NCV47722PAAJR2G

High Side Switch with Adjustable Current Limit and Diagnostic Features NCV47722 The NCV47722 High Side Switch (HSS) with 250 mA is designed for use in harsh automotive environments. The device has a high peak input voltage tolerance and reverse input voltage, reverse bias, overcurrent and overtemperature protections. The integrated current sense feature (adjustable by resistor connected to CSO pin) provides diagnosis and system protection functionality. The CSO pin output current creates voltage drop across CSO resistor which is proportional to output current. Extended diagnostic features in OFF state are also available and controlled by dedicated input and output pins. • • • MARKING DIAGRAM 14 14 1 Features • • • • www.onsemi.com Output Current: up to 250 mA Enable Input (3.3 V Logic Compatible) Adjustable Current Limit: up to 350 mA Protection Features: ♦ Current Limitation ♦ Thermal Shutdown ♦ Reverse Input Voltage and Reverse Bias Voltage Diagnostic Features: ♦ Short To Battery (STB) and Open Load (OL) in OFF State ♦ Internal Components for OFF State Diagnostics ♦ Open Collector Flag Output ♦ Output Voltage Monitoring Output (analog) AEC−Q100 Grade 1 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant NCV4 7722 ALYWG G TSSOP−14 Exposed Pad CASE 948AW 1 47722 = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet. Typical Applications • Audio and Infotainment System • Active Safety System C in Vout Vin 1 µF C out Vout_FB EN NCV47722 To A/D CSO C CSO 1 µF R CSO 1 µF Diagnostic Enable Input DE GND EF Error Flag Output (Open Collector) *Vout_FB is sensed Vout output voltage via internal resistor divider Figure 1. Application Schematic This document contains information on some products that are still under development. ON Semiconductor reserves the right to change or discontinue these products without notice. © Semiconductor Components Industries, LLC, 2015 July, 2020 − Rev. 1 1 Publication Order Number: NCV47722/D NCV47722 IPU 10 mA IPU_ON Vin Vout ICSO = Iout / RATIO* VOLTAGE REFERENCE EN RPD_ON 780k ENABLE VREF VREF_OFF EN PASS DEVICE AND CURRENT MIRROR + VREF 2.55 V − SATURATION PROTECTION OC_ON THERMAL SHUTDOWN + − PD_ON CSO 0.95x VREF RPD1 500k STB_OL_OFF EN DE IPU_ON RPD_DE 780k + − RPD2 100k Vout_FB VREF_OFF 0.5 V PD_ON STB_OL_OFF DIAGNOSTIC CONTROL LOGIC EF OC_ON GND *) for current value of RATIO see into Electrical Characteristic Table Figure 2. Simplified Block Diagram www.onsemi.com 2 NCV47722 1 14 NC NC NC NC NC NC GND EPAD EF DE EN Vout_FB CSO Vin Vout TSSOP−14 EPAD Figure 3. Pin Connections (Top Views) Table 1. PIN FUNCTION DESCRIPTION Pin No. TSSOP−14 EPAD Pin Name 1 NC Not Connected, not internally bonded. 2 NC Not Connected, not internally bonded. 3 NC Not Connected, not internally bonded. 4 GND 5 EN 6 CSO 7 Vin Power Supply Input. 8 Vout Regulated Output Voltage. 9 Vout_FB 10 DE Diagnostic Enable Input. 11 EF Error Flag (Open Collector) Output. Active Low. 12 NC Not Connected, not internally bonded. 13 NC Not Connected, not internally bonded. 