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NCV2002SN1T1G

NCV2002SN1T1G

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    SOT23-6

  • 描述:

    IC OPAMP GP 1 CIRCUIT 6TSOP

  • 数据手册
  • 价格&库存
NCV2002SN1T1G 数据手册
NCS2002, NCV2002 Sub-One Volt Rail-to-Rail Operational Amplifier with Enable Feature The NCS2002 is an industry first sub−one volt operational amplifier that features a rail−to−rail common mode input voltage range, along with rail−to−rail output drive capability. This amplifier is guaranteed to be fully operational down to 0.9 V, providing an ideal solution for powering applications from a single cell Nickel Cadmium (NiCd) or Nickel Metal Hydride (NiMH) battery. Additional features include no output phase reversal with overdriven inputs, trimmed input offset voltage of 0.5 mV, extremely low input bias current of 40 pA, and a unity gain bandwidth of 1.1 MHz at 5.0 V. The NCS2002 also has an active high enable pin that allows external shutdown of the device. In the standby mode, the supply current is typically 1.9 mA at 1.0 V. Because of its small size and enable feature, this amplifier represents the ideal solution for small portable electronic applications. The NCS2002 is available in the space saving SOT23−6 (TSOP−6) package with two industry standard pinouts. http://onsemi.com 1 TSSOP−6 SN SUFFIX CASE 318G MARKING DIAGRAM Features • • • • • • • • • • • 0.9 V Guaranteed Operation Standby Mode: ID = 1.9 mA at 1.0 V, Typical Rail−to−Rail Common Mode Input Voltage Range Rail−to−Rail Output Drive Capability No Output Phase Reversal for Over−Driven Input Signals 0.5 mV Trimmed Input Offset 10 pA Input Bias Current 1.1 MHz Unity Gain Bandwidth at $2.5 V, 1.0 MHz at $0.5 V Tiny SOT23−6 (TSOP−6) Package NCV Parts − AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant Typical Applications • • • • • • • • 0.8 V to 7.0 V + - A Y W G = Device Code Marking Defined on Page 15 in Ordering Information = Assembly Location = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) VOUT 1 6 VEE VCC Non−Inverting Input 2 5 Enable 4 Inverting Input 3 + − VOUT 1 6 VCC VEE Non−Inverting Input 2 5 Enable 4 Inverting Input 3 + − Style 2 Pinout (SN2T1) ORDERING AND MARKING INFORMATION This device contains 81 active transistors. See detailed ordering, marking, and shipping information in the package dimensions section on page 15 of this data sheet. Figure 1. Typical Application June, 2013 − Rev. 7 AA x= Style 1 Pinout (SN1T1) Rail to Rail Output © Semiconductor Components Industries, LLC, 2013 1 PIN CONNECTIONS Single Cell NiCd / NiMH Battery Powered Applications Cellular Telephones Pagers Personal Digital Assistants Electronic Games Digital Cameras Camcorders Hand Held Instruments Rail to Rail Input AAxAYW G G 1 Publication Order Number: NCS2002/D NCS2002, NCV2002 MAXIMUM RATINGS Rating Symbol Value Unit VS 7.0 V Input Differential Voltage Range (Note 1) VIDR VEE – 300 mV to 7.0 V V Input Common Mode Voltage Range (Note 1) VICR VEE – 300 mV to 7.0 V V Output Short Circuit Duration (Note 2) tSc Indefinite