NCS2500DG

NCS2500 1.1 mA 200 MHz Current Feedback Op Amp NCS2500 is a 1.1 mA 200 MHz current feedback monolithic operational amplifier featuring high slew rate and low differential gain and phase error. The current feedback architecture allows for a superior bandwidth and low power consumption. Features http://onsemi.com MARKING DIAGRAMS 8 8 1 SO−8 D SUFFIX CASE 751 1 SC−70−5 (SC−88A) SQ SUFFIX CASE 419A 5 5 1 SOT23−5 (TSOP−5) SN SUFFIX CASE 483 YA0, N2500 A L Y W M • • • • • • • • • • • • • −3.0 dB Small Signal BW (AV = +2.0, VO = 0.5 Vp−p) 200 MHz Typ Slew Rate 450 V/ms Supply Current 1.1 mA Input Referred Voltage Noise 4.0 nV/ Hz THD −55 dB (f = 5.0 MHz, VO = 2.0 Vp−p) Output Current 100 mA Pin Compatible with EL5161, LMH6723, MAX4452 Pb−Free Packages are Available N2500 ALYW G 5 4 12 3 5 YA0M G 1 Applications Portable Video Line Drivers Radar/Communication Receivers Set Top Box NTSC/PAL/HDTV 3 2 VS = ±5V VOUT = 0.5V YA0YW G 1 NORMAILIZED GAIN(dB) 1 0 −1 −2 −3 −4 −5 Gain = +2 RF = 1.2kW RL = 100W VS = ±5V VOUT = 0.7V G = NCS2500 = Assembly Location = Wafer Lot = Year = Work Week = Date Code = Pb−Free Package VS = ±2.5V VOUT = 2.0V VS = ±5V VOUT = 2.0V VS = ±2.5V VOUT = 0.7V SO−8 PINOUT NC −IN +IN 1 2 3 4 (Top View) 100 1000 SOT23−5/SC70−5 PINOUT OUT VEE +IN 1 + 2 3 (Top View) − 4 −IN 5 VCC − + 8 7 6 5 NC VCC OUT NC −6 0.01 VS = ±2.5V VOUT = 0.5V VEE 0.1 1 10 FREQUENCY (MHz) Figure 1. Frequency Response: Gain (dB) vs. Frequency Av = +2.0, RL = 100 W ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 13 of this data sheet. © Semiconductor Components Industries, LLC, 2005 1 May, 2005 − Rev. 1 Publication Order Number: NCS2500/D NCS2500 PIN FUNCTION DESCRIPTION Pin (SO−8) 6 Pin (SOT23/SC70) 1 Symbol OUT Function Output Equivalent Circuit VCC ESD OUT VEE 4 3 2 3 VEE +IN Negative Power Supply Non−inverted Input ESD +IN VCC ESD −IN VEE 2 7 1, 5, 8 4 5 N/A −IN VCC NC Inverted Input Positive Power Supply No Connect See Above VCC +IN −IN OUT CC VEE Figure 2. Simplified Device Schematic http://onsemi.com 2 NCS2500 ATTRIBUTES Characteristics ESD Human Body Model Machine Model Charged Device Model Moisture Sensitivity (Note 2) Flammability Rating Oxygen Index: 28 to 34 Value 2.0 kV (Note 1) 200 V 1.0 kV Level 1 UL 94 V−0 @ 0.125 in 1. 0.8 kV between the input pairs +IN and −IN pins only. All other pins are 2.0 kV. 2. For additional information, see Application Note AND8003/D. MAXIMUM RATINGS Parameter Power Supply Voltage Input Voltage Range Input Differential Voltage Range Output Current Maximum Junction Temperature (Note 3) Operating Ambient Temperature Storage Temperature Range Power Dissipation Thermal Resistance, Junction−to−Air SO−8 SC70−5 SOT23−5 Symbol VS VI VID IO TJ TA Tstg PD RqJA 172 215 154 Rating 11 vVS vVS 100 150 −40 to +85 −60 to +150 (See Graph) Unit VDC VDC VDC mA °C °C °C mW °C/W Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 3. Power dissipation