NCS2201SN2T1

NCS2200 Series, NCS2200A Low Voltage Comparators The NCS2200 Series is an industry first sub−one volt, low power comparator family. These devices consume only 10 mA of supply current. They are guaranteed to operate at a low voltage of 0.85 V which allows them to be used in systems that require less than 1.0 V and are fully operational up to 6.0 V which makes them convenient for use in both 3.0 V and 5.0 V systems. Additional features include no output phase inversion with overdriven inputs, internal hysteresis, which allows for clean output switching, and rail−to−rail input and output performance. The NCS2200 Series is available in the tiny SOT−23−5 and SOT−23−6 package. There are eight options featuring two industry standard pinouts. Additionally, the NCS2200 and NCS2202 are available in the SC70−5 package. The NCS2200 is also available in the tiny DFN 2x2.2 package. The NCS2200A is available in UDFN 1.2x1.0 package. (Table 1) The NCS2201/3 Series in the SOT−23−6 package features an enable function, which can be externally controlled. When the enable pin is pulled low (output tri−state mode), current consumption is typically 0.3 mA. This allows the user to implement these devices in power sensitive applications such as portable electronics. Features http://onsemi.com 5 1 SOT−23−5 (TSOP−5) SN SUFFIX CASE 483 6 1 SOT−23−6 (TSOP−6) SN SUFFIX CASE 318G • • • • • • • • • • • • • • Operating Voltage of 0.85 V to 6.0 V Rail−to−Rail Input/Output Performance Low Supply Current of 10 mA No Phase Inversion with Overdriven Input Signals Glitchless Transitioning in or out of Tri−State Mode Complementary or Open Drain Output Configuration Available with the Enable Function Internal Hysteresis Propagation Delay of 1.1 ms Pb−Free Packages are Available Single Cell NiCd/NiMH Battery Powered Applications Cellular Telephones Alarm and Security Systems Personal Digital Assistants 1 6 DFN 2x2.2 SQL SUFFIX CASE 488 5 1 SC70−5 SQ SUFFIX CASE 419A UDFN 1.2x1.0 MU SUFFIX CASE 517AA 1 Typical Applications ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 13 of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 14 of this data sheet. © Semiconductor Components Industries, LLC, 2006 1 August, 2006 − Rev. 8 Publication Order Number: NCS2200/D NCS2200 Series, NCS2200A Table 1. Comparator Selector Guide Output Type Complementary Complementary Complementary Complementary, Enable Complementary, Enable Open Drain Open Drain Open Drain Open Drain Open Drain, Enable Open Drain, Enable Complementary Complementary Device NCS2200SN1T1 NCS2200SN2T1 NCS2200SQ2T2 NCS2201SN1T1 NCS2201SN2T1 NCS2202SN1T1 NCS2202SQ1T2 NCS2202SN2T1 NCS2202SQ2T2 NCS2203SN1T1 NCS2203SN2T1 NCS2200SQLT1 NCS2200AMUT1 Package SOT−23−5 SOT−23−5 SC70−5 SOT−23−6 SOT−23−6 SOT−23−5 SC70−5 SOT−23−5 SC70−5 SOT−23−6 SOT−23−6 DFN, 2x2.2 UDFN, 1.2x1.0 Pinout Style 1 2 2 1 2 1 1 2 2 1 2 N/A N/A PIN CONNECTIONS Output VCC Non−Inverting Input 1 2 3 +− 4 5 VEE Inverting Input Output VEE Non−Inverting Input 1 2 3 +− 4 5 VCC Inverting Input Style 1 Pinout (SN1T1) Style 