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NCV511SN25T1G

NCV511SN25T1G

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    TSOP5

  • 描述:

    IC REG LDO 50MA 2.5V TSOP

  • 数据手册
  • 价格&库存
NCV511SN25T1G 数据手册
NCP511, NCV511 Voltage Regulator - CMOS, Low Iq, Low-Dropout 150 mA The NCP511 series of fixed output low dropout linear regulators are designed for handheld communication equipment and portable battery powered applications which require low quiescent current. The NCP511 series features an ultra−low quiescent current of 40 A. Each device contains a voltage reference unit, an error amplifier, a PMOS power transistor, resistors for setting output voltage, current limit, and temperature limit protection circuits. The NCP511 has been designed to be used with low cost ceramic capacitors and requires a minimum output capacitor of 1.0 F. The device is housed in the micro−miniature TSOP−5 surface mount package. Standard voltage versions are 1.5 V, 1.8 V, 2.5 V, 2.7 V, 2.8 V, 3.0 V, 3.3 V, and 5.0 V. Other voltages are available in 100 mV steps. www.onsemi.com TSOP−5 SN SUFFIX CASE 483 PIN CONNECTIONS AND MARKING DIAGRAM Features • Low Quiescent Current of 40 A Typical Low Dropout Voltage of 100 mV at 100 mA Excellent Line and Load Regulation Maximum Operating Voltage of 6.0 V Low Output Voltage Option High Accuracy Output Voltage of 2.0% Industrial Temperature Range of −40°C to 85°C NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These are Pb−Free Devices Vin 1 GND 2 Enable 3 xxxAYWG G • • • • • • • • 5 Vout 4 N/C (Top View) xxx A Y W G = Specific Device Code = Assembly Location = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) Typical Applications • • • • ORDERING INFORMATION Cellular Phones Battery Powered Instruments Hand−Held Instruments Camcorders and Cameras See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet. Vin 1 5 Thermal Shutdown Vout Driver w/ Current Limit Enable ON 3 OFF GND 2 This device contains 82 active transistors Figure 1. Representative Block Diagram © Semiconductor Components Industries, LLC, 2015 October, 2019 − Rev. 13 1 Publication Order Number: NCP511/D NCP511, NCV511 ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ PIN FUNCTION DESCRIPTION Pin No. Pin Name 1 Vin Description 2 GND 3 Enable 4 N/C No internal connection. 5 Vout Regulated output voltage. Positive power supply input voltage. Power supply ground. This input is used to place the device into low−power standby. When this input is pulled low, the device is disabled. If this function is not used, Enable should be connected to Vin. MAXIMUM RATINGS Rating Symbol Value Unit Vin 0 to 6.0 V Enable Voltage Enable −0.3 to Vin +0.3 V Output Voltage Vout −0.3 to Vin +0.3 V Power Dissipation and Thermal Characteristics Power Dissipation Thermal Resistance, Junction to Ambient PD RJA Internally Limited 250 W °C/W Operating Junction Temperature TJ +150 °C Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −55 to +150 °C Input Voltage Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL−STD−883, Method 3015 Machine Model Method 200 V 2. Latch up capability (85°C) ±100 mA DC with trigger voltage. www.onsemi.com 2 NCP511, NCV511 ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Venable = Vin, Cin = 1.0 F, Cout = 1.0 F, TJ = 25°C, unless otherwise noted.) Symbol Characteristic Output Voltage (TA = 25°C, Iout = 1.0 mA) 1.5 V 1.8 V 2.5 V 2.7 V 2.8 V 3.0 V 3.3 V 5.0 V Vout Output Voltage (TA = −40°C to 85°C, Iout = 1.0 mA) 1.5 V 1.8 V 2.5 V 2.7 V 2.8 V 3.0 V 3.3 V 5.0 V Vout Line Regulation (Iout = 10 mA) 1.5 V−4.4 V (Vin = Vout(nom.) + 1.0 V to 6.0 V) 4.5 V−5.0 V (Vin = 5.5 V to 6.0 V) Regline Load Regulation (Iout = 1.0 mA to 150 mA) Regload Output Current (Vout = (Vout at Iout = 150 mA) −3%) 1.5 V−1.8 V (Vin = 4.0 V) 1.9 V−3.0 V (Vin = 5.0 V) 3.1 V−5.0 V (Vin = 6.0 V) Iout(nom.) Dropout Voltage (Iout = 100 mA, Measured at Vout −3.0%) 1.5 V 1.8 V 2.5 V 2.7 V 2.8 V 3.0 V 3.3 V 5.0 V Vin−Vout Quiescent Current (Enable Input = 0 V) (Enable Input = Vin, Iout = 1.0 mA to Io(nom.)) IQ Output Voltage Temperature Coefficient TC Enable Input Threshold Voltage (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Vth(en) Output Short Circuit Current (Vout = 0 V) 1.5 V−1.8 V (Vin = 4.0 V) 1.9 V−3.0 V (Vin = 5.0 V) 3.1 V−5.0 V (Vin = 6.0 V) Iout(max) Min Typ Max 1.455 1.746 2.425 2.646 2.744 2.94 3.234 4.900 1.5 1.8 2.5 2.7 2.8 3.0 3.3 5.0 1.545 1.854 2.575 2.754 2.856 3.06 3.366 5.100 1.455 1.746 2.425 2.619 2.716 2.910 3.201 4.900 1.5 1.8 2.5 2.7 2.8 3.0 3.3 5.0 1.545 1.854 2.575 2.781 2.884 3.09 3.399 5.100 − − 1.0 1.0 3.5 3.5 − 0.3 0.8 150 150 150 − − − − − − − − − − − − − − 245 160 110 100 100 100 90 75 350 200 200 200 200 200 200 200 − − 0.1 40 1.0 100 − "100 − 1.3 − − − − 0.3 200 200 200 400 400 400 800 800 800 Unit V V mV/V mV/mA mA mV A ppm/°C V mA Ripple Rejection (f = 1.0 kHz, Io = 60 mA) RR − 50 − dB Output Noise Voltage (f = 20 Hz to 100 kHz, Iout = 60 mA) Vn − 110 − VRMS Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Maximum package power dissipation limits must be observed. T *TA PD + J(max) RJA 4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. www.onsemi.com 3 NCP511, NCV511 TYPICAL CHARACTERISTICS 200 Vout, OUTPUT VOLTAGE (V) 180 DROPOUT VOLTAGE (mV) 3.5 Vout(nom.) = 3.0 V Iout = 150 mA 160 140 120 Iout = 100 mA 100 80 Iout = 50 mA 60 40 Iout = 1 mA Iout = 10 mA 20 0 −60 −40 −20 0 20 40 60 80 2.5 2.0 Vout(nom.) = 3.0 V IO = 0 mA Cin = 1.0 F Cout = 1.0 F TA = 25°C Venable = Vin 1.5 1.0 0.5 0 100 120 140 0 1 2 5 6 Figure 2. Dropout Voltage vs. Temperature Figure 3. Output Voltage vs. Input Voltage 7 GROUND PIN CURRENT (A) 45 40 35 30 Vin = Vout(nom.) + 0.5 V Vout(nom.) = 3.0 V IO = 0 mA 25 20 −50 −25 0 25 75 50 100 43 41 39 37 35 33 31 27 25 125 Vout(nom.) = 3.0 V Vin = 5.0 V TA = 25°C 29 0 25 TEMPERATURE (°C) 40 400 35 350 CURRENT LIMIT (mA) 450 30 25 20 15 Vout(nom.) = 3.0 V Iout = 50 mA TA = 25°C 5 0 1 2 3 4 75 100 125 150 Figure 5. Ground Pin Current vs. Output Current 45 10 50 Iout, OUTPUT CURRENT (mA) Figure 4. Quiescent Current vs. Temperature GROUND PIN CURRENT (A) 4 Vin, INPUT VOLTAGE (V) 45 0 3 TEMPERATURE (°C) 50 IQ, QUIESCENT CURRENT (A) 3.0 5 300 250 200 150 100 Vout(nom.) = 3.0 V Cin = 1.0 F 50 0 6 0 1 2 3 4 5 Vin, INPUT VOLTAGE (V) Vin, INPUT VOLTAGE (V) Figure 6. Ground Pin Current vs. Input Voltage Figure 7. Current Limit vs. Input Voltage www.onsemi.com 4 6 Vin, INPUT VOLTAGE (V) 5 4 3 60 Vin = 3.5 V to 4.5 V Vout = 3.0 V Cout = 1 F Iout = 1 mA 40 20 OUTPUT VOLTAGE DEVIATION (mV) OUTPUT VOLTAGE DEVIATION (mV) Vin, INPUT VOLTAGE (V) NCP511, NCV511 0 −20 −40 5 4 3 100 50 0 −50 −100 Vin = 3.5 V to 4.5 V Vout = 3.0 V 20 100 200 300 400 500 600 700 800 900 40 60 Figure 9. Line Transient Response Figure 8. Line Transient Response Vin, INPUT VOLTAGE (V) 100 120 140 160 180 TIME (s) TIME (s) 5 4 3 150 100 OUTPUT VOLTAGE DEVIATION (mV) 80 Cout = 1 F Iout = 100 mA Cout = 1 F Iout = 150 mA 50 0 −50 −100 −150 −200 Vin = 3.5 V to 4.5 V Vout = 3.0 V 20 40 60 80 100 120 140 160 180 TIME (s) 150 Vin = 3.5 V Vout = 3.0 V Cin = 1 F Cout = 10 F Iout = 1 mA to 150 mA OUTPUT VOLTAGE DEVIATION (mV) OUTPUT VOLTAGE DEVIATION (mV) 0 20 10 0 −10 Iout, OUTPUT CURRENT (mA) Iout, OUTPUT CURRENT (mA) Figure 10. Line Transient Response 200 400 600 800 1000 1200 1400 1600 1800 150 Vin = 3.5 V Vout = 3.0 V 0 200 100 Cin = 1 F Cout = 1 F IO = 1 mA to 150 mA 0 −100 −200 200 400 600 800 1000 1200 1400 1600 1800 TIME (s) TIME (s) Figure 11. Load Transient Response Figure 12. Load Transient Response www.onsemi.com 5 ENABLE VOLTAGE (V) NCP511, NCV511 2 1 0 Vin = 3.5 V Vout = 3.0 V