NCS2302
Headset Detection
Interface with Send/End
Detect
The NCS2302 is a compact and cost effective headset detection
interface IC. It integrates several circuit blocks to detect the presence
of a stereo headset with a microphone and whether the send/end button
has been pressed. The NMOS transistor on the MIC pin mutes the
signal when the headset is not present. The built in resistor divider
provides the reference voltage for detecting the left audio channel.
When L_DET and GND_DET are pulled low, the logic low output of
the OR gate indicates the headset has been connected properly and the
MIC pull−down is disabled. A comparator is integrated for detecting
the send/end button press. The NCS2302 comes in a space−saving
UQFN10 package (1.4 x 1.8 mm).
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1
UQFN10
MU SUFFIX
CASE 488AT
MARKING DIAGRAM
Features
• Wide Supply Voltage Ranges:
•
•
•
•
For Headset Detection Circuit: VDD = 1.6 V to 2.5 V
For S/E Comparator Circuit: VDD2 = 1.6 V to 2.8 V
Low Quiescent Supply Current: 17 mA typical
Low Impedance MIC Pull−Down Reduces Pop & Click Noise:
RDS(ON) = 0.45 W Typical
Space Saving UQFN10 Package
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
• Cell Phones, Smartphones
• Tablets
• Notebooks
AQMG
G
AQ
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN DIAGRAM
S/E_DET
8
S/E_REF
9
VDD2
10
S/E DET
7 6
1
5
GND_DET
4
L_DET
3
VDD
2
GND MIC
Top View
ORDERING INFORMATION
Device
NCS2302MUTAG
Package
Shipping†
UQFN10
(Pb−Free)
3000 / Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
June, 2014 − Rev. 3
1
Publication Order Number:
NCS2302/D
NCS2302
Baseband
Processor
GPIO
GPIO
VDD 2
S/E 7
S/E detection
6
DET
GND_DET 5
8 S/E_DET
NCS2302
L_DET 4
9 S/E_REF
VDD2
Audio Codec
VDD
VDD
10 VDD 2
MIC bias
voltage
GND 1
3
2 MIC
2.2 k
MIC
GND_DET
L_DET
MIC
L
R
GND
Output to
speakers
L
R
G
M
Figure 1. Simplified Application Schematic
NCS2302
S/E_REF
S/E_DET
VDD2
S/E
9
8
10
7
+
−
VDD
MIC
6
DET
1
GND
VDD
VDD
270k
2
−
+
1M
VDD
VDD
1M
1M
VDD
4
5
3
L_DET
GND_DET
VDD
Figure 2. Block Diagram
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2
NCS2302
Table 1. OUTPUT LOGIC
Inputs
Outputs
L_detect
GND_detect
DET
MIC
Headset
0
0
0
1 (external pull−up)
Detected
0
1
1
0
1
0
1
0
1
1
1
0
Not Detected
Table 2. PIN DESCRIPTION
Pin
Name
Type
Description
1
GND
Power
Connects to system ground.
2
MIC
Output
The open drain MIC pin is connected to the audio jack MIC pin. The MIC pin will pull low when
the headset is not connected. When the headset is detected, the internal pull−down is disabled and the external pull−up biases the microphone.
3
VDD
Power
Supply voltage pin for headset detection circuit. A bypass capacitor of 0.1 mF is recommended
as close as possible to this pin.
4
L_DET
Input
Connect to audio jack L_DET. This pin is pulled low when the headset is present.
5
GND_DET
Input
Connect to audio jack GND_DET. This pin is pulled low when the headset is present.
6
DET
Output
Indicates whether headset has been detected. Headset is detected when DET is low.
7
S/E
Output
Indicates whether send/end button press has been detected. Button press is detected when
S/E is low.
8
S/E_DET
Input
Non−inverting input of the comparator detects whether the send/end button has been pressed.
9
S/E_REF
Input
Inverting input of the comparator sets a voltage reference with an external resistor divider
10
VDD2
Power
Supply voltage pin for S/E detection comparator. A bypass capacitor of 0.1 mF is recommended as close as possible to this pin.