sec Junction Temperature TJ 150 °C RqJA PD 235 340 °C/W mW Supply Voltage (VCC to VEE) Power Dissipation and Thermal Characteristics SOT23−6 Package Thermal Resistance, Junction−to−Air Power Dissipation @ TA = 70°C Operating Ambient Temperature Range NCS2002 NCV2002 (Note 3) TA Storage Temperature Range Tstg −65 to 150 °C VESD 1500 V ESD Protection at any Pin Human Body Model (Note 4) °C −40 to 105 −40 to 125 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Either or both inputs should not exceed the range of VEE – 300 mV to VEE + 7.0 V. 2. Maximum package power dissipation limits must be observed to ensure that the maximum junction temperature is not exceeded. TJTA + (PD RqJA) 3. NCV prefix is for automotive and other applications requiring site and change control. 4. ESD data available upon request. DC ELECTRICAL CHARACTERISTICS (VCC = 2.5 V, VEE = −2.5 V, VCM = VO = 0 V, RL to GND, TA = 25°C, unless otherwise noted) Rating Symbol Input Offset Voltage VCC = 0.45 V, VEE = −0.45 V TA = 25°C TA = 0°C to 70°C TA = −40 to +125°C VCC = 1.5 V, VEE = −1.5 V TA = 25°C TA = 0°C to 70°C TA = −40 to +125°C VCC = 2.5 V, VEE = −2.5 V TA = 25°C TA = 0°C to 70°C TA = −40 to +125°C Min Typ Max VIO Unit mV −6.0 −8.5 −9.5 0.5 − − 6.0 8.5 9.5 −6.0 −7.0 −7.5 0.5 − − 6.0 7.0 7.5 −6.0 −7.5 −7.5 0.5 − − 6.0 7.5 7.5 DVIO / DT − 8.0 − mV/°C IIB − 10 − pA Input Common Mode Voltage Range VICR − VEE to VCC − V Large Signal Voltage Gain VCC = 0.45 V, VEE = −0.45 V RL = 10 k VCC = 1.5 V, VEE = −1.5 V RL = 10 k VCC = 2.5 V, VEE = −2.5 V RL = 10 k AVOL Output Voltage Swing, High State Output (VID = + 0.5 V) TA = Tlow to Thigh VCC = 0.45 V, VEE = −0.45 V RL = 10 k RL = 2.0 k VCC = 1.5 V, VEE = −1.5 V RL = 10 k RL = 2.0 k VCC = 2.5 V, VEE = −2.5 V RL = 10 k RL = 2.0 k VOH Input Offset Voltage Temperature Coefficient (RS = 50) TA = −40 to +125°C Input Bias Current (VCC = 1.0 V to 5.0 V) http://onsemi.com 2 kV/V − 40 − − 40 − 10 40 − V 0.40 0.35 0.442 0.409 − − 1.45 1.40 1.494 1.473 − − 2.45 2.40 2.493 2.469 − − NCS2002, NCV2002 DC ELECTRICAL CHARACTERISTICS (VCC = 2.5 V, VEE = −2.5 V, VCM = VO = 0 V, RL to GND, TA = 25°C, unless otherwise noted) Rating Symbol Output Voltage Swing, Low State Output (VID = − 0.5 V) TA = −40 to +125°C VCC = 0.45 V, VEE = −0.45 V RL = 10 k RL = 2.0 k VCC = 1.5 V, VEE = −1.5 V RL = 10 k RL = 2.0 k VCC = 2.5 V, VEE = −2.5 V RL = 10 k RL = 2.0 k Min Typ Max VOL Unit V − − −0.446 −0.432 −0.40 −0.35 − − −1.497 −1.484 −1.45 −1.40 − − −2.496 −2.481 −2.45 −2.40 Common Mode Rejection Ratio (Vin = 0 to 5.0 V) CMRR 60 82 − dB Power Supply Rejection Ratio (VCC = 0.5 V to 2.5 V, VEE = −2.5 V) PSRR 60 85 − dB Output Short Circuit Current VCC = 0.45 V, VEE = −0.45 V, VID = $0.4 V Source Current High Output State Sink Current Low Output State VCC = 1.5 V, VEE = −1.5 V, VID = $0.5 V Source Current High Output State Sink Current Low Output State VCC = 2.5 V, VEE = −2.5 V, VID = $0.5 V Source Current High Output State Sink Current Low Output State ISC Power Supply Current (Per Amplifier, VO = 0 V) TA = −40 to +125°C VCC = 0.5 V to VEE = −0.5 V Venable = VCC Venable = VEE VCC = 1.5 V to VEE = −1.5 V Venable = VCC Venable = VEE VCC = 2.5 V to VEE = −2.5 V Venable = VCC Venable = VEE ID Enable Input Threshold Voltage (VCC = 2.5 V, VEE = −2.5 V) Operating Disabled Vth(EN) Enable Input Current (VCC = 5.0 V, VEE = 0) Enable = 5.0 V Enable = GND IEnable http://onsemi.com 3 mA 0.5 − 1.0 −3.0 − −2.0 25 − 32 −58 − −45 65 − 86 −128 − −100 mA − − 480 1.5 600 3.0 − − 720 2.2 900 5.0 − − 820 2.5 1000 5.0 − 1.7 V + VEE 2.7 V + VEE 1.9 2.8 V + VEE − − − 1.1 1.1 2.0 2.0 V mA NCS2002, NCV2002 AC ELECTRICAL CHARACTERISTICS (VCC = 2.5 V, VEE = −2.5 V, VCM = VO = 0 V, RL to GND, TA = 25°C, unless otherwise noted) Rating Symbol Min Typ Max Unit Differential Input Resistance (VCM = 0 V) Rin − >1.0 − tera W Differential Input Capacitance (VCM = 0 V) Cin − 3.0 − pf en − 100 − nV/ǠHz − − 0.6 0.8 0.8 0.9 − − − Equivalent Input Noise Voltage (f = 1.0 kHz) Gain Bandwidth Product (f = 100 kHz) VCC = 0.45 V, VEE = −0.45 V VCC = 1.5 V, VEE = −1.5 V VCC = 2.5 V, VEE = −2.5 V GBW MHz Gain Margin (RL = 10 k, CL = 5.0 pf) Am − 6.5 − dB Phase Margin (RL = 10 k, CL = 5.0 pf) fm − 60 − Deg Power Bandwidth (VO = 4.0 VPP, RL = 2.0 k, THD = 1.0 %, AV = 1.0) BWP − 80 − kHz Total Harmonic Distortion (VO = 4.0 VPP, RL = 2.0 k, AV = 1.0) f = 1.0 kHz f = 10 kHz THD − − 0.008 0.08 − − 0.85 0.85 1.2 1.3 − − % Slew Rate (VS = $2.5 V, VO = −2.0 V to 2.0 V, RL = 2.0 k, AV = 1.0) Positive Slope Negative Slope SR Time Delay for Device to Turn On (RL = 10 k) ton − 5.5 7.5 ms Time Delay for Device to Turn Off (RL = 10 k) toff − 2.5 3.0 ms http://onsemi.com 4 V/ms NCS2002, NCV2002 0 VCC VS = ±2.5 V RL to GND TA = 25°C High State Output Sourcing Current −600 600 400 Low State Output Sinking Current 200 0 VEE 100 1.0 k 10 k 100 k −0.1 −0.2 VCC VS = $2.5 V RL to GND TA = 25°C −0.3 −0.4 High State Output Sourcing Current −0.5 0.4 Low State Output Sinking Current 0.3 0.2 0.1 0 1.0 M VEE 0 4.0 8.0 Figure 2. Output Saturation Voltage versus Load Resistance 100 10 VS = ±2.5 V RL = ∞ CL = 0 AV = 1.0 AV, Gain (dB) 1000 80 IIB, Input Current (pA) 100 25 50 75 100 VS = $2.5 V RL = 100 k TA = 25°C Amp = 0.8 mV Gain Phase 60 0 20 60 100 20 140 0 180 1.0 125 10 100 1.0 k 10 k 100 k 1.0 M TA, Ambient Temperature (°C) f, Frequency (Hz) Figure 4. Input Bias Current versus Temperature Figure 5. Gain and Phase versus Frequency VS = $2.5 V RL = 10 k CL = 10 pF AV = 1.0 TA = 25°C 500 mV/Div VS = $2.5 V RL = 10 k CL = 10 pF AV = 1.0 TA = 25°C 50 mV/Div 20 40 0 0 16 Figure 3. Output Saturation Voltage versus Load Current 10,000 1.0 12 IL, Load Current (mA) RL, Load Resistance (W) t, Time (500 ns/Div) t, Time (1.0 ms/Div) Figure 6. Transient Response Figure 7. Slew Rate http://onsemi.com 5 10 M F, Excess Phase (°) −200 −400 Vsat, Output Saturation Voltage (V) Vsat, Output Saturation Voltage (mV) 0 Vout, Output Voltage (Vpp) 10 8.0 AV = 1.0 RL = 10 k TA = 25°C VS = ±3.5 V 6.0 VS = ±2.5 V 4.0 2.0 VS = ±0.45 V 0 1.0 k 10 k 100 k f, Frequency (Hz) 1.0 M CMRR, Common Mode Rejection Ratio (dB) NCS2002, NCV2002 