b) can be a substitute for device master capability. The host processes the interrupt and simultaneously accesses all ALERT# devices through the Alert Response Address. Only the device(s) which pulled ALERT# low will acknowledge the Alert Response Address. The host performs a modified Receive Byte operation. The 7 bit device address provided by the slave transmit device is placed in the 7 most significant bits of the byte. The eighth bit can be a zero or one. 10 SLAVE W A COMMAND A S SLAVE S ADDRESS R A DATA A CODE (LSB) ADDRESS 11 12 13 DATA A P (MSB) Figure 27. Single Word Read to a Register Block Read 7 In this operation, the master device sends a command byte, the slave sends a byte count followed by the stated number of data bytes to the master device as follows: 1. The master device asserts a START condition on SDA. 2. The master sends the 7-bit slave address followed by the write bit (low). 3. The addressed slave device asserts ACK on SDA. 4. The master sends a REPEATED START condition on SDA 5. The master sends the 7-bit slave address followed by the read bit (high). 6. The slave asserts ACK on SDA. 7. The slave sends the byte count N. 8. The master asserts ACK on SDA. 9. The slave sends the first data byte. 10. The master asserts ACK on SDA. 11. The slave sends the remainder of the data byes, the master asserts an ACK on SDA after each data byte. 12. After the last data byte the master asserts a No ACK on SDA. 13. The master asserts a STOP condition on SDA. 1 2 SLAVE S ADDRESS 3 4 SLAVE WA S ADDRESS 8 9 A DATA BYTE 1 10 A 5 6 R A S Address 1 1 X N P Timeout The NCP81233 includes a timeout feature. If there is no activity for 35 ms, the NCP81233 assumes that the bus is locked and releases the bus. This prevents the device from locking or holding the expecting data. Some controllers cannot handle the timeout feature, so it can be disabled. Configuration Register 1 (0xD1) Bit 3 BUS_TO_EN = 1; timeout enabled. Bit 3 TODIS = 0; timeout disabled (default). Virus Protection To prevent rogue programs or viruses from accessing critical NCP81233 register settings, the lock bit can be set. Setting Bit 0 of the Lock/Reset sets the lock bit and locks critical registers. In this mode, certain registers can no longer be written to until the NCP81233 is powered down and powered up again. For more information on which registers are locked see the register map. 12 13 A Rd A 7 If more than one device pulls ALERT# low, the highest priority (lowest address) device will win communication rights via standard arbitration during the slave address transfer. A host which does not implement the ALERT# signal may periodically access the ARA. 7 11 1 Figure 29. Alert Response Address Command BYTE COUNT=N DATA BYTE N Alert Response Address 1 P Figure 28. Block Write to a Command Coder www.onsemi.com 43 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS QFN52 6x6, 0.4P CASE 485BE ISSUE B DATE 23 JUN 2010 1 52 SCALE 2:1 PIN ONE LOCATION ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ L1 DETAIL A E ALTERNATE TERMINAL CONSTRUCTIONS ÉÉÉ ÉÉÉ ÉÉÉ 0.10 C EXPOSED Cu TOP VIEW 0.10 C A (A3) DETAIL B 0.10 C L L A B D MOLD CMPD DETAIL B ALTERNATE CONSTRUCTION 0.08 C A1 NOTE 4 SIDE VIEW C D2 DETAIL C DIM A A1 A3 b D D2 E E2 e K L L1 L2 MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.15 0.25 6.00 BSC 4.60 4.80 6.00 BSC 4.60 4.80 0.40 BSC 0.30 REF 0.25 0.45 0.00 0.15 0.15 REF GENERIC MARKING DIAGRAM* SEATING PLANE K 14 DETAIL A L2 27 L2 DETAIL C XXXXXXXXX XXXXXXXXX AWLYYWWG 8 PLACES E2 52X XXX = Specific Device Code A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package L 1 40 52 52X e BOTTOM VIEW b 0.07 C A B 0.05 C NOTE 3 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. SOLDERING FOOTPRINT* 6.40 4.80 52X 0.63 4.80 6.40 0.11 PKG OUTLINE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSIONS: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30mm FROM TERMINAL TIP 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 0.49 DETAIL D 0.40 PITCH 52X DETAIL D 8 PLACES 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON47515E QFN52, 6x6, 0.4MM PITCH Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. 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