Table 3. ABSOLUTE MAXIMUM RATINGS (Note 1)
Rating
Symbol
Value
Unit
Supply Voltage Range of Headset Detection Circuit
VDD
0 to 2.75
V
Supply Voltage Range of S/E Detection Comparator
VDD2
0 to 2.95
V
Input Pin Voltage Range (L_DET, GND_DET)
VIN
−0.1 to VDD + 0.1
V
Input Pin Voltage Range (S/E_REF, S/E_DET) (Note 4)
VIN
−0.1 to min(VDD2 + 0.6, 3.3)
V
MIC Output Pin Voltage Range
VMIC
0 to 6.0
V
Max Current on MIC Pin
IMIC
2
mA
TJ(max)
+125
°C
Tstg
−65 to +150
°C
ILU
800
mA
MSL
Level 1
Maximum Junction Temperature
Storage Temperature Range
Latch−up Current (Note 2)
Moisture Sensitivity Level (Note 3)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. Latch−up Current tested per JEDEC standard: JESD78
3. Moisture Sensitivity Level tested per IPC/JEDEC standard: J−STD−020A
4. The maximum voltage on the S/E_REF and S/E_DET pins must be the lesser of VDD2 + 0.6 and 3.3 V.
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NCS2302
Table 4. RECOMMENDED OPERATING RANGES
Rating
Conditions
Power Supply Voltage
Input Voltage
Symbol
Min
Typ
Max
Unit
Headset Detection Circuit
VDD
1.6
1.8
2.5
V
S/E Detection Comparator
VDD2
1.6
2.8
V
VIN
0
VDD
V
0
VDD2
V
0
10
ns/V
L_DET, GND_DET
S/E_DET, S/E_REF
Input Transition Rise or Fall Rate
Dt / DV
GND_DET pin
MIC Bias Voltage
VMIC
0
2.95
V
Ambient Temperature
TA
−40
85
°C
Junction Temperature
TJ
−40
125
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
Table 5. ELECTRICAL CHARACTERISTICS Typical values are referenced to TA = 25°C, VDD = 1.8 V, VDD2 = 2.1 V, unless
otherwise noted. Min/max values apply from TA = −40°C to 85°C, unless otherwise noted. (Notes 5, 6)