90 80 VS = ±2.5 V RL = ∞ AV = 1.0 TA = 25°C 70 60 50 40 30 20 10 0 10 |ISC|, Output Short Circuit Current (mA) 120 VS = ±2.5 V RL = ∞ AV = 1.0 TA = 25°C 100 PSR + 80 PSR − 60 40 20 0 10 200 100 1.0 k 10 k 100 k 1.0 M 10 M 10 M 280 Output Pulsed Test at 3% Duty Cycle 240 −40°C 25°C 200 160 85°C 120 80 40 0 0 ±0.5 ±1.0 ±1.5 ±2.0 ±2.5 ±3.0 f, Frequency (Hz) VS, Supply Voltage (V) Figure 11. Output Short Circuit Sinking Current versus Supply Voltage −40°C 25°C 120 85°C 80 40 ±0.5 ±1.0 ±3.5 1.0 Output Pulsed Test at 3% Duty Cycle 0 1.0 M Figure 10. Power Supply Rejection Ratio versus Frequency 160 0 1.0 k 10 k 100 k f, Frequency (Hz) Figure 9. Common Mode Rejection Ratio versus Frequency ±1.5 ±2.0 ±2.5 ±3.0 |ID|, Supply Current (mA) |ISC|, Output Short Circuit Current (mA) PSRR, Power Supply Rejection Ratio (dB) Figure 8. Output Voltage versus Frequency 100 0.8 −40°C 0.6 0.4 0.2 0 ±3.5 85°C 25°C RL = ∞ AV = 1.0 0 ±0.5 ±1.0 ±1.5 ±2.0 ±2.5 ±3.0 VS, Supply Voltage (V) VS, Supply Voltage (V) Figure 12. Output Short Circuit Sourcing Current versus Supply Voltage Figure 13. Supply Current versus Supply Voltage with No Load http://onsemi.com 6 ±3.5 NCS2002, NCV2002 10 THD, Total Harmonic Distortion (%) THD, Total Harmonic Distortion (%) 10 AV = 1000 1.0 AV = 100 VS = ±0.5 V Vout = 0.4 Vpp RL = 2.0 k TA = 25°C 0.1 AV = 10 AV = 1.0 0.01 10 100 1.0 k 10 k AV = 1000 1.0 AV = 100 0.1 f, Frequency (Hz) 1.0 k f, Frequency (Hz) Figure 14. Total Harmonic Distortion versus Frequency with 1.0 V Supply Figure 15. Total Harmonic Distortion versus Frequency with 1.0 V Supply 1.0 AV = 100 AV = 10 VS = ±2.5 V Vout = 4.0 Vpp RL = 2.0 k TA = 25°C 0.01 AV = 1.0 0.001 10 100 1.0 k 10 k THD, Total Harmonic Distortion (%) THD, Total Harmonic Distortion (%) AV = 1000 AV = 100 0.1 AV = 10 VS = ±2.5 V Vout = 4.0 Vpp RL = 10 k TA = 25°C 0.01 AV = 1.0 100 1.0 k 10 k 100 k f, Frequency (Hz) Figure 16. Total Harmonic Distortion versus Frequency with 5.0 V Supply Figure 17. Total Harmonic Distortion versus Frequency with 5.0 V Supply 3.0 +Slew Rate, VS = ±2.5 V GBW, Gain Bandwidth Product (MHz) SR, Slew Rate (V/ms) 100 k 1.0 0.001 10 100 k 1.3 1.2 −Slew Rate, VS = ±2.5 V 1.1 +Slew Rate, VS = ±0.5 V −Slew Rate, VS = ±0.5 V 0.8 RL = 10 k CL = 10 pF AV = 1.0 0.7 0.6 0.5 −50 10 k f, Frequency (Hz) 1.4 0.9 100 AV = 1000 1.5 1.0 10 10 10 0.1 AV = 10 AV = 1.0 0.01 100 k VS = ±0.5 V Vout = 0.4 Vpp RL = 10 k TA = 25°C −25 0 25 50 75 100 125 VS = ±2.5 V RL = 10 k CL = 10 pF 2.0 1.0 0 −50 −25 0 25 50 75 100 TA, Ambient Temperature (°C) TA, Ambient Temperature (°C) Figure 18. Slew Rate versus Temperature Figure 19. Gain Bandwidth Product versus Temperature http://onsemi.com 7 125 NCS2002, NCV2002 60 100 100 60 Phase Margin VS = ±0.5 V RL = 100 k TA = 25°C Amp = 0.8 mV −20 −40 10 k 100 k 140 60 180 40 220 20 1.0 M VS = ±2.5 V RL = 10 k CL = 10 pF Gain Margin 0 25 50 75 0 125 100 TA, Ambient Temperature (°C) Figure 20. Voltage Gain and Phase versus Frequency Figure 21. Gain and Phase Margin versus Temperature 100 100 100 Phase Margin 80 80 VS = ±2.5 V