2 Pinout (SN2T1, SQ2T2) Figure 1. SOT−23−5 (NCS2200, NCS2202), SC70−5 (NCS2200, NCS2202) Output VCC Non−Inverting Input 1 2 3 +− 5 6 5 4 VEE Enable Inverting Input Output VEE Non−Inverting Input 1 2 3 +− 6 5 5 4 VCC Enable Inverting Input Style 1 Pinout (SN1T1) Style 2 Pinout (SN2T1) Figure 2. SOT−23−6 (NCS2201, NCS2203) VEE VCC IN− 1 2 3 Top View 6 5 4 VOUT VCC IN+ VEE N/A IN− 1 2 3 Top View 6 5 4 VOUT VCC IN+ Figure 3. DFN 2x2.2 (NCS2200) Figure 4. UDFN 1.2x1.0 (NCS2200A) http://onsemi.com 2 NCS2200 Series, NCS2200A MAXIMUM RATINGS Rating Supply Voltage Range (VCC to VEE) Non−inverting/Inverting Input to VEE Operating Junction Temperature Operating Ambient Temperature Storage Temperature Range Output Short Circuit Duration Time (Note 1) ESD Tolerance (Note 2) NCS2200/2201 Human Body Model Machine Model NCS2202/NCS2203 Human Body Model Machine Model NCS2200A Human Body Model Machine Model Thermal Resistance, Junction−to−Ambient TSOP−5 DFN (Note 3) SC70−5 UDFN Symbol VS − TJ TA Tstg tS − 2000 200 1000 200 1900 200 RqJA °C/W 238 215 283 350 Value 6.0 −0.2 to (VCC + 0.2) 150 −40 to +105 −65 to +150 Indefinite Unit V V °C °C °C s V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The maximum package power dissipation limit must not be exceeded. TJ(max) * TA PD + RqJA 2. ESD data available upon request. 3. For more information, refer to application note, AND8080/D. http://onsemi.com 3 NCS2200 Series, NCS2200A ELECTRICAL CHARACTERISTICS (For all values VCC = 0.85 V to 6.0 V, VEE = 0 V, TA = 25°C, unless otherwise noted.) (Note 4) NCS2200 Series Characteristics Input Hysteresis TA = 25°C Input Offset Voltage VCC = 0.85 V TA = 25°C TA = −40°C to 105°C VCC = 3.0 V TA = 25°C TA = −40°C to 105°C VCC = 6.0 V TA = 25°C TA = −40°C to 105°C Common Mode Voltage Range Output Leakage Current (NCS2202/NCS2203) VCC = 6.0 V Output Short−Circuit Sourcing or Sinking (Vout = GND) Common Mode Rejection Ratio VCM = VCC Input Bias Current Power Supply Rejection Ratio DVS = 2.575 V Supply Current VCC = 0.85 V TA = 25°C TA = −40°C to 105°C VCC = 3.0 V TA = 25°C TA = −40°C to 105°C VCC = 6.0 V TA = 25°C TA = −40°C to 105°C Output Voltage High (NCS2200/NCS2201) VCC = 0.85 V, Isource = 0.5 mA TA = 25°C TA = −40°C to 105°C VCC = 3.0 V, Isource = 3.0 mA TA = 25°C TA = −40°C to 105°C VCC = 6.0 V, Isource = 5.0 mA TA = 25°C TA = −40°C to 105°C Output Voltage Low VCC = 0.85 V, Isink = 0.5 mA TA = 25°C TA = −40°C to 105°C VCC = 3.0 V, Isink = 3.0 mA TA = 25°C TA = −40°C to 105°C VCC = 6.0 V, Isink = 5.0 mA TA = 25°C TA = −40°C to 105°C Propagation Delay 20 mV Overdrive, CL = 15 pF tPHL tPLH Output Fall Time VCC = 6.0 V, CL = 50 pF Output Rise Time VCC = 6.0 V, CL = 50 pF Powerup Time tFALL tRISE tPU − − − − − 0.7 1.1 20 16 35 − − − − − ns ns ms Symbol VHYS VIO −10 −12 −6.0 −8.0 −5.0 −7.0 VCM ILEAK ISC CMRR IIB PSRR ICC − 10 − 10 − 10 − 15 17 15 17 15 17 V VCC − 0.2 VCC − 0.225 VCC − 0.2 VCC − 0.25 VCC − 0.2 VCC − 0.25 VOL − VEE + 0.10 − VEE + 0.12 − VEE + 0.12 − VEE + 0.2 VEE + 0.225 VEE + 0.2 VEE + 0.25 VEE + 0.2 VEE + 0.25 ms VCC − 