NCV47823PAAJR2G

NCV47823 Dual High Side Switch with Adjustable Constant Current and Diagnostic Features The NCV47823 is designed for using in harsh automotive environments providing dual mode operation depending on the load impedance: High Side Switch (HSS) or Constant Current Source (CCS). In both modes of operation the current limit can be set up to 350 mA per channel by external resistor. The device has a high peak input voltage tolerance and reverse input voltage, reverse bias, overcurrent and overtemperature protections. The integrated current sense feature (adjustable by resistor connected to CSO pin for each channel) provides diagnosis and system protection functionality. The CSO pin output current creates voltage drop across CSO resistor which is proportional to output current of each channel. Extended diagnostic features in OFF state are also available and controlled by dedicated input and output pins. Features • • • • • • • • Reduced Inrush Current (current value set by external resistor only) Adjustable Constant Current: up to 350 mA Two Independent Enable Inputs (3.3 V Logic Compatible) PWM Function of Enable Inputs Available Protection Features: ♦ Current Limitation ♦ Thermal Shutdown ♦ Reverse Input Voltage and Reverse Bias Voltage ♦ Reduced Reverse Bias Current Diagnostic Features: ♦ Short To Battery (STB) and Open Load (OL) in OFF State ♦ Internal Components for OFF State Diagnostics ♦ Open Collector Flag Output ♦ Two Output Voltage Monitoring Outputs (Analog) AEC−Q100 Grade 1 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant www.onsemi.com MARKING DIAGRAM 14 NCV4 7823 ALYWG G TSSOP−14 Exposed Pad CASE 948AW 14 1 1 A L Y W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information on page 14 of sheet. Typical Applications • Audio and Infotainment System • Active Safety System • LED Lighting Systems © Semiconductor Components Industries, LLC, 2016 December, 2017 − Rev. 0 1 Publication Order Number: NCV47823/D NCV47823 Vout1 Vin Cin Proportional Voltage to Vout1* 1 μF EN1 Vout_FB1 Cout1 CSO1 1 μF RCSO1 NCV47823 (Dual CCHSS) Diagnostic Enable Input DE EF Diagnostic Channel Select Input Error Flag Output (Open Collector) Vout2 CS Vout_FB2 EN2 Proportional Voltage to Vout2* Cout2 1 μF CSO2 GND RCSO2 Figure 1. Application Schematic * Vout_FB1 and Vout_FB2 are sensed Vout1 and Vout2 output voltages, respectively, via internal resistor dividers www.onsemi.com 2 NCV47823 IPU1 10 mA IPU1_ON Vin Vout1 ICSO1= Iout1/ RATIO* VOLTAGE RPD_EN1 REFERENCE 780 kW EN1 VREF VREF_OFF PASS DEVICE 1 AND CURRENT MIRROR EN1 ENABLE + VREF 2.55 V − SATURATION PROTECTION CSO1 + THERMAL SHUTDOWN OC1_ON − PD1_ON 0.95x VREF RPD_11 500 kW + STB1_OL1_OFF RPD_CS DE 780 kW CS − IPU1_ON IPU2_ON EN1 EN2 RPD_DE 780 kW DIAGNOSTIC CONTROL LOGIC RPD_12 100 kW Vout_FB1 VREF_OFF PD1_ON PD2_ON EF OC1_ON OC2_ON STB1_OL1_OFF STB2_OL2_OFF IPU2 10 mA IPU2_ON Vout2 Vin ICSO2 = Iout2/ RATIO* RPD_EN2 780 kW EN2 ENABLE EN2 PASS DEVICE 2 AND CURRENT MIRROR + VREF 2.55V − CSO2 THERMAL SHUTDOWN SATURATION PROTECTION OC2_ON + − PD2_ON STB2_OL2_OFF GND + − * for current value of RATIO see into Electrical Characteristic Table Figure 2. Simplified Block Diagram www.onsemi.com 3 0.95x VREF RPD21 500 kW RPD22 100 kW VREF_OFF Vout_FB2 NCV47823 1 14 Vin Vout1 CSO1 EN1 EPAD GND EN2 CSO2 Vin Vout_FB1 CS EF DE Vout_FB2 Vout2 TSSOP−14 EPAD (Top View) Figure 3. Pin Connections Table 1. PIN FUNCTION DESCRIPTION Pin No. TSSOP−14 EPAD Pin Name 1 Vin 2 CSO1 Current Sense Output 1, Current Limit setting and Output Current value information. See Application Section for more details. 