NCV4274_07

NCV4274, NCV4274A 400 mA 2% and 4%Voltage Regulator Family Description The NCV4274 and NCV4274A is a precision micro−power voltage regulator with an output current capability of 400 mA available in the DPAK and D2PAK packages. The output voltage is accurate within ±2.0% or ±4.0% depending on the version with a maximum dropout voltage of 0.5 V with an input up to 40 V. Low quiescent current is a feature drawing only 150 mA with a 1 mA load. This part is ideal for automotive and all battery operated microprocessor equipment. The regulator is protected against reverse battery, short circuit, and thermal overload conditions. The device can withstand load dump transients making it suitable for use in automotive environments. Features http://onsemi.com MARKING DIAGRAMS 4 74X−xxG ALYWW x 1 2 3 1 Input 2, 4 Ground 3 Output DPAK DT SUFFIX CASE 369C • • • • • • • • • 2.5, 3.3 V, 5.0 V, ±2.0% and ±4.0% Output Options Low 150 mA Quiescent Current at 1 mA load current 400 mA Output Current Capability Fault Protection +60 V Peak Transient Voltage with Respect to GND S −40 V Reverse Voltage S Short Circuit S Thermal Overload Very Low Dropout Voltage AEC−Q100 Qualified NCV Prefix for Automotive and Other Applications Requiring Site and Control Changes These are Pb−Free Devices 4 NC V4274X−xx AWLYWWG D2PAK DS SUFFIX CASE 418AF 1 Input 2, 4 Ground 3 Output 1 2 4 3 SOT−223 ST SUFFIX CASE 318E X xx A L, WL Y WW, W G AYW 74X−xxG 1 2 3 1 Input 2, 4 Ground 3 Output = A or blank = Voltage Ratings = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 13 of this data sheet. © Semiconductor Components Industries, LLC, 2007 February, 2007 − Rev. 8 1 Publication Order Number: NCV4274/D NCV4274, NCV4274A I Q Bandgap Refernece − + Current Limit and Saturation Sense Thermal Shutdown GND Figure 1. Block Diagram Pin Definitions and Functions Pin No. 1 2,4 3 Symbol I GND Q Function Input; Bypass directly at the IC a ceramic capacitor to GND. Ground Output; Bypass with a capacitor to GND. 1. DPAK 3LD package code 6025 2. D2PAK 3LD package code 6083 ABSOLUTE MAXIMUM RATINGS Pin Symbol, Parameter I, Input−to−Regulator Voltage Current I, Input peak Transient Voltage to Regulator with Respect to GND Q, Regulated Output Voltage Current GND, Ground Current Junction Temperature Storage Temperature ESD Capability, Human Body Model ESD Capability, Machine Model ESD Capability, Charged Device Model Symbol VI II VI VQ IQ IGND TJ TStg ESDHB ESDMM ESDCDM −1.0 Internally Limited − − −50 4 200 1 Condition Min −42 Internally Limited Max 45 Internally Limited 60 40 Internally Limited 100 150 150 mA °C °C kV V kV V V Unit V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 3. This device series incorporates ESD protection and is tested by the following methods: ESD HBM tested per AEC−Q100−002 (EIA/JESD22−A114) ESD MM tested per AEC−Q100−003 (EIA/JESD22−A115) ESD CDM tested per EIA/JES D22/C101, Field Induced Charge Model http://onsemi.com 2 NCV4274, NCV4274A OPERATING RANGE Parameter Input Voltage (5.0 V Version) Input Voltage (3.3 V, and 2.5 V Version) Junction Temperature Symbol VI VI TJ Condition Min 5.5 4.5 −40 Max 40 40 150 Unit V V °C THERMAL RESISTANCE Parameter Junction−to−Ambient Junction−to−Ambient Junction−to−Case Junction−to−Case Junction−to−Tab Junction−to−Ambient 4. Soldered in, minimal footprint, FR4 5. 