0.10 − VCC − 0.12 − VCC − 0.12 − − − − − 53 − 45 0.5 − 0.5 − 0.5 − VEE to VCC 3.3 70 65 1.0 55 +10 +12 +6.0 +8.0 +5.0 +7.0 − − − − − − V nA mA dB pA dB mA Min 2.0 Typ 8.0 Max 20 Unit mV mV − − VOH − − V − − 4. The limits over the extended temperature range are guaranteed by design only. http://onsemi.com 4 NCS2200 Series, NCS2200A ELECTRICAL CHARACTERISTICS (For all values VCC = 0.85 V to 6.0 V, VEE = 0 V, TA = 25°C, unless otherwise noted.) (Note 5) NCS2200A Characteristics Input Hysteresis TA = 25°C Input Offset Voltage VCC = 0.85 V TA = 25°C TA = −40°C to 105°C VCC = 3.0 V TA = 25°C TA = −40°C to 105°C VCC = 6.0 V TA = 25°C TA = −40°C to 105°C Common Mode Voltage Range Output Short−Circuit Sourcing or Sinking (Vout = GND) Common Mode Rejection Ratio VCM = VCC Input Bias Current Power Supply Rejection Ratio DVS = 2.575 V Supply Current VCC = 0.85 V TA = 25°C TA = −40°C to 105°C VCC = 3.0 V TA = 25°C TA = −40°C to 105°C VCC = 6.0 V TA = 25°C TA = −40°C to 105°C Output Voltage High VCC = 0.85 V, Isource = 0.5 mA TA = 25°C TA = −40°C to 105°C VCC = 3.0 V, Isource = 3.0 mA TA = 25°C TA = −40°C to 105°C VCC = 6.0 V, Isource = 5.0 mA TA = 25°C TA = −40°C to 105°C Output Voltage Low VCC = 0.85 V, Isink = 0.5 mA TA = 25°C TA = −40°C to 105°C VCC = 3.0 V, Isink = 3.0 mA TA = 25°C TA = −40°C to 105°C VCC = 6.0 V, Isink = 5.0 mA TA = 25°C TA = −40°C to 105°C Propagation Delay 20 mV Overdrive, CL = 15 pF tPHL tPLH Output Fall Time VCC = 6.0 V, CL = 50 pF (Note 6) Output Rise Time VCC = 6.0 V, CL = 50 pF (Note 6) tFALL tRISE − − − − 0.5 0.5 20 16 − − − − ns ns Symbol VHYS VIO −10 −12 −6.0 −8.0 −5.0 −7.0 VCM ISC CMRR IIB PSRR ICC − 7.5 − 8.0 − 9.0 − 15 17 15 17 15 17 V VCC − 0.25 VCC − 0.275 VCC − 0.3 VCC − 0.35 VCC − 0.3 VCC − 0.35 VOL − VEE + 0.10 − VEE + 0.12 − VEE + 0.12 − VEE + 0.25 VEE + 0.275 VEE + 0.3 VEE + 0.35 VEE + 0.3 VEE + 0.35 ms VCC − 0.10 − VCC − 0.12 − VCC − 0.12 − − − − 53 − 45 0.5 − 0.5 − 0.5 − VEE to VCC 60 70 1.0 80 +10 +12 +6.0 +8.0 +5.0 +7.0 − − − − − V mA dB pA dB mA Min 2.0 Typ 4.5 Max 20 Unit mV mV − − VOH − − V − − 5. The limits over the extended temperature range are guaranteed by design only. 6. Input signal: 1 kHz, squarewave signal with 10 ns edge rate. http://onsemi.com 5 NCS2200 Series, NCS2200A ENABLE FUNCTION ELECTRICAL CHARACTERISTICS (NCS2201/NCS2203 only) (For all values VCC = 6.0 V, VEE = 0 V, Characteristics Enable Voltage Threshold Input Voltage Increasing, Device Enabled Input Voltage Decreasing, Device Disabled Enable Hysteresis Enable Pullup Current Disable State Supply Current Enable Input to Output Propagation Delay Input Voltage Increasing, Device Enabled Input Voltage Decreasing, Device Disabled Symbol VEN(HIGH) VEN(LOW) VENHYS IEN ICCD tEN(ON) tEN(OFF) Min − 2.0 − − − − − Typ 3.2 2.2 1.0 100 300 82 0.5 Max 4.0 − − 200 600 − − V nA nA ms Unit V TA = 25°C, unless otherwise noted.) (Note 7) 7. The limits over the extended temperature range are guaranteed by design only. http://onsemi.com 6 NCS2200 Series, NCS2200A 12 ICC, SUPPLY CURRENT (mA) VCC = 5.0 V 11 10 9.0 8.0 7.0 