RL = 10 k CL = 10 pF TA = 25°C 60 40 60 40 Gain Margin 20 1.0 20 Fm, Phase Margin (°) Am, Gain Margin (dB) Phase Margin Am, Gain Margin (dB) −25 20 f, Frequency (Hz) 100 0 60 40 0 −50 260 100 M 10 M 80 Fm, Phase Margin (°) VS = ±2.5 V 0 80 80 VS = ±2.5 V RL = 10 k AV = 100 TA = 25°C 60 40 60 40 Gain Margin 20 20 0 1.0 0 100 k 100 1.0 k 10 k 10 Rt, Differential Source Resistance (W) 80 Figure 22. Gain and Phase Margin versus Differential Source Resistance Fm, Phase Margin (°) AV, Gain (dB) VS = ±0.5 V 20 100 Fm, Excess Phase (°) Am, Gain Margin (dB) VS = ±2.5 V 40 0 1000 10 100 CL, CapacitIve Load (pF) Figure 23. Gain and Phase Margin versus Output Load Capacitance 100 8.0 100 6.0 4.0 2.0 RL = 10 k AV = 100 TA = 25°C 80 60 60 40 40 Gain Margin 20 20 0 0 0 ±0.5 ±1.0 ±1.5 ±2.0 ±2.5 ±3.0 0 0 ±3.5 ±0.5 ±1.0 ±1.5 ±2.0 ±2.5 ±3.0 VS, Supply Voltage (V) VS, Supply Voltage (V) Figure 24. Output Voltage Swing versus Supply Voltage Figure 25. Gain and Phase Margin versus Supply Voltage http://onsemi.com 8 ±3.5 Fm, Phase Margin (°) Am, Gain Margin (dB) Vout, Output Voltage (Vpp) Phase Margin 80 NCS2002, NCV2002 20 VIO, Input Offset Voltage (mV) AVOL, Open Loop Voltage Gain (dB) 100 80 60 40 RL = 10 k TA = 25°C 20 0 0 ±0.5 ±1.0 ±1.5 ±2.0 ±2.5 ±3.0 10 5 0 −5 −10 −15 −20 −3.0 ±3.5 −2.0 0 1.0 2.0 3.0 VCM, Common Voltage Range (V) Figure 26. Open Loop Voltage Gain versus Supply Voltage Figure 27. Input Offset Voltage versus Common Mode Input Voltage Range, VS = +2.5 V 3.0 15 10 5 VCM, Input Common Mode Voltage Range (V) VS = ±0.9 V RL = ∞ CL = 0 AV = 1.0 TA = 25°C 0 −5 −10 −15 −20 −1.0 −0.8 −0.6 −0.4 −0.2 2.0 1.0 D VIO = 5.0 mV RL = ∞ CL = 0 AV = 1.0 TA = 25°C 0 −1.0 −2.0 −3.0 0 0.2 0.4 0.6 0.8 1.0 0 ±0.5 VCM, Common Mode Input Voltage (V) ±1.0 ±1.5 ±2.0 ±2.5 ±3.0 VS, Supply Voltage (V) Figure 28. Input Offset Voltage versus Common Mode Input Voltage Range, VS = +0.9 V Figure 29. Common−Mode Input Voltage Range versus Power Supply Voltage 4.0 VEN, Enable Input Voltage (V) 3.0 ICC, Supply Current (mA) −1.0 VS, Supply Voltage (V) 20 VIO, Input Offset Voltage (mV) VS = ±2.5 V RL = ∞ CL = 0 AV = 1.0 TA = 25°C 15 2.5 2.0 1.5 1.0 RL = ∞ AV = 1.0 TA = 25°C 0.5 0 3.5 VEN(on) 3.0 2.5 2.0 VEN(off) 1.5 1.0 AV = ∞ TA = 25°C 0.5 0 0 ±0.5 ±1.0 ±1.5 ±2.0 ±2.5 ±3.0 0 ±3.5 VS, Supply Voltage (V) ±0.5 ±1.0 ±1.5 ±2.0 ±2.5 ±3.0 VS, Supply Voltage (V) Figure 30. Supply Current versus Supply Voltage (Disabled) Figure 31. Enable Input Voltage versus Supply Voltage http://onsemi.com 9 ±3.5 NCS2002, NCV2002 16 RL = 10 k TA = 25°C Propagation Delay (mS) 14 12 10 8.0 ton 6.0 4.0 toff 2.0 0 0 ±0.5 ±1.0 ±1.5 ±2.0 ±2.5 ±3.0 ±3.5 VS, SUPPLY VOLTAGE (V) Figure 32. Propagation Delay versus Supply Voltage APPLICATION INFORMATION AND OPERATING DESCRIPTION GENERAL INFORMATION The NCS2002 is an industry first rail−to−rail input, rail−to−rail output amplifier that features guaranteed sub one volt operation. This unique feature set is achieved with the use of a modified analog CMOS process that allows the implementation of depletion MOSFET devices. The amplifier