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NCV33064D-5R2G

NCV33064D-5R2G

  • 厂商:

    ONSEMI(安森美)

  • 封装:

  • 描述:

    NCV33064D-5R2G - UNDERVOLTAGE SENSING CIRCUIT - ON Semiconductor

  • 数据手册
  • 价格&库存
NCV33064D-5R2G 数据手册
MC34064, MC33064, NCV33064 Undervoltage Sensing Circuit The MC34064 is an undervoltage sensing circuit specifically designed for use as a reset controller in microprocessor−based systems. It offers the designer an economical solution for low voltage detection with a single external resistor. The MC34064 features a trimmed−in−package bandgap reference, and a comparator with precise thresholds and built-in hysteresis to prevent erratic reset operation. The open collector reset output is capable of sinking in excess of 10 mA, and operation is guaranteed down to 1.0 V input with low standby current. The MC devices are packaged in 3−pin TO-92, micro size TSOP−5, 8−pin SOIC−8 and Micro8t surface mount packages. The NCV device is packaged in SOIC−8 and TO−92. Applications include direct monitoring of the 5.0 V MPU/logic power supply used in appliance, automotive, consumer and industrial equipment. Features http://onsemi.com TO−92 P SUFFIX CASE 29 Pin 1. Reset 2. Input 3. Ground 3 SOIC−8 D SUFFIX CASE 751 Micro8 DM SUFFIX CASE 846A TSOP−5 SN SUFFIX CASE 483 Pin 1. 2. 3. 4. 5. Reset Input Ground NC NC 1 2 8 1 8 1 5 1 • • • • • • • • • • • Trimmed−In−Package Temperature Compensated Reference Comparator Threshold of 4.6 V at 25°C Precise Comparator Thresholds Guaranteed Over Temperature Comparator Hysteresis Prevents Erratic Reset Reset Output Capable of Sinking in Excess of 10 mA Internal Clamp Diode for Discharging Delay Capacitor Guaranteed Reset Operation with 1.0 V Input Low Standby Current Economical TO−92, TSOP−5, SOIC−8 and Micro8 Surface Mount Packages NCV Prefix for Automotive and Other Applications Requiring Site and Control Changes Pb−Free Packages are Available Input 2 (2) Reset 1 (1) PIN CONNECTIONS Reset 1 Input 2 N.C. 3 Ground 4 (Top View) 8 N.C. 7 N.C. 6 N.C. 5 N.C. ORDERING INFORMATION 1.2 Vref See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. DEVICE MARKING INFORMATION GND 3 (4) = Sink Only Positive True Logic See general marking information in the device marking section on page 7 of this data sheet. Pin numbers adjacent to terminals are for the 3−pin TO−92 package. Pin numbers in parenthesis are for the 8−lead packages. This device contains 21 active transistors. Figure 1. Representative Block Diagram © Semiconductor Components Industries, LLC, 2005 1 February, 2005 − Rev. 12 Publication Order Number: MC34064/D MC34064, MC33064, NCV33064 MAXIMUM RATINGS Rating Power Input Supply Voltage Reset Output Voltage Reset Output Sink Current (Note 2) Clamp Diode Forward Current, Pin 1 to 2 (Note 2) Power Dissipation and Thermal Characteristics P Suffix, Plastic Package Maximum Power Dissipation @ TA = 25°C Thermal Resistance, Junction−to−Air D Suffix, Plastic Package Maximum Power Dissipation @ TA = 25°C Thermal Resistance, Junction−to−Air DM Suffix, Plastic Package Maximum Power Dissipation @ TA = 25°C Thermal Resistance, Junction−to−Air Operating Junction Temperature Operating Ambient Temperature MC34064 MC33064 NCV33064 Storage Temperature Range Symbol Vin VO ISink IF Value −1.0 to 10 10 Internally Limited 100 Unit V V mA mA PD RqJA PD RqJA PD RqJA TJ TA 625 200 625 200 520 240 +150 0 to +70 −40 to +85 −40 to +125 mW °C/W mW °C/W mW °C/W °C °C Tstg −65 to +150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. ESD data available upon request. ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TA is the operating ambient temperature range that applies [Notes 3 and 4] unless otherwise noted.) Characteristics COMPARATOR Threshold Voltage High State Output (Vin Increasing) Low State Output (Vin Decreasing) Hysteresis RESET OUTPUT Output Sink Saturation (Vin = 4.0 V, ISink = 8.0 mA) (Vin = 4.0 V, ISink = 2.0 mA) (Vin = 1.0 V, ISink = 0.1 mA) Output Sink Current (Vin, Reset = 4.0 V) Output Off-State Leakage (Vin, Reset = 5.0 V) Clamp Diode Forward Voltage, Pin 1 to 2 (IF = 10 mA) TOTAL DEVICE Operating Input Voltage Range Quiescent Input Current (Vin = 5.0 V) Vin Iin 1.0 to 6.5 − − 390 − 500 V mA VOL − − − ISink IOH VF 10 − 0.6 0.46 0.15 − 27 0.02 0.9 1.0 0.4 0.1 60 0.5 1.2 mA mA V V V VIH VIL VH 4.5 4.5 0.01 4.61 4.59 0.02 4.7 4.7 0.05 Symbol Min Typ Max Unit 2. Maximum package power dissipation limits must be observed. 3. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Thigh = +70°C for MC34064 4. Tlow = 0°C for MC34064 −40°C for MC33064 +85°C for MC33064 −40°C for NCV33064 +125°C for NCV33064 5. NCV prefix is for automotive and other applications requiring site and change control. http://onsemi.com 2 MC34064, MC33064, NCV33064 10 RL = 10 k to Vin TA = 25°C VO , OUTPUT VOLTAGE (V) VO , OUTPUT VOLTAGE (V) 8.0 6.0 4.0 2.0 0 4.0 3.0 2.0 1.0 0 5.0 RL = 10 k to Vin TA = 25°C 0 2.0 4.0 6.0 Vin, INPUT VOLTAGE (V) 8.0 10 4.560 4.580 4.600 Vin, INPUT VOLTAGE (V) 4.620 4.640 Figure 2. Reset Output Voltage versus Input Voltage Figure 3. Reset Output Voltage versus Input Voltage 4.630 V th, THRESHOLD VOLTAGE (V) RL = 10 k to Vin 4.620 4.610 4.600 4.590 4.580 4.570 −55 Lower Threshold Low State Output −25 0 25 50 75 100 125 I in , INPUT CURRENT (mA) Upper Threshold High State Output 1.0 0.8 0.6 +85°C 0.4 0.2 0 TA = +25°C +85°C −40°C TA = +25°C −40°C 0 2.0 4.0 6.0 8.0 10 TA, AMBIENT TEMPERATURE (°C) Vin, INPUT VOLTAGE (V) Figure 4. Comparator Threshold Voltage versus Temperature Figure 5. Input Current versus Input Voltage 2.0 Vin = 4.0 V V OL, OUTPUT SATURATION (V) 1.5 TA = 85°C TA = 25°C Reset 90% Vin = 5.0 V to 4.0 V RL = 10 k TA = 25°C TA = −40°C Vin 5.0 V − 4.0 V − Vin 10k Reset 1.0 0.5 10% 0 5.0V 4.0V REF 0 10 20 30 ISink, SINK CURRENT (mA) 40 200 ns/DIV Figure 6. Reset Output Saturation versus Sink Current Figure 7. Reset Delay Time http://onsemi.com 3 MC34064, MC33064, NCV33064 80 I F , FORWARD CURRENT (mA) Vin = 0 V TA = 25°C 60 40 20 0 0 0.4 0.8 1.2 VF , FORWARD VOLTAGE (V) 1.6 Figure 8. Clamp Diode Forward Current versus Voltage + Power Supply 2 (2) 1 (1) R Reset Microprocessor Circuit − − + 1.2 Vref CDLY A time delayed reset can be accomplished with the addition of CDLY. For systems with extremely fast power supply rise times (
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