Test Conditions
Parameter
Symbol
Min
Typ
Max
Units
SUPPLY CHARACTERISTICS
Quiescent Supply Current
Headset Detection Circuit,
VGND_DET = 1.8 V, VL_DET = 1.8 V
IDD
7
8.5
mA
S/E Detection Comparator,
VSE_REF = 0 V, VSE_DET = 2.1 V
IDD2
10
12.5
mA
1.33
V
INPUT CHARACTERISTICS OF L_DET
Voltage Input Low
VIL
Voltage Input High
VIH
1.5
V
Propagation Delay to DET
Cout = 15 pF, GND_DET = 0 V,
L_DET = 1.31 V to 1.52 V
tpLH, tpHL
45
ns
Low to High Propagation Delay to MIC
Cout = 15 pF, GND_DET = 0 V,
L_DET = 1.31 V to 1.52 V,
RPU = 2.2 kW, MIC bias = 2.3 V
tpLH
230
ns
High to Low Propagation Delay to MIC
Cout = 15 pF, GND_DET = 0 V,
L_DET = 1.31 V to 1.52 V,
RPU = 2.2 kW, MIC bias = 2.3 V
tpHL
30
ns
Low Voltage Input Bias Current
VL_DET = 0 V
IIL
1.8
mA
High Voltage Input Leakage
VL_DET = 1.8 V
IIH
2.4
nA
Input Capacitance
f = 1 MHz
CIN
3
pF
INPUT CHARACTERISTICS OF GND_DET
Voltage Input Low
VIL
0.63
Voltage Input High
VIH
Low to High Propagation Delay to DET Cout = 15 pF, RL = 1 MW, L_detect = 0 V,
GND_detect = 1.8 to 0 V
tpLH
30
ns
High to Low Propagation Delay to DET Cout = 15 pF, RL = 1 MW, L_detect = 0 V,
GND_detect = 0 to 1.8 V
tpHL
16
ns
1.17
V
V
Low Voltage Input Bias Current
VGND_detect = 0 V
IIL
1.8
mA
High Voltage Input Leakage
VGND_detect = 1.8 V
IIH
2.7
nA
Input Capacitance
f = 1 MHz
CIN
3
pF
5. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
6. Performance guaranteed over the indicated operating temperature range by design and/or characterization.
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NCS2302
Table 5. ELECTRICAL CHARACTERISTICS Typical values are referenced to TA = 25°C, VDD = 1.8 V, VDD2 = 2.1 V, unless
otherwise noted. Min/max values apply from TA = −40°C to 85°C, unless otherwise noted. (Notes 5, 6)
Parameter
Test Conditions
Symbol
Min
Typ
Max
Units
0.1
V
OUTPUT CHARACTERISTICS OF DET
Voltage Output Low
IOH = 0.1 mA
VOL
Voltage Output High
IOH = −0.1 mA
VOH
Rise Time
COUT = 15 pF, RL = 1 MW
trise
50
ns
Fall Time
COUT = 15 pF, RL = 1 MW
tfall
28
ns
tpLH, tpHL
50
ns
150
pA
3
pF
1.6
V
INPUT CHARACTERISTICS OF S/E_REF AND S/E_DET
Propagation Delay to S/E
Cout = 15 pF, VCM = mid−supply, 100 mV
overdrive
Input Leakage
VCM = 0.9 V
IIL
Input Capacitance
S/E_DET, f = 1 MHz
CIN
S/E_REF, f = 1 MHz
11
OUTPUT CHARACTERISTICS OF S/E
Voltage Output Low
IOH = 0.1 mA
VOL
0.1
V
Voltage Output High
IOH = −0.1 mA
VOH
Rise Time
COUT = 15 pF, RL = 1 MW
trise
30
ns
Fall Time
COUT = 15 pF, RL = 1 MW
tfall
18
ns
RDS(ON)
0.45
1.9
V
CHARACTERISTICS OF MIC
Drain−Source On Resistance of NMOS IMIC = 1 mA
W
1.2
5. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
6. Performance guaranteed over the indicated operating temperature range by design and/or characterization.
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
TYPICAL CHARACTERISTICS
0.8
VDD = 1.6 V
MIC RDS(on) RESISTANCE (W)
MIC RDS(on) RESISTANCE (W)
0.8
0.7
0.6
T = 85°C
0.5
T = 25°C
T = −40°C
0.4
0.3
VDD = 1.8 V
0.7
0.6
T = 85°C
0.5
T = 25°C
0.4
T = −40°C
0.3
0.2
0.2
0.5 1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0.5 1.0
5.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
MIC DRAIN CURRENT (mA)
MIC DRAIN CURRENT (mA)
Figure 3. MIC On Resistance vs. Drain Current
at VDD = 1.6 V
Figure 4. MIC On Resistance vs. Drain Current
at VDD = 1.8 V
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NCS2302
TYPICAL CHARACTERISTICS
VDD = 2.0 V
1.6
4.0
1.5 INPUT
3.5
INPUT VOLTAGE (V)
0.7
0.6
T = 85°C
0.5
T = 25°C
0.4
T = −40°C
1.4
VDD = 1.8 V
VDD2 = 2.1 V
1.3
RL = 1 MW
CL = 15 pF
TA = 25°C
1.1
1.5
100 mV
50 mV
20 mV
10 mV
OUTPUT
1.0
0.9
1.0
0.5
0
0.8
0.5 1.0
1.5
2.0
3.0
2.5
3.5
4.0
0.7
−100
5.0
4.5
0
MIC DRAIN CURRENT (mA)
100
200
4.0
VDD = 1.8 V
VDD2 = 2.1 V
INPUT VOLTAGE (V)
RL = 1 MW
CL = 15 pF
TA = 25°C
3.5
3.0
1.3
2.5
1.2
2.0
1.1
1.5
100 mV
50 mV
20 mV
10 mV
OUTPUT
1.0
0.9
1.0
0.5
0.8
OUTPUT VOLTAGE (V)
1.4
0
0.7
−100
0
100
200
300
400
−0.5
500
PROPAGATION DELAY (ns)
Figure 7. High to Low Propagation to DET with
Changing Input Overdrive of L_DET
4.0
0.8
3.5
VDD = 1.8 V
VDD2 = 2.1 V
0.5
RL = 1 MW
CL = 15 pF
TA = 25°C
3.0
2.5
2.0
0.4
0.3
1.5
100 mV
50 mV
20 mV
10 mV
0.2
0.1 OUTPUT
1.0
0.5
OUTPUT VOLTAGE (V)
INPUT VOLTAGE (V)
0.7 INPUT
0.6
0
0
−0.1
−100
0
400
−0.5
500
Figure 6. Low to High Propagation to DET with
Changing Input Overdrive of L_DET
1.6
INPUT
300
PROPAGATION DELAY (ns)
Figure 5. MIC On Resistance vs. Drain Current
at VDD = 2.0 V
1.5
2.5
2.0
1.2
0.3
0.2
3.0
100
200
300
400
−0.5
500
PROPAGATION DELAY (ns)
Figure 8. Low to High Propagation to SE with
Changing Input Overdrive of SE_DET
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OUTPUT VOLTAGE (V)
MIC RDS(on) RESISTANCE (W)
0.8
NCS2302
TYPICAL CHARACTERISTICS
0.8
4.0
VDD = 1.8 V
VDD2 = 2.1 V
0.7
0.6
3.5
3.0
0.5
2.5
0.4
2.0
100 mV
50 mV
20 mV
10 mV
0.3
0.2
0.1
0
1.5
1.0
0.5
OUTPUT
−0.1
−100
0
OUTPUT VOLTAGE (V)
INPUT VOLTAGE (V)
INPUT
RL = 1 MW
CL = 15 pF
TA = 25°C
0
100
200
300
400
500
600
−0.5
700
PROPAGATION DELAY (ns)
Figure 9. High to Low Propagation to SE with
Changing Input Overdrive of SE_DET
APPLICATIONS INFORMATION
Supply Voltages
The NCS2302 can work with either the CTIA or OMTP
standard. In order to support both standards simultaneously,
a cross point switch and additional circuitry is necessary to
detect and swap the ground and microphone pins.