1 oz copper, 5 mm2 copper area, FR4 DPAK D2PAK DPAK D2PAK SOT−223 SOT−223 Symbol Rthja Rthja Rthjc Rthjc Y−JLX, YLX Condition Min − − − − − − Max 70 (Note 4) 60 (Note 4) 4 3 14.5 (Note 5) 169.7 (Note 5) Unit °C/W °C/W °C/W °C/W °C/W °C/W RqJA, qJA LEAD FREE SOLDERING TEMPERATURE AND MSL Parameter Lead Free Soldering, (Note 6) Reflow (SMD styles only), Moisture Sensitivity Level 6. Per IPC/JEDEC J−STD−020C Pb−Free Symbol Tsld Condition 60s − 150s Above 217s 40s Max at Peak DPAK and D2PAK SOT−223 Min − 1 3 Max 265 pk − − Unit °C MSL http://onsemi.com 3 NCV4274, NCV4274A ELECTRICAL CHARACTERISTICS NCV4274A and NCV4274 5.0 V −40°C < TJ < 150°C; VI = 13.5 V unless otherwise noted. Min Parameter REGULATOR Output Voltage (5.0 V Version) Output Voltage (5.0 V Version) Output Voltage (3.3 V Version) Output Voltage (3.3 V Version) Output Voltage (2.5 V Version) Output Voltage (2.5 V Version) Current Limit Quiescent Current VQ VQ VQ VQ VQ VQ IQ Iq 5 mA < IQ < 400 mA 6V < VI < 28 V 5 mA < IQ < 200 mA 6 V < VI < 40 V 5 mA < IQ < 400 mA 4.5 V < VI < 28 V 5 mA < IQ < 200 mA 4.5 V < VI < 40 V 5 mA < IQ < 400 mA 4.5 V < VI < 28 V 5 mA < IQ < 200 mA 4.5 V < VI < 40 V − Iq = 1 mA VQ = 5.0 V VQ = 3.3 V VQ = 2.5 V Iq = 250 mA VQ = 5.0 V VQ = 3.3 V VQ = 2.5 V Iq = 400 mA VQ = 5.0 V VQ = 3.3 V VQ = 2.5 V IQ = 250 mA, VDR = VI − VQ VI = 5.0 V VI = 4.5 V VI = 4.5 V IQ = 5 mA to 400 mA DVI = 12 V to 32 V IQ = 5 mA ƒr = 100 Hz, Vr = 0.5 VPP 4.9 4.9 3.23 3.23 2.45 2.45 400 − − − − − − − − − 5.0 5.0 3.3 3.3 2.5 2.5 600 190 145 140 10 13 12 20 30 28 5.1 5.1 3.37 3.37 2.55 2.55 − 250 250 250 15 20 15 35 45 35 4.8 4.8 3.17 3.17 2.4 2.4 400 − − − − − − − − − 5.0 5.0 3.3 3.3 2.5 2.5 600 190 145 140 10 13 12 20 30 28 5.2 5.2 3.43 3.43 2.6 2.6 − 250 250 250 15 20 15 35 45 35 V V V V V V mA mA mA mA mA mA mA mA mA mA Symbol Test Conditions Typ Max Min Typ Max Unit NCV4274A NCV4274 Dropout Voltage 5.0 V Version 3.3 V Version 2.5 V Version Load Regulation Line Regulation Power Supply Ripple Rejection Temperature output voltage drift Thermal Shutdown Temperature* *Guaranteed by design, not tested in production VI VI II C11 1.0 mF I C12 100 nF 1 NCV4274 3 NCV4274A 2,4 GND IGND Q VDR − − − − − − − 250 − − 7 10 60 0.5 − 500 1.23 2.05 20 25 − − 210 − − − − − − − 165 250 − − 7 10 60 0.5 − 500 1.33 2.1 30 25 − − 210 mV V V mV mV dB mV/K °C DVQ DVQ PSRR dVQ/dT TSD IQ = 5 mA 165 IQ CQ 10 mF or 22 mF VQ VQ 4.5 − 40 V Input Rload CI 100 nF 1 NCV4274 3 NCV4274A 2,4 GND 5.0 V CQ Output 10 mF Figure 2. Measuring Circuit Figure 3. Application Circuit http://onsemi.com 4 NCV4274, NCV4274A TYPICAL CHARACTERISTIC CURVES 1000 VI = 13.5 V 100 ESR (W) Maximum ESR COUT = 1 mF − 100 mF Stable Region Minimum ESR COUT = 1 mF 0 5 20 60 100 140 180 220 260 300 340 380 420 LOAD CURRENT (mA) 10 1.0 0.1 Figure 4. ESR Characterization http://onsemi.com 5 NCV4274, NCV4274A TYPICAL CHARACTERISTIC CURVES − 5.0 V Version 5.2 VI = 13.5 V RL = 1 kW 5.1 4 VQ (V) 5.0 VQ (V) 3 2 4.9 1 4.8 −40 0 0 40 TJ (°C) 80 120 160 0 2 4 VI (V) 6 8 10 6 5 RL = 20 W TJ = 25°C Figure 5. Output Voltage vs. Junction Temperature Figure 6. Output Voltage vs. Input Voltage 800 TJ = 25°C VQ = 0 V 600 60 50 40 TJ = 25°C VI = 13.5 V IQ (mA) Iq (mA) 400 30 20 200 10 0 0 0 10 20 VI (V) 30 40 50 0 100 200 300 IQ (mA) 400 500 600 Figure 