14 NC Not Connected, not internally bonded. EPAD EPAD Description Power Supply Ground. Enable Input; low level disables regulator. (Used also for OFF state diagnostics control. Current Sense Output, Current Limit setting and Output Current value information. See Application Section for more details. Output Voltage Analog Monitoring. See Application Section for more details. Exposed Pad is connected to Ground. Connect to GND plane on PCB. www.onsemi.com 3 NCV47722 Table 2. MAXIMUM RATINGS Rating Symbol Min Max Unit Input Voltage DC Vin −42 45 V Input Voltage (Note 1) Load Dump − Suppressed Us* − 60 Enable Input Voltage VEN −42 45 V Vout_FB −0.3 10 V VCSO −0.3 7 V VDE, VCS, VEF −0.3 7 V Vout −1 40 V Junction Temperature TJ −40 150 °C Storage Temperature TSTG −55 150 °C Output Voltage Monitoring CSO Voltage DE, CS and EF Voltages Output Voltage V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Load Dump Test B (with centralized load dump suppression) according to ISO16750−2 standard. Guaranteed by design. Not tested in production. Passed Class A according to ISO16750−1. Table 3. ESD CAPABILITY (Note 2) Rating ESD Capability, Human Body Model Symbol Min Max Unit ESDHBM −2 2 kV 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010) Field Induced Charge Device Model ESD characterization is not performed on plastic molded packages with body sizes < 50 mm2 due to the inability of a small package body to acquire and retain enough charge to meet the minimum CDM discharge current waveform characteristic defined in JEDEC JS−002−2014. Table 4. LEAD SOLDERING TEMPERATURE AND MSL (Note 3) Symbol Rating Moisture Sensitivity Level Min MSL Max 1 Unit − 3. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D THERMAL CHARACTERISTICS (Note 4) Symbol Rating Value Thermal Characteristics (single layer PCB) Thermal Resistance, Junction−to−Air (Note 5) Thermal Reference, Junction−to−Lead (Note 5) RθJA RψJL 62.6 23.7 Thermal Characteristics (4 layers PCB) Thermal Resistance, Junction−to−Air (Note 5) Thermal Reference, Junction−to−Lead (Note 5) RθJA RψJL 44.1 16.8 Unit °C/W °C/W 4. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 5. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate. Single layer − according to JEDEC51.3, 4 layers − according to JEDEC51.7 Table 5. RECOMMENDED OPERATING RANGES Rating Symbol Min Max Unit Input Voltage (Note 6) Vin 4.4 40 V Output Current Limit (Note 7) ILIM 10 350 mA TJ −40 150 °C CCSO 1 4.7 mF Junction Temperature Current Sense Output (CSO) Capacitor Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 6. Minimum Vin = 4.4 V or (Vout + 0.5 V), whichever is higher. 7. Corresponding RCSO is in range from 76.5 kW down to 2185 W. www.onsemi.com 4 NCV47722 Table 6. ELECTRICAL CHARACTERISTICS Vin = 13.5 V, VEN = 3.3 V, RCSO = 0 W, CCSO = 1 mF, Cin = 1 mF, Cout = 1 mF, Min and Max values are valid for temperature range −40°C v TJ v +150°C unless noted otherwise and are guaranteed by test, design or statistical correlation. Typical values are referenced to TJ = 25°C (Note 8) Parameter Test Conditions Symbol Min Typ Max − − 200 225 350 400 Unit OUTPUTS Input to Output Differential Voltage Vin = 8 V to 18 V Iout = 200 mA Iout = 250 mA Vin−out mV CURRENT LIMIT PROTECTION Vout = Vin – 1 V ILIM 350 − − mA Disable Current VEN = 0 V IDIS − 0.002 10 mA Quiescent Current, Iq = Iin − Iout Iout = 500 mA, Vin = 8 V to 18 V Iq − 0.5 1.3 mA Quiescent Current, Iq = Iin – Iout Iout = 200 mA, Vin = 8 V to 18 V Iq − 8 19 mA Quiescent Current, Iq = Iin – Iout Iout = 250 mA, Vin = 8 V to 18 V Iq − 11 25 mA 0.99 − 1.8 1.9 − 2.31 2 9 20 − 25 − VCSO_Ilim 2.448 (−4%) 2.55 2.652 (+4%) V VCSO − − 3.3 V Current Limit DISABLE