has a 1.0 MHz gain bandwidth product, 1.2 V/ms slew rate and is operational over a power supply range less than 0.9 V to as high as 7.0 V. The ultra low input bias current of the NCS2002 allows the use of extremely high value source and feedback resistor without reducing the amplifier’s gain accuracy. These high value resistors, in conjunction with the device input and printed circuit board parasitic capacitances Cin, will add an additional pole to the single pole amplifier in Figure 33. If low enough in frequency, this additional pole can reduce the phase margin and significantly increase the output settling time. The effects of Cin, can be canceled by placing a zero into the feedback loop. This is accomplished with the addition of capacitor Cfb. An approximate value for Cfb can be calculated by: Inputs The input topology chosen for this device series is unconventional when compared to most low voltage operational amplifiers. It consists of an N−channel depletion mode differential transistor pair that drives a folded cascade stage and current mirror. This configuration extends the input common mode voltage range to encompass the VEE and VCC power supply rails, even when powered from a combined total of less than 0.9 volts. Figures 27, 28 and 29 show the input common mode voltage range versus power supply voltage. The differential input stage is laser trimmed in order to minimize offset voltage. The N−channel depletion mode MOSFET input stage exhibits an extremely low input bias current of less than 10 pA. The input bias current versus temperature is shown in Figure 4. Either one or both inputs can be biased as low as VEE minus 300 mV to as high as 7.0 V without causing damage to the device. If the input common mode voltage range is exceeded, the output will not display a phase reversal. If the maximum input positive or negative voltage ratings are to be exceeded, a series resistor must be used to limit the input current to less than 2.0 mA. Cfb + Rin Cin Rfb Cfb Rfb Input Rin Cin + Output Cin = Input and printed circuit board capacitance Figure 33. Input Capacitance Pole Cancellation http://onsemi.com 10 NCS2002, NCV2002 Output The output stage consists of complementary P and N channel devices connected to provide rail−to−rail output drive. With a 2.0 k load, the output can swing within 50 mV of either rail. It is also capable of supplying over 75 mA when powered from 5.0 V and 1.0 mA when powered from 0.9 V. When connected as a unity gain follower, the NCS2002 can directly drive capacitive loads in excess of 820 pF at room temperature without oscillating but with significantly reduced phase margin. The unity gain follower configuration exhibits the highest bandwidth and is most prone to oscillations when driving a high value capacitive load. The capacitive load in combination with the amplifier’s output impedance, creates a phase lag that can result in an under−damped pulse response or a continuous oscillation. Figure 35 shows the effect of driving a large capacitive load in a voltage follower type