must be considered to ensure maximum junction temperature (TJ) is not exceeded. MAXIMUM POWER DISSIPATION 1400 Maximum Power Dissapation (mW) 1200 SO−8 Pkg SOT23 Pkg The maximum power that can be safely dissipated is limited by the associated rise in junction temperature. For the plastic packages, the maximum safe junction temperature is 150°C. If the maximum is exceeded momentarily, proper circuit operation will be restored as soon as the die temperature is reduced. Leaving the device in the “overheated’’ condition for an extended period can result in device damage. 1000 800 600 SC70 Pkg 400 200 0 −50 −25 0 50 75 25 100 Ambient Temperature (°C) 125 150 Figure 3. Power Dissipation vs. Temperature http://onsemi.com 3 NCS2500 AC ELECTRICAL CHARACTERISTICS (VCC = +5.0 V, VEE = −5.0 V, TA = −40°C to +85°C, RL = 100 W to GND, RF = 1.2 kW, AV = +2.0, VIN = 0 V, unless otherwise specified). Symbol Characteristic Conditions Min Typ Max Unit FREQUENCY DOMAIN PERFORMANCE BW Bandwidth 3.0 dB Small Signal 3.0 dB Large Signal 0.1 dB Gain Flatness Bandwidth Differential Gain Differential Phase MHz AV = +2.0, VO = 0.5 Vp−p AV = +2.0, VO = 2.0 Vp−p AV = +2.0 AV = +2.0, RL = 150 W, f = 3.58 MHz AV = +2.0, RL = 150 W, f = 3.58 MHz 200 140 30 0.02 0.1 MHz % ° GF0.1dB dG dP TIME DOMAIN RESPONSE SR ts Slew Rate Settling Time 0.01% 0.1% Rise and Fall Time AV = +2.0, Vstep = 2.0 V AV = +2.0, Vstep = 2.0 V AV = +2.0, Vstep = 2.0 V (10%−90%) AV = +2.0, Vstep = 2.0 V f = 5.0 MHz, VO = 2.0 Vp−p, RL = 150 W f = 5.0 MHz, VO = 2.0 Vp−p f = 5.0 MHz, VO = 2.0 Vp−p f = 10 MHz, VO = 2.0 Vp−p f = 5.0 MHz, VO = 2.0 Vp−p f = 1.0 MHz f = 1.0 MHz, Inverting f = 1.0 MHz, Non−Inverting 450 35 18 5.0 ns V/ms ns tr tf HARMONIC/NOISE PERFORMANCE THD HD2 HD3 IP3 SFDR eN iN Total Harmonic Distortion 2nd Harmonic Distortion 3rd Harmonic Distortion Third−Order Intercept Spurious−Free Dynamic Range Input Referred Voltage Noise Input Referred Current Noise −55 −67 −57 35 58 4.0 15 15 dB dBc dBc dBm dBc nV pA Hz Hz http://onsemi.com 4 NCS2500 DC ELECTRICAL CHARACTERISTICS (VCC = +5.0 V, VEE = −5.0 V, TA = −40°C to +85°C, RL = 100 W to GND, RF = 1.2 kW, AV = +2.0, VIN = 0 V, unless otherwise specified). Symbol DC PERFORMANCE VOS DVIO/DT IIB DIIB/DT Offset Voltage Input Offset Voltage Temperature Coefficient Input Bias Current Input Bias Current Temperature Coefficient +Input (Non−Inverting), VO = 0 V −Input (Inverting), VO = 0 V (Note 4) +Input (Non−Inverting), VO = 0 V −Input (Inverting), VO = 0 V −4.0 −4.0 −4.0 "0.7 6.0 "2.0 "0.4 "40 "10 +4.0 +4.0 +4.0 mV mV/°C mA nA/°C Characteristic Conditions Min Typ Max Unit INPUT CHARACTERISTICS VCM CMRR RIN CIN Input Common Mode Voltage Range (Note 4) Common Mode Rejection Ratio Input Resistance Differential Input Capacitance (See Graph) +Input (Non−Inverting) −Input (Inverting) "3.0 50 "4.0 55 4.0 350 1.0 65 V dB MW W pF OUTPUT CHARACTERISTICS ROUT VO IO Output Resistance