AND QUIESCENT CURRENTS ENABLE Vth(EN) Enable Input Threshold Voltage Logic Low (OFF) Logic High (ON) Vout v 0.1 V Vout w Vin – 1 V Enable Input Current VEN = 3.3 V IEN Turn On Time from Enable ON to Vout = Vin – 1 V Iout = 100 mA ton V mA ms OUTPUT CURRENT SENSE CSO Voltage Level at Current Limit Vout = Vin – 1 V RCSO = 3.3 kΩ CSO Transient Voltage Level CCSO = 4.7 mF, RCSO = 3.3 kΩ Iout pulse from 10 mA to 350 mA, tr = 1 ms Output Current to CSO Current Ratio VCSO = 2 V, Iout = 10 mA to 50 mA Vin = 8 V to 18 V, −40℃ v TJ v +150℃ Iout/ICSO − (−15%) 265 − (+15%) − Output Current to CSO Current Ratio VCSO = 2 V, Iout = 50 mA to 350 mA Vin = 8 V to 18 V, −40℃ v TJ v +150℃ Iout/ICSO − (−5%) 285 − (+5%) − CSO Current at no Load Current VCSO = 0 V, Iout = 0 mA ICSO_off − − 15 mA VOC 92 95 98 % of VCSO_ DIAGNOSTICS Overcurrent Voltage Level Threshold Vout = Vin – 1 V RCSO = 3.3 kΩ Ilim Short To Battery (STB) Voltage Threshold in OFF state Vin = 4.4 V to 18 V, Iout = 0 mA VSTB 2 3 4 V Open Load (OL) Current Threshold in OFF state Vin = 4.4 V to 18 V IOL 5 10 25 mA Output Voltage to Output Feedback Voltage Ratio Vin = 4.4 V to 18 V Vout/VoutFB 5.7 6 6.3 − 0.99 − 1.8 1.9 − 2.31 VEF_Low − 0.04 0.4 V TSD 150 175 195 °C Diagnostics Enable Threshold Voltage Logic Low (OFF) Logic High (ON) Error Flag Low Voltage Vth(DE) IEF = −1 mA V THERMAL SHUTDOWN Thermal Shutdown Temperature (Note 9) Iout = 90 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 8. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TA [ TJ. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 9. Values based on design and/or characterization. www.onsemi.com 5 NCV47722 TYPICAL CHARACTERISTICS 400 350 Vin = 13.5 V 300 250 Iout = 200 mA 200 150 Iout = 15 mA 100 50 0 20 40 60 80 300 TJ = 25°C 250 200 TJ = −40°C 150 100 50 0 50 100 150 200 250 350 400 300 Iout, OUTPUT CURRENT (mA) Figure 4. Input to Output Differential Voltage vs. Temperature Figure 5. Input to Output Differential Voltage vs. Output Current 0 850 Iin, INPUT CURRENT (mA) TJ = 25°C 800 TJ = 150°C 750 700 TJ = −40°C 650 600 Vout = (Vin − 1 V) V 550 0 5 10 15 20 25 30 35 40 TJ = 25°C Rout = 3.3 kW −0.5 −1.0 −1.5 −2.0 −2.5 −3.0 −3.5 −45 −40 45 −35 −30 −25 −20 −15 −10 −5 Vin, INPUT VOLTAGE (V) Vin, INPUT VOLTAGE (V) Figure 6. Output Current Limit vs. Input Voltage Figure 7. Input Current vs. Input Voltage (Reverse Input Voltage) 400 0 3.0 350 300 250 200 150 100 50 0 TJ = 150°C Vin = 13.5 V TJ, JUNCTION TEMPERATURE (°C) 900 500 350 0 100 120 140 160 VCSO, CSO VOLTAGE (V) ILIM, OUTPUT CURRENT LIMIT (mA) 0 −40 −20 ILIM, OUTPUT CURRENT LIMIT (mA) Iout = 350 mA Vin−out, INPUT TO OUTPUT DIFFERENTIAL VOLTAGE (mV) Vin−out, INPUT TO OUTPUT DIFFERENTIAL VOLTAGE (mV) 400 0 10 20 30 40 50 60 70 2.0 1.5 1.0 0.5 0 80 TJ = −40°C to 150°C ILIM = 10 mA to 350 mA 2.5 0 10 20 30 40 50 60 70 80 90 100 110 RCSO (kW) Iout, OUTPUT CURRENT (% of ILIM) Figure 8. Output Current Limit vs. RCSO Figure 9. CSO Voltage vs. Output Current (% of ILIM) www.onsemi.com 6 NCV47722 TYPICAL CHARACTERISTICS 20 Iq, QUIESCENT CURRENT (mA) Iq, QUIESCENT CURRENT (mA) 1.0 TJ = 25°C Vin = 13.5 V 0.9 0.8 0.7 0.6 0.5 0.4 0 5 10 15 20 18 TJ = 25°C Vin = 13.5 V 16 14 12 10 8 6 4 2 0 0 50 100 150 200 250 300 Iout, OUTPUT CURRENT (mA) Iout, OUTPUT CURRENT (mA) Figure 10. Quiescent Current vs. Output Current (Low Load) Figure 11. Quiescent