of setup. When driving capacitive loads exceeding 820 pF, it is recommended to place a low value isolation resistor between the output of the op amp and the load, as shown in Figure 34. The series resistor isolates the capacitive load from the output and enhances the phase margin. Refer to Figure 36. Larger values of R will result in a cleaner output waveform but excessively large values will degrade the large signal rise and fall time and reduce the output amplitude. Depending upon the capacitor characteristics, the isolation resistor value will typically be between 50 to 500 W. The output drive capability for resistive and capacitive loads is shown in Figures 2, 3, and 23. Input + - R Output CL Isolation resistor R = 50 to 500 Figure 34. Capacitance Load Isolation Note that the lowest phase margin is observed at cold temperature and low supply voltage. Enable Pin The enable pin allows the user to externally control the device. if the enable pin is pulled below the input disable threshold voltage (VEN < 45% VCC), the amplifier is disabled. Once the enable pin is taken above the threshold voltage (VEN = 60% VCC), the amplifier will turn on. In the event the enable pin is not connected, the amplifier will remain on by default http://onsemi.com 11 NCS2002, NCV2002 Vin VS = ±0.45 V Vin = 0.8 VPP R=0 CL = 820 pF AV = 1.0 TA = 25°C Vout Figure 35. Small Signal Transient Response with Large Capacitive Load Vin VS = ±0.45 V Vin = 0.8 VPP R = 51 CL = 820 pF AV = 1.0 TA = 25°C Vout Figure 36. Small Signal Transient Response with Large Capacitive Load and Isolation Resistor. http://onsemi.com 12 NCS2002, NCV2002 RT 470 k VCC Output Voltage 0 0.9 V CT 1.0 nF Timing Capacitor Voltage - fO = 1.5 kHz + 0.9 V The non−inverting input threshold levels are set so that the capacitor voltage oscillates between 1/3 and 2/3 of VCC. This requires the resistors R1a, R1b and R2 to be of equal value. The following formula can be used to approximate the output frequency. R1a 470 k R2 470 k R1b 470 k 0.67 VCC 0.33 VCC 1 f + O 1.39 R TC T Figure 37. 0.9 V Square Wave Oscillator cww 10 k D1 1N4148 10 k D2 1N4148 VCC Output Voltage 0 1.0 M Timing Capacitor Voltage 0.67 VCC 0.33 VCC cw Clock−wise, Low Duty Cycle VCC CT 1.0 nF VCC Output Voltage - fO + 0 Timing Capacitor Voltage R1a 470 k 0.67 VCC 0.33 VCC Counter−Clock−wise, High Duty Cycle VCC R1b 470 k R2 470 k The timing capacitor CT will charge through diode D2 and discharge through diode D1, allowing a variable duty cycle. The pulse width of the signal can be programmed by adjusting the value of the trimpot. The capacitor voltage will oscillate between 1/3 and 2/3 of VCC, since all the resistors at the non−inverting input are of equal value. Figure 38. Variable Duty Cycle Pulse Generator http://onsemi.com 13 NCS2002, NCV2002 R1 1.0 M 2.5 V R3 1.0 k + ≈ 10,000 mF - Cin 10 mF −2.5 V R Ceff. + 1 Cin R3 R2 1.0 M Figure 39. Positive Capacitance Multiplier Af Cf 400 pF Rf 100 k fL R2 10 k 0.5 V + Vin 1 f + [ 200 Hz L 2pR C 1 1 VO C1 80 nF fH R1 10 k −0.5 V 1 f + [ 4.0 kHz H 2pRC f f R A + 1 ) f + 11 f R2 Figure 40. 