6.0 −50 1000 TA = 25°C ICC, SUPPLY CURRENT (mA) 100 VCC = 5.0 V 10 VCC = 2.7 V −25 0 25 50 75 100 1.0 0.01 0.1 1.0 10 100 300 TA, AMBIENT TEMPERATURE (°C) FREQUENCY (kHz) Figure 1. NCS2200 Series Supply Current versus Temperature Figure 2. NCS2200 Series Supply Current versus Output Transition Frequency 12 ICC, SUPPLY CURRENT (mA) 10 8.0 6.0 4.0 2.0 0 0 1.0 2.0 3.0 4.0 5.0 6.0 VCC, SUPPLY VOLTAGE (V) TA = 85°C TA = 25°C TA = −40°C 1000 VCC − VOH, OUTPUT VOLTAGE HIGH STATE (mV) VCC = 5.0 V TA = 25°C 100 10 1.0 0.1 0.01 0.1 1.0 10 Isource, OUTPUT SOURCE CURRENT (mA) Figure 3. NCS2200 Series Supply Current versus Supply Voltage VOL, OUTPUT VOLTAGE LOW STATE (mV) 1000 VCC = 5.0 V TA = 25°C 100 VOL, OUTPUT VOLTAGE LOW STATE (mV) 160 140 120 100 80 60 40 20 0 −100 Figure 4. NCS2200/1 Output Voltage High State versus Output Source Current VCC = 5.0 V ILOAD = 4.0 mA 10 1.0 0.1 0.01 0.1 1.0 10 −50 0 50 100 150 Isink, OUTPUT SINK CURRENT, (mA) TA, AMBIENT TEMPERATURE (°C) Figure 5. NCS2200 Series Output Voltage Low State versus Output Sink Current Figure 6. NCS2200 Series Output Voltage Low State versus Temperature http://onsemi.com 7 NCS2200 Series, NCS2200A VOH, OUTPUT VOLTAGE HIGH STATE (mV) 4.95 PROPAGATION DELAY (ms) 4.94 4.93 4.92 4.91 4.90 4.89 4.88 −100 VCC = 5.0 V ILOAD = 4.0 mA 1.0 0.8 tPLH 0.6 tPHL 0.4 0.2 VCC = 5.0 V Input Overdrive = 50 mV 0 −50 −25 0 25 50 75 100 −50 0 50 100 150 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 7. NCS2200/1 Series Output Voltage High State versus Temperature Figure 8. NCS2200 Series Propagation Delay versus Temperature 700 OUTPUT RESPONSE TIME (ns) PROPAGATION DELAY (ms) 600 tLH 500 400 300 200 100 0 TA = 25°C Input Overdrive = 100 mV 0 1.0 2.0 3.0 4.0 5.0 6.0 tHL 1.2 1.0 0.8 0.6 tPLH 0.4 tPHL 0.2 0 0 50 100 150 200 VCC, SUPPLY VOLTAGE (V) INPUT OVERDRIVE (mV) VCC = 2.7 V TA = 25°C Figure 9. NCS2200 Series Output Response Time versus Supply Voltage Figure 10. NCS2200 Series Propagation Delay versus Input Overdrive 0.8 PROPAGATION DELAY (ms) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 50 100 150 200 INPUT OVERDRIVE (mV) 10 ms/Div tPHL tPLH VCC = 5.0 V TA = 25°C VCC 2 V/Div Output Input Overdrive = 50 mV Figure 11. NCS2200 Series Propagation Delay versus Input Overdrive Figure 12. NCS2200 Series Powerup Delay http://onsemi.com 8 NCS2200 Series, NCS2200A VCM, INPUT COMMON MODE VOLTAGE RANGE (V) ICCD, DISABLE STATE SUPPLY CURRENT (mA) 3.0 TA = 25°C 2.0 1.0 0 0.45 TA = 25°C 0.3 −1.0 0.15 −2.0 −3.0 1.0 0 1.0 2.0 3.0 4.0 5.0 6.0 VCC, SUPPLY VOLTAGE (V) 2.0 3.0 4.0 5.0 6.0 VS, SUPPLY VOLTAGE (V) Figure 13. NCS2200 Series Input Common Mode Voltage Range versus Supply Voltage ILEAK, OUTPUT LEAKAGE CURRENT (nA) Figure 14. NCS2201/3 Series Disable State Supply Current versus Supply Voltage 3.5 ENABLE INPUT VOLTAGE (V) 3.0 2.5 2.0 1.5 1.0 0.5 0 0 1.0 2.0 3.0 4.0 5.0 6.0 VCC, SUPPLY VOLTAGE (V) Device Disabled Output Tri−State Device Enabled Output Active TA = 25°C 180 160 140 120 100 80 60 40 20 0 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 VOUT, OUTPUT