Output Voltage Swing Output Current "3.0 "60 0.02 "3.5 "100 W V mA POWER SUPPLY VS IS PSRR Operating Voltage Supply Power Supply Current Power Supply Rejection Ratio VO = 0 V (See Graph) 0.5 50 10 1.1 60 2.0 70 V mA dB 4. Guaranteed by design and/or characterization. http://onsemi.com 5 NCS2500 AC ELECTRICAL CHARACTERISTICS (VCC = +2.5 V, VEE = −2.5 V, TA = −40°C to +85°C, RL = 100 W to GND, RF = 1.2 kW, AV = +2.0, VIN = 0 V, unless otherwise specified). Symbol Characteristic Conditions Min Typ Max Unit FREQUENCY DOMAIN PERFORMANCE BW Bandwidth 3.0 dB Small Signal 3.0 dB Large Signal 0.1 dB Gain Flatness Bandwidth Differential Gain Differential Phase MHz AV = +2.0, VO = 0.5 Vp−p AV = +2.0, VO = 1.0 Vp−p AV = +2.0 AV = +2.0, RL = 150 W, f = 3.58 MHz AV = +2.0, RL = 150 W, f = 3.58 MHz 180 130 15 0.02 0.1 MHz % ° GF0.1dB dG dP TIME DOMAIN RESPONSE SR ts Slew Rate Settling Time 0.01% 0.1% Rise and Fall Time AV = +2.0, Vstep = 1.0 V AV = +2.0, Vstep = 1.0 V AV = +2.0, Vstep = 1.0 V (10%−90%) AV = +2.0, Vstep = 1.0 V f = 5.0 MHz, VO = 1.0 Vp−p, RL = 150 W f = 5.0 MHz, VO = 1.0 Vp−p f = 5.0 MHz, VO = 1.0 Vp−p f = 10 MHz, VO = 1.0 Vp−p f = 5.0 MHz, VO = 1.0 Vp−p f = 1.0 MHz f = 1.0 MHz, Inverting f = 1.0 MHz, Non−Inverting 350 40 18 8.0 ns V/ms ns tr tf HARMONIC/NOISE PERFORMANCE THD HD2 HD3 IP3 SFDR eN iN Total Harmonic Distortion 2nd Harmonic Distortion 3rd Harmonic Distortion Third−Order Intercept Spurious−Free Dynamic Range Input Referred Voltage Noise Input Referred Current Noise −55 −67 −57 35 58 4.0 15 15 dB dBc dBc dBm dBc nV pA Hz Hz http://onsemi.com 6 NCS2500 DC ELECTRICAL CHARACTERISTICS (VCC = +2.5 V, VEE = −2.5 V, TA = −40°C to +85°C, RL = 100 W to GND, RF = 1.2 kW, AV = +2.0, VIN = 0 V, unless otherwise specified). Symbol DC PERFORMANCE VOS DVIO/DT IIB DIIB/DT Offset Voltage Input Offset Voltage Temperature Coefficient Input Bias Current Input Bias Current Temperature Coefficient +Input (Non−Inverting), VO = 0 V −Input (Inverting), VO = 0 V (Note 5) +Input (Non−Inverting), VO = 0 V −Input (Inverting), VO = 0 V −4.0 −4.0 −4.0 "0.5 6.0 "2.0 "0.4 "40 "10 +4.0 +4.0 +4.0 mV mV/°C mA nA/°C Characteristic Conditions Min Typ Max Unit INPUT CHARACTERISTICS VCM CMRR RIN CIN Input Common Mode Voltage Range (Note 5) Common Mode Rejection Ratio Input Resistance Differential Input Capacitance (See Graph) +Input (Non−Inverting) −Input (Inverting) "1.3 50 "1.5 55 4.0 350 1.0 65 V dB MW W pF OUTPUT CHARACTERISTICS ROUT VO IO Output Resistance Output Voltage Swing Output Current "1.1 "40 0.02 "1.4 "80 W V mA POWER SUPPLY VS IS PSRR Operating Voltage Supply Power Supply Current Power Supply Rejection Ratio VO = 0 V (See Graph) 0.5 50 5.0 0.9 60 1.9 70 V mA dB 5. Guaranteed by design and/or characterization. VIN + − VOUT RF RF RL Figure 4. Typical Test Setup (AV = +2.0, RF = 1.8 kW or 1.2 kW or 1.0 kW, RL = 100 W) http://onsemi.com 7 NCS2500 3 2 NORMAILIZED GAIN(dB) 1 0 −1 −2 −3 −4 −5 −6 0.01 0.1 Gain = +2 RF = 1.2kW RL = 100W VS = ±2.5V VOUT = 0.5V VS = ±5V VOUT = 0.5V 6 3 0 −3 −6 −9 100 1000 −12 0.01 VS = ±5V VOUT = 0.7V VS = ±2.5V VOUT = 0.7V VS = ±5V VOUT = 1.0V VS = ±2.5V VOUT = 1.0V 0.10 1 10 FREQUENCY (MHz) 100 1000 Gain = +1 RF = 1.2kW RL = 100W VS = ±5V VOUT = 0.5V VS = ±2.5V VOUT = 0.5V VS = ±2.5V VOUT = 2.0V VS = ±5V VOUT = 2.0V VS = ±2.5V VOUT = 0.7V VS = ±2.5V VOUT = 0.7V 1 10 FREQUENCY (MHz) NORMALIZED GAIN (dB) Figure 5. Frequency Response: Gain (dB) vs. Frequency Av = +2.0 6 NORMAILIZED GAIN(dB) 3 0 −3 −6 −9 −12 0.01 VOUT = 2.0V RL = 100W 0.10 VS = ±2.5V AV = +2 VS = ±5V AV = +2 VS = ±2.5V AV = +4 1 10 FREQUENCY (MHz) 100 1000 VS = ±5V AV = +4 6 3 0 −3 −6 −9 −12 0.01 Figure 6. Frequency Response: Gain (dB) vs. Frequency Av = +1.0 NORMALIZED GAIN (dB) VS = ±5V AV = +4 VS = ±5V AV = +2 VS = ±5V AV = +1 VS = ±2.5V AV = +1 VS = ±2.5V AV = +4 VOUT = 0.5V RL = 100W 0.10 VS = ±2.5V AV = +4 1 10 FREQUENCY (MHz) 100 1000 Figure 7. Large Signal Frequency Response Gain (dB) vs. Frequency Figure 8. Small Signal Frequency Response Gain (dB) vs. Frequency Figure 9. Small Signal Step Response Vertical: 500 mV/div Horizontal: 10 ns/div Figure 10. Large Signal Step Response Vertical: 500 mV/div Horizontal: 10 ns/div http://onsemi.com 8 NCS2500 −40 −45 DISTORTION (dB) −50 −55 −60 −65 −70 −75 −80 10 −70 100 FREQUENCY (MHz) 1000 0.5 1 1.5 2 2.5 VOUT (VPP) 3 3.5 4 HD3 HD2 THD VS = ±5V VOUT = 2VPP RL = 150W −40 −45 DISTORTION (dB) −50 THD −55 −60 −65 HD3 VS = ±5V f = 5MHz RL = 150W HD2 Figure 11. THD, HD2, HD3 vs. Frequency Figure 12. THD, HD2, HD3 vs. Output Voltage 7 VOLTAGE NOISE (nV/pHz) 6 5 4 3 2 ±5.0V CMRR (dB) ±2.5V −20 −25 −30 −35 −40 −45 −50 −55 VS = ±5V 1 0 1 10 100 FREQUENCY (kHz) 1000 −60 −65 10k 100k 1M FREQUENCY (Hz) 10M 100M Figure 13. Input Referred Noise vs. Frequency Figure 14. CMRR vs. Frequency 0 DIFFERENTIAL GAIN (%) −10 −20 PSRR(dB) +5.0V −30 −40 −50 −5.0V −60 −70 0.01 +2.5 −2.5V 0.06 0.04 0.02 0 VS = ±5V RL = 150W 4.43MHz 3.58MHz −0.02 10MHz 20MHz −0.04 −0.06 −0.8 0.1 1 FREQUENCY (MHz) 10 100 −0.6 0.4 0.2 −0.4 −0.2 0 OFFSET VOLTAGE (V) 0.6 0.8 Figure 15. PSRR vs. Frequency Figure 16. Differential Gain http://onsemi.com 9 NCS2500 0.06 20MHz DIFFERENTIAL PHASE (°) 0.04 0.02 0 4.43MHz 3.58MHz VS = ±5V RL = 150W −0.6 0.4 0.2 −0.4 −0.2 0 OFFSET VOLTAGE (V) 0.6 0.8 10MHz CURRENT (mA) 1.4 1.3 1.2 1.1 1 0.9 0.8 0.7 0.6 4 5 6 8 7 9 POWER SUPPLY VOLTAGE (V) 10 11 −40°C 85°C 25°C −0.02 −0.04 −0.06 −0.8 Figure 17. Differential Phase Figure 18. Supply Current vs. Power Supply 8 OUTPUT VOLTAGE (VPP) OUTPUT VOLTAGE (VPP) 7 6 85°C 5 4 3 −40°C 25°C 9 8 7 6 5 4 3 2 1 AV = +2 f = 1MHz 1 10 1000 100 LOAD RESISTANCE (W) 10k VS = ±2.5V VS = ±5V 2 4 5 6 8 7 9 SUPPLY VOLTAGE (V) 10 11 0 Figure 19. Output Voltage Swing vs. Supply Voltage Figure 20. Output Voltage Swing vs. Load Resistance 100 OUTPUT RESISTANCE (W) VS = ±5V 10 GAIN (dB) 18 12 6 0 −6 −12 −18 −24 VS = ±5V RF = 1.2kW RL = 100W Gain= +2 1 100pF 1 47pF 10pF 0.1 0.01 0.01 −30 0.1 1 10 FREQUENCY (MHz) 100 10 100 FREQUENCY (MHz) 1000 Figure 21. Output Impedance vs. Frequency Figure 22. Frequency Response vs. CL http://onsemi.com 10 NCS2500 10M 1M VS = ±5V TRANSIMPEDANCE (W) 100k 10k 1k 100 10 1 0.01 0.1 1 100 10 FREQUENCY (MHz) 1000 10k Figure 23. Transimpedance (ROL) vs. Frequency http://onsemi.com 11 NCS2500 General Design Considerations The current feedback amplifier is optimized for use in high performance video and data acquisition systems. For current feedback architecture, its closed−loop bandwidth depends on the value of the feedback resistor. The closed−loop bandwidth is not a strong function of gain, as is for a voltage feedback amplifier, as shown in Figure 24. 10 5 0 −5 resistor too far below its recommended value will cause overshoot, ringing, and eventually oscillation. Since each application is slightly different, it is worth some experimentation to find the optimal RF for a given circuit. A value of the feedback resistor that produces X0.1 dB of peaking is the best compromise between stability and maximal bandwidth. It is not recommended to use a current feedback amplifier with the output shorted directly to the inverting input. Printed Circuit Board Layout Techniques RF = 1 kW RF = 1.2 kW RF = 1.8 kW −10 −15 AV = +2 VCC = +5 V VEE = −5 V 0.1 1.0 10 100 1000 10000 −20 0.01 Proper high speed PCB design rules should be used for all wideband amplifiers as the PCB parasitics can affect the overall performance. Most important are stray capacitances at the output and inverting input nodes as it can effect peaking and bandwidth. A space (3/16″ is plenty) should be left around the signal lines to minimize coupling. Also, signal lines connecting the feedback and gain resistors should be short enough so that their associated inductance does not cause high frequency gain errors. Line lengths less than 1/4″ are recommended. Video Performance GAIN (dB) FREQUENCY (MHz) Figure 24. Frequency Response vs. RF The −3.0 dB bandwidth is, to some extent, dependent on the power supply voltages. By using lower power supplies, the bandwidth is reduced, because the internal capacitance increases. Smaller values of feedback resistor can be used at lower supply voltages, to compensate for this affect. Feedback and Gain Resistor Selection for Optimum Frequency Response This device designed to provide good performance with NTSC, PAL, and HDTV video signals. Best performance is obtained with back terminated loads as performance is degraded as the load is increased. The back termination reduces reflections from the transmission line and effectively masks transmission line and other parasitic capacitances from the amplifier output stage. ESD Protection A current feedback operational amplifier’s key advantage is the ability to maintain optimum frequency response independent