TA = 25°C Iout = 1 mA Cin = 1 F Vout, OUTPUT VOLTAGE (V) 4 3 2 Cout = 10 F Cout = 1 F 1 0 20 40 60 80 100 120 140 160 180 TIME (s) Figure 13. Turn−On Response OUTPUT NOISE DENSITY (V/ǠHZ) 1.6 Vout = 1.5 V Vin = 2.5 V Iout = 60 mA Cout = 2.2 F 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0.01 0.1 1.0 10 100 1000 f, FREQUENCY (kHz) Figure 14. Output Noise Density RR, RIPPLE REJECTION (dB) 70 Vout = 3.0 V Vin = 3.5 VDC  0.25 V Iout = 60 mA Cout = 1.0 F 60 50 40 30 20 10 0 100 1k 10 k 100 k f, FREQUENCY (Hz) Figure 15. Ripple Rejection vs. Frequency www.onsemi.com 6 1M NCP511, NCV511 DEFINITIONS Load Regulation Line Regulation The change in output voltage for a change in output current at a constant temperature. The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected. Dropout Voltage The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 3.0% below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Line Transient Response Typical over and undershoot response when input voltage is excited with a given slope. Thermal Protection Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 160°C, the regulator turns off. This feature is provided to prevent failures from accidental overheating. Maximum Power Dissipation The maximum total dissipation for which the regulator will operate within its specifications. Quiescent Current The quiescent current is the current which flows through the ground when the LDO operates without a load on its output: internal IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current. It is actually the difference between the input current (measured through the LDO input pin) and the output current. Maximum Package Power Dissipation The maximum power package dissipation is the power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 125°C. Depending on the ambient power dissipation and thus the maximum available output current. www.onsemi.com 7 NCP511, NCV511 APPLICATIONS INFORMATION Thermal A typical application circuit for the NCP511 series is shown in Figure 16. As power across the NCP511 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material and also the ambient temperature effect the rate of temperature rise for the part. This is stating that when the NCP511 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. The maximum dissipation the package can handle is given by: Input Decoupling (C1) A 1.0 F capacitor either ceramic or tantalum is recommended and should be connected close to the NCP511 package. Higher values and lower ESR will improve the overall line transient response. Output Decoupling (C2) The NCP511 is a stable Regulator and does not require any specific Equivalent Series Resistance (ESR) or a minimum output current. Capacitors exhibiting ESRs ranging from a few m up to 3.0  can thus safely be used. The minimum decoupling value is 1.0 F and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices. Larger values improve noise rejection and load regulation transient response. T *TA PD + J(max) RJA If junction temperature is not allowed above the maximum 125°C, then the NCP511 can dissipate up to 400 mW @ 25°C. The power dissipated by the NCP511 can be calculated from the following equation: Enable Operation Ptot + ƪVin * Ignd (Iout)ƫ ) [Vin * Vout] * Iout The enable pin will turn on or off the regulator. These limits of threshold are covered in the electrical specification section of this data sheet. If the enable is not used then the pin should be connected to Vin. or P ) Vout * Iout VinMAX + tot Ignd ) Iout Hints If a 150 mA output current is needed then the ground current from the data sheet is 40 A. For an NCP511SN30T1 (3.0 V), the maximum input voltage will then be 5.6 V. Please be sure the Vin and GND lines are sufficiently wide. When the impedance of these lines is high, there