VOLTAGE (V) TA = −40°C TA = 25°C TA = 85°C Figure 15. NCS2201/3 Enable Input Voltage versus Supply Voltage Figure 16. NCS2202/3 Output Leakage Current versus Output Voltage http://onsemi.com 9 NCS2200 Series, NCS2200A OPERATING DESCRIPTION The NCS2200 Series is an industry first sub−one volt, low power comparator family. This series is designed for rail−to−rail input and output performance. These devices consume only 10 mA of supply current while achieving a typical propagation delay of 1.1 ms at a 20 mV input overdrive. Figures 10 and 11 show propagation delay with various input overdrives. This comparator family is guaranteed to operate at a low voltage of 0.85 V up to 6.0 V. This is accomplished by the use of a modified analog CMOS process that implements depletion MOSFET devices. The common−mode input voltage range extends 0.1 V beyond the upper and lower rail without phase inversion or other adverse effects. This series is available in the SOT−23−5 and SOT−23−6 package. Additionally, the NCS2200 device is available in the tiny DFN 2x2.2 package and the SC70−5 package. NCS2200A is available in UDFN package. The SOT−23−6 features the enable function, which can be externally controlled. This feature allows significantly lower current consumption of 0.3 mA. This makes the devices suitable for implementation in power sensitive applications such as portable electronics. The enable VCC function is active high when connected to the VCC pin. When the enable pin is driven low (device disabled), output tri−state mode is activated. The device will remain in this mode and will not respond to any changes at the inputs of the comparator. In order to pull the device out of tri−state mode, the enable upper voltage threshold must be met. Figure 15 shows the enable input voltage required to either enable or disable the device, with a variance in supply voltage. In addition, these devices have a typical internal hysteresis of "8.0 mV. This allows for greater noise immunity and clean output switching. Output Stage The NCS2200/1 has a complementary P and N Channel output stage that has capability of driving a rail−to−rail output swing with a load ranging up to 5.0 mA. It is designed such that shoot−through current is minimized while switching. This feature eliminates the need for bypass capacitors under most circumstances. The NCS2202/3 has an open drain N−channel output stage that can be pulled up to 6.0 V (max) with an external resistor. This facilitates mixed voltage system applications. VCC IN (+) Output IN (−) IN (+) Output IN (−) VEE VEE Figure 17. NCS2200/1SNxT1/NCS2200A Complementary Output Configuration Figure 18. NCS2202/3SNxT1 Open Drain Output Configuration http://onsemi.com 10 NCS2200 Series, NCS2200A VCC Rx Cx IN (−) NCS 2201 IN (+) EN OUT R2 VO R1 The oscillation frequency can be programmed as follows: 1 f+1+ T 2.2 RxCx Figure 19. Schmitt Trigger Oscillator VCC 1M R1 100 pF t0 R2 1M IN (−) NCS 2201 IN (+) EN OUT C1 VO t0 t1 VCC 0 R3 The resistor divider R1 and R2 can be used to set the magnitude of the input