The NCS2302 works with a wide range of supply
voltages. The main headset detection circuitry power supply
can range from VDD = 1.6 V to 2.5 V. The send/end button
press detection circuit can be powered from VDD2 = 1.6 to
2.8 V. VDD should be powered up before VDD2. The
send/end detection comparator will not be functional unless
VDD and VDD2 are both applied. VDD2 can be connected to
VDD or to a separate supply voltage, such as the MIC bias
voltage. Decoupling capacitors of 0.1 mF should be placed
as close as possible to each power supply pin. Since the
NCS2302 has built in latch−up immunity up to 800 mA,
series resistors are not recommended on VDD or VDD2.
Send/End Button Press Detection
A second integrated comparator allows the send/end
signal to be compared with a reference voltage to detect
whether the send/end button has been pressed.
MIC Pin Biasing
The typical application schematic in Figure 1 shows the
recommended 2.2 kW pull−up resistor to the MIC bias
voltage. The MIC bias voltage can exceed VDD and can go
as high as 2.95 V. When the headset is not detected, the
internal NMOS transistor is enabled to mute the MIC signal.
In the typical application scenario with a 2.2 kW pull−up to
a 2.1 V MIC bias voltage, the MIC pin is pulled to 1 mV
when the headset is not present. The internal NMOS
transistor is optimized to sink up to 2 mA of current,
allowing some flexibility in the selection of the pull−up
resistor and MIC bias voltage.
Audio Jack Detection
The NCS2302 is designed to simplify the detection of a
stereo audio connector with a microphone contact. When the
headset is not connected, the internal pull−up resistors on
L_DET and GND_DET pull those pins high. When the
headset is connected to the switched audio jack, the headset
ground and left audio channel trigger L_DET and
GND_DET to logic low.
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UQFN10 1.4x1.8, 0.4P
CASE 488AT−01
ISSUE A
DATE 01 AUG 2007
1
SCALE 5:1
EDGE OF PACKAGE
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
PIN 1 REFERENCE
2X
2X
A
0.10 C
L1
E
0.10 C
B
TOP VIEW
A1
0.05 C
A1
C
SIDE VIEW
3
9X
EXPOSED Cu
A
0.05 C
10X
DETAIL A
Bottom View
(Optional)
5
ÉÉÉ
ÉÉÉ
SEATING
PLANE
DETAIL B
Side View
(Optional)
6
e
1
10
10 X
L3
b
A3
DIM
A
A1
A3
b
D
E
e
L
L1
L3
MILLIMETERS
MIN
MAX
0.45
0.60
0.00
0.05
0.127 REF
0.15
0.25
1.40 BSC
1.80 BSC
0.40 BSC
0.30
0.50
0.00
0.15
0.40
0.60
GENERIC
MARKING DIAGRAM*
XXMG
G
e/2
L
MOLD CMPD
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
XX
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
0.10 C A B
0.05 C
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
NOTE 3
BOTTOM VIEW
MOUNTING FOOTPRINT
1.700
0.0669
0.663
0.0261
0.200
0.0079
9X
0.563
0.0221
1
2.100
0.0827
0.400
0.0157
PITCH
DOCUMENT NUMBER:
DESCRIPTION:
10 X
0.225
0.0089
SCALE 20:1
98AON22493D
mm Ǔ
ǒinches
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
10 PIN UQFN, 1.4 X 1.8, 0.4P
PAGE 1 OF 1
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