NCS6433

NCS6433 Wideband Quad 2:1 Video Switch The NCS6433 is a wide bandwidth, bidirectional, Quad 2:1, NMOS−based video switch suitable for dealing with video signals such as RGB, composite, S−Video, and component video (YPbPr). The NCS6433 is controlled by a single switch−enabled (OE) input. When OE is low the switch is enabled and the A port is connected to the B port. When OE is high the switch is disabled and the high−impedance state exists between the A and B ports. The line select (SEL) input controls the data path of the multiplexer/demultiplexer. The NCS6433 has a wide bandwidth, low crosstalk, low on resistance, and fast switching times making it suitable for high−frequency video applications in high definition LCD TV’s. Features http://onsemi.com MARKING DIAGRAMS 16 1 TSSOP−16 DTB SUFFIX CASE 948F 16 1 SOIC−16 D SUFFIX CASE 751B A WL, L Y WW, W G or G 16 NCS6433G AWLYWW 1 = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package 16 NCS 6433 ALYWG G 1 • • • • • • • • • • • • • • • • • Very Wide Frequency Bandwidth: 570 MHz Low Switch Serial Resistance RDS(on), 4 W Typical Power Supply Voltage, 5 V Less Than 0.25 ns Bidirectional Maximum Propagation Delay Through Switch Low Quiescent Current: 3 mA Maximum Very Low Crosstalk, −80 dB Typical at 10 MHz Control Inputs are TTL/CMOS Compatible Ideal for High Definition Video Applications ESD HBM Protection 8 kV Fast Switching − Better Than 10 ns Capable of Driving a High Current at the Output (>100 mA) Available in SOIC−16 or TSSOP−16 Package This is a Pb−Free Device Flat Panel Displays including LCDTV CRT Displays DVD Reader/Writer Set−Top Boxes (Note: Microdot may be in either location) PIN CONNECTIONS SEL 1B1 1B2 1A 2B1 2B2 2A GND 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC OE 4B1 4B2 4A 3B1 3B2 3A Typical Applications TRUTH TABLE SEL X L H OE H L L Function Open A = B1 A = B2 PIN NAMES Pin OE SEL A B1, B2 Description Bus Switch Enables Select Inputs Bus A Bus B ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. © Semiconductor Components Industries, LLC, 2008 August, 2008 − Rev. 1 1 Publication Order Number: NCS6433/D NCS6433 1A 1B1 1B2 2A 2B1 2B2 3A 3B1 3B2 4A 4B1 4B2 FLOW CONTROL OE SEL Figure 1. NCS6433 Block Diagram ORDERING INFORMATION Device Order Number NCS6433DR2G NCS6433DTBR2G Package SOIC−16 (Pb−Free) TSSOP−16 (Pb−Free) Shipping† 2500 / Tape & Reel 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 2 NCS6433 ATTRIBUTES Characteristics ESD Protection Human Body Model, R = 1000 W, C = 100 pF (Note 1) Machine Model Flammability Rating I/O Pins 2−7, 9−14 All Pins All Pins Value 8 kV 2 kV 100 V UL 94 V−0 @ 0.125 in. Oxygen Index: 28 to 34 Meets or exceeds JEDEC Spec EIA/JESD78 IC Latch−up Test 1. Meets or exceeds JEDEC spec JESD22−A114−B. 2. For additional information, see Application Note AND8003/D MAXIMUM RATINGS Parameter DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Sink Current DC Supply Current per Supply Pin DC Ground Current per Ground Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature Under Bias (Note 3) Thermal Resistance SOIC−16 TSSOP−16 Symbol VCC VI VO IIK IOK IO ICC IGND TSTG TL TJ qJA Value −0.5 to +5.5 −0.5 to +5.5 −0.5 to +5.5 *50 *50 128 $100 $100 −65 to +150 260 +150 125 170 Unit V V V mA mA mA mA mA °C °C °C °C/W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 3. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = +25°C. RECOMMENDED OPERATING CONDITIONS Symbol VCC VI VO TA Dt/DV Supply Voltage Input Voltage Output Voltage Operating Free−Air Temperature Input Transition Rise or Fall Rate Switch I/O Switch Control Input VCC = 5.0 V ± 0.5 V Parameter Operating, Data Retention Only (Note 4) (HIGH or LOW State) Min 4.75 0 0 −40 0 Max 5.25 5.25 5.25 +85 DC 5 Unit V V V °C ns/V 4. Unused control inputs may not be left open. All control inputs must be tied to a high or low logic input voltage level. http://onsemi.com 3 NCS6433 DC ELECTRICAL CHARACTERISTICS (TA = −40°C to +85°C for Min and Max values, TA = 25°C for Typ values) Symbol VIK VIH VIL ILI IOZ RON ICC DICC Parameter Clamp Diode Voltage High−Level Input Voltage Low−Level Input Voltage Input Leakage Current Off−State Leakage Current Switch On Resistance (Note 5) 0 ≤ VIN ≤ 5.5 V 0 ≤ A, B ≤ VCC VIN = 1 V, ION = 13 mA, RL = 75 W VIN = 2 V, ION = 26 mA, RL = 75 W Quiescent Supply Current Increase In ICC per Input VIN = VCC or GND, IOUT = 0 One input at 3.4 V, Other inputs at VCC or GND Conditions IIN = −18 mA VCC (V) 4.5 4.0 to 5.5 4.0 to 5.5 5.5 5.5 4.5 4.5 5.5 5.5 4.0 7.0 Min −1.2 2.0 0.8 ±1.0 ±1.0 7.0 10 3.0 2.5 mA mA Typ* −0.8 Max Unit V V V mA mA W *Typical values are at VCC = 5.0 V and TA = 25°C. 5. Measured by the voltage drop between A and B pins at the indicated current through the switch. On resistance is determined by the lower of the voltages on the two (A or B) pins. AC ELECTRICAL CHARACTERISTICS (TA = −40°C to +85°C, CL = 20 pF, RU = RD = 75 W unless otherwise specified) (Note 6) VCC = 4.5−5.5 V Symbol tON tOFF BW Xtalk OffISO Turn On Time Turn Off Time −3 dB Bandwidth Crosstalk Adjacent Non−Adjacent Off Isolation Parameter Conditions RL = 75 W, CL = 20 pF, see Figure 7 RL = 75 W, CL = 20 pF, see Figure 7 RL = 150 W, TA = 25°C 10 MHz, CL = 0 pF, RL = 150 W 10 MHz, CL = 0 pF, RL = 150 W −47 −80 −48 Min Typ 2.8 1.4 Max 5.0 5.0 570 Unit ns ns MHz dB dB 6. TA = )25°C, parameters characterized but not tested. CAPACITANCES (Note 7) Symbol CIN CI/OA CI/OB Parameter Control Pin Input Capacitance A Port Input/Output Capacitance B Port Input/Output Capacitance Conditions VCC = 5.0 V VCC = OE = 5.0 V VCC = OE = 5.0 V Min Typ 2.0 5.0 5.0 Max Unit pF pF pF 7. TA = )25°C, f = 1 MHz, Capacitance is characterized but not tested. http://onsemi.com 4 NCS6433 TYPICAL CHARACTERISTICS 3 0 −3 GAIN (dB) −6 −9 −12 −15 CROSSTALK (dB) 0 −10 −20 −30 −40 −50 −60 −70 −80 −90 −100 0.1 1 10 100 1000 10,000 0.1 1 10 100 1000 10,000 FREQUENCY (MHz) FREQUENCY (MHz) Figure 2. Gain vs. Frequency Figure 3. Crosstalk vs. Frequency (Non−Adjacent Channels) 0 −10 OFF ISOLATION (dB) −20 −30 −40 −50 −60 −70 −80 −90 −100 0 −10 −20 CROSSTALK (dB) −30 −40 −50 −60 −70 −80 −90 −100 0.1 1 10 100 1000 10,000 0.1 1 10 100 1000 10,000 FREQUENCY (MHz) FREQUENCY (MHz) Figure 4. Crosstalk vs. Frequency (Adjacent Channels) Figure 5. Off Isolation vs. Frequency High = 3 V Low = 0 V 3V 0V SEL B1 B2 NCS6433 A RD 75 W Vout 20 pF CL VCC OE GND VCC SEL = LOW ≥ A = B1 SEL = HIGH ≥ A = B2 Figure 6. AC Test Circuit for Turn−on and Turn−off Times http://onsemi.com 5 NCS6433 Figure 7. Turn−on and Turn−off Times VNA S1 S2 VB 75W Vin (1VPP) B A SEL OE SEL = LOW w A = B1 SEL = HIGH w A = B2 1mF VCC DUT A B 20pF CL Figure 8. Gain, Crosstalk, Off−Isolation http://onsemi.com 6 NCS6433 Vcc = +5 V HD_SEL Y1 Pb1 Pr1 Y2 Pb2 Pr2 SEL OE 1B1 1B2 2B1 2B2 3B1 3B2 4B1 4B2 NCS6433 Flow Control 1A Y 0.1 mF 2A Pb TV/PC_SEL Vcc = +5 V 3A Pr 4A SEL OE Y 1B1 VGA_R 1B2 Pb 2B1 VGA_G 2B2 NCS6433 Flow Control 1A 0.1 mF 2A G / Pb VGA_R VGA_G VGA_B VGA_Hs VGA_Vs Pr 3B1 VGA_B 3B2 4B1 4B2 3A B / Pr 4A VGA_Hs VGA_Vs Figure 9. Example of LCDTV Application Using the Video Switch NCS6433 http://onsemi.com 7 VIDEO PROCESSING R/Y NCS6433 PACKAGE DIMENSIONS TSSOP−16 CASE 948F−01 ISSUE B 16X K REF 0.10 (0.004) 0.15 (0.006) T U S M TU S V S K 2X L/2 16 9 J1 B −U− SECTION N−N J N L PIN 1 IDENT. 1 8 0.15 (0.006) T U S A −V− N F DETAIL E C 0.10 (0.004) −T− SEATING PLANE D G H DETAIL E SOLDERING FOOTPRINT* 7.06 1 0.36 16X 16X 1.26 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 ÉÉÉ ÇÇÇ ÉÉÉ ÇÇÇ ÇÇÇ 0.25 (0.010) M K1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ −W− 0.65 PITCH DIMENSIONS: MILLIMETERS NCS6433 PACKAGE DIMENSIONS SOIC−16 D SUFFIX CASE 751B−05 ISSUE K −A− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 16 9 −B− 1 8 P 8 PL 0.25 (0.010) M B S G F K C −T− SEATING PLANE R X 45 _ M D 16 PL M J 0.25 (0.010) TB S A S SOLDERING FOOTPRINT* 6.40 16X 8X 1.12 16 1 16X 0.58 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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