pulse. The pulse width is set by adjusting C1 and R3. Figure 20. One−Shot Multivibrator http://onsemi.com 11 NCS2200 Series, NCS2200A +5 V +3 V 100 k R pullup 100 k IN (−) NCS 2203 IN (+) EN +3 V Logic Output OUT +5 V Logic Input This circuit converts 5 V logic to 3 V logic. Using the NCS2202/3 allows for full 5 V logic swing without creating overvoltage on the 3 V logic input. Figure 21. Logic Level Translator VCC IN (−) NCS 2201 IN (+) 100 mV EN OUT Figure 22. Zero−Crossing Detector http://onsemi.com 12 NCS2200 Series, NCS2200A ORDERING INFORMATION Device NCS2200AMUT1G NCS2200SN1T1 NCS2200SN1T1G NCS2200SN2T1 NCS2200SN2T1G NCS2200SQ2T2 NCS2200SQ2T2G NCS2200SQLT1 NCS2200SQLT1G NCS2201SN1T1 NCS2201SN1T1G NCS2201SN2T1 NCS2201SN2T1G NCS2202SN1T1 NCS2202SN1T1G NCS2202SQ1T2G NCS2202SN2T1 NCS2202SN2T1G NCS2202SQ2T2G NCS2203SN1T1 NCS2203SN1T1G NCS2203SN2T1 NCS2203SN2T1G Pinout Style N/A 1 1 2 2 2 2 N/A N/A 1 1 2 2 1 1 1 2 2 2 1 1 2 2 Output Type Complementary Complementary Complementary Complementary Complementary Complementary Complementary Complementary Complementary Complementary, Enable Complementary, Enable Complementary, Enable Complementary, Enable Open Drain Open Drain Open Drain Open Drain Open Drain Open Drain Open Drain, Enable Open Drain, Enable Open Drain, Enable Open Drain, Enable Package UDFN (Pb−Free) SOT−23−5 (TSOP−5) SOT−23−5 (TSOP−5) (Pb−Free) SOT−23−5 (TSOP−5) SOT−23−5 (TSOP−5) (Pb−Free) SC70−5 SC70−5 (Pb−Free) DFN, 2x2.2 DFN, 2x2.2 (Pb−Free) SOT−23−6 (TSOP−6) SOT−23−6 (TSOP−6) (Pb−Free) SOT−23−6 (TSOP−6) SOT−23−6 (TSOP−6) (Pb−Free) SOT−23−5 (TSOP−5) SOT−23−5 (TSOP−5) (Pb−Free) SC70−5 (Pb−Free) SOT−23−5 (TSOP−5) SOT−23−5 (TSOP−5) (Pb−Free) SC70−5 (Pb−Free) SOT−23−6 (TSOP−6) SOT−23−6 (TSOP−6) (Pb−Free) SOT−23−6 (TSOP−6) SOT−23−6 (TSOP−6) (Pb−Free) Shipping † 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel This device contains 93 active transistors. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 13 NCS2200 Series, NCS2200A MARKING DIAGRAMS SOT−23−5 (TSOP−5) SN SUFFIX CASE 483 5 CAx AYWG G 1 1 x = I for NCS2200SN1T1 J for NCS2200SN2T1 M for NCS2202SN1T1 N for NCS2202SN2T1 A = Assembly Location Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) = K for NCS2201SN1T1 L for NCS2201SN2T1 O for NCS2203SN1T1 P for NCS2203SN2T1 A = Assembly Location Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) DFN6 2x2.2 SQL SUFFIX CASE 488 x SOT−23−6 (TSOP−6) SN SUFFIX CASE 318G 6 CAxAYWG G SC70−5 SQ SUFFIX CASE 419A 5 CBx MG G 1 = Specific Device Code = A for NCS2200SQ2T2 D for NCS2202SQ1T2G E for NCS2202SQ2T2G M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation, position, and underbar may vary depending upon manufacturing location. CBx x 1 CB MG G CB = Specific Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code overbar and underbar may vary depending upon manufacturing location. UDFN6 1.2x1.0 MU SUFFIX CASE 517AA SM G 1 S M G (Top View) = Specific Device Code = Date Code = Pb−Free Package http://onsemi.com 14 NCS2200 Series, NCS2200A PACKAGE DIMENSIONS SOT−23−5 / TSOP−5 / SC59−5 