Current vs. Output Current (High Load) 350 Iout/ICSO, OUTPUT CURRENT TO CSO CURRENT RATIO (−) 310 TJ = 25°C Vin = 13.5 V 305 300 295 290 285 280 275 270 265 260 255 250 10 100 1000 Iout, OUTPUT CURRENT (mA) Figure 12. Output Current to CSO Current Ratio vs. Output Current DEFINITIONS General Current Limit All measurements are performed using short pulse low duty cycle techniques to maintain junction temperature as close as possible to ambient temperature. Current Limit is value of output current by which output voltage drops 1 V below input supply voltage level. Thermal Protection Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 175°C, the regulator turns off. This feature is provided to prevent failures from accidental overheating. Input to Output Differential Voltage The Input to Output Differential Voltage parameter is defined for specific output current values and specified over Temperature range. Quiescent and Disable Currents Quiescent Current (Iq) is the difference between the input current (measured through the LDO input pin) and the output load current. If Enable pin is set to LOW the regulator reduces its internal bias and shuts off the output, this term is called the disable current (IDIS). Maximum Package Power Dissipation The power dissipation level is maximum allowed power dissipation for particular package or power dissipation at which the junction temperature reaches its maximum operating value, whichever is lower. www.onsemi.com 7 NCV47722 APPLICATIONS INFORMATION Circuit Description Once output current reaches its limit value (ILIM) set by external resistor RCSO than voltage at CSO pin is typically 2.55 V. Calculations of ILIM or RCSO values can be done using Equation 2 and Equation 3, respectively. Minimum and maximum value of Output Current Limit can be calculated according to Equations 4 and 5. The NCV47722 is an integrated High Side Switch (HSS) with output current capability up to 250 mA to output. It is enabled with an input to the enable pin. The integrated current sense feature provides diagnosis and system protection functionality. The current limit of the device is adjustable by resistor connected to CSO pin. Voltage on CSO pin is proportional to output current. The HSS is protected by both current limit and thermal shutdown. Thermal shutdown occurs above 150°C to protect the IC during overloads and extreme ambient temperatures. I LIM_min + RATIO min I LIM_max + RATIO max Enable Input Setting the Output Current Limit The output current limit can be set up to 350 mA by external resistor RCSO (see Figure 1). Capacitor CCSO of 1 mF in parallel with RCSO is required for stability of current limit control circuitry (see Figure 1). ǒ I LIM + RATIO R CSO + RATIO 1 RATIO 2.55 R CSO 2.55 I LIM Ǔ V CSO_max R CSO_min (eq. 4) (eq. 5) where RATIOmin − minimum value of Output Current to CSO Current Ratio from electrical characteristics table and particular output current range RATIOmax − maximum value of Output Current to CSO Current Ratio from electrical characteristics table and particular output current range VCSO_min ­ minimum value of CSO Voltage Level at Current Limit from electrical characteristics table VCSO_max ­ maximum value of CSO Voltage Level at Current Limit from electrical characteristics table RCSO_min − minimum value of RCSO with respect its accuracy RCSO_max − maximum value of RCSO with respect its accuracy Designers should consider the tolerance of RCSO during the design phase. The enable pin is used to turn the regulator on or off. By holding the pin down to a voltage less than 0.99 V, the output of the regulator will be turned off. When the voltage on the enable pin is greater than 2.31 V, the output of the regulator will be enabled to power its output to the regulated output voltage. The enable pin may be connected directly to the input pin to give constant enable to the output regulator. V CSO + I out R CSO V CSO_min R CSO_max (eq. 1) (eq. 2) (eq. 3) where RCSO − current limit setting resistor VCSO ­ voltage at CSO pin proportional to Iout ILIM − current limit value Iout − output current actual value RATIO − typical value of Output Current to CSO Current Ratio for particular output current range CSO pin provides information about output current actual value. The CSO voltage is proportional to output current according to Equation 1. Diagnostic in OFF State The NCV47722 contains also circuitry for OFF state diagnostics for Short to Battery (STB) and Open Load (OL). There are internal current source and Pull Down resistors which provide additional cost savings for overall application by excluding external components and their assembly cost and saving PCB space and safe control IOs of a Microcontroller Unit (MCU). Simplified functional schematic and truth table is shown in Figure 13 and related flowchart in Figure 14. www.onsemi.com 8 NCV47722 I PU Start Current source enabled via EN and DE pins PASS DEVICE is OFF in Diagnostics Mode in OFF state Vin Diag. OFF. Set EN = L & DE = L Vout RPD1 Diag. ON. Set EN = L & DE = H + EN Comparator active only in Diagnostic state (DE = H). − VREF_OFF RPD2 DE HZ EF Digital Diagnostics: to MCU’s digital input with pull−up resistor to MCU’s DIO supply rail EN – Enable (Logic Input) DE – Diagnostics Enable (Logic Input) EF – Error Flag Output (Open Collector Output) EN L L DE IPU EF Vout L OFF HZ Unknown H OFF L V out > Vout_OFF Diagnostic Status/Action None (Diagnostics OFF) Short to Battery (STB) Check for Open Load (OL) L H OFF HZ V out < Vout_OFF H H ON H H ON L V out > Vout_OFF EF = ? L IPU ON. Set EN = H & DE = H HZ Open Load (OL) EF = ? HZ V out < Vout_OFF No Failure (V out close to 0 V) Figure 13. Simplified Functional Diagram of OFF State Diagnostics (STB and OL) No Failure For diagnostics in OFF state the input DE pin has to be put logic high. Logic level on EN pin determines which failure (STB or OL) is diagnosed. For detailed information see Diagnostic Truth Table 7. L Open Load Short to Battery Figure 14. Flowchart for Diagnostics in OFF State Diagnostic in ON State Diagnostic in ON State provides information about Overcurrent or Short to Ground failures, during which the EF output is in logic low state. For detailed information see Diagnostic Features Truth Table 7. Table 7. DIAGNOSTIC FEATURES TRUTH TABLE Operational Status EN DE Output Voltage (Vout) Diagnostic Output (CSO) Error Flag (EF) Disabled L L Low (~0 V) Low (~0 V) HZ Short to Battery L H High (Vout ~ Vin) Low (~0 V) L (Note 10) Open Load (OFF) H H High (Vout ~ Vin) Low (~0 V) L (Note 11) Normal (OFF) H H Low (~0 V) Low (~0 V) HZ (Note 11) Open Load (ON) H L High (Vout ~ Vin) Low (~0 V) HZ Normal (ON) H L High (Vout ~ Vin) Proportional to Iout (±5%) (Note 12) HZ Over Current H L Vin − 1 V High (~2.55 V) L Short to Ground H L Low (~0 V) High (~2.55 V) L 10. Internal current source disabled (between Vout and Vin). 