3 EN1 Enable Input 1; low level disables the Channel 1. (Used also for OFF state diagnostics control for Channel 1) 4 GND Power Supply Ground. 5 EN2 Enable Input 2; low level disables the Channel 2. (Used also for OFF state diagnostics control for Channel 2) 6 CSO2 Current Sense Output 2, Current Limit setting and Output Current value information. See Application Section for more details. 7 Vin Description Power Supply Input for Channel 1 and supply of control circuits of whole chip. At least 4.4 V power supply must be used for proper IC functionality. Power Supply Input for Channel 2. Connect to pin 1 or different power supply rail. 8 Vout2 9 Vout_FB2 Output Voltage 2. 10 DE Diagnostic Enable Input. 11 EF Error Flag (Open Collector) Output. Active Low. 12 CS Channel Select Input for OFF state diagnostics. Set CS = Low for OFF state diagnostics of Channel 1. Set CS = High for OFF state diagnostics of Channel 2. Corresponding EN pin has to be used for diagnostics control (see Application Information section for more details). 13 Vout_FB1 14 Vout1 Output Voltage 1. EPAD EPAD Exposed Pad is connected to Ground. Connect to GND plane on PCB. Output Voltage 2 Analog Monitoring. See Application Section for more details. Output Voltage 1 Analog Monitoring. See Application Section for more details. www.onsemi.com 4 NCV47823 Table 2. MAXIMUM RATINGS Rating Symbol Min Max Unit Input Voltage DC Vin −42 45 V Input Voltage (Note 1) Load Dump − Suppressed Us* − 60 V VEN1,2 −42 45 V Vout_FB1,2 −0.3 10 V Enable Input Voltage Output Voltage Monitoring CSO Voltage VCSO1,2 −0.3 7 V VDE, VCS, VEF −0.3 7 V Vout1,2 −1 40 V Junction Temperature TJ −40 150 °C Storage Temperature TSTG −55 150 °C DE, CS and EF Voltages Output Voltage Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Load Dump Test B (with centralized load dump suppression) according to ISO16750−2 standard. Guaranteed by design. Not tested in production. Passed Class A according to ISO16750−1. Table 3. ESD CAPABILITY (Note 2) Rating ESD Capability, Human Body Model Symbol Min Max Unit ESDHBM −2 2 kV 2. This device series incorporates ESD protection and is tested by the following methods. ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010) Field Induced Charge Device Model ESD characterization is not performed on plastic molded packages with body sizes < 50 mm2 due to the inability of a small package body to acquire and retain enough charge to meet the minimum CDM discharge current waveform characteristic defined in JEDEC JS−002−2014. Table 4. LEAD SOLDERING TEMPERATURE AND MSL (Note 3) Rating Symbol Moisture Sensitivity Level MSL Min Max 1 Unit − 3. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D Table 5. THERMAL CHARACTERISTICS (Note 4) Symbol Value Thermal Characteristics (single layer PCB) Thermal Resistance, Junction−to−Air (Note 5) Thermal Reference, Junction−to−Lead (Note 5) RθJA RψJL 52 9.0 Thermal Characteristics (4 layers PCB) Thermal Resistance, Junction−to−Air (Note 5) Thermal Reference, Junction−to−Lead (Note 5) RθJA RψJL 31 10 Rating Unit °C/W °C/W 4. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area. 5. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate. Single layer * according to JEDEC51.3, 4 layers * according to JEDEC51.7 www.onsemi.com 5 NCV47823 Table 6. RECOMMENDED OPERATING RANGES Rating Input Voltage (Note 6) Output Current Limit (Note 7) Symbol Min Max Unit Vin 4.4 40 V ILIM1,2 10 350 mA TJ −40 150 °C Junction Temperature Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 6. Minimum Vin = 4.4 V or (Vout1,2 + 0.5 V), whichever is higher. 