7. Output Current vs. Input Voltage 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 10 20 30 IQ (mA) 40 50 60 100 0 VDR (mV) Iq (mA) TJ = 25°C VI = 13.5 V 600 500 400 Figure 8. Current Consumption vs. Output Current (High Load) TJ = 125°C 300 200 TJ = 25°C 0 100 200 IQ (mA) 300 400 Figure 9. Current Consumption vs. Output Current (Low Load) Figure 10. Drop Voltage vs. Output Current http://onsemi.com 6 NCV4274, NCV4274A TYPICAL CHARACTERISTIC CURVES − 5.0 V Version 40 RL = 20 W TJ = 25°C 30 Iq (mA) II (mA) 6 4 2 0 −2 20 −4 −6 −8 10 −10 −12 −14 0 0 10 20 VI (V) 30 40 50 −16 −50 −25 0 VI (V) 25 50 RL = 6.8 kW TJ = 25°C Figure 11. Current Consumption vs. Input Voltage Figure 12. Input Current vs. Input Voltage http://onsemi.com 7 NCV4274, NCV4274A TYPICAL CHARACTERISTIC CURVES − 3.3 V Version 3.5 3.4 3.3 VQ (V) 3.2 3.1 3.0 2.9 −40 VQ (V) VI = 6 V RL = 1 kW 6 5 4 3 2 1 0 0 40 TJ (°C) 80 120 160 RL = 20 W TJ = 25°C 0 1 2 3 VI (V) 4 5 6 Figure 13. Output Voltage vs. Junction Temperature 800 TJ = 25°C VQ = 0 V 600 40 IQ (mA) Iq (mA) 400 30 20 200 10 0 0 0 60 50 Figure 14. Output Voltage vs. Input Voltage TJ = 25°C VI = 13.5 V 0 10 20 VI (V) 30 40 50 100 200 300 IQ (mA) 400 500 600 Figure 15. Output Current vs. Input Voltage 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 10 20 30 IQ (mA) 40 50 60 1.16 1.14 VDR (V) Iq (mA) 1.22 1.20 1.18 TJ = 25°C VI = 13.5 V 1.26 1.24 Figure 16. Current Consumption vs. Output Current (High Load) TJ = 125°C TJ = 25°C VDR = VI(min) − VQ 0 100 200 IQ (mA) 300 400 Figure 17. Current Consumption vs. Output Current (Low Load) Figure 18. Voltage Drop vs. Output Current http://onsemi.com 8 NCV4274, NCV4274A TYPICAL CHARACTERISTIC CURVES − 3.3 V Version 7 6 5 Iq (mA) II (mA) 4 3 2 1 0 0 10 20 VI (V) 30 40 50 RL = 20 W TJ = 25°C 4 2 0 −2 −4 −6 −8 −10 −12 −14 −16 −50 −25 0 VI (V) RL = 3.3 kW TJ = 25°C 25 50 Figure 19. Current Consumption vs. Input Voltage Figure 20. Input Current vs. Input Voltage http://onsemi.com 9 NCV4274, NCV4274A TYPICAL CHARACTERISTIC CURVES − 2.5 V Version 2.7 2.6 2.5 VQ (V) 2.4 2.3 2.2 2.1 −40 VQ (V) VI = 6 V RL = 1 kW 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 40 TJ (°C) 80 120 160 0 1 2 3 VI (V) 4 5 6 Figure 21. Output Voltage vs. Junction Temperature 800 TJ = 25°C VQ = 0 V 600 40 IQ (mA) Iq (mA) 400 30 20 200 10 0 0 0 60 50 Figure 22. Output Voltage vs. Input Voltage TJ = 25°C VI = 13.5 V 0 10 20 VI (V) 30 40 50 100 200 300 IQ (mA) 400 500 600 Figure 23. Output Current vs. Input Voltage 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 10 20 30 IQ (mA) 40 50 60 VDR (V) Iq (mA) TJ = 25°C VI = 13.5 V 2.05 2.04 2.03 2.02 2.01 2.00 1.99 1.98 1.97 1.96 1.95 0 Figure 24. Current Consumption vs. Output Current (High Load) TJ = 125°C TJ = 25°C VDR = VI(min) − VQ 100 200 IQ (mA) 300 400 Figure 25. Current Consumption vs. Output Current (Low Load) Figure 26. Voltage Drop vs. Output Current http://onsemi.com 10 NCV4274, NCV4274A TYPICAL CHARACTERISTIC CURVES − 2.5 V Version 4.5 4.0 3.5 3.0 Iq (mA) 2.5 2.0 1.5 1.0 0.5 0 0 10 20 VI (V) 30 40 50 II (mA) RL = 20 W TJ = 25°C 2 0 −2 −4 −6 −8 −10 −12 −14 −50 −25 0 VI (V) RL = 3.3 kW TJ = 25°C 25 50 Figure 27. Current Consumption vs. Input Voltage Figure 28. Input Current vs. Input Voltage http://onsemi.com 11 NCV4274, NCV4274A APPLICATION DESCRIPTION Output