SN SUFFIX PLASTIC PACKAGE CASE 483−02 ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. DIM A B C D G H J K L M S MILLIMETERS MIN MAX 3.00 BSC 1.50 BSC 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00 NOTE 5 2X D 5X 0.20 C A B 5 1 2 4 3 0.10 T 0.20 T L G A B S M K DETAIL Z 2X DETAIL Z J C 0.05 H T SEATING PLANE SOLDERING FOOTPRINT* 1.9 0.074 0.95 0.037 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 15 NCS2200 Series, NCS2200A PACKAGE DIMENSIONS SOT−23−6 / TSOP−6 / SC59−6 SN SUFFIX CASE 318G−02 ISSUE S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.38 0.50 0.18 0.26 3.00 3.10 1.50 1.70 0.95 1.05 0.40 0.60 2.75 3.00 10° − INCHES NOM 0.039 0.002 0.014 0.007 0.118 0.059 0.037 0.016 0.108 − D 6 5 1 2 4 3 HE E b e q 0.05 (0.002) A1 A L c DIM A A1 b c D E e L HE q MIN 0.90 0.01 0.25 0.10 2.90 1.30 0.85 0.20 2.50 0° MIN 0.035 0.001 0.010 0.004 0.114 0.051 0.034 0.008 0.099 0° MAX 0.043 0.004 0.020 0.010 0.122 0.067 0.041 0.024 0.118 10° SOLDERING FOOTPRINT* 2.4 0.094 1.9 0.075 0.95 0.037 0.95 0.037 0.7 0.028 1.0 0.039 SCALE 10:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 16 NCS2200 Series, NCS2200A PACKAGE DIMENSIONS DFN6, 2x2.2 SQL SUFFIX CASE 488−03 ISSUE G D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. TERMINAL b MAY HAVE MOLD COMPOUND MATERIAL ALONG SIDE EDGE. 6. DETAILS A AND B SHOW OPTIONAL VIEWS FOR END OF TERMINAL LEAD AT EDGE OF PACKAGE AND SIDE EDGE OF PACKAGE. DIM A A1 A3 b b1 D D2 E e L L1 MIN 0.80 0.00 0.20 0.30 0.40 0.30 0.00 MILLIMETERS NOM MAX 0.90 1.00 0.03 0.05 0.20 REF 0.25 0.30 0.35 0.40 2.00 BSC 0.50 0.60 2.20 BSC 0.65 BSC 0.35 0.40 0.05 0.10 E PIN ONE REFERENCE 2X 0.10 C 2X 0.10 C 0.10 C 6X 0.08 C SIDE VIEW 0.10 C A 0.05 C B b1 1 3 NOTE 3 6X L BOTTOM VIEW EDGE OF PACKAGE MOLD CMPD L1 A1 DETAIL A Bottom View (Optional) ÉÉ ÉÉ ÉÉ ÍÍÍ ÍÍÍ ÍÍÍ 6 TOP VIEW DETAIL B A3 A A1 C SEATING PLANE SOLDERING FOOTPRINT* 0.50 0.020 0.65 0.025 e DETAIL A D2 0.40 0.016 0.50 0.020 0.65 0.025 4 b 5X 1.9 0.075 0.10 C A 0.05 C B SCALE 10:1 NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. EXPOSED Cu A3 DETAIL B Side View (Optional) http://onsemi.com 17 NCS2200 Series, NCS2200A PACKAGE DIMENSIONS SC70−5/SC88A (SOT−353) SQ SUFFIX CASE 419A−02 ISSUE J A G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 5 4 S 1 2 3 −B− DIM A B C D G H J K N S D 5 PL 0.2 (0.008) M B M N J C INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 H K SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 18 NCS2200 Series, NCS2200A PACKAGE DIMENSIONS UDFN6, 1.2x1.0, 0.4P CASE 517AA ISSUE A D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.00 BSC 1.20 BSC 0.40 BSC 0.30 0.40 0.40 0.50 PIN ONE REFERENCE 2X 0.10 C 2X 0.10 C 0.10 C 10X 0.08 C L2 6X b 0.10 C A B 0.05 C NOTE 3 6 4 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative ÉÉÉ ÉÉÉ ÉÉÉ 1 E TOP VIEW (A3) A SIDE VIEW A1 5X 3 SEATING PLANE DIM A A1 A3 b D E e L L2 MOUNTING FOOTPRINT* 6X C L 0.42 6X 0.22 0.40 PITCH e 1.07 DIMENSIONS: MILLIMETERS BOTTOM VIEW *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 19 NCS2200/D