11. Internal current source enabled (between Vout and Vin). 12. Valid for Iout = 50 mA to 350 mA. For Iout = 10 mA to 50 mA range proportional to Iout (±15%). www.onsemi.com 9 NCV47722 Thermal Considerations 120 P D(MAX) + ƪTJ(MAX) * TAƫ RqJA, THERMAL RESISTANCE (°C/W) As power in the device increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. When the device has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power applications. The maximum dissipation the device can handle is given by: (eq. 6) R qJA Since TJ is not recommended to exceed 150°C, then the device soldered on 645 mm2, 1 oz copper area, FR4 can dissipate up to 2 W when the ambient temperature (TA) is 25°C. See Figure 15 for RqJA versus PCB area. The power dissipated by the device can be calculated from the following equations: P D [ V inǒI q@I outǓ ) I out ǒV in * V outǓ P D(MAX) ) ǒV out I outǓ I out ) I q 1 oz, Single Layer 90 80 70 60 2 oz, Single Layer 50 40 1 oz, 4 Layer 30 2 oz, 4 Layer 20 0 100 200 300 400 500 600 700 COPPER HEAT SPREADER AREA (mm2) Figure 15. Thermal Resistance vs. PCB Copper Area Hints Vin and GND printed circuit board traces should be as wide as possible. When the impedance of these traces is high, there is a chance to pick up noise or cause the regulator to malfunction. Place external components, especially the output capacitor, as close as possible to the device and make traces as short as possible. (eq. 7) or V in(MAX) [ 110 100 (eq. 8) ORDERING INFORMATION Device NCV47722PAAJR2G Marking Package Shipping† Line1: NCV4 Line2: 7722 TSSOP−14 Exposed Pad (Pb−Free) 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D www.onsemi.com 10 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP−14 EP CASE 948AW ISSUE C 14 1 SCALE 1:1 B NOTE 6 14 DATE 09 OCT 2012 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.07 mm MAX. AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OF THE FOOT. MINIMUM SPACE BETWEEN PROTRUSION AND ADJACENT LEAD IS 0.07. 4. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 mm PER SIDE. DIMENSION D IS DETERMINED AT DATUM H. 5. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.25 mm PER SIDE. DIMENSION E1 IS DETERMINED AT DATUM H. 6. DATUMS A AND B ARE DETERMINED AT DATUM H. 7. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 8. SECTION B−B TO BE DETERMINED AT 0.10 TO 0.25 mm FROM THE LEAD TIP. b 8 ÉÉ ÇÇÇ ÇÇÇ ÉÉ b1 E1 c1 E NOTE 5 SECTION B−B c PIN 1 REFERENCE 1 7 0.20 C B A e 2X 14 TIPS TOP VIEW NOTE 6 A D A2 NOTE 4 0.05 C 0.10 C A 0.10 C B S A S DETAIL A B 14X b 14X NOTE 8 C M SEATING PLANE c B NOTE 3 END VIEW SIDE VIEW D2 H E2 L2 A1 L NOTE 7 C DETAIL A BOTTOM VIEW RECOMMENDED SOLDERING FOOTPRINT* 3.40 14X 1.15 GAUGE PLANE DIM A A1 A2 b b1 c c1 D D2 E E1 E2 e L L2 M MILLIMETERS MIN MAX −−−− 1.20 0.05 0.15 0.80 1.05 0.19 0.30 0.19 0.25 0.09 0.20 0.09 0.16 4.90 5.10 3.09 3.62 6.40 BSC 4.30 4.50 2.69 3.22 0.65 BSC 0.45 0.75 0.25 BSC 0_ 8_ GENERIC MARKING DIAGRAM* 14 XXXX XXXX ALYWG G 1 3.06 6.70 1 0.65 PITCH 14X 0.42 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON66474E TSSOP−14 EP, 5.0X4.4 XXXX = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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