is a chance to pick up noise or cause the regulator to malfunction. Set external components, especially the output capacitor, as close as possible to the circuit, and make leads a short as possible. Battery or Unregulated Voltage C1 + 1 ON 3 Vout 5 + 2 ESR, OUTPUT CAPACITOR () 100 C2 UNSTABLE 10 0.1 0.01 4 OFF Cout = 1 F to 10 F TA = 25°C to 125°C Vin = up to 6.0 V 1 STABLE 0 25 50 75 100 125 150 IO, OUTPUT CURRENT (mA) Figure 16. Typical Application Circuit Figure 17. Output Capacitor vs. Output Current www.onsemi.com 8 NCP511, NCV511 APPLICATION CIRCUITS Input R1 Input Q1 R Output R2 Q2 Output 1.0 F 3 1.0 F 3 Figure 18. Current Boost Regulator Short circuit current limit is essentially set by the VBE of Q2 and R1. ISC = ((VBEQ2 − ib * R2) / R1) + IO(max) Regulator Enable Voltage (V) Input Output 5 1.0 F 1.0 F 2 Enable Output 5 1 1.0 F 2 3 4 3 4 C TA = 25°C Vin = 3.5 V Vout = 3.0 V 2 1 0 Vout, Output Voltage (V) 4 1.0 F 4 Figure 19. Current Boost Regulator with Short Circuit Limit The NCP511 series can be current boosted with a PNP transistor. Resistor R in conjunction with VBE of the PNP determines when the pass transistor begins conducting; this circuit is not short circuit proof. Input/Output differential voltage minimum is increased by VBE of the pass resistor. 3 1.0 F 2 4 1 5 1 2 R R3 5 1 1.0 F Q1 3 R = 1.0 M mW C = 0.1 F 1 0 R = 1.0 M C = 1.0 F No Delay 2 20 0 60 40 80 100 120 140 160 Time (ms) Figure 20. Delayed Turn−on Figure 21. Delayed Turn−on The graph shows the delay between the enable signal and output turn−on for various resistor and capacitor values. If a delayed turn−on is needed during power up of several voltages then the above schematic can be used. Resistor R, and capacitor C, will delay the turn−on of the bottom regulator. A few values were chosen and the resulting delay can be seen in Figure 21. Input Output Q1 R 1 5 1.0 F 2 1.0 F 3 5.6 V 4 Figure 22. Input Voltages Greater than 6.0 V A regulated output can be achieved with input voltages that exceed the 6.0 V maximum rating of the NCP511 series with the addition of a simple pre−regulator circuit. Care must be taken to prevent Q1 from overheating when the regulated output (Vout) is shorted to GND. www.onsemi.com 9 NCP511, NCV511 ORDERING INFORMATION Nominal Output Voltage Marking NCP511SN15T1G 1.5 LBU NCP511SN18T1G 1.8 LBV NCP511SN25T1G 2.5 LBW NCP511SN27T1G 2.7 LBX NCP511SN28T1G 2.8 LBY NCP511SN30T1G 3.0 LBZ NCP511SN33T1G 3.3 LCA NCP511SN50T1G 5.0 LCB NCV511SN15T1G 1.5 LBU NCV511SN25T1G 2.5 LBW Device Package Shipping† TSOP−5 3000 Units/ 7″ Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. NOTE: Additional voltages in 100 mV steps are available upon request by contacting your ON Semiconductor representative. www.onsemi.com 10 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSOP−5 CASE 483 ISSUE N 5 1 SCALE 2:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION A. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. D 5X NOTE 5 2X DATE 12 AUG 2020 0.20 C A B 0.10 T M 2X 0.20 T 5 B 1 4 2 B S 3 K DETAIL Z G A A TOP VIEW DIM A B C D G H J K M S DETAIL Z J C 0.05 H C SIDE VIEW SEATING PLANE END VIEW GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT* 0.95 0.037 MILLIMETERS MIN MAX 2.85 3.15 1.35 1.65 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 0_ 10 _ 2.50 3.00 1.9 0.074 5 5 XXXAYWG G 1 1 Analog 2.4 0.094 XXX = Specific Device Code A = Assembly Location Y = Year W = Work Week G = Pb−Free Package 1.0 0.039 XXX MG G Discrete/Logic XXX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) 0.7 0.028 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98ARB18753C TSOP−5 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 www.onsemi.com 1 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative
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