of gain by using appropriate values for the feedback resistor. To obtain a very flat gain response, the feedback resistor tolerance should be considered as well. Resistor tolerance of 1% should be used for optimum flatness. Normally, lowering RF resistor from its recommended value will peak the frequency response and extend the bandwidth while increasing the value of RF resistor will cause the frequency response to roll off faster. Reducing the value of RF This device is protected against electrostatic discharge (ESD) on all pins as specified in the attributes table. Note: Human Body Model for +IN and −IN pins are rated at 0.8 kV while all other pins are rated at 2.0 kV. Under closed−loop operation, the ESD diodes have no effect on circuit performance. However, under certain conditions the ESD diodes will be evident. If the device is driven into a slewing condition, the ESD diodes will clamp large differential voltages until the feedback loop restores closed−loop operation. Also, if the device is powered down and a large input signal is applied, the ESD diodes will conduct. http://onsemi.com 12 NCS2500 ORDERING INFORMATION Device NCS2500SQT2 NCS2500SQT2G NCS2500SNT1 NCS2500SNT1G NCS2500D* NCS2500DR2* NCS2500DG* NCS2500DR2G* Package SC70−5 (SC88A) SC70−5 (SC88A) (Pb−Free) SOT23−5 (TSOP−5) SOT23−5 (TSOP−5) (Pb−Free) SO−8 SO−8 SO−8 (Pb−Free) SO−8 (Pb−Free) Shipping† 3000 Tape & Reel 3000 Tape & Reel 3000 Tape & Reel 3000 Tape & Reel 98 Units/Rail 2500 Tape & Reel 98 Units/Rail 2500 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *Contact ON Semiconductor for ordering information. http://onsemi.com 13 NCS2500 PACKAGE DIMENSIONS SO−8 D SUFFIX CASE 751−07 ISSUE AF −X− A 8 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. DIM A B C D G H J K M N S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244 B 1 4 S 0.25 (0.010) M Y M −Y− G C −Z− H D 0.25 (0.010) M SEATING PLANE K N X 45 _ 0.10 (0.004) M J ZY S X S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 14 NCS2500 PACKAGE DIMENSIONS SC−70−5 (SC−88A) SQ SUFFIX CASE 419A−02 ISSUE G A G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 5 4 S 1 2 3 −B− DIM A B C D G H J K N S D 5 PL 0.2 (0.008) M B M N J C INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 H K SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 15 NCS2500 PACKAGE DIMENSIONS SOT23−5 (TSOP−5) SN SUFFIX CASE 483−02 ISSUE C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. A AND B DIMENSIONS DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 2.90 3.10 0.1142 0.1220 B 1.30 1.70 0.0512 0.0669 C 0.90 1.10 0.0354 0.0433 D 0.25 0.50 0.0098 0.0197 G 0.85 1.05 0.0335 0.0413 H 0.013 0.100 0.0005 0.0040 J 0.10 0.26 0.0040 0.0102 K 0.20 0.60 0.0079 0.0236 L 1.25 1.55 0.0493 0.0610 M 0_ 10 _ 0_ 10 _ S 2.50 3.00 0.0985 0.1181 D 5 1 2 4 3 S B L G A J C 0.05 (0.002) H K M ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 16 NCS2500/D