Regulator The output is controlled by a precision trimmed reference and error amplifier. The PNP output has saturation control for regulation while the input voltage is low, preventing over saturation. Current limit and voltage monitors complement the regulator design to give safe operating signals to the processor and control circuits. Stability Considerations Once the value of PD(max) is known, the maximum permissible value of RqJA can be calculated: Pq JA + 150 C * T A PD (eq. 2) The input capacitor CI1 in Figure 2 is necessary for compensating input line reactance. Possible oscillations caused by input inductance and input capacitance can be damped by using a resistor of approximately 1 W in series with CI2. The output or compensation capacitor helps determine three main characteristics of a linear regulator: startup delay, load transient response and loop stability. The capacitor value and type should be based on cost, availability, size and temperature constraints. The aluminum electrolytic capacitor is the least expensive solution, but, if the circuit operates at low temperatures (−25°C to −40°C), both the value and ESR of the capacitor will vary considerably. The capacitor manufacturer’s data sheet usually provides this information. The value for the output capacitor CQ shown in Figure 2 should work for most applications; however, it is not necessarily the optimized solution. Stability is guaranteed at values CQ w 2.2 mF and an ESR v 2.5 W within the operating temperature range. Actual limits are shown in a graph in the Typical Performance Characteristics section. Calculating Power Dissipation in a Single Output Linear Regulator The value of RqJA can then be compared with those in the package section of the data sheet. Those packages with RqJA’s less than the calculated value in Equation 2 will keep the die temperature below 150°C. In some cases, none of the packages will be sufficient to dissipate the heat generated by the IC, and an external heat sink will be required. The current flow and voltages are shown in the Measurement Circuit Diagram. Heat Sinks A heat sink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment will have a thermal resistance. Like series electrical resistances, these resistances are summed to determine the value of RqJA: R qJA + R qJC ) R qCS ) R qSA (eq. 3) The maximum power dissipation for a single output regulator (Figure 3) is: P D(max) + [V I(max) * V Q(min)]I Q(max) ) V I(max)I q (eq. 1) Where: RqJC = the junction−to−case thermal resistance, RqCS = the case−to−heat sink thermal resistance, and RqSA = the heat sink−to−ambient thermal resistance. RqJC appears in the package section of the data sheet. Like RqJA, it too is a function of package type. RqCS and RqSA are functions of the package type, heat sink and the interface between them. These values appear in data sheets of heat sink manufacturers. Thermal, mounting, and heat sinking are discussed in the ON Semiconductor application note AN1040/D, available on the ON Semiconductor Website. Where: VI(max) is the maximum input voltage, VQ(min) is the minimum output voltage, IQ(max) is the maximum output current for the application, and Iq is the quiescent current the regulator consumes at IQ(max). http://onsemi.com 12 NCV4274, NCV4274A ORDERING INFORMATION4 Device