1.0 V Voiceband Filter http://onsemi.com 14 NCS2002, NCV2002 Vsupply VCC Vin + I - V in + sink R sense Rsense Figure 41. High Compliance Current Sink Is VL Rsense R1 1.0 k RL 1.0 V R3 1.0 k R4 1.0 k + R5 - 2.4 k VO 75 Is VO 435 mA 34.7 mV 212 mA 36.9 mV R6 For best performance, use low tolerance resistors. R2 3.3 k Figure 42. High Side Current Sense ORDERING INFORMATION1 Device Package Shipping† TSOP−6 (Pb−Free) 3000 / Tape & Reel Marking NCS2002SN1T1G P NCS2002SN2T1G Q NCV2002SN1T1G P NCV2002SN2T1G Q †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV2002: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change control. AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 15 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSOP−6 CASE 318G−02 ISSUE V 1 SCALE 2:1 D H ÉÉ ÉÉ 6 E1 1 NOTE 5 5 2 L2 4 GAUGE PLANE E 3 L b SEATING PLANE C DETAIL Z e DIM A A1 b c D E E1 e L L2 M c A 0.05 M DATE 12 JUN 2012 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D AND E1 ARE DETERMINED AT DATUM H. 5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE. A1 DETAIL Z MIN 0.90 0.01 0.25 0.10 2.90 2.50 1.30 0.85 0.20 0° MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.38 0.50 0.18 0.26 3.00 3.10 2.75 3.00 1.50 1.70 0.95 1.05 0.40 0.60 0.25 BSC 10° − STYLE 1: PIN 1. DRAIN 2. DRAIN 3. GATE 4. SOURCE 5. DRAIN 6. DRAIN STYLE 2: PIN 1. EMITTER 2 2. BASE 1 3. COLLECTOR 1 4. EMITTER 1 5. BASE 2 6. COLLECTOR 2 STYLE 3: PIN 1. ENABLE 2. N/C 3. R BOOST 4. Vz 5. V in 6. V out STYLE 4: PIN 1. N/C 2. V in 3. NOT USED 4. GROUND 5. ENABLE 6. LOAD STYLE 5: PIN 1. EMITTER 2 2. BASE 2 3. COLLECTOR 1 4. EMITTER 1 5. BASE 1 6. COLLECTOR 2 STYLE 6: PIN 1. COLLECTOR 2. COLLECTOR 3. BASE 4. EMITTER 5. COLLECTOR 6. COLLECTOR STYLE 7: PIN 1. COLLECTOR 2. COLLECTOR 3. BASE 4. N/C 5. COLLECTOR 6. EMITTER STYLE 8: PIN 1. Vbus 2. D(in) 3. D(in)+ 4. D(out)+ 5. D(out) 6. GND STYLE 9: PIN 1. LOW VOLTAGE GATE 2. DRAIN 3. SOURCE 4. DRAIN 5. DRAIN 6. HIGH VOLTAGE GATE STYLE 10: PIN 1. D(OUT)+ 2. GND 3. D(OUT)− 4. D(IN)− 5. VBUS 6. D(IN)+ STYLE 11: PIN 1. SOURCE 1 2. DRAIN 2 3. DRAIN 2 4. SOURCE 2 5. GATE 1 6. DRAIN 1/GATE 2 STYLE 12: PIN 1. I/O 2. GROUND 3. I/O 4. I/O 5. VCC 6. I/O STYLE 13: PIN 1. GATE 1 2. SOURCE 2 3. GATE 2 4. DRAIN 2 5. SOURCE 1 6. DRAIN 1 STYLE 14: PIN 1. ANODE 2. SOURCE 3. GATE 4. CATHODE/DRAIN 5. CATHODE/DRAIN 6. CATHODE/DRAIN STYLE 15: PIN 1. ANODE 2. SOURCE 3. GATE 4. DRAIN 5. N/C 6. CATHODE STYLE 16: PIN 1. ANODE/CATHODE 2. BASE 3. EMITTER 4. COLLECTOR 5. ANODE 6. CATHODE STYLE 17: PIN 1. EMITTER 2. BASE 3. ANODE/CATHODE 4. ANODE 5. CATHODE 6. COLLECTOR GENERIC MARKING DIAGRAM* RECOMMENDED SOLDERING FOOTPRINT* 6X 0.60 XXXAYWG G 1 6X 3.20 XXX A Y W G 0.95 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98ASB14888C TSOP−6 1 IC 0.95 XXX MG G = Specific Device Code =Assembly Location = Year = Work Week = Pb−Free Package STANDARD XXX = Specific Device Code M = Date Code G = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. 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