7. Corresponding RCSO1,2 is in range from 67.5 kΩ down to 2040 Ω Table 7. ELECTRICAL CHARACTERISTICS Vin = 13.5 V, VEN1,2 = 3.3 V, VDE = 0 V, RCSO1,2 = 0 Ω, Cin = 1 μF, Cout1,2 = 1 μF, Min and Max values are valid for temperature range −40°C v TJ v +150°C unless noted otherwise and are guaranteed by test, design or statistical correlation. Typical values are referenced to TJ = 25°C (Note 8) Parameter Test Conditions Symbol Min Typ Max − 210 230 350 400 Unit OUTPUTS Vin = 8 V to 18 V Iout1,2 = 200 mA Iout1,2 = 250 mA Vin−out1,2 Vout1,2 = Vin – 1 V ILIM1,2 350 − − mA IDIS − 5 20 μA Quiescent Current, Iq = Iin − (Iout1 +Iout2) Iout1 = Iout2 = 500 μA, Vin = 8 V to 18 V Iq − 0.85 1.5 mA Quiescent Current, Iq = Iin – (Iout1 +Iout2) Iout1 = Iout2 = 200 mA, Vin = 8 V to 18 V Iq − 15 25 mA Quiescent Current, Iq = Iin – (Iout1 +Iout2) Iout1 = Iout2 = 250 mA, Vin = 8 V to 18 V Iq − 20 40 mA 0.99 − 1.8 1.9 − 2.31 2 7 20 − 25 − 2.474 (−3 %) 2.55 2.626 (+3 %) − − 3.3 − (−15 %) 265 − (+15 %) − (−5 %) 285 − (+5 %) − (−5 %) 280 − (+5 %) Input to Output Differential Voltage mV CURRENT LIMIT PROTECTION Current Limit DISABLE AND QUIESCENT CURRENTS Disable Current VEN1,2 = 0 V ENABLE Enable Input Threshold Voltage Logic Low (OFF) Logic High (ON) Vout1,2 v 0.1 V Vout1,2 w Vin – 1 V Enable Input Current VEN1,2 = 3.3 V Turn On Time from from Enable ON to Vout1,2 = Vin – 1 V Iout1,2 = 100 mA Vth(EN1,2) IEN1,2 V μA μs ton OUTPUT CURRENT SENSE VCSO_Ilim1,2 CSO Voltage Level at Current Limit Vout1,2 = Vin – 1 V RCSO1,2 = 3.3 kW CSO Transient Voltage Level RCSO1,2 = 3.3 kW Iout1,2 pulse from 10 mA to 350 mA, tr = 1μs VCSO1,2 VCSO1,2 = 2 V, Iout1,2 = 10 mA to 50 mA Vin = 8 V to 18 V, −40°C v TJ v +150°C Output Current to CSO Current Ratio VCSO1,2 = 2 V, Iout1,2 = 50 mA to 200 mA Vin = 8 V to 18 V, −40°C v TJ v +150°C Iout1,2/ICSO1,2 VCSO1,2 = 2 V, Iout1,2 = 200 mA to 350 mA Vin = 8 V to 18 V, −40°C v TJ v +150°C CSO Current at no Load Current V V − VCSO1,2 = 0 V, Iout1,2 = 0 mA ICSO_off1,2 − − 15 μA Vin = 0 V, Vout1,2 = 18 V, VEN1,2 = 0 V Iout_rev1,2 −2 −0.03 − mA REVERSE BIAS CURRENT Reverse Current DIAGNOSTICS Short to Ground (STG) Voltage Threshold in ON State Vin = 4.4 V to 18 V RCSO1,2 = 3.3 kW VSTG1,2 2 3 4 V Short To Battery (STB) Voltage Threshold in OFF state Vin = 4.4 V to 18 V, Iout1 = Iout2 = 0 mA VDE = 3.3 V VSTB1,2 2 3 4 V www.onsemi.com 6 NCV47823 Open Load (OL) Current Threshold in OFF state Vin = 4.4 V to 18 V, VDE = 3.3 V Output Voltage to Output Feedback Voltege Ratio Vin = 4.4 V to 18 V IOL1,2 5.0 10 25 mA Vout1,2/Vout_FB1,2 5.7 6.0 6.3 − Diagnostics Enable Threshold Voltage Logic Low Logic High Vth(DE) Channel Select Threshold Voltage Logic Low Logic High Vth(CS) Error Flag Low Voltage IEF = −1 mA V 0.99 − 1.8 1.9 − 2.31 0.99 − 1.8 1.9 − 2.31 VEF_Low − 0.04 0.4 V TSD1,2 150 175 195 °C V THERMAL SHUTDOWN Thermal Shutdown Temperature (Note 9) Iout1 = Iout2 = 90 mA, each channel measured separately Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 8. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TA [ TJ. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible 9. Values based on design and/or characterization. www.onsemi.com 7 NCV47823 TYPICAL CHARACTERISTICS 400 350 Vin = 13.5 V 300 250 Iout1,2 = 200 mA 200 150 Iout1,2 = 15 mA 100 50 Vin = 13.5 V 350 TJ = 150°C 300 250 TJ = 25°C 200 150 TJ = −40°C 100 50 0 0 20 60 40 80 100 120 140 160 0 50 100 150 200 250 300 350 400 TJ, JUNCTION TEMPERATURE (°C) Iout1,2, OUTPUT CURRENT (mA) Figure 4. Input to Output Differential Voltage vs. Temperature Figure 5. Input to Output Differential Voltage vs. Output Current 0 950 TJ = 150°C 900 TJ = 25°C Rout1,2 = 3.3 kW −1 Iin, INPUT CURRENT (mA) ILIM1,2, OUTPUT CURRENT LIMIT (mA) 0 −40 −20 850 TJ = 25°C 800 750 TJ = −40°C 700 650 600 550 500 5 10 15 20 25 30 35 40 −2 −3 −4 −5 −6 Vout1,2 = (Vin − 1 V) V 0 −7 −45 −40 45 −35 −30 −25 −20 −10 −15 −5 VIN, INPUT VOLTAGE (V) VIN, INPUT VOLTAGE (V) Figure 6. Output Current Limit vs. Input Voltage Figure 7. Input Current vs. Input Voltage (Reverse Input Voltage) 400 0 3.0 350 VCSO1,2, CSO VOLTAGE (V) ILIM1,2, OUTPUT CURRENT LIMIT (mA) Iout1,2 = 350 mA Vin−out1,2, INPUT TO OUTPUT DIFFERENTIAL VOLTAGE (mV) Vin−out1,2, INPUT TO OUTPUT DIFFERENTIAL VOLTAGE (mV) 400 300 250 200 150 100 50 TJ = −40°C to 150°C ILIM1,2 = 10 mA to 350 mA 2.5 2.0 1.5 1.0 0.5 0 0 0 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 10 20 30 40 50 60 70 80 90 100 110 RCSO1,2 (kW) Iout1,2, OUTPUT CURRENT (% of ILIM1,2) Figure 8. Output Current Limit vs. RCSO Figure 9. CSO Voltage vs. Output Current (% of ILIM) www.onsemi.com 8 NCV47823 TYPICAL CHARACTERISTICS 40 1.6 Iq, QUIESCENT CURRENT (mA) TJ = 25°C Vin = 13.5 V 1.7 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 TJ = 25°C Vin = 13.5 V 35 30 25 20 15 10 5 0 0 5 10 20 15 0 50 100 150 200 250 300 Iout1,2, OUTPUT CURRENT (mA) Iout1,2, OUTPUT CURRENT (mA) Figure 10. Quiescent Current vs. Output Current (Low Load) Figure 11. Quiescent Current vs. Output Current (High Load) Iout1,2/ICSO1,2, OUTPUT CURRENT TO CSO CURRENT RATIO (−) Iq, QUIESCENT CURRENT (mA) 1.8 310 305 300 295 TJ = 25°C Vin = 13.5 V 290 285 280 275 270 265 260 255 250 10 100 Iout1,2, OUTPUT CURRENT (mA) Figure 12. Output Current to CSO Current Ratio vs. Output Current www.onsemi.com 9 1000 350 NCV47823 DEFINITIONS General All measurements are performed using short pulse low duty cycle techniques to maintain junction temperature as close as possible to ambient temperature. Current Limit Input to Output Differential Voltage Thermal Protection The Input to Output Differential Voltage parameter is defined for specific output current values and specified over Temperature range. Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 175_C, the regulator turns off. This feature is provided to prevent failures from accidental overheating. Current Limit is value of output current by which output voltage drops to or below Vin − 1 V value. Quiescent and Disable Currents Quiescent Current (Iq) is the difference between the input current (measured through the LDO input pin) and the output load current. If Enable pin is set to LOW the regulator reduces its internal bias and shuts off the output, this term is called the disable current (IDIS). Maximum Package Power Dissipation The power dissipation level is maximum allowed power dissipation for particular package or power dissipation at which the junction temperature reaches its maximum operating value, whichever is lower. www.onsemi.com 10 NCV47823 APPLICATIONS INFORMATION where RCSO1,2 − current limit setting resistor Circuit Description VCSO1,2 − voltage at CSO pin proportional to Iout1,2 The NCV47823 is an integrated dual High Side Switch (HSS) with current limit up to 350 mA per channel able to operate in Constant Current Source (CCS) mode depending on the output current load. The operation mode can be expressed by equations as follows: HSSmode : (V in * V in*out1,2) R load1,2 + I out1,2 t I LIM1,2 (eq. 1) + I out1,2 + I LIM1,2 (eq. 2) ILIM1,2 − current limit value Iout1,2 − output current actual value RATIO − typical value of Output Current to CSO Current Ratio for particular output current range CSO pin provides information about output current actual value. The CSO voltage is proportional to output current according to (eq. 3). Once output current reaches its limit value (ILIM1,2) set by external resistor RCSO than voltage at CSO pin is typically 2.55 V. Calculations of ILIM1,2 or RCSO1,2 