NCV4274DS50G NCV4274DS50R4G NCV4274DT50G NCV4274DT50RKG NCV4274ADS50G NCV4274ADS50R4G NCV4274ADT50G NCV4274ADT50RKG NCV4274ST33T3G NCV4274DT33RKG NCV4274AST33T3G NCV4274ADT33RKG NCV4274ST25T3G NCV4274AST25T3G Output Voltage Accuracy 4% 4% 4% 4% 2% 2% 2% 2% 4% 4% 2% 2% 4% 2% Output Voltage 5.0 V 5.0 V 5.0 V 5.0 V 5.0 V 5.0 V 5.0 V 5.0 V 3.3 V 3.3 V 3.3 V 3.3 V 2.5 V 2.5 V Package D2PAK (Pb−Free) D2PAK (Pb−Free) DPAK (Pb−Free) DPAK (Pb−Free) D2PAK (Pb−Free) D2PAK (Pb−Free) DPAK (Pb−Free) DPAK (Pb−Free) SOT−223 (Pb−Free) DPAK (Pb−Free) SOT−223 (Pb−Free) DPAK (Pb−Free) SOT−223 (Pb−Free) SOT−223 (Pb−Free) Shipping † 50 Units / Rail 800 / Tape & Reel 75 Units / Rail 2500 / Tape & Reel 50 Units / Rail 800 / Tape & Reel 75 Units / Rail 2500 / Tape & Reel 4000 / Tape & Reel 2500 / Tape & Reel 4000 / Tape & Reel 2500 / Tape & Reel 4000 / Tape & Reel 4000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 13 NCV4274, NCV4274A PACKAGE DIMENSIONS DPAK (SINGLE GAUGE) CASE 369C−01 ISSUE O −T− B V R 4 SEATING PLANE C E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.235 0.245 0.250 0.265 0.086 0.094 0.027 0.035 0.018 0.023 0.037 0.045 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.180 0.215 0.025 0.040 0.020 −−− 0.035 0.050 0.155 −−− MILLIMETERS MIN MAX 5.97 6.22 6.35 6.73 2.19 2.38 0.69 0.88 0.46 0.58 0.94 1.14 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.57 5.45 0.63 1.01 0.51 −−− 0.89 1.27 3.93 −−− S A 1 2 3 Z U K F L D G 2 PL J H 0.13 (0.005) M DIM A B C D E F G H J K L R S U V Z T SOLDERING FOOTPRINT* 6.20 0.244 3.0 0.118 2.58 0.101 5.80 0.228 1.6 0.063 6.172 0.243 SCALE 3:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 14 NCV4274, NCV4274A PACKAGE DIMENSIONS SOT−223 (TO−261) CASE 318E−04 ISSUE L D b1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. MILLIMETERS NOM MAX 1.63 1.75 0.06 0.10 0.75 0.89 3.06 3.20 0.29 0.35 6.50 6.70 3.50 3.70 2.30 2.40 0.94 1.05 1.75 2.00 7.00 7.30 10° − INCHES NOM 0.064 0.002 0.030 0.121 0.012 0.256 0.138 0.091 0.037 0.069 0.276 − 4 HE 1 2 3 E e1 b e A q L1 C DIM A A1 b b1 c D E e e1 L1 HE q MIN 1.50 0.02 0.60 2.90 0.24 6.30 3.30 2.20 0.85 1.50 6.70 0° MIN 0.060 0.001 0.024 0.115 0.009 0.249 0.130 0.087 0.033 0.060 0.264 0° MAX 0.068 0.004 0.035 0.126 0.014 0.263 0.145 0.094 0.041 0.078 0.287 10° 0.08 (0003) A1 SOLDERING FOOTPRINT 3.8 0.15 2.0 0.079 2.3 0.091 2.3 0.091 6.3 0.248 2.0 0.079 1.5 0.059 mm inches SCALE 6:1 http://onsemi.com 15 NCV4274, NCV4274A PACKAGE DIMENSIONS D2PAK CASE 418AF−01 ISSUE O NOTES: 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 4. CONTROLLING DIMENSION: INCH. 5. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 6. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 4. 7. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.051 REF 0.100 BSC 0.539 0.579 0.125 MAX 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 _ REF 0.116 REF 0.200 MIN 0.250 MIN MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.295 REF 2.540 BSC 13.691 14.707 3.175 MAX 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 _ REF 2.946 REF 5.080 MIN 6.350 MIN −T− K A OPTIONAL CHAMFER TERMINAL 4 E V U S B F 1 2 3 H M L P DIM A B C D E F G H J K L M N P R S U V J D 0.010 (0.254) M T G N R C ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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