values can be done using (eq. 6) and (eq. 7). or CCSmode : (V in * V in*out1,2) R load1,2 where ILIM1,2 value is preset by RCSO1,2. In HSS mode of operation (eq. 1) output current Iout1,2 may exceed ILIM1,2 (reduced inrush current). Voltage on CSO pin is proportional to output current. The operation mode with PWM function of Enable inputs is provided by the circuit. The integrated current sense features diagnosis and system protection functionality. The HSS is protected by both current limit and thermal shutdown. Thermal shutdown occurs above 150°C to protect the IC during overloads and extreme ambient temperatures. I LIM1,2_min + RATIO min I LIM1,2_max + RATIO max An enable pin is used to turn the channel on or off. By holding the pin down to a voltage less than 0.99 V, the output of the channel will be turned off. When the voltage on the enable pin is greater than 2.31 V, the output of the channel will be enabled to power its output to the regulated output voltage. The enable pins may be connected directly to the input pin to give constant enable to the output channel. As mentioned above, the circuit allows using both Enable inputs to obtain PWM of output current. Setting the Output Current Limit The output current value can be set up to 350 mA by external resistor RCSO1,2 (see Figure 1). ǒ 1 RATIO I LIM1,2 + RATIO 1 2.55 R CSO1,2 (eq. 4) 2.55 I LIM1,2 (eq. 5) R CSO1,2 + RATIO 1 Ǔ R CSO1,2_max V CSO1,2_max R CSO1,2_min (eq. 6) (eq. 7) where: RATIOmin – minimum value of Output Current to CSO Current Ratio from electrical characteristics table and particular output current range RATIOmax – maximum value of Output Current to CSO Current Ratio from electrical characteristics table and particular output current range VCSO1,2_min – minimum value of CSO Voltage Level at Current Limit from electrical characteristics table VCSO1,2_max – maximum value of CSO Voltage Level at Current Limit from electrical characteristics table RCSO1,2_min – minimum value of RCSO1,2 with respect its accuracy RCSO1,2_max – maximum value of RCSO1,2 with respect its accuracy Designers should consider the tolerance of RCSO1,2 during the design phase. Enable Inputs V CSO1,2 + I out1,2 R CSO1,2 V CSO1,2_min (eq. 3) Diagnostic in OFF state table is shown in Figure 13 and related flowchart in Figure 14. The diagnostics in OFF state shall be performed for each channel separately. For diagnostics of Channel 1 the input CS pin has to be put logic low, for diagnostics of Channel 2 the input CS pin has to be put logic high. Corresponding EN pin has to be used for control (EN1 for Channel 1 and EN2 for Channel 2). The NCV47823 contains also circuitry for OFF state diagnostics for Short to Battery (STB) and Open Load (OL). There are internal current sources and Pull Down resistors providing additional cost savings for overall application by excluding external components and their assembly cost and saving PCB space and safe control IOs of a Microcontroller Unit (MCU). Simplified functional schematic and truth www.onsemi.com 11 NCV47823 IPU Current source enabled via EN and DE pins Start PASS DEVICE is OFF in Diagnostics Mode in OFF state Vin Diag. OFF. Set EN = L & DE = L Vout RPD1 − + Comparator active only in Diagnostic state (DE = H). EN Diag. ON. Set EN = L & DE = H RPD2 VREF_OFF DE HZ L EF = ? EF EN − Enable (Logic Input) DE − Diagnostics Enable (Logic Input) EF − Error Flag Output (Open Collector Output) EN DE IPU EF Vout Digital Diagnostic: to MCU’s digital input with pull−up resistor to MCU’s DIO supply rail HZ Diagnostic Status/Action L L OFF HZ Unknown L H OFF L Vout>Vout_OFF Short to Battery (STB